CN210623018U

CN210623018U - Air pump for high-pressure spraying and cleaning of semiconductor chip

Info

Publication number: CN210623018U
Application number: CN201921266944.8U
Authority: CN
Inventors: 马磊
Original assignee: Weihai Aomou Intelligent Technology Co Ltd
Current assignee: Weihai Aomou Intelligent Technology Co Ltd
Priority date: 2019-08-07
Filing date: 2019-08-07
Publication date: 2020-05-26
Anticipated expiration: 2029-08-07

Abstract

The utility model discloses an air pump for high-pressure spraying and cleaning of a semiconductor chip, which comprises a boosting part and a driving part, wherein the boosting part is fixedly arranged on the front side of the driving part; the driving part comprises a front component, a rear component and a cylinder body, and the front component, the cylinder body and the rear component are sequentially arranged from front to back and are mechanically sealed; the air pump of the utility model can carry out high-pressure spray cleaning on the semiconductor chip with the processing procedure below 45nm, and the cleaning effect is better; and the air pump is set up by the cooperation of boost portion and drive division, and the volume of air pump is littleer, and weight is lighter, and does not need external energy storage ware energy supply, has that area is littleer, and the maintenance cost is lower advantage, is favorable to carrying out workshop management.

Description

Air pump for high-pressure spraying and cleaning of semiconductor chip

Technical Field

The utility model relates to a pump especially relates to a semiconductor chip high pressure sprays washs and uses air pump.

Background

After the semiconductor manufacturing process is upgraded, the cleaning frequency needs to be greatly improved, so that the demand of semiconductor cleaning equipment is increased, and the demand is in a stable increasing trend; with the 3D of the semiconductor structure, the cleaning effect is not only on the surface, but also the internal pollutants need to be cleaned under the condition of no damage, and the development of the market of cleaning equipment driven by the technical progress is continued for a long time.

The spraying cleaning technology is the mainstream under the current predictable technical condition, is used for the cleaning process among all procedures in the semiconductor industry, particularly the previous procedure, has good wafer cleaning effect, has no secondary pollution and becomes the core advantage, and the liquid medicine transmission and the spraying are realized by a pump. The existing pump is large in size and insufficient in energy supply, the use condition can be met by an external leather bag type energy accumulator, the maintenance cost is increased, the occupied area is large, and the workshop management is not facilitated, so that when the transmission of fluid is limited to a certain extent, parts need to be replaced frequently, and excessive maintenance and repair are caused, so that enterprise waste is caused; and with the continuous promotion of the manufacturing process of semiconductor wafers, the process is developed from 100nm to the process below 10nm, the improvement of the manufacturing process has geometric grade double-rise requirement on the cleaning performance, the existing pumps of different types have different application fields and application ranges, are not universal in all industries, have limitations, and the cleaning effect of the pump in the prior art in the process of spraying and cleaning semiconductor chips below 45nm is poor, so that the cleaning requirement of the semiconductor chips below 45nm can not be met. Therefore, there is a need for an air pump that can be used for high pressure spray cleaning of semiconductor chips with a thickness of 45nm or less.

SUMMERY OF THE UTILITY MODEL

In order to solve the defects of the prior art, the utility model provides an air pump for high-pressure spraying and cleaning of a semiconductor chip.

In order to solve the technical problem, the utility model discloses a technical scheme is: an air pump for high-pressure spray cleaning of a semiconductor chip comprises a boosting part and a driving part, wherein the boosting part is fixedly arranged on the front side of the driving part;

the driving part comprises a front component, a rear component and a cylinder body, and the front component, the cylinder body and the rear component are sequentially arranged from front to back and are mechanically sealed;

the top of the rear component is provided with an air inlet and an air outlet, and the inside of the rear component is provided with an air cylinder component; the air cylinder assembly comprises an air cylinder and an air guide rod, and the air guide rod is inserted in the air cylinder; the air cylinder is provided with an air hole A, and the air guide rod is provided with an air hole B; the front end surface of the rear component is provided with an air hole C;

a main shaft is transversely arranged at the center of the interior of the cylinder body, and a piston is fixedly arranged on the main shaft; the front end of the main shaft passes through the through hole in the center of the front component forwards and then enters the interior of the boosting part;

the boosting part comprises a boosting assembly, a boosting cylinder body and a moving assembly, the boosting assembly is arranged on the front side of the boosting cylinder body, and the boosting cylinder body is connected with the front assembly of the driving part through a connecting sleeve; the upper part and the right part of the boosting cylinder body are respectively provided with a liquid outlet hole and a liquid inlet hole; the floating assembly is arranged in the boosting cylinder body and is positioned at the front end of the main shaft; the left part and the right part of the boosting assembly are respectively provided with a liquid inlet assembly and a liquid outlet assembly, and a liquid outlet port of the liquid outlet assembly is communicated with a liquid inlet hole on the boosting cylinder body through a liquid outlet pipe.

Furthermore, the aperture of the air inlet hole is larger than that of the air hole A, and the aperture of the air hole A is larger than that of the air hole B.

Furthermore, the liquid inlet component is formed by sequentially arranging a liquid inlet port, a gasket, a leakage-proof washer, a check valve A, a pin A, a gear washer A and a spring A from left to right; the liquid outlet assembly is formed by sequentially arranging a check valve B, a pin B, a gear washer B, a spring B and a liquid outlet port from left to right.

The movable component comprises a gear screw and a cylinder, and the gear screw and the cylinder are sequentially sleeved on the main shaft from front to back; a gasket, a convex gasket, an O-shaped ring and a concave gasket are sequentially arranged between the gear screw and the cylinder from front to back, and the gasket, the convex gasket, the O-shaped ring and the concave gasket are all sleeved on the main shaft;

the front end of the main shaft is provided with a fixing hole, a pin is inserted into the fixing hole, and the head of the pin is buckled and then clamped with the teeth of the gear screw to fix the moving assembly at the front end of the main shaft.

Furthermore, threaded holes B corresponding to the positions are formed in the rear component and the front component, and the front component and the rear component are fixedly connected together through screws B inserted into the threaded holes B; the front assembly and the boosting assembly are provided with threaded holes A corresponding in position, and the boosting assembly and the front assembly are fixedly connected together through screws A inserted into the threaded holes A.

Furthermore, the lower part of the connecting sleeve is provided with a waste discharge hole.

The air pump of the utility model can carry out high-pressure spray cleaning on the semiconductor chip with the processing procedure below 45nm, and the cleaning effect is better; and the air pump is set up by the cooperation of boost portion and drive division, and the volume of air pump is littleer, and weight is lighter, and does not need external energy storage ware energy supply, has that area is littleer, and the maintenance cost is lower advantage, is favorable to carrying out workshop management.

Drawings

Fig. 1 is a schematic structural view of an air pump.

Fig. 2 is a bottom view of fig. 1.

Fig. 3 is an exploded view of fig. 1.

Fig. 4 is a top view of fig. 1.

Fig. 5 is a cross-sectional view of fig. 4.

Fig. 6 is a right side view of fig. 1.

Fig. 7 is a schematic view of the structure of the cylinder assembly.

Fig. 8 is a schematic structural view of the driving portion.

Fig. 9 is an exploded view of fig. 8.

Fig. 10 is a schematic structural diagram of the booster assembly.

Fig. 11 is a cross-sectional view of a booster assembly.

Fig. 12 is a schematic structural view of the play assembly.

Figure 13 is a cross-sectional view of the flyweight assembly.

FIG. 14 is a graph comparing the cleaning effect of semiconductor chips.

In the figure: 1. a front assembly; 2. a rear assembly; 3. a cylinder body; 4. a main shaft; 5. a piston; 6. a through hole; 7. a boost assembly; 8. a boosting cylinder body; 9. a swimming assembly; 10. a connecting sleeve; 11. a barrel; 12. A gasket; 13. a convex pad; 14. a concave pad; 15. an O-ring; 16. a fixing hole; 17. a pin; 18. A cylinder; 19. an air guide rod; 22. air holes A; 23. air holes B; 24. an air inlet; 25. an air outlet; 26. Air holes C; 27. a liquid outlet port; 28. a liquid inlet hole; 29. a liquid outlet hole; 30. a liquid inlet port; 31. a gasket; 32. a leak-proof gasket; 33. a check valve A; 34. a pin A; 35. a gear washer A; 36. a spring A; 37. a check valve B; 38. a pin B; 39. a gear washer B; 40. a spring B; 41. waste discharge holes; 42. a threaded hole B; 43. a screw B; 44. a threaded hole A; 45. a screw A; 46. gear screws.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

As shown in fig. 1 to 6, the air pump for high-pressure spray cleaning of a semiconductor chip comprises a pressure boosting part and a driving part, wherein the pressure boosting part is fixedly arranged at the front side of the driving part, and is used for boosting a low-pressure liquid into a high-pressure liquid and then spraying the high-pressure liquid from the air pump to perform high-pressure spray cleaning on the semiconductor chip.

As shown in fig. 8, the driving portion includes a front assembly 1, a rear assembly 2, and a cylinder 3, and the front assembly 1, the cylinder 3, and the rear assembly 2 are sequentially disposed from front to rear and mechanically sealed to ensure the sealing performance of the driving portion.

As shown in fig. 7, the top of the rear assembly 2 is provided with an air inlet 24 and an air outlet 25, and the inside of the rear assembly 2 is provided with a cylinder assembly; the cylinder assembly comprises a cylinder 18 and an air guide rod 19, and the air guide rod 19 is inserted in the cylinder 18; the cylinder 18 is provided with an air hole A22, and the air guide rod 19 is provided with an air hole B23; the front end surface of the rear component 2 is provided with an air hole C26; the aperture of the air inlet hole 24 is larger than that of the air hole A22, and the aperture of the air hole A22 is larger than that of the air hole B23.

As shown in fig. 9, a main shaft 4 is transversely arranged at the center of the interior of the cylinder 3, and a piston 5 is fixedly arranged on the main shaft 4; the front end of the main shaft 4 passes through the through hole 6 at the center of the front component 1 forwards and enters the interior of the boosting part.

As shown in fig. 3, the booster unit includes a booster unit 7, a booster cylinder 8, and a traveling unit 9, the booster unit 7 is provided on the front side of the booster cylinder 8, and the booster cylinder 8 is connected to the front unit 1 of the drive unit via a connecting sleeve 10.

The upper part and the right part of the boosting cylinder body 8 are respectively provided with a liquid outlet 29 and a liquid inlet 28; the floating assembly 9 is arranged inside the boosting cylinder body 8, and the floating assembly 9 is positioned at the front end of the main shaft 4; as shown in fig. 12 and 13, the traveling assembly 9 includes a gear screw 46 and a cylinder 11, and the gear screw 46 and the cylinder 11 are sequentially sleeved on the main shaft 4 from front to back; a gasket 12, a convex gasket 13, an O-shaped ring 15 and a concave gasket 14 are sequentially arranged between the gear screw 46 and the cylinder 11 from front to back, and the gasket 12, the convex gasket 13, the O-shaped ring 15 and the concave gasket 14 are all sleeved on the main shaft 4; the front end of the main shaft 4 is provided with a fixing hole 16, a pin 17 is inserted in the fixing hole 16, and the head of the pin 17 is buckled and then clamped with the teeth of the gear screw 46 to fix the floating assembly 9 at the front end of the main shaft 4.

As shown in fig. 10 and 11, the left part and the right part of the boosting assembly 7 are respectively provided with a liquid inlet assembly and a liquid outlet assembly, and a liquid outlet port 27 of the liquid outlet assembly is communicated with a liquid inlet hole 28 on the boosting cylinder 8 through a liquid outlet pipe. The liquid inlet component is formed by sequentially arranging a liquid inlet port 30, a gasket 31, a leakage-proof gasket 32, a check valve A33, a pin A34, a gear gasket A35 and a spring A36 from left to right; the liquid outlet assembly is formed by sequentially arranging a check valve B37, a pin B38, a gear washer B39, a spring B40 and a liquid outlet port 27 from left to right.

As shown in fig. 3 and 9, the rear module 2 and the front module 1 are respectively provided with a threaded hole B42 at a corresponding position, and a screw B43 inserted into the threaded hole B42 fixedly connects the front module 1 and the rear module 2 together; the front assembly 1 and the pressure boosting assembly 7 are respectively provided with a threaded hole A44 corresponding to each other in position, and the pressure boosting assembly 7 and the front assembly 1 are fixedly connected together through a screw A45 inserted in the threaded hole A44.

The working method of the air pump for high-pressure spray cleaning of the semiconductor chip comprises the following steps:

introducing low-pressure gas into the air pump through the gas inlet hole 24, and introducing low-pressure liquid into the air pump through the liquid inlet component; low-pressure gas enters the rear component 2 from the gas inlet hole 24 and then enters the cylinder component for pressurizing twice; low-pressure gas enters the rear component 2 through the gas inlet hole 24, then enters the cylinder 18 through the gas hole A22, and contacts with the gas guide rod 19 to drive the gas guide rod 19 to rotate; because the aperture of the air inlet hole 24 is larger than that of the air hole A22, the low-pressure air enters the air hole A22 from the air inlet hole 24 to complete the first pressurization; the gas after primary pressurization enters the air guide rod 19 through the gas hole B23, and the aperture of the gas hole A22 is larger than that of the gas hole B23, so that the gas after primary pressurization enters the gas hole B23 from the gas hole A22 to complete secondary pressurization, and high-pressure gas is obtained; when the air guide rod 19 rotates to enable the air hole B23 to be communicated with the air hole C26, high-pressure air flows into the cylinder 3 from the air guide rod 19 through the air hole C26 to push the piston 5 to move forwards, the piston 5 moves to drive the main shaft 4 to move forwards, and further the floating assembly 9 is driven to move forwards in the boosting cylinder 8;

the low-pressure liquid enters the boosting assembly 7 from the liquid inlet assembly and then flows out from the liquid outlet port 27 of the liquid outlet assembly, and flows into the boosting cylinder 8 from the liquid inlet hole 28 through the liquid outlet pipe; at the moment, the swimming assembly 9 moves forwards in the boosting cylinder 8 to generate pulses for the low-pressure liquid in the boosting cylinder 8, and the low-pressure liquid is pressurized to obtain high-pressure liquid; the high-pressure liquid in the boosting cylinder 8 is sprayed out from the liquid outlet hole 29 to carry out high-pressure spraying cleaning on the semiconductor chip.

The high-pressure gas pushes the piston 5 to move to drive the moving component 9 to generate pulse to the low-pressure liquid, so that the low-pressure liquid is pressurized to obtain high-pressure liquid, and the high-pressure liquid is sprayed out from the liquid outlet hole 29; this carries out the in-process of pressurizeing to low pressure liquid and has consumed high-pressure gas's energy, so produced the negative pressure at piston 5's rear side, piston 5 is being promoted and is moving backward, and gas in the cylinder body 3 is discharged from venthole 25, and meanwhile the outside low pressure liquid of air pump passes through the feed liquor subassembly and is inhaled the air pump in, continues to let in low-pressure gas from inlet port 24, begins next duty cycle, the utility model discloses an air pump can carry out the high pressure spray in succession to semiconductor chip and wash.

As shown in fig. 2, the connection of the booster cylinder 8 and the front assembly 1 through the connecting sleeve 10 ensures the sealing property therebetween; waste discharge hole 41 has been seted up to the lower part of connecting sleeve 10, when the subassembly 9 that moves about in the cylinder body 8 that steps up takes place to damage, the leakproofness between cylinder body 8 and the connecting sleeve 10 that steps up is destroyed, and the liquid in the cylinder body 8 that steps up can be followed waste discharge hole 41 and flowed out, and the staff has liquid outflow through observing waste discharge hole 41 and just can know that the subassembly 9 that moves about has damaged and can in time change the damage part.

The utility model discloses an air pump can carry out the high pressure to the semiconductor chip and spray the washing, and the cleaning performance is better. As shown in fig. 14, fig. 14 is a comparison graph of the cleaning effect of the semiconductor chip, showing the difference between the cleaning machine using the air pump of the present invention and the cleaning machine using the pump of the prior art, and the micro-particles remained on the chip after the semiconductor chip is cleaned. In the figure, pattern wafer Clean Performance means a wafer cleaning effect, i.e., a cleaning effect of a semiconductor chip; the ordinate of the line graph represents the particle number of the micro-particles, the abscissa represents the number of the semiconductor chips in the chip box, namely L1 represents that one semiconductor chip is in the chip box, L3 represents that three semiconductor chips are in the chip box, and the cleaning machine cleans the semiconductor chips in the chip box; before in the table represents data for cleaning the semiconductor chip using the cleaning machine of the prior art pump, and after represents data for cleaning the semiconductor chip using the cleaning machine of the present invention. The washer used in the test was a TEL (Tokyo Electron Ltd, Tokyo electronics Ltd) washer and the prior art pump was a bellows pump.

The cleaning machine adopting the pump in the prior art is used for cleaning the semiconductor chip at low pressure, has poor cleaning effect, has more residual micro-particles on the semiconductor chip, and can not meet the cleaning requirement of the semiconductor chip with the processing procedure below 45 nm; as can be seen from fig. 14, when the cleaning machine of the air pump of the present invention is used to perform high-pressure spray cleaning on semiconductor chips, the number of remaining micro-particles on the semiconductor chips is significantly reduced compared with the spray cleaning using the pump of the prior art, and the air pump of the present invention has a better cleaning effect on the semiconductor chips; and the utility model discloses an air pump is by the cooperation setting of splenium and drive division, and the volume of air pump is littleer, and weight is lighter, and does not need external energy storage ware energy supply, and it is littleer to have area, and the lower advantage of maintenance cost is favorable to carrying out workshop management.

The above embodiments are not intended to limit the present invention, and the present invention is not limited to the above examples, and the technical personnel in the technical field are in the present invention, which can also belong to the protection scope of the present invention.

Claims

1. An air pump for high-pressure spray cleaning of a semiconductor chip is characterized in that: the device comprises a boosting part and a driving part, wherein the boosting part is fixedly arranged on the front side of the driving part;

the driving part comprises a front component (1), a rear component (2) and a cylinder body (3), and the front component (1), the cylinder body (3) and the rear component (2) are sequentially arranged from front to back and are mechanically sealed;

the top of the rear component (2) is provided with an air inlet (24) and an air outlet (25), and the inside of the rear component (2) is provided with an air cylinder component; the air cylinder assembly comprises an air cylinder (18) and an air guide rod (19), and the air guide rod (19) is inserted into the air cylinder (18); the air cylinder (18) is provided with an air hole A (22), and the air guide rod (19) is provided with an air hole B (23); an air hole C (26) is formed in the front end face of the rear component (2);

a main shaft (4) is transversely arranged at the center of the interior of the cylinder body (3), and a piston (5) is fixedly arranged on the main shaft (4); the front end of the main shaft (4) penetrates through a through hole (6) in the center of the front component (1) forwards and then enters the interior of the boosting part;

the boosting part comprises a boosting assembly (7), a boosting cylinder body (8) and a moving assembly (9), the boosting assembly (7) is arranged on the front side of the boosting cylinder body (8), and the boosting cylinder body (8) is connected with the front assembly (1) of the driving part through a connecting sleeve (10); the upper part and the right part of the boosting cylinder body (8) are respectively provided with a liquid outlet hole (29) and a liquid inlet hole (28); the moving assembly (9) is arranged in the boosting cylinder body (8) and the moving assembly (9) is positioned at the front end of the main shaft (4); the left part and the right part of the boosting assembly (7) are respectively provided with a liquid inlet assembly and a liquid outlet assembly, and a liquid outlet port (27) of the liquid outlet assembly is communicated with a liquid inlet hole (28) on the boosting cylinder body (8) through a liquid outlet pipe.

2. The air pump for high-pressure spray cleaning of semiconductor chips according to claim 1, characterized in that: the aperture of the air inlet hole (24) is larger than that of the air hole A (22), and the aperture of the air hole A (22) is larger than that of the air hole B (23).

3. The air pump for high-pressure spray cleaning of semiconductor chips according to claim 2, characterized in that: the liquid inlet assembly is formed by sequentially arranging a liquid inlet port (30), a gasket (31), a leakage-proof gasket (32), a check valve A (33), a pin A (34), a gear gasket A (35) and a spring A (36) from left to right; the liquid outlet assembly is formed by sequentially arranging a check valve B (37), a pin B (38), a gear washer B (39), a spring B (40) and a liquid outlet port (27) from left to right.

4. The air pump for high-pressure spray cleaning of semiconductor chips according to claim 3, wherein: the moving assembly (9) comprises a gear screw (46) and a cylinder body (11), and the gear screw (46) and the cylinder body (11) are sequentially sleeved on the main shaft (4) from front to back; a gasket (12), a convex gasket (13), an O-shaped ring (15) and a concave gasket (14) are sequentially arranged between the gear screw (46) and the barrel body (11) from front to back, and the gasket (12), the convex gasket (13), the O-shaped ring (15) and the concave gasket (14) are all sleeved on the main shaft (4);

the front end of the main shaft (4) is provided with a fixing hole (16), a pin (17) is inserted into the fixing hole (16), and the head of the pin (17) is buckled and then clamped with the teeth of the gear screw (46) to fix the moving assembly (9) at the front end of the main shaft (4).

5. The air pump for high-pressure spray cleaning of semiconductor chips according to claim 4, wherein: threaded holes B (42) corresponding to the positions of the rear component (2) and the front component (1) are formed in the rear component (2) and the front component (2), and the front component (1) and the rear component (2) are fixedly connected together through screws B (43) inserted into the threaded holes B (42); threaded holes A (44) corresponding in position are formed in the front assembly (1) and the boosting assembly (7), and the boosting assembly (7) is fixedly connected with the front assembly (1) through screws A (45) inserted into the threaded holes A (44).

6. The air pump for high-pressure spray cleaning of semiconductor chips according to claim 5, wherein: the lower part of the connecting sleeve (10) is provided with a waste discharge hole (41).