CN110318979B - Air pump and method for high-pressure spray cleaning of semiconductor chip - Google Patents
Air pump and method for high-pressure spray cleaning of semiconductor chip Download PDFInfo
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- CN110318979B CN110318979B CN201910723832.9A CN201910723832A CN110318979B CN 110318979 B CN110318979 B CN 110318979B CN 201910723832 A CN201910723832 A CN 201910723832A CN 110318979 B CN110318979 B CN 110318979B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 53
- 239000004065 semiconductor Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000007921 spray Substances 0.000 title claims abstract description 21
- 239000007788 liquid Substances 0.000 claims description 92
- 238000007667 floating Methods 0.000 claims description 8
- 239000002699 waste material Substances 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims description 6
- 230000009182 swimming Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 12
- 238000012423 maintenance Methods 0.000 abstract description 6
- 238000004146 energy storage Methods 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract description 2
- 239000011859 microparticle Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
- F04B37/10—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
- F04B37/12—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high pressure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B39/00—Component parts, details, or accessories, of pumps or pumping systems specially adapted for elastic fluids, not otherwise provided for in, or of interest apart from, groups F04B25/00 - F04B37/00
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Infusion, Injection, And Reservoir Apparatuses (AREA)
Abstract
The invention discloses an air pump and a method for high-pressure spray cleaning of a semiconductor chip, wherein the air pump comprises a boosting part and a driving part, and the boosting part is fixedly arranged at the front side of the driving part; the driving part comprises a front component, a rear component and a cylinder body, and the front component, the cylinder body and the rear component are sequentially arranged from front to back and are mechanically sealed; the working method of the air pump is characterized in that the high-pressure spray cleaning of the semiconductor chip is finished through a plurality of steps; the air pump can carry out high-pressure spray cleaning on the semiconductor chip below 45nm in the process, and the cleaning effect is better; and the air pump is set up by the cooperation of portion of stepping up and drive division, and the volume of air pump is littleer, and weight is lighter, and does not need external energy storage ware energy supply, has area littleer, and maintenance cost is lower advantage, is favorable to carrying out workshop management.
Description
Technical Field
The invention relates to a pump and a method, in particular to an air pump and a method for high-pressure spray cleaning of a semiconductor chip.
Background
The cleaning frequency of the semiconductor is required to be greatly improved after the semiconductor manufacturing process is upgraded, so that the requirement of semiconductor cleaning equipment is increased, and the requirement amount is in a stable growing trend; and with the 3D of the semiconductor structure, the cleaning effect is not only on the surface, but also the internal pollutants need to be cleaned under the non-destructive condition, and the development of the market of cleaning equipment by the driving of technical progress is continuous for a long time.
The spray cleaning technology is the main stream under the current predictable technical condition, is used for cleaning processes among various processes in the semiconductor industry, particularly the front process, has good wafer cleaning effect, does not have secondary pollution and becomes a core advantage, and the liquid medicine transmission and spraying are realized by a pump. The existing pump has large volume and insufficient energy supply, the external leather bag type energy accumulator is required to reach the use condition, the maintenance cost is increased, the occupied area is large, and the workshop management is not facilitated, so when the fluid transmission is limited, the parts are required to be replaced frequently, and excessive maintenance and maintenance are caused, so that the enterprise waste is caused; with the continuous progress of the process of manufacturing the semiconductor wafer, the process is developed from 100nm to below 10nm, the geometric level of the process is improved for the cleaning performance requirement, the existing pumps of different types have different application fields and application ranges, are not universal in all industries, have limitations, have poor cleaning effect when the pump of the prior art sprays to clean the semiconductor chips below 45nm, and cannot meet the cleaning requirement of the process below 45 nm. Therefore, there is a need for an air pump that can be used for high pressure shower cleaning of semiconductor chips below 45 nm.
Disclosure of Invention
In order to solve the defects of the technology, the invention provides an air pump and a method for high-pressure spray cleaning of a semiconductor chip.
In order to solve the technical problems, the invention adopts the following technical scheme: the air pump for high-pressure spray cleaning of the semiconductor chip comprises a boosting part and a driving part, wherein the boosting part is fixedly arranged at the front side of the driving part;
the driving part comprises a front component, a rear component and a cylinder body, and the front component, the cylinder body and the rear component are sequentially arranged from front to back and are mechanically sealed;
The top of the rear component is provided with an air inlet hole and an air outlet hole, and the inside of the rear component is provided with an air cylinder component; the air cylinder assembly comprises an air cylinder and an air guide rod, and the air guide rod is inserted into the air cylinder; the air cylinder is provided with an air hole A, and the air guide rod is provided with an air hole B; the front end face of the rear component is provided with an air hole C; the aperture of the air inlet hole is larger than that of the air hole A, and the aperture of the air hole A is larger than that of the air hole B;
a main shaft is transversely arranged at the center of the interior of the cylinder body, and a piston is fixedly arranged on the main shaft; the front end of the main shaft passes through a through hole in the center of the front assembly and then enters the interior of the boosting part;
The boosting part comprises a boosting component, a boosting cylinder body and a swimming component, the boosting component is arranged at the front side of the boosting cylinder body, and the boosting cylinder body is connected with the front component of the driving part through a connecting sleeve; the upper part and the right part of the boosting cylinder body are respectively provided with a liquid outlet hole and a liquid inlet hole; the floating component is arranged in the boosting cylinder body and is positioned at the front end of the main shaft; the left part and the right part of the boosting component are respectively provided with a liquid inlet component and a liquid outlet component, and a liquid outlet port of the liquid outlet component is communicated with a liquid inlet hole on the boosting cylinder body through a liquid outlet pipe;
The liquid inlet component is formed by sequentially arranging a liquid inlet port, a gasket, a leakage-proof gasket, a return stop valve A, a pin A, a gear gasket A and a spring A from left to right; the liquid outlet component is formed by arranging a return valve B, a pin B, a gear washer B, a spring B and a liquid outlet port in sequence from left to right; the floating assembly comprises a gear screw and a cylinder body, and the gear screw and the cylinder body are sequentially sleeved on the main shaft from front to back;
further, a fixing hole is formed in the front end of the main shaft, a pin is inserted into the fixing hole, and after the head of the pin is bent, the pin is clamped with teeth of the gear screw to fix the floating assembly at the front end of the main shaft.
Further, screw holes B corresponding to the positions are formed in the rear assembly and the front assembly, and screws B inserted into the screw holes B fixedly connect the front assembly and the rear assembly together; screw rod A inserted in screw hole A is in fixed connection with the front assembly.
Further, waste discharging holes are formed in the lower portion of the connecting sleeve.
The working method of the air pump for high-pressure spray cleaning of the semiconductor chip comprises the following steps:
Low-pressure gas is introduced into the air pump through the air inlet hole, and low-pressure liquid is introduced into the air pump through the liquid inlet component; the low-pressure gas enters the rear assembly from the air inlet hole and then enters the cylinder assembly for pressurization twice; the low-pressure gas enters the rear assembly through the air hole A and then enters the cylinder through the air hole A, and contacts with the air guide rod to drive the air guide rod to rotate; because the aperture of the air inlet hole is larger than that of the air hole A, low-pressure air enters the air hole A from the air inlet hole to complete the first pressurization; the gas after primary pressurization enters the gas guide rod through the gas hole B, and the aperture of the gas hole A is larger than that of the gas hole B, so that the gas after primary pressurization enters the gas hole B from the gas hole A to complete secondary pressurization, and high-pressure gas is obtained; when the air guide rod rotates to enable the air hole B to be communicated with the air hole C, high-pressure air flows into the cylinder body from the air guide rod through the air hole C to push the piston to move forwards, the piston moves to drive the main shaft to move forwards, and then the movable assembly is driven to move forwards in the boosting cylinder body;
The low-pressure liquid flows out from a liquid outlet port of the liquid outlet assembly after entering the pressure boosting assembly from the liquid inlet assembly, and flows into the pressure boosting cylinder body from the liquid inlet hole through the liquid outlet pipe; at the moment, the swimming component moves forwards in the boosting cylinder body to generate pulses for low-pressure liquid in the boosting cylinder body, and the low-pressure liquid is pressurized to obtain high-pressure liquid; and high-pressure liquid in the pressure boosting cylinder body is sprayed out from the liquid outlet hole to carry out high-pressure spray cleaning on the semiconductor chip.
The air pump can carry out high-pressure spray cleaning on the semiconductor chip below 45nm in the process, and the cleaning effect is better; and the air pump is set up by the cooperation of portion of stepping up and drive division, and the volume of air pump is littleer, and weight is lighter, and does not need external energy storage ware energy supply, has area littleer, and maintenance cost is lower advantage, is favorable to carrying out workshop management.
Drawings
Fig. 1 is a schematic structural view of an air pump.
Fig. 2 is a bottom view of fig. 1.
Fig. 3 is an exploded view of fig. 1.
Fig. 4 is a top view of fig. 1.
Fig. 5 is a cross-sectional view of fig. 4.
Fig. 6 is a right side view of fig. 1.
Fig. 7 is a schematic structural view of the cylinder assembly.
Fig. 8 is a schematic structural view of the driving section.
Fig. 9 is an exploded view of fig. 8.
Fig. 10 is a schematic structural diagram of the boosting assembly.
Fig. 11 is a cross-sectional view of a boost assembly.
Fig. 12 is a schematic structural view of the swimming assembly.
Fig. 13 is a cross-sectional view of the traveling assembly.
Fig. 14 is a graph showing the comparison of the cleaning effect of semiconductor chips.
In the figure: 1. a front assembly; 2. a rear assembly; 3. a cylinder; 4. a main shaft; 5. a piston; 6. ; 7. a boost assembly; 8. a boost cylinder; 9. a swimming assembly; 10. a connecting sleeve; 11. a cylinder; 12. a gasket; 13. a convex gasket; 14. a concave gasket; 15. an O-ring; 16. a fixing hole; 17. a pin; 18. a cylinder; 19. an air guide rod; 22. an air hole A; 23. an air hole B; 24. an air inlet hole; 25. an air outlet hole; 26. an air hole C; 27. a liquid outlet port; 28. a liquid inlet hole; 29. a liquid outlet hole; 30. a liquid inlet port; 31. a gasket; 32. a leak-proof gasket; 33. a check valve A; 34. a pin A; 35. a gear washer A; 36. a spring A; 37. a check valve B; 38. a pin B; 39. a gear washer B; 40. a spring B; 41. waste discharging holes; 42. a threaded hole B; 43. a screw B; 44. a threaded hole A; 45. screw a.
Detailed Description
The invention will be described in further detail with reference to the drawings and the detailed description.
As shown in fig. 1-6, the air pump for high-pressure spray cleaning of semiconductor chips comprises a pressure increasing part and a driving part, wherein the pressure increasing part is fixedly arranged at the front side of the driving part and is used for increasing pressure of low-pressure liquid into high-pressure liquid and then spraying the high-pressure liquid from the air pump to clean the semiconductor chips.
As shown in fig. 8, the driving part includes a front assembly 1, a rear assembly 2, and a cylinder 3, and the front assembly 1, the cylinder 3, and the rear assembly 2 are sequentially disposed from front to back and mechanically sealed to ensure tightness of the driving part.
As shown in fig. 7, the top of the rear component 2 is provided with an air inlet hole 24 and an air outlet hole 25, and the interior of the rear component 2 is provided with a cylinder component; the cylinder assembly comprises a cylinder 18 and an air guide rod 19, and the air guide rod 19 is inserted into the cylinder 18; the air cylinder 18 is provided with an air hole A22, and the air guide rod 19 is provided with an air hole B23; the front end surface of the rear component 2 is provided with an air hole C26; the aperture of the air inlet 24 is larger than that of the air hole A22, and the aperture of the air hole A22 is larger than that of the air hole B23.
As shown in fig. 9, a main shaft 4 is transversely arranged at the inner center of the cylinder body 3, and a piston 5 is fixedly arranged on the main shaft 4; the front end of the spindle 4 passes forward through a through hole 6 in the centre of the front assembly 1 and into the interior of the booster.
As shown in fig. 3, the pressure increasing section includes a pressure increasing block 7, a pressure increasing cylinder 8, and a traveling block 9, the pressure increasing block 7 is provided on the front side of the pressure increasing cylinder 8, and the pressure increasing cylinder 8 is connected to the front block 1 of the driving section through a connecting sleeve 10.
The upper part and the right part of the boosting cylinder body 8 are respectively provided with a liquid outlet 29 and a liquid inlet 28; the floating assembly 9 is arranged in the pressure boosting cylinder body 8, and the floating assembly 9 is positioned on the front end of the main shaft 4; as shown in fig. 12 and 13, the traveling assembly 9 comprises a gear screw and a cylinder 11, and the gear screw and the cylinder 11 are sleeved on the main shaft 4 in sequence from front to back; a gasket 12, a convex gasket 13, an O-shaped ring 15 and a concave gasket 14 are sequentially arranged between the gear screw and the cylinder 11 from front to back, and the gasket 12, the convex gasket 13, the O-shaped ring 15 and the concave gasket 14 are sleeved on the main shaft 4; the front end of the main shaft 4 is provided with a fixing hole 16, a pin 17 is inserted in the fixing hole 16, and the head of the pin 17 is buckled and then is engaged with the teeth of the gear screw to fix the floating assembly 9 at the front end of the main shaft 4.
As shown in fig. 10 and 11, the left part and the right part of the pressure boosting assembly 7 are respectively provided with a liquid inlet assembly and a liquid outlet assembly, and a liquid outlet port 27 of the liquid outlet assembly is communicated with a liquid inlet hole 28 on the pressure boosting cylinder body 8 through a liquid outlet pipe. The liquid inlet component is formed by sequentially arranging a liquid inlet port 30, a gasket 31, a leakage-proof gasket 32, a return valve A33, a pin A34, a gear gasket A35 and a spring A36 from left to right; the liquid outlet assembly is composed of a check valve B37, a pin B38, a gear washer B39, a spring B40 and a liquid outlet port 27 which are sequentially arranged from left to right.
As shown in fig. 3 and 9, the rear component 2 and the front component 1 are provided with threaded holes B42 corresponding to each other, and a screw rod B43 inserted into the threaded holes B42 fixedly connects the front component 1 and the rear component 2 together; screw A44 corresponding to the positions is arranged on the front assembly 1 and the booster assembly 7, and screw A45 inserted into the screw A44 fixedly connects the booster assembly 7 with the front assembly 1.
The working method of the air pump for high-pressure spray cleaning of the semiconductor chip comprises the following steps:
Low-pressure gas is introduced into the air pump through the air inlet hole 24, and low-pressure liquid is introduced into the air pump through the liquid inlet assembly; the low-pressure gas enters the rear assembly 2 from the air inlet hole 24 and then enters the cylinder assembly for pressurization twice; the low-pressure gas enters the rear assembly 2 through the air hole A22 and then enters the air cylinder 18 through the air inlet hole 24, and contacts the air guide rod 19 to drive the air guide rod 19 to rotate; since the aperture of the air inlet 24 is larger than that of the air hole A22, the low-pressure air enters the air hole A22 from the air inlet 24 to complete the first pressurization; the gas after primary pressurization enters the air guide rod 19 through the air hole B23, and the aperture of the air hole A22 is larger than that of the air hole B23, so that the gas after primary pressurization enters the air hole B23 from the air hole A22 to complete secondary pressurization, and high-pressure gas is obtained; when the air guide rod 19 rotates to enable the air hole B23 to be communicated with the air hole C26, high-pressure air flows into the cylinder body 3 from the air guide rod 19 through the air hole C26 to push the piston 5 to move forwards, the piston 5 moves to drive the main shaft 4 to move forwards, and then the travelling assembly 9 is driven to move forwards in the boosting cylinder body 8;
The low-pressure liquid flows out from a liquid outlet port 27 of the liquid outlet assembly after entering the pressure boosting assembly 7, and flows into the pressure boosting cylinder body 8 from a liquid inlet hole 28 through a liquid outlet pipe; at this time, the traveling assembly 9 moves forward in the booster cylinder 8 to generate a pulse to the low-pressure liquid in the booster cylinder 8, so as to pressurize the low-pressure liquid and obtain high-pressure liquid; the high-pressure liquid in the pressure boosting cylinder 8 is sprayed out from the liquid outlet 29 to perform high-pressure spray cleaning on the semiconductor chip.
The high-pressure gas pushes the piston 5 to move so as to drive the traveling assembly 9 to pulse the low-pressure liquid, so that the low-pressure liquid is pressurized to obtain high-pressure liquid, and the high-pressure liquid is sprayed out from the liquid outlet 29; the energy of high-pressure gas is consumed in the process of pressurizing the low-pressure liquid, so that negative pressure is generated at the rear side of the piston 5, the piston 5 is pushed to move backwards, the gas in the cylinder 3 is discharged from the gas outlet hole 25, meanwhile, the low-pressure liquid outside the air pump is sucked into the air pump through the liquid inlet assembly, the low-pressure gas is continuously introduced from the gas inlet hole 24, and the next working cycle is started.
As shown in fig. 2, the connection of the booster cylinder 8 with the front assembly 1 by the connecting sleeve 10 ensures the tightness between the two; the waste discharging hole 41 is formed in the lower portion of the connecting sleeve 10, when the movable assembly 9 in the boosting cylinder body 8 is damaged, the sealing performance between the boosting cylinder body 8 and the connecting sleeve 10 is damaged, liquid in the boosting cylinder body 8 flows out of the waste discharging hole 41, and workers can know that the movable assembly 9 is damaged and can replace damaged components in time by observing that the waste discharging hole 41 is provided with liquid.
The air pump can perform high-pressure spray cleaning on the semiconductor chip, and has better cleaning effect. As shown in fig. 14, fig. 14 is a graph comparing the cleaning effect of semiconductor chips, showing the difference of the residual micro particles on the chips after cleaning the semiconductor chips between the cleaning machine using the air pump of the present invention and the cleaning machine using the pump of the related art. In the figure, PATTERN WAFER CLEAN Performance means a wafer cleaning effect, i.e., a cleaning effect of the semiconductor chip; the ordinate of the line graph represents the particle number of the micro particles, the abscissa represents the number of the semiconductor chips in the chip box, namely, L1 represents one semiconductor chip in the chip box, L3 represents three semiconductor chips in the chip box, and the cleaning machine cleans the semiconductor chips in the chip box; in the table, before represents data for cleaning semiconductor chips by using a cleaner of the prior art pump, after represents data for cleaning semiconductor chips by using a cleaner of the air pump of the present invention. The washer used in the test was a TEL (Tokyo Electron Ltd, tokyo electronics limited) washer and the prior art pump was a bellows pump.
The cleaning machine adopting the pump in the prior art is used for cleaning the semiconductor chip at low pressure, the cleaning effect is poor, and the residual micro-particles on the semiconductor chip are more, so that the cleaning requirement of the semiconductor chip below 45nm in the process can not be met; as can be seen from fig. 14, the number of the micro particles remained on the semiconductor chip is significantly reduced after the high-pressure spray cleaning of the semiconductor chip by the cleaning machine using the air pump of the present invention, compared with the spray cleaning using the pump of the prior art, the cleaning effect of the air pump of the present invention is better; the air pump is arranged by matching the pressure boosting part and the driving part, has smaller volume and lighter weight, does not need an external energy accumulator for energy supply, has the advantages of smaller occupied area and lower maintenance cost, and is beneficial to workshop management.
The above embodiments are not intended to limit the present invention, and the present invention is not limited to the above examples, but is also intended to be limited to the following claims.
Claims (5)
1. An air pump for high-pressure spray cleaning of a semiconductor chip is characterized in that: the device comprises a boosting part and a driving part, wherein the boosting part is fixedly arranged at the front side of the driving part;
The driving part comprises a front assembly (1), a rear assembly (2) and a cylinder body (3), wherein the front assembly (1), the cylinder body (3) and the rear assembly (2) are sequentially arranged from front to back and are mechanically sealed;
An air inlet hole (24) and an air outlet hole (25) are formed in the top of the rear assembly (2), and an air cylinder assembly is arranged in the rear assembly (2); the air cylinder assembly comprises an air cylinder (18) and an air guide rod (19), and the air guide rod (19) is inserted into the air cylinder (18); an air hole A (22) is formed in the air cylinder (18), and an air hole B (23) is formed in the air guide rod (19); an air hole C (26) is formed in the front end face of the rear assembly (2); the aperture of the air inlet hole (24) is larger than that of the air hole A (22), and the aperture of the air hole A (22) is larger than that of the air hole B (23);
a main shaft (4) is transversely arranged at the inner center of the cylinder body (3), and a piston (5) is fixedly arranged on the main shaft (4); the front end of the main shaft (4) passes through a through hole (6) at the center of the front assembly (1) forwards and then enters the interior of the boosting part;
The boosting part comprises a boosting assembly (7), a boosting cylinder body (8) and a traveling assembly (9), wherein the boosting assembly (7) is arranged at the front side of the boosting cylinder body (8), and the boosting cylinder body (8) is connected with the front assembly (1) of the driving part through a connecting sleeve (10); the upper part and the right part of the pressure boosting cylinder body (8) are respectively provided with a liquid outlet hole (29) and a liquid inlet hole (28); the floating assembly (9) is arranged in the pressure boosting cylinder body (8), and the floating assembly (9) is positioned at the front end of the main shaft (4); the left part and the right part of the pressure boosting assembly (7) are respectively provided with a liquid inlet assembly and a liquid outlet assembly, and a liquid outlet port (27) of the liquid outlet assembly is communicated with a liquid inlet hole (28) on the pressure boosting cylinder body (8) through a liquid outlet pipe;
The liquid inlet assembly is formed by sequentially arranging a liquid inlet port (30), a gasket (31), a leakage-proof gasket (32), a return stop valve A (33), a pin A (34), a gear gasket A (35) and a spring A (36) from left to right; the liquid outlet component is formed by sequentially arranging a return valve B (37), a pin B (38), a gear washer B (39), a spring B (40) and a liquid outlet port (27) from left to right; the moving assembly (9) comprises a gear screw and a cylinder body (11), and the gear screw and the cylinder body (11) are sequentially sleeved on the main shaft (4) from front to back.
2. The air pump for high-pressure shower cleaning of semiconductor chips as defined in claim 1, wherein: the front end of the main shaft (4) is provided with a fixing hole (16), a pin (17) is inserted in the fixing hole (16), and the head of the pin (17) is buckled and then is engaged with the tooth phase of the gear screw to fix the movable component (9) at the front end of the main shaft (4).
3. The air pump for high-pressure shower cleaning of semiconductor chips as defined in claim 2, wherein: screw rods B (43) inserted in the screw holes B (42) fixedly connect the front assembly (1) with the rear assembly (2); screw holes A (44) corresponding to the positions are formed in the front assembly (1) and the boosting assembly (7), and a screw rod A (45) inserted into the screw holes A (44) fixedly connects the boosting assembly (7) with the front assembly (1).
4. The air pump for high-pressure shower cleaning of semiconductor chips as defined in claim 3, wherein: the lower part of the connecting sleeve (10) is provided with a waste discharging hole (41).
5. A method of operating an air pump for high pressure shower cleaning of semiconductor chips as defined in any one of claims 2 to 4, characterized by: the working method comprises the following steps:
Low-pressure gas is introduced into the air pump through the air inlet hole (24), and low-pressure liquid is introduced into the air pump through the liquid inlet component; the low-pressure gas enters the rear assembly (2) from the air inlet hole (24) and then enters the cylinder assembly for pressurization twice; the low-pressure gas enters the rear assembly (2) through the air hole A (22) and then enters the air cylinder (18) through the air inlet hole (24), and contacts the air guide rod (19) to drive the air guide rod (19) to rotate; because the aperture of the air inlet hole (24) is larger than that of the air hole A (22), the low-pressure air enters the air hole A (22) from the air inlet hole (24) to complete the first pressurization; the gas after primary pressurization enters the air guide rod (19) through the air hole B (23), and the aperture of the air hole A (22) is larger than that of the air hole B (23), so that the gas after primary pressurization enters the air hole B (23) from the air hole A (22) to complete secondary pressurization, and high-pressure gas is obtained; when the air guide rod (19) rotates to enable the air hole B (23) to be communicated with the air hole C (26), high-pressure air flows into the cylinder body (3) from the air guide rod (19) through the air hole C (26) to push the piston (5) to move forwards, the piston (5) moves to drive the main shaft (4) to move forwards, and then the travelling assembly (9) is driven to move forwards in the boosting cylinder body (8);
The low-pressure liquid flows out from a liquid outlet port (27) of the liquid outlet assembly after entering the pressure increasing assembly (7) from the liquid inlet assembly, and flows into the pressure increasing cylinder body (8) from the liquid inlet hole (28) through the liquid outlet pipe; at the moment, the swimming component (9) moves forwards in the boosting cylinder body (8) to generate pulse to low-pressure liquid in the boosting cylinder body (8), so as to pressurize the low-pressure liquid and obtain high-pressure liquid; the high-pressure liquid in the pressure boosting cylinder body (8) is sprayed out from the liquid outlet hole (29) to carry out high-pressure spray cleaning on the semiconductor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910723832.9A CN110318979B (en) | 2019-08-07 | 2019-08-07 | Air pump and method for high-pressure spray cleaning of semiconductor chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910723832.9A CN110318979B (en) | 2019-08-07 | 2019-08-07 | Air pump and method for high-pressure spray cleaning of semiconductor chip |
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| Publication Number | Publication Date |
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| CN110318979A CN110318979A (en) | 2019-10-11 |
| CN110318979B true CN110318979B (en) | 2024-06-21 |
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| CN210623018U (en) * | 2019-08-07 | 2020-05-26 | 威海奥牧智能科技有限公司 | Air pump for high-pressure spraying and cleaning of semiconductor chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2178793Y (en) * | 1993-10-16 | 1994-10-05 | 钟惠政 | Pump drived by air pressure |
| CN103233876B (en) * | 2013-04-09 | 2015-11-18 | 北京康斯特仪表科技股份有限公司 | Returning type coaxial gas suction booster and gas make pressure method |
| TWM536700U (en) * | 2016-09-06 | 2017-02-11 | Kinyao Enterprise Co Ltd | Structure improvement of air pressure pump |
| CN108194296A (en) * | 2018-01-16 | 2018-06-22 | 江山澳特机械制造有限公司 | A kind of two cylinder compression pumps |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210623018U (en) * | 2019-08-07 | 2020-05-26 | 威海奥牧智能科技有限公司 | Air pump for high-pressure spraying and cleaning of semiconductor chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110318979A (en) | 2019-10-11 |
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