CN210607320U - LED package - Google Patents

Abstract

An object of the utility model is to provide a LED package, including PCB bottom, infrared chip and gold thread, its characterized in that: the bottom of the PCB is provided with a bowl-shaped cavity, the infrared chip is arranged at the bottom of the bowl-shaped cavity, the infrared chip is connected with the bottom of the PCB through the gold thread, the infrared chip and the gold thread are packaged at the bottom of the bowl-shaped cavity through silica gel, the upper surface of the bottom of the PCB is provided with a shell cover containing an optical angle design, an epoxy resin layer is arranged in the shell cover, and the epoxy resin layer is positioned right above the infrared chip; the utility model provides a broken bowl phenomenon and the problem of light type skew that traditional design caused.

Description

LED package

Technical Field

The utility model relates to a LED technical field, especially a LED encapsulation.

Background

The LED is called as a fourth generation illumination light source or a green light source, has the characteristics of energy conservation, environmental protection, long service life, small volume and the like, and is widely applied to the fields of various indications, display, decoration, backlight sources, common illumination, urban night scenes and the like. According to different use functions, the system can be divided into five categories of information display, signal lamps, vehicle lamps, liquid crystal display backlight sources and general illumination.

At present, the high brightness HIR products all need to focus light by using an optically calculated bowl cup design, and the packaging structure of the HIR products is shown in FIG. 1 and FIG. 2, and two solder joint positions are required to be designed for wire bonding. The two welding spot designs can cause bowl breaking, which is the problem of light pattern deviation caused by the design failing to meet the requirement of a complete circle due to the requirement of the manufacturing process.

In order to solve the above problems, the present invention is proposed.

Disclosure of Invention

An object of the utility model is to provide a LED encapsulation solves the problem of broken bowl phenomenon and light type skew that traditional design caused.

The utility model discloses a following mode realizes: the utility model provides a LED package, includes PCB bottom, infrared chip and gold thread, its characterized in that: PCB bottom is provided with a brill bowl shape cavity, infrared chip set up in bore the bottom of bowl shape cavity, infrared chip with pass through between the PCB bottom the gold thread is connected, infrared chip with the gold thread passes through silica gel encapsulation in bore the bottom of bowl shape cavity, the upper surface of PCB bottom is provided with a cap that contains the design of optics angle, be provided with an epoxy layer in the cap, epoxy layer is located directly over infrared chip.

Furthermore, a reflective layer is coated on the inner surface of the drilling bowl-shaped cavity.

Further, the optical angle of the shell cover is designed within 30 degrees of a half angle.

The beneficial effects of the utility model reside in that: the bottom of the PCB of the utility model is provided with a drilling bowl-shaped cavity, and the chip and the gold thread are both packaged in the bowl of the drilling bowl-shaped cavity, and the LED which has asymmetric light shape and can independently operate can be formed after being packaged by silica gel; the utility model discloses a be provided with cap that contains the design of optics angle for adjustment light angle's, generally convergence lets the product reach the purpose of small angle, falls the part that only remains the small angle to the cap lid for the light of large angle, revises above-mentioned skew light type to bilateral symmetry.

Drawings

Fig. 1 is a schematic view of a conventional LED package structure.

Fig. 2 is a first schematic diagram illustrating a bowl breaking phenomenon in a conventional package structure.

Fig. 3 is a schematic view of the packaging structure of the present invention.

Fig. 4 is a top view of fig. 3.

Fig. 5 is an explanatory view of a bowl breaking phenomenon.

Detailed Description

The present invention will be further explained with reference to the accompanying drawings.

Referring to fig. 3 to 4, in an embodiment of the present invention, an LED package includes a PCB bottom 1, an infrared chip 2 and a gold thread 3, and is characterized in that: the PCB bottom 1 is provided with a drilling bowl-shaped cavity 4, the infrared chip 2 is arranged at the bottom of the drilling bowl-shaped cavity 4, the infrared chip 2 is connected with the PCB bottom 1 through the gold thread 3, the infrared chip 2 and the gold thread 3 are packaged at the bottom of the diamond-bowl-shaped cavity 4 through silica gel, the upper surface of the PCB bottom 1 is provided with a shell cover 5 containing an optical angle design, the shell cover 5 is used for adjusting the light angle, generally converging to enable the product to reach the purpose of small angle, the shell cover 5 is used for covering the large-angle light to only keep the small-angle part, an epoxy resin layer 6 is arranged in the shell cover 5, the epoxy resin layer 6 is positioned right above the infrared chip 2, the light transmittance of the epoxy resin layer 6 is close to 100 percent, the optical angle of the shell cover 5 can be adjusted, so that infrared rays are projected out from the epoxy resin layer 6; the bottom of the PCB of the utility model is provided with a drilling bowl-shaped cavity 4, and the chip and the gold thread are both packaged in the bowl of the drilling bowl-shaped cavity 4, and the LED which has asymmetric light shape and can independently operate can be formed after being packaged by silica gel; the utility model discloses a be provided with cap 5 that contains the design of optics angle, revise above-mentioned skew light type to bilateral symmetry.

Referring to fig. 3, in an embodiment of the present invention, a reflective layer (not shown) is coated on the inner surface of the drilling bowl-shaped cavity 4, and the reflective layer is formed by gold plating and silver plating, and is used for reflecting light emitted from the bottom of the infrared chip.

Referring to fig. 3 to 5, in an embodiment of the present invention, the optical angle of the housing cover 5 is designed to be within 30 ° of a half angle, as shown in fig. 5, the situation caused by the "bowl breaking" may cause the left and right asymmetry of the light pattern, the shadow part is an exaggerated situation, and the housing cover is intended to trim the unwanted blocks to achieve the symmetry of the light pattern or trim the light region with a large angle.

The above is only the preferred embodiment of the present invention, and all the equivalent changes and modifications made according to the claims of the present invention should be covered by the present invention.

Claims (3)

1. The utility model provides a LED package, includes PCB bottom, infrared chip and gold thread, its characterized in that: PCB bottom is provided with a brill bowl shape cavity, infrared chip set up in bore the bottom of bowl shape cavity, infrared chip with pass through between the PCB bottom the gold thread is connected, infrared chip with the gold thread passes through silica gel encapsulation in bore the bottom of bowl shape cavity, the upper surface of PCB bottom is provided with a cap that contains the design of optics angle, be provided with an epoxy layer in the cap, epoxy layer is located directly over infrared chip.

2. The LED package of claim 1, wherein: the inner surface of the drilling bowl-shaped cavity is coated with a reflecting layer.

3. The LED package of claim 1, wherein: the optical angle of the shell cover is designed within 30 degrees of a half angle.

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