CN210651370U - Germanium single crystal wafer cutting mechanism capable of collecting chippings - Google Patents
Germanium single crystal wafer cutting mechanism capable of collecting chippings Download PDFInfo
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- CN210651370U CN210651370U CN201920712033.7U CN201920712033U CN210651370U CN 210651370 U CN210651370 U CN 210651370U CN 201920712033 U CN201920712033 U CN 201920712033U CN 210651370 U CN210651370 U CN 210651370U
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Abstract
The utility model discloses a can collect clastic germanium single crystal cutting mechanism for wafer, collect the mechanism including the base and installing the piece at base intermediate position, the gag lever post is installed to base top both sides, the gag lever post setting is collected the mechanism both sides at the piece, the gag lever post top is provided with the horizontal pole, the horizontal pole intermediate position is provided with cutting assembly, piece collection mechanism is collected the passageway, is collected mouthful, air exhauster and piece by piece collecting box, through-hole, piece and collects the drawer and constitutes. The utility model discloses a piece that piece collecting box produced the germanium single crystal wafer on with the fixed station because of the cutting is collected, and the piece that collects the inside surplus piece of piece collecting box through the air exhauster simultaneously is through collecting mouth, exhaust duct, air-out pipeline, import, piece collection passageway and further collect to make the germanium single crystal wafer can be collected because of the piece that the cutting produced, and then reduce the waste of germanium raw materials.
Description
Technical Field
The utility model relates to a germanium single crystal wafer cutting technical field specifically is a can collect clastic cutting mechanism for germanium single crystal wafer.
Background
With the development of the times, the production level of people is continuously improved, the use of semiconductor elements is also continuously improved, germanium is one of the elements, in order to meet the requirements of different products, the germanium single crystal wafer needs to be processed in different specifications, and a germanium single crystal wafer cutting mechanism is mostly adopted to cut the germanium single crystal wafer at the present stage.
However, the existing germanium single-crystal wafer cutting mechanism has the following disadvantages:
1. when the existing germanium single-crystal wafer cutting mechanism is used, due to the defects of the structure, a corresponding scrap processing device is not arranged, so that scraps generated when the germanium single-crystal wafer is cut cannot be collected timely, and further the waste of germanium raw materials is caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a can collect clastic cutting mechanism for germanium single crystal wafer has solved current germanium single crystal wafer cutting mechanism and can not in time collect the problem that the piece that the cutting produced because of the defect of structure itself when using.
In order to achieve the above object, the utility model provides a following technical scheme: a cutting mechanism for a germanium single chip capable of collecting scraps comprises a base and a scrap collecting mechanism arranged at the middle position of the base, limiting rods are arranged on two sides of the top of the base and are arranged on two sides of the scrap collecting mechanism, a cross rod is arranged at the top of the limiting rod, a cutting assembly is arranged at the middle position of the cross rod, the scrap collecting mechanism comprises a scrap collecting box, a through hole, a scrap collecting channel, a collecting port, an exhaust fan and a scrap collecting drawer, the scrap collecting box is arranged at the middle position of the base, a fixing platform is arranged at the top of the scrap collecting box, the through hole is formed at the bottom of the scrap collecting box, the collecting port is arranged on two sides of the scrap collecting box, the collecting port is connected with an exhaust fan exhaust port through an exhaust pipeline, inlets are formed in two sides of the scrap collecting channel, and, the top of the debris collection channel is connected with the bottom of the through hole, and the bottom of the debris collection channel is communicated with the debris collection drawer.
Preferably, the cylinder is installed at the top of the cutting assembly, and the cylinder is installed at the middle position of the bottom of the cross rod.
Preferably, a plurality of holes are formed in the bottom of the fixed table, and baffles are arranged on two sides of the fixed table.
Preferably, the two sides of the bottom of the debris collecting channel are provided with inclined plates, and the tops of the inclined plates are flush with the bottom of the inlet.
Preferably, the two sides of the debris collecting channel are provided with fixing plates, the top of each fixing plate is fixedly connected with the base, and the bottom of each fixing plate is fixedly connected with the shell of the exhaust fan.
The utility model provides a can collect clastic germanium single crystal cutting mechanism for piece possesses following beneficial effect:
(1) the utility model discloses a set up the piece collecting box, the through-hole, piece collecting channel, collect the mouth, the air exhauster, the drawer is collected to the piece, the air suction pipeline, import, the air-out pipeline, the piece that produces because of the cutting is collected with the germanium single crystal wafer on the fixed station through the piece collecting box, the piece that collects through the piece collecting box passes through the through-hole, piece collecting channel gets into the piece and collects the drawer, simultaneously through the air exhauster with the inside surplus piece of piece collecting box through collecting the mouth, the air suction pipeline, the air-out pipeline, the import gets into piece collecting channel, get into in the piece collecting drawer through piece collecting channel, thereby make the piece that the germanium single crystal wafer produced because of the cutting can be collected, and then reduce the waste of.
Drawings
Fig. 1 is a front view of the present invention;
fig. 2 is a structural diagram of the debris collecting mechanism of the present invention.
In the figure: 1. a base; 2. a limiting rod; 3. a cross bar; 4. a debris collection bin; 5. a through hole; 6. a debris collection channel; 7. a collection port; 8. an exhaust fan; 9. a debris collection drawer; 10. a fixed table; 11. an air extraction duct; 12. an inlet; 13. an air outlet pipeline; 14. a cutting assembly; 15. a cylinder; 16. a baffle plate; 17. a sloping plate; 18. and (7) fixing the plate.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
As shown in fig. 1-2, the utility model provides a technical solution: a cutting mechanism for a germanium single chip capable of collecting chips comprises a base 1 and a chip collecting mechanism arranged at the middle position of the base 1, wherein limiting rods 2 are arranged on two sides of the top of the base 1, the limiting rods 2 are arranged on two sides of the chip collecting mechanism, a cross rod 3 is arranged at the top of each limiting rod 2, a cutting component 14 is arranged at the middle position of each cross rod 3, the chip collecting mechanism comprises a chip collecting box 4, a through hole 5, a chip collecting channel 6, a collecting port 7, an exhaust fan 8 and a chip collecting drawer 9, the chip collecting box 4 is arranged at the middle position of the base 1, a fixing table 10 is arranged at the top of the chip collecting box 4, the through hole 5 is arranged at the bottom of the chip collecting box 4, the collecting ports 7 are arranged on two sides of the chip collecting box 4, and the collecting ports 7 are connected with an, import 12 has been seted up to piece collecting channel 6 both sides, 8 air outlets of air exhauster are linked together through air-out pipeline 13 and import 12, 6 tops of piece collecting channel are connected with 5 bottoms of through-hole, 6 bottoms of piece collecting channel are linked together with piece collection drawer 9.
The cylinder 15 is installed at cutting assembly 14 top, the cylinder 15 is installed in horizontal pole 3 bottom intermediate position, through setting up cylinder 15, has made things convenient for reciprocating of cutting assembly 14.
A plurality of holes have been seted up to fixed station 10 bottom, fixed station 10 both sides all are provided with baffle 16, through seting up a plurality of holes for conveniently get into piece collecting box 4 because of the piece that the cutting left on fixed station 10, the baffle 16 that sets up simultaneously is favorable to preventing that the piece that the germanium single wafer produced from splashing when the cutting, further reduces the waste of germanium raw materials.
States chip collecting channel 6 bottom both sides and is provided with swash plate 17, swash plate 17 top and 12 bottom parallel and level of import, through setting up swash plate 17, be favorable to the piece to collect drawer 9 with getting into the piece more easily when passing through chip collecting channel 6 in, prevent that the piece from appearing accumulational condition in chip collecting channel 6.
Fixed plates 18 are arranged on two sides of the debris collecting channel 6, the top of each fixed plate 18 is fixedly connected with the base 1, the bottom of each fixed plate 18 is fixedly connected with the shell of the exhaust fan 8, the exhaust fan 8 is connected with the base 1 through the arrangement of the fixed plates 18, and therefore the exhaust fan 8 is fixed.
The working principle is as follows: this device is when using, put on fixed station 10 through the germanium single crystal wafer that will carry out the cutting and fix, through opening cylinder 15, make cutting mechanism descend, when reaching the height that can cut, close cylinder 15, cut the germanium single crystal wafer through cutting assembly 14 simultaneously, the piece that produces in the cutting process, the hole through on the fixed station 10 falls into piece collecting box 4, the piece passes through-hole 5 in piece collecting box 4 part gets into piece collection drawer 9 through piece collection passageway 6, open air exhauster 8 simultaneously, under the effect of air exhauster 8, with remaining piece through collection mouth 7 in piece collecting box 4, exhaust duct 11, air-out pipeline 13 gets into in piece collection passageway 6, finally get into piece collection drawer 9, thereby make the piece can be collected, and then reduce the waste of germanium raw materials.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A cutting mechanism for a germanium single crystal wafer capable of collecting chips comprises a base (1) and a chip collecting mechanism arranged in the middle of the base (1), and is characterized in that: the device is characterized in that limiting rods (2) are installed on two sides of the top of the base (1), the limiting rods (2) are arranged on two sides of a chip collecting mechanism, a cross rod (3) is arranged on the top of the limiting rods (2), a cutting assembly (14) is arranged in the middle of the cross rod (3), the chip collecting mechanism is composed of a chip collecting box (4), a through hole (5), a chip collecting channel (6), a collecting port (7), an exhaust fan (8) and a chip collecting drawer (9), the chip collecting box (4) is installed in the middle of the base (1), a fixing table (10) is installed on the top of the chip collecting box (4), the through hole (5) is arranged at the bottom of the chip collecting box (4), the collecting port (7) is arranged on two sides of the chip collecting box (4), and the collecting port (7) is connected with the exhaust fan (8) through an, import (12) have been seted up to piece collecting channel (6) both sides, air exhauster (8) air outlet is linked together through air-out pipeline (13) and import (12), piece collecting channel (6) top is connected with through-hole (5) bottom, piece collecting channel (6) bottom is collected drawer (9) with the piece and is linked together.
2. The cutting mechanism of claim 1, wherein the cutting mechanism comprises: the cylinder (15) is installed at the top of the cutting assembly (14), and the cylinder (15) is installed in the middle of the bottom of the cross rod (3).
3. The cutting mechanism of claim 1, wherein the cutting mechanism comprises: a plurality of holes are formed in the bottom of the fixed table (10), and baffles (16) are arranged on two sides of the fixed table (10).
4. The cutting mechanism of claim 1, wherein the cutting mechanism comprises: both sides of the bottom of the debris collecting channel (6) are provided with inclined plates (17), and the tops of the inclined plates (17) are flush with the bottom of the inlet (12).
5. The cutting mechanism of claim 1, wherein the cutting mechanism comprises: fixed plates (18) are arranged on two sides of the debris collecting channel (6), the top of each fixed plate (18) is fixedly connected with the base (1), and the bottom of each fixed plate (18) is fixedly connected with the shell of the exhaust fan (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920712033.7U CN210651370U (en) | 2019-05-17 | 2019-05-17 | Germanium single crystal wafer cutting mechanism capable of collecting chippings |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920712033.7U CN210651370U (en) | 2019-05-17 | 2019-05-17 | Germanium single crystal wafer cutting mechanism capable of collecting chippings |
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| Publication Number | Publication Date |
|---|---|
| CN210651370U true CN210651370U (en) | 2020-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920712033.7U Active CN210651370U (en) | 2019-05-17 | 2019-05-17 | Germanium single crystal wafer cutting mechanism capable of collecting chippings |
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| CN (1) | CN210651370U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112620696A (en) * | 2020-12-07 | 2021-04-09 | 安徽科达汽车轴瓦有限公司 | Automatic punching equipment of axle bush convenient to operation |
-
2019
- 2019-05-17 CN CN201920712033.7U patent/CN210651370U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112620696A (en) * | 2020-12-07 | 2021-04-09 | 安徽科达汽车轴瓦有限公司 | Automatic punching equipment of axle bush convenient to operation |
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