CN210628241U - Processing chamber for semiconductor processing equipment - Google Patents
Processing chamber for semiconductor processing equipment Download PDFInfo
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- CN210628241U CN210628241U CN201922235250.4U CN201922235250U CN210628241U CN 210628241 U CN210628241 U CN 210628241U CN 201922235250 U CN201922235250 U CN 201922235250U CN 210628241 U CN210628241 U CN 210628241U
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Abstract
The utility model discloses a processing chamber for semiconductor processing equipment, which comprises a frame, wherein a conveyor belt is arranged at the front part of the frame, a limiting plate is arranged on the conveyor belt, and the limiting plate is made of rubber; a processing table is arranged on the front side of the conveying belt, and plasma etchers are arranged on two sides of the processing table respectively and comprise a steering device, an air suction device and a processing cavity; the processing cavity for the semiconductor processing equipment has the advantages that through the structures of the arranged rack, the conveying belt, the limiting plate, the processing table, the processing cavity, the fixing frame, the steering motor, the steering device, the rotating frame, the plasma etchers, the air suction device, the air pump, the air suction disc and the air cylinder, the efficient loading and unloading of wafers are greatly facilitated by using the matching of the two groups of plasma etchers; the efficient matching with the conveyor belt is realized, and the operating efficiency is greatly improved; meanwhile, the structure is simple, and the use is convenient.
Description
Technical Field
The utility model relates to a processing cavity field of semiconductor processing equipment specifically is a processing cavity for semiconductor processing equipment.
Background
The semiconductor is a substance with conductivity between an insulator and a conductor, and the conductivity of the semiconductor is easy to control and can be used as an element material for information processing. Semiconductors are very important from the viewpoint of technological or economic development. The core elements of many electronic products, such as computers, mobile phones, and digital recorders, utilize the conductivity change of semiconductors to process information. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is the most influential of various semiconductor materials in commercial applications.
When the semiconductor wafer is subjected to plasma etching processing, the wafer is usually required to be loaded into a processing cavity, and the existing processing cavity is singly arranged, so that loading and unloading are inconvenient; meanwhile, the existing charging equipment only uses a single operation structure and cannot be well matched with a conveyor belt to carry out efficient charging and discharging; these problems have created a need for a process chamber for semiconductor processing equipment.
Disclosure of Invention
An object of the utility model is to provide a processing cavity for semiconductor processing equipment to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a processing chamber for semiconductor processing equipment comprises a rack, wherein a conveyor belt is arranged at the front part of the rack, a limiting plate is arranged on the conveyor belt, and the limiting plate is made of rubber; the front side of the conveying belt is provided with a processing table, two sides of the processing table are respectively provided with a plasma etcher, each plasma etcher comprises a steering device, an air suction device and a processing cavity, each steering device comprises a fixed frame, a steering motor and a rotating frame, and the fixed frames are fixed on the rack through bolts and nuts; the steering motor is vertically fixed on the fixing frame through bolts and nuts; a rotating frame is arranged on the upper side of the steering motor and is fixedly connected with a rotating shaft of the steering motor through bolts and nuts; a plurality of air suction devices are arranged on the rotating frame; the air suction device comprises an air cylinder, an air pump and an air suction disc, the air cylinder is vertically fixed on the rotating frame through bolts and nuts, and the air suction disc is arranged on the lower side of the air cylinder; the air suction disc is fixed on an air pressure push rod of the air cylinder through a bolt and a nut; the air suction disc is connected with the air pump through an air duct; a plurality of processing cavities are respectively arranged on two sides of the processing table; the air pump is arranged on the rotating frame and is fixed on the fixed frame through bolts and nuts; the air pump is connected with the cylinder and the air suction disc through the air duct.
As a further aspect of the present invention: the conveying belt is a rubber conveying belt; the limiting plate and the conveyor belt are of an integrally formed structure.
As a further aspect of the present invention: the limiting plate is provided with a limiting groove; the size of the limiting groove is equal to the size of the wafer.
As a further aspect of the present invention: the steering motor is a stepping motor; the rotating frame is made of stainless steel.
As a further aspect of the present invention: the air suction disc is made of plastic; a plasma processing device is arranged on the processing cavity; the size of the processing cavity is equal to that of the wafer, and the processing cavity is opposite to the air suction disc.
Compared with the prior art, the beneficial effects of the utility model are that: the processing cavity for the semiconductor processing equipment has the advantages that through the structures of the arranged rack, the conveying belt, the limiting plate, the processing table, the processing cavity, the fixing frame, the steering motor, the steering device, the rotating frame, the plasma etchers, the air suction device, the air pump, the air suction disc and the air cylinder, the efficient loading and unloading of wafers are greatly facilitated by using the matching of the two groups of plasma etchers; the efficient matching with the conveyor belt is realized, and the operating efficiency is greatly improved; meanwhile, the structure is simple, and the use is convenient.
Drawings
Fig. 1 is a schematic top view of a process chamber for semiconductor processing equipment.
FIG. 2 is a schematic illustration of an etch configuration for a plasma etcher in a process chamber of a semiconductor processing apparatus.
Fig. 3 is a schematic front view of a plasma etcher for use in a process chamber of a semiconductor processing apparatus.
Fig. 4 is a schematic diagram of a suction device for use in a process chamber of a semiconductor processing apparatus.
In the figure: the device comprises a rack 1, a conveyor belt 2, a limiting plate 3, a processing table 4, a processing cavity 5, a fixing frame 6, a steering motor 7, a steering device 8, a rotating frame 9, a plasma etcher 10, an air suction device 11, an air pump 12, an air suction disc 13 and an air cylinder 14.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 3, in an embodiment of the present invention, a processing chamber for semiconductor processing equipment includes a frame 1, a conveyor belt 2 is disposed at a front portion of the frame 1, the conveyor belt 2 is a rubber conveyor belt, a limiting plate 3 is disposed on the conveyor belt 2, the limiting plate 3 is made of rubber, and the limiting plate 3 and the conveyor belt 2 are of an integrally formed structure; the limiting plate 3 is provided with a limiting groove, and the limiting groove is used for placing a wafer; the size of the limiting groove is equal to that of the wafer; a processing table 4 is arranged on the front side of the conveyor belt 2, plasma etchers 10 are respectively arranged on two sides of the processing table 4, each plasma etcher 10 comprises a steering device 8, an air suction device 11 and a processing cavity 5, each steering device 8 comprises a fixed frame 6, a steering motor 7 and a rotating frame 9, and the fixed frames 6 are fixed on the rack 1 through bolts and nuts; the steering motor 7 is vertically fixed on the fixing frame 6 through bolts and nuts, and the steering motor 7 is a stepping motor; a rotating frame 9 is arranged on the upper side of the steering motor 7, the rotating frame 9 is made of stainless steel, and the rotating frame 9 is fixedly connected with a rotating shaft of the steering motor 7 through bolts and nuts; the steering device 8 is used for rotating the rotating frame 9 to realize the position adjustment of the wafer; a plurality of air suction devices 11 are arranged on the rotating frame 9;
referring to fig. 3 to 4, in the embodiment of the present invention, the air suction device 11 includes an air cylinder 14, an air pump 12, and an air suction cup 13, the air cylinder 14 is vertically fixed on the rotating frame 9 through a bolt and a nut, the air suction cup 13 is disposed at a lower side of the air cylinder 14, and the air suction cup 13 is made of a plastic material; the air suction disc 13 is fixed on an air pressure push rod of the air cylinder 14 through bolts and nuts; the air suction disc 13 is connected with the air pump 12 through an air duct; the air suction disc 13 is used for sucking and grabbing the wafer; a plurality of processing cavities 5 are respectively arranged on two sides of the processing table 4, and a plasma processing device is arranged on each processing cavity 5; the size of the processing cavity 5 is equal to that of the wafer, and the processing cavity 5 is opposite to the air suction disc 13; the processing cavity 5 is used for etching and depositing the wafer; the air pump 12 is arranged on the rotating frame 9, and the air pump 12 is fixed on the fixed frame 6 through bolts and nuts; the air pump 12 is connected with the air cylinder 14 and the air suction disc 13 through an air guide pipe; the air pump 12 is used for supplying air to the air cylinder 14 and the air pump 12; the air suction device 11 is used for grabbing the wafer, so that the wafer can be conveniently rotated and conveyed;
when the wafer positioning device is used, a wafer is placed on the positioning plate and then is conveyed through the conveyor belt 2; after the wafer is conveyed to the position of the processing table 4 by the conveyor belt 2, the air suction disc 13 is pushed to move downwards by the air cylinder 14, the wafer is sucked and fixedly grabbed by the air suction disc 13, then the air cylinder 14 is reset, the rotating frame 9 is driven to rotate by the steering motor 7, the wafer is rotated to the position of the processing cavity 5, and then the air cylinder 14 pushes the air suction disc 13 to move downwards to place the wafer into the processing cavity 5; then, carrying out deposition etching on the wafer through the processing cavity 5; after etching is finished, the wafer is sucked and fixedly clamped through the air sucking disc 13, then the wafer is driven to rotate to the position of the positioning plate through the rotation of the steering motor 7, and the wafer is placed on the limiting plate 3; and then comes out through the conveyor belt 2.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (5)
1. A processing chamber for semiconductor processing equipment comprises a rack (1) and is characterized in that a conveyor belt (2) is arranged at the front part of the rack (1), a limiting plate (3) is arranged on the conveyor belt (2), and the limiting plate (3) is made of rubber; the front side of the conveyor belt (2) is provided with a processing table (4), two sides of the processing table (4) are respectively provided with a plasma etcher (10), each plasma etcher (10) comprises a steering device (8), an air suction device (11) and a processing cavity (5), each steering device (8) comprises a fixed frame (6), a steering motor (7) and a rotating frame (9), and each fixed frame (6) is fixed on the rack (1) through bolts and nuts; the steering motor (7) is vertically fixed on the fixed frame (6) through bolts and nuts; a rotating frame (9) is arranged on the upper side of the steering motor (7), and the rotating frame (9) is fixedly connected with a rotating shaft of the steering motor (7) through bolts and nuts; a plurality of air suction devices (11) are arranged on the rotating frame (9); the air suction device (11) comprises an air cylinder (14), an air pump (12) and an air suction disc (13), the air cylinder (14) is vertically fixed on the rotating frame (9) through bolts and nuts, and the air suction disc (13) is arranged on the lower side of the air cylinder (14); the air suction disc (13) is fixed on an air pressure push rod of the air cylinder (14) through bolts and nuts; the air suction disc (13) is connected with the air pump (12) through an air duct; a plurality of processing cavities (5) are respectively arranged on two sides of the processing table (4); an air pump (12) is arranged on the rotating frame (9), and the air pump (12) is fixed on the fixed frame (6) through bolts and nuts; the air pump (12) is connected with the air cylinder (14) and the air suction disc (13) through an air duct.
2. A process chamber for semiconductor process equipment according to claim 1, characterized in that the conveyor (2) is a rubber conveyor; the limiting plate (3) and the conveyor belt (2) are of an integrally formed structure.
3. The processing chamber for semiconductor processing equipment according to claim 1, wherein the limiting plate (3) is provided with a limiting groove; the size of the limiting groove is equal to the size of the wafer.
4. A process chamber for semiconductor processing equipment according to claim 1, characterized in that the steering motor (7) is a stepper motor; the rotating frame (9) is made of stainless steel.
5. A process chamber for semiconductor processing equipment according to claim 1, wherein the gas chuck (13) is of a plastic material; a plasma processing device is arranged on the processing cavity (5); the size of the processing cavity (5) is equal to that of the wafer, and the processing cavity (5) is opposite to the air suction disc (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922235250.4U CN210628241U (en) | 2019-12-13 | 2019-12-13 | Processing chamber for semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922235250.4U CN210628241U (en) | 2019-12-13 | 2019-12-13 | Processing chamber for semiconductor processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210628241U true CN210628241U (en) | 2020-05-26 |
Family
ID=70763920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922235250.4U Active CN210628241U (en) | 2019-12-13 | 2019-12-13 | Processing chamber for semiconductor processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210628241U (en) |
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2019
- 2019-12-13 CN CN201922235250.4U patent/CN210628241U/en active Active
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