CN210617874U

CN210617874U - Electronic equipment and heat radiation structure thereof

Info

Publication number: CN210617874U
Application number: CN201921429834.9U
Authority: CN
Inventors: 许成智; 曹彦哲; 余其武; 景争科
Original assignee: Xi'an Megmeet Electric Co ltd
Current assignee: Xi'an Megmeet Electric Co ltd
Priority date: 2019-08-29
Filing date: 2019-08-29
Publication date: 2020-05-26
Anticipated expiration: 2029-08-29

Abstract

The utility model discloses a heat radiation structure and electronic equipment, including PCB board, radiator main part, air feed device and sealing strip, radiator main part cover is established and is laminated in a surface of PCB board to be connected with the PCB board, in order to form both ends open-ended heat dissipation wind channel, the air feed device is installed in the one end in heat dissipation wind channel, and the sealing strip is installed in the PCB board and is described radiator main part laminating part. Therefore, the joint of the radiator main body and the PCB is in a sealing state, and an air source provided by the air supply device cannot pass through the joint of the radiator main body and the PCB, so that power devices except the radiating air duct can normally work, and the stability of an internal circuit is improved.

Description

Electronic equipment and heat radiation structure thereof

Technical Field

The embodiment of the utility model provides a relate to the technical field of the machine that charges, especially, relate to an electronic equipment and heat radiation structure thereof.

Background

With the rapid development of the electric automobile industry, an electric automobile charger has become an indispensable electric energy conversion device for electric automobiles. In the process of using the power module in the electric vehicle charger, a large amount of heat is generated by the internal power device, and therefore, a corresponding heat dissipation structure needs to be arranged for heat dissipation.

The utility model discloses the inventor is realizing the utility model discloses an in-process discovers: at present, in a conventional heat dissipation structure, a heat sink main body is covered on a PCB (Printed Circuit Board) and directly connected to the PCB to form a heat dissipation channel, but a mounting gap exists at a connection position of the heat sink main body and the PCB. When the power module dissipates heat, the fan arranged at the opening on one side of the radiator main body blows air along the heat dissipation channel to dissipate heat, and partial dust can be blown to the periphery through the installation gap, so that the normal work of a power device on the periphery of the radiator main body is influenced.

SUMMERY OF THE UTILITY MODEL

In order to solve the above technical problem, an object of the embodiments of the present invention is to provide a heat dissipation structure, which can seal a connection part between a heat sink main body and a PCB.

In a first aspect, an embodiment of the present invention provides a heat dissipation structure, including:

a PCB board;

the radiator main body is covered and attached to one surface of the PCB and connected with the PCB to form a radiating air duct with openings at two ends;

the air supply device is arranged at one end of the heat dissipation air channel and used for providing an air source for the heat dissipation air channel;

and the sealing strip is arranged at the joint of the PCB and the radiator main body.

Optionally, a groove is formed in one side, which is used for being attached to the PCB, of the heat sink main body, and the sealing strip is installed in the groove and partially protrudes out of the groove.

Optionally, the heat dissipation structure further comprises heat dissipation teeth, the heat dissipation teeth are mounted on the inner wall of the heat sink main body, and the heat sink main body is located in the heat dissipation air duct.

Optionally, heat radiation structure still includes that one end has the screwed connecting piece, the radiator main part with one side of PCB board laminating is provided with the screw hole, the PCB board is provided with the through-hole, the screw thread end of connecting piece passes spiro union behind the through-hole in the screw hole.

Optionally, the heat sink body comprises a first support plate, a second support plate and a cover plate;

the first supporting plate with the one end of second backup pad all with the PCB board is fixed, and first backup pad and second backup pad set up relatively, the both ends of apron respectively with the other end of first backup pad and second backup pad is fixed.

Optionally, the first support plate, the second support plate and the cover plate are integrally formed.

Optionally, the cover plate further comprises a first sub-cover plate and a second sub-cover plate;

the first sub-cover plate is fixed with the other end of the first supporting plate, and the first sub-cover plate and the first supporting plate are integrally formed;

the second sub-cover plate is fixed to the other end of the second support plate, and the second sub-cover plate and the second support plate are integrally formed.

Optionally, the heat dissipation structure further comprises a fixing block;

first backup pad or the second backup pad is kept away from one side in heat dissipation wind channel is provided with the sand grip, install one side of sand grip the fixed block, the fixed block is used for making power device closely laminate the backup pad.

Optionally, the shape of the heat sink body is a U-shape.

On the other hand, the embodiment of the utility model provides an electronic equipment, including above-mentioned heat radiation structure, first heating element group and second heating element group all weld in on the PCB board, and radiator main part cover is located on the first heating element group.

The embodiment of the utility model provides a beneficial effect is: the embodiment of the utility model provides a heat radiation structure, including PCB board, radiator main part, air feed device and sealing strip, radiator main part cover is established and is laminated in a surface of PCB board to be connected with the PCB board, in order to form both ends open-ended heat dissipation wind channel, the air feed device is installed in the one end in heat dissipation wind channel, and the sealing strip is installed in the PCB board and is described radiator main part laminating part. Therefore, the joint of the radiator main body and the PCB is in a sealing state, and an air source provided by the air supply device cannot pass through the joint of the radiator main body and the PCB, so that power devices except the radiating air duct can normally work, and the stability of an internal circuit is improved.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.

Fig. 1 is a schematic view of a heat dissipation structure according to an embodiment of the present invention;

FIG. 2 is a schematic view of the heat sink body of FIG. 1;

FIG. 3 is a schematic view of one component of the heat sink body of FIG. 2;

FIG. 4 is a schematic view of another configuration of the heat sink body of FIG. 2;

FIG. 5 is a schematic view of another embodiment of the heat sink body of FIG. 2;

fig. 6 is a schematic structural diagram of an electronic device according to another embodiment of the present invention;

fig. 7 is a schematic view of the distribution of the first heat generating element group and the second heat generating element group in fig. 6.

In the figure: 100. a heat dissipation structure; 200. an electronic device; 10. a PCB board; 20. a heat sink body; 30. an air supply device; 40. a sealing strip; 50. a heat dissipation air duct; 60. a heat dissipating tooth; 70. a fixed block; 80. a first heat generating element group; 90. a second heat generating element group; 21. a threaded hole; 22. a groove; 23. a first support plate; 24. a second support plate; 25. a cover plate; 251. a first sub-cover plate; 252. a second sub-cover plate; 26. and (4) raised strips.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described in more detail with reference to the accompanying drawings and specific embodiments. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "upper", "lower", "inner", "outer", "vertical", "horizontal", and the like as used herein are used in the description to indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

As shown in fig. 1-3, a heat dissipation structure 100 according to one embodiment of the present invention includes a PCB 10(Printed Circuit Board), a heat sink body 20, an air supply device 30, and a sealing strip 40, wherein the heat sink body 20 covers and adheres to a surface of the PCB 10 and is connected to the PCB 10, so as to form a heat dissipation duct 50 with two open ends. The air supply device 30 is installed at one end of the heat dissipation air duct 50, and is used for providing an air source for the heat dissipation air duct 50. The sealing tape 40 is mounted on the PCB board 10 where it is attached to the heat sink body 20.

The heat sink main body 20 covers the PCB, two separated spaces are formed in the PCB, that is, the heat dissipation channel 50 and the space outside the heat dissipation channel, and the power device on the PCB 10 may be installed in the heat dissipation channel 50 or installed around the heat sink main body 20 and attached to the heat sink main body 20 to transfer heat to the heat sink main body 20. It can be understood that the air source provided by the air supply device 30 blows the heat dissipated by the power device out of the heat dissipating duct 50, or accelerates the heat dissipating speed, thereby achieving the heat dissipating effect. And air supply device 30 is when to heat dissipation wind channel 50, can directly draw the air from the external world, then pour into in heat dissipation channel 50 from the one end of heat dissipation channel 50 into, and return to the external world from the heat dissipation channel 50 other end, realize heat exchange of heat radiation structure and external world, and external air can contain the dust usually, cover through radiator main part 20 and locate the PCB board, form two divided spaces at the PCB board, set up the power device that dustproof requirement is higher outside heat dissipation channel 50, the power device that dustproof requirement is lower sets up in heat dissipation channel 50, so, both can satisfy the dustproof requirement of power device, can satisfy the heat dissipation requirement of power device again. The air supply device 30 may be a fan or a blower, and in the present embodiment, the air supply device 30 is a blower. It should be noted that the heat sink main body 20 and the PCB board 10 may be fixedly connected by welding or using a sealant, or may be detachably connected by a connector, such as a screw.

It can be understood that, at the place where the PCB board 10 is attached to the heat sink main body 20, if the sealing strip 40 is not provided, there will be a mounting gap at the place where the PCB board 10 contacts the heat sink main body 20, and thus, when the air supply device 30 supplies air along the heat dissipation channel, the air for heat dissipation will blow to the periphery of the mounting gap through the mounting gap. The air supply device 30 inevitably carries dust in the air when supplying air, so that some dust is blown to the peripheral power device installation position through the installation gap along with the wind, and the normal operation of the peripheral power device of the installation gap is seriously influenced after long-time accumulation. Therefore, the inventor of the present invention sets the sealing strip 40 in the installation gap for filling the installation gap between the PCB board 10 and the heat sink main body 20, thereby isolating the heat dissipation air duct 50, so that the heat dissipation air can only be started from the air supply device 30, and reaches the exit of the heat dissipation air duct 50 along the heat dissipation air duct 50, thereby ensuring the heat dissipation air without dissipation at the installation position of the PCB board 10 and the heat sink main body 20, and thus ensuring the normal operation of the power device around the heat sink main body 20.

It can be understood that the sealing strip 40 is installed at the joint of the PCB 10 and the heat sink body 20, and the sealing strip 40 is in a compressed state, on one hand, the sealing strip 40 can completely cover the joint surface of the PCB 10 and the heat sink body 20, and on the other hand, the sealing strip 40 can also cover a part of the joint surface of the PCB 10 and the heat sink body 20. Preferably, the sealing tape 40 completely covers the connection surface of the PCB board 10 and the heat sink body 20, so that a better sealing effect can be obtained.

Preferably, the side of the heat sink main body 20 for attaching to the PCB 10 is provided with a groove 22, the sealing strip 40 is installed in the groove 22, and part of the sealing strip protrudes from the groove 22, so that when the PCB 10 is connected to the heat sink main body 20, the protruding part of the sealing strip 40 fills the installation gap between the PCB and the heat sink main body, thereby achieving a relative sealing effect. It can be understood that the sealing strip 40 is accommodated in the groove 22, and an installer does not need to deliberately calibrate whether the sealing strip 40 is relatively right with respect to the side of the heat sink body 20 connected with the PCB 10, and only needs to put the sealing strip 40 into the groove 22, so that the installation of the sealing strip 40 can be realized, and the installation is more convenient.

Further, the heat dissipation structure 100 further includes a connecting member (not shown) having a thread, a threaded hole 21 is formed in one side of the heat sink main body 20, which is attached to the PCB 10, correspondingly, the PCB 10 is provided with a through hole (not shown), and a threaded end of the connecting member is screwed into the threaded hole 21 after passing through the through hole, so that the PCB 10 is connected to the heat sink main body 20. It can be understood that, when the sealing strip 40 is installed in the groove 22 provided in the heat sink main body 20, the groove 22 occupies most of the area of the abutting surface of the PCB board 10 and the heat sink main body 20 and affects the installation of the connector, the sealing strip 40 is provided with a hole for the connector to pass through, so as to achieve the connection between the PCB board 10 and the heat sink main body 20, and the threaded hole 21 is located at the bottom of the groove 22; when the groove 22 only occupies a part of the area of the surface of the PCB 10 abutting against the heat sink main body 20 and does not affect the installation of the connector, the sealing strip 40 does not need to be provided with a hole for the connector to pass through, and only needs to be provided with the threaded hole 21 near the periphery of the opening of the groove 22, so as to realize the connection between the PCB 10 and the heat sink main body 20.

Further, the heat dissipation structure 100 further includes heat dissipation teeth 60. The heat dissipation teeth 60 are mounted on the inner wall of the heat sink main body 20, and the heat sink main body 20 is located inside the heat dissipation air duct 50. It can be understood that the heat dissipation teeth 60 disposed on the heat sink main body 20 can transfer heat dissipated by the power device close to the outer wall of the heat sink main body 20 into the heat dissipation air duct 50, so that the air source provided by the air supply device 30 can dissipate the heat. It will be appreciated that the heat dissipation teeth 60 are disposed on the inner wall of the heat sink, and may be arranged in such a manner that the central axis of the heat dissipation teeth 60 is parallel to the plane of the PCB board 10 for fitting with the heat sink main body 20 or slightly angled. In some embodiments, the heat dissipation teeth 60 are arranged at equal intervals, and the gaps between the heat dissipation teeth 60 can further homogenize the air sent by the air supply device 30 after being divided by the heat dissipation teeth 60, so that the heat dissipation wind can better contact with the inner wall of the heat sink body 20, and the utilization rate of the heat dissipation wind is enhanced.

It should be noted that the heat sink main body 20 may be integrally formed, or may be formed by splicing a plurality of plates. The shape of the heat sink main body 20 is not limited to the shape in this embodiment, and the shape may be various, and it is required to ensure that the heat sink main body 20 can be connected with the PCB board 10 to form the heat dissipation air duct 50, and the shape of the heat sink main body 20 does not affect the normal operation of the power device installed in the heat dissipation air duct 50.

Further, as shown in fig. 3, the heat sink main body 20 includes a first supporting plate 23, a second supporting plate 24 and a cover plate 25, one end of each of the first supporting plate 23 and the second supporting plate 24 is fixed to the PCB 10, the first supporting plate 23 and the second supporting plate 24 are disposed opposite to each other, two ends of the cover plate 25 are fixed to the other end of each of the first supporting plate 23 and the second supporting plate 24, and the cover plate 25, the first supporting plate 23, the second supporting plate 24 and the PCB 10 are enclosed to form a heat dissipation channel 50. It will be appreciated that the ends of the first and

second support plates

23 and 24 for connection with the PCB 10 are mounted with the sealing tape 40, thereby ensuring a sealing effect at the connection of the heat sink body 20 with the PCB 10.

In some embodiments, as shown in fig. 4, the first support plate 23, the second support plate 24, and the cover plate 25 are integrally formed. The first support plate 23, the second support plate 24 and the cover plate 25 are integrally formed, which means that there is no connection gap between the first support plate 23, the second support plate 24 and the cover plate 25, for example: the radiator main body 20 is formed by casting or bending a sheet metal part, and the sealing effect is better.

In other embodiments, the heat sink main body 20 may also be formed by splicing, that is, the first support plate 23, the second support plate 24 and the cover plate 25 are independent of each other, and two ends of the cover plate 25 are respectively connected to the first support plate 23 and the second support plate 24, for example: detachable connections with screws, by welding, etc. It should be noted that, when two ends of the cover plate 25 are respectively connected to the other ends of the first support plate 23 and the second support plate 24, in order to achieve a better sealing effect, it is preferable that a sealant is used to seal the connection ends of the cover plate 25 and the first support plate 23 or the second support plate 24.

In some embodiments, as shown in fig. 5, the cover plate 25 further includes a first sub-cover plate 251 and a second sub-cover plate 252, the first sub-cover plate 251 is fixed to the other end of the first support plate 23, the first sub-cover plate 251 is integrally formed with the first support plate 23, the second sub-cover plate 252 is fixed to the other end of the second support plate 24, the second sub-cover plate 252 is integrally formed with the second support plate 24, and the first cover plate 25 and the second cover plate 25 are connected to each other, thereby forming the heat sink main body 20. Similarly, the joint of the first cover plate 25 and the second cover plate 25 is sealed by sealant, so that a better sealing effect is achieved.

Further, in order to make the power device installed at the periphery of the heat sink main body 20 better fit with the outer surface of the heat sink main body 20, so that the power device can better and more rapidly transfer heat to the heat sink main body 20, one side of the first support plate 23 and the second support plate 24 away from the heat dissipation air duct 50 is provided with a protruding strip 26, a fixing block 70 is installed on the protruding strip 26, one end of the fixing block 70 is detachably installed on the protruding strip 26 through a screw, the other end of the fixing block 70 abuts against one side of the power device away from the heat dissipation air duct 50, and one side of the power device close to the heat dissipation air duct 50 is tightly attached to the heat sink main body 20, so that the heat dissipated by the power device is transferred to the heat sink main. In this example, the fixing block 70 has an "L" shape with one side slightly inclined, one end of the L-shaped fixing block 70 is fitted and fixed to the protruding strip 26, and the other end is used for contact with the power device. Of course, the shape of the heat sink main body 20 may be other forms as long as it is ensured that the heat sink main body 20 can be connected with the PCB board 10 to form the heat dissipation air duct 50, and the shape of the heat sink main body 20 does not affect the normal operation of the power device installed in the heat dissipation air duct 50. In the present embodiment, the shape of the heat sink main body 20 is a U shape.

The embodiment of the utility model provides a heat radiation structure, including PCB board 10, radiator main part 20, air feed device 30 and sealing strip 40, radiator main part 20 covers and establishes and laminate in a surface of PCB board 10 to be connected with PCB board 10, in order to form both ends open-ended heat dissipation wind channel 50, air feed device 30 is installed in the one end of heat dissipation wind channel 50, and sealing strip 40 is installed in PCB board 10 and the laminating part of radiator main part 20. Therefore, the joint of the radiator main body 20 and the PCB 10 is in a sealed state, and the wind source provided by the wind supply device 30 cannot pass through the joint of the radiator main body 20 and the PCB 10, so that the power devices except the heat dissipation duct 50 can normally work, and the stability of the internal circuit is improved.

Referring to fig. 6 to 7, an electronic device 200 according to another embodiment of the present invention includes the heat dissipation structure 100, the first heat generating element group 80 and the second heat generating element group 90 in the above embodiments, the first heat generating element group 80 and the second heat generating element group 90 are both soldered on the PCB 10, and the heat sink main body 20 is covered on the first heat generating element group 80. The first heating element group 80 covered in the heat sink main body 20, that is, the first heating element group 80 located in the heat dissipation air duct 50, when it works, the wind carrying dust does not have a great influence on its working state, that is, the first heating element group 80 is not sensitive to dust, and can be directly installed in the heat dissipation air duct 50, such as a capacitor, a resistor, etc., while the second heating element group 90 sensitive to dust is installed at the periphery of the heat sink main body 20, and can dissipate heat through the heat sink main body 20, and the sealing strip 40 can isolate the wind carrying dust in the heat dissipation air duct 50, thereby not affecting the periphery of the heat sink main body 20. In this embodiment, the electronic device is a power module.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A heat dissipation structure, comprising:

a PCB board;

2. The heat dissipating structure of claim 1, wherein a groove is formed on a side of the heat sink body for being attached to the PCB, and the sealing strip is installed in the groove and partially protrudes from the groove.

3. The heat dissipating structure of claim 1, further comprising heat dissipating teeth mounted on an inner wall of the heat sink body, the heat sink body being located within the heat dissipating air duct.

4. The heat dissipation structure of claim 1, further comprising a connecting member having a thread at one end thereof, wherein a threaded hole is formed in a side of the heat sink body, which is attached to the PCB, and the PCB is provided with a through hole, and the threaded end of the connecting member is screwed into the threaded hole after passing through the through hole.

5. The heat dissipation structure according to claim 1, wherein the heat sink main body includes a first support plate, a second support plate, and a cover plate;

6. The heat dissipation structure of claim 5, wherein the first support plate, the second support plate, and the cover plate are integrally formed.

7. The heat dissipation structure of claim 5, wherein the cover plate further comprises a first sub-cover plate and a second sub-cover plate;

8. The heat dissipation structure of claim 5, further comprising a fixing block;

first backup pad or the second backup pad is kept away from one side in heat dissipation wind channel is provided with the sand grip, install one side of sand grip the fixed block, the fixed block is used for making power device closely laminate in first backup pad with the surface of second backup pad.

9. The heat dissipating structure of any one of claims 1 to 8, wherein the heat sink body has a U-shape.

10. An electronic device, comprising the heat dissipation structure of any one of claims 1 to 9, a first heat generating element group, and a second heat generating element group, wherein the first heat generating element group and the second heat generating element group are both soldered to the PCB board, and the heat sink main body is covered on the first heat generating element group.