CN210605699U

CN210605699U - Digital chip multi-address long-distance communication module

Info

Publication number: CN210605699U
Application number: CN201922264476.7U
Authority: CN
Inventors: 王正禹; 江数兵; 姚先华
Original assignee: Wuxi Must Create Measurement And Control Technology Co ltd
Current assignee: Wuxi Must Create Measurement And Control Technology Co ltd
Priority date: 2019-12-16
Filing date: 2019-12-16
Publication date: 2020-05-22
Anticipated expiration: 2029-12-16

Abstract

The utility model provides a digital chip multi-address long-distance communication module, which comprises a digital probe, an MCU chip, a 485 chip and a 485 terminal device; a digital probe chip is arranged in the digital probe, the digital probe chip is connected with an MCU chip through an I2C data line, the MCU chip is connected with a 485 chip through a UART serial data bus, and the 485 chip is connected with 485 terminal equipment; the utility model discloses increased circuits such as MCU chip, 485 chips on digital probe's basis, can realize remote communication, the 485 chip provides stable signal through the difference mode, further improves the interference killing feature.

Description

Digital chip multi-address long-distance communication module

Technical Field

The utility model relates to a digital probe technical field, in particular to digital chip multiaddress long distance communication module.

Background

In some environment detection, the currently adopted I2C digital probe has the following problems:

1) short communication distance and insufficient anti-interference performance. After the extension line of the I2C probe exceeds 3 meters, the probability of communication failure is greatly increased.

2) The I2C digital probe with poor stability and higher anti-interference performance has high manufacturing cost.

3) The address is single. The I2C chip is a single address, which cannot be realized if a device needs to collect multi-point data.

4) The control mode is single. The I2C chip defaults to a slave and must send a start/acknowledge bit from the master to start/terminate the transmission.

SUMMERY OF THE UTILITY MODEL

The purpose of the present invention is to solve at least one of the technical drawbacks.

Therefore, an object of the present invention is to provide a digital chip multi-address long-distance communication module, which has low manufacturing cost, good interference effect and good stability.

In order to achieve the above object, the utility model provides a digital chip multi-address long-distance communication module, which comprises a digital probe, an MCU chip, a 485 chip and a 485 terminal device; a digital probe chip is arranged in the digital probe, the digital probe chip is connected with an MCU chip through an I2C data line, the MCU chip is connected with a 485 chip through a UART serial data bus, and the 485 chip is connected with 485 terminal equipment;

and a first input pin of the MCU chip is connected with one end of the first pull-up resistor, a second input end of the MCU chip is connected with the second pull-up resistor, and a power supply of the MCU chip is connected with the first decoupling capacitor.

In any of the above schemes, preferably, the I2C address input pin of the digital probe chip is connected to one end of a first resistor and one end of a second resistor, the other end of the first resistor is connected to a power supply voltage, the other end of the second resistor is grounded, the power supply of the digital probe chip is connected to a second decoupling capacitor, and the other end of the second decoupling capacitor is grounded.

In any of the above schemes, preferably, the digital probe chip is an SHT30 model temperature and humidity sensor.

In any of the above schemes, preferably, the model of the MCU chip is STC8F2K16S 2.

In any of the above schemes, preferably, the 485 chip is SN75176 BP.

In any of the above schemes, preferably, a power supply of the 485 chip is connected to one end of a third decoupling capacitor, and the other end of the third decoupling capacitor is grounded.

In any of the above schemes, preferably, the first input terminal of the 485 terminal device is connected to one end of a first voltage regulator, and the other end of the first voltage regulator is grounded.

In any of the above schemes, preferably, the second input terminal of the 485 terminal device is connected to one end of a second voltage regulator, and the other end of the second voltage regulator is grounded.

In any of the above schemes, preferably, the MCU chip is connected to digital probe chips in a plurality of digital probes.

In any of the above aspects, preferably, the other end of the first decoupling capacitor is grounded.

The utility model discloses a digital chip multiaddress long distance communication module has following beneficial effect:

1. the utility model discloses an adopt design of a plurality of decoupling capacitor, for example first decoupling capacitor-third decoupling capacitor provides more stable power for the circuit, also can reduce the noise that the component couples to the power end simultaneously, and other components can be reduced indirectly and the influence of this component noise is received, can also be the high frequency clutter filtering that the preceding stage carried, regard output signal's interference as the filtering object, play anti-jamming effect to improve signal transmission's interference killing feature and stability.

2. The utility model discloses increased circuits such as MCU chip, 485 chips on digital probe's basis, can realize remote communication, the 485 chip provides stable signal through the difference mode, further improves the interference killing feature.

3. The utility model discloses a first resistance R10, second resistance R11 set up the setting value of the I2C address input pin of digital probe chip, and the abnormal signal that the digital probe chip of filtering detected only exports normal signal to MCU chip 2 to guarantee the degree of accuracy of signal, further improve the interference killing feature and the stability of circuit.

4. The utility model discloses a MCU chip directly carries out data transmission through I2C data line with digital probe chip, has avoided I2C signal interference and communication failure to improve the holistic interference killing feature of circuit.

5. The utility model discloses a digital chip multiaddress long distance communication module's circuit components and parts are than less, simple structure, and each components and parts are relatively cheaper, and are with low costs, and easily integration can use widely on a large scale.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a block diagram of the digital chip multi-address long-distance communication module of the present invention;

fig. 2 is a schematic circuit diagram of the digital probe chip of the present invention;

FIG. 3 is a schematic circuit diagram of the MCU chip of the present invention;

fig. 4 is a schematic circuit diagram of a 485 chip of the present invention;

fig. 5 is a schematic circuit diagram of the 485 terminal device of the present invention;

in the figure, 1, a digital probe chip; 2. an MCU chip; 3. 485 chips; 4. 485 terminal equipment;

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

The utility model provides a digital chip multi-address long-distance communication module, as shown in figure 1, comprising a digital probe, an MCU chip 2, a 485 chip 3 and a 485 terminal device 4; be equipped with digital probe chip 1 in the digital probe, digital probe chip 1 is connected with MCU chip 2 through I2C data line, and MCU chip 2 passes through the connection of UART serial data bus with 485

chip

3, and 485 chip 3 is connected with 485 terminal equipment 4.

The working principle is as follows: the digital probe chip transmits detected temperature and humidity signals to the MCU chip through an I2C data line, the MCU chip preprocesses the detected data, the preprocessed data are transmitted to the 485 chip through the UART serial data bus, the 485 chip converts preprocessed serial data into 485 communication data, and the 485 communication data are transmitted to the 485 terminal device.

The utility model discloses a design of a plurality of decoupling capacitor, for example first decoupling capacitor-third decoupling capacitor provides more stable power for the circuit, also can reduce the noise that the component couples to the power end simultaneously, and other components can be reduced indirectly and the influence of this component noise is received, can also be the high frequency clutter filtering that the preceding stage carried, regard output signal's interference as the filtering object, play anti-jamming effect to improve signal transmission's interference killing feature and stability.

The utility model discloses increased circuits such as MCU chip, 485 chips on digital probe's basis, can realize remote communication, the 485 chip provides stable signal through the difference mode, further improves the interference killing feature.

As shown in fig. 2, the I2C address input pin ADDR of the digital probe chip is connected to one end of the first resistor R10 and one end of the second resistor R11, the other end of the first resistor R10 is connected to the power supply voltage VCC, the other end of the second resistor R11 is grounded, the power supply terminal VDD of the digital probe chip is connected to the second decoupling capacitor C4, and the other end of the second decoupling capacitor C4 is grounded. The digital probe chip is an SHT30 type temperature and humidity sensor.

The utility model discloses a first resistance R10, second resistance R11 set up the setting value of the I2C address input pin of digital probe chip, and the abnormal signal that the digital probe chip of filtering detected only exports normal signal to MCU chip 2 to guarantee the degree of accuracy of signal, further improve the interference killing feature and the stability of circuit.

As shown in fig. 3, in order to improve the stability and the anti-interference capability of the circuit, the first input pin of the MCU chip 2 is connected to one end of a first pull-up resistor R5, the second input terminal thereof is connected to a second pull-up resistor R9, the power supply terminal thereof is connected to a first decoupling capacitor C3, and the model of the MCU chip 2 is STC8F2K16S 2.

The utility model discloses a MCU chip 2 directly carries out data transmission through I2C data line with digital probe chip, has avoided I2C signal interference and communication failure to improve the holistic interference killing feature of circuit.

As shown in fig. 4, in order to further improve the anti-interference capability of the circuit, the 485 chip selects SN75176 BP. The power supply terminal VCC of the 485 chip is connected with one end of a third decoupling capacitor C1, and the other end of the third decoupling capacitor C1 is grounded.

The utility model discloses a 485 chips are difference transmission mode, and the signal is stable. The general farthest design is 400 meters; the maximum relay-free theoretical transmission distance is 1200 meters; the impedance matching and low-attenuation special cable can reach 1800 meters; over 1200 meters, repeaters (up to 8) may be added, thus providing a transmission distance of approximately 10 kilometers. Basically, the method can accord with all wired temperature and humidity monitoring application scenes.

As shown in fig. 5, to further improve the stability of the circuit, the first input terminal of the 485 termination device J2 is connected to one terminal of the first voltage regulator V1, and the other terminal of the first voltage regulator V1 is grounded. The second input terminal of the 485 termination device J2 is connected to one terminal of a second voltage regulator V2, and the other terminal of the second voltage regulator V2 is connected to ground.

In another embodiment of the present invention, the MCU chip 2 is connected to the digital probe chips 1 in the plurality of digital probes. The MCU chip 2 can receive the data collected by the digital probe chips 1 in a plurality of digital probes. When the multi-digital probe is transmitted in the main mode, the number 1 digital probe firstly transmits data, other digital probes calculate the difference value of the number of the digital probes after receiving the data, and the next active transmission time is reset, so that the probes can be sequentially transmitted even if the probes are abnormal in the middle.

The utility model discloses can also further expand, have following beneficial effect:

1. the utility model discloses the aim at who sets up the MCU chip alleviates the calculation pressure of rear end equipment, and when the probe appearance is unusual, the analysis probe abnormal conditions and report the error code.

2. The utility model discloses a temperature and humidity value is collected through I2C data line to the MCU chip, and the packing is passed through the serial ports after the analysis and is transmitted 485 chip conversion for 485 communications. When receiving the instruction, the 485 chip is firstly converted into serial port data, the parameters are modified according to the instruction content after the serial port data is analyzed, and the modified data is sent to be sent from the serial port to 485 after the modification is completed. When the MCU analyzes the I2C data, the abnormal condition of the probe can be preliminarily calculated and judged, the calculation amount of the terminal equipment is reduced, and meanwhile, the abnormality is captured and processed more effectively.

3. The utility model discloses a MCU chip just can realize modifying the probe parameter through reading and writing IAP subregion, only using 485 communications, has following characteristics:

1) the Baud rate can be modified according to the requirements of the actual application scene, and the range is 9600-115200;

2) the number of the probes can be set, and the number of the probes can be freely increased/decreased;

3) the master-slave mode can be set as desired.

4. The utility model discloses during master mode 485 communication, there is communication simultaneously between each probe, according to receiving the probe number that is reporting, calculates the polling and sends interval time, prevents blocking or delay communication that middle probe damaged or abnormal conditions etc. caused.

5. The utility model discloses when setting up a plurality of digital probes, the MUC chip can calculate every digital probe self-adaptation acquisition time, guarantees that data is smooth.

It should be noted that, the utility model provides a parts such as MCU chip, digital probe chip, 485 chip select for use all be chip models commonly used, and circuit structure, circuit principle etc. of its self inside have all been disclosed in the field, adopt common components and parts on the market, and the components and parts of being convenient for are maintained and are changed, are favorable to reduce cost.

The utility model discloses a digital chip multiaddress long distance communication module's circuit components and parts are than less, simple structure, and each components and parts are relatively cheaper, and are with low costs, and easily integration can use widely on a large scale.

Although embodiments of the present invention have been shown and described, it is to be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that changes, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the principles and spirit of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A digital chip multi-address long-distance communication module is characterized by comprising a digital probe, an MCU chip, a 485 chip and a 485 terminal device; a digital probe chip is arranged in the digital probe, the digital probe chip is connected with an MCU chip through an I2C data line, the MCU chip is connected with a 485 chip through a UART serial data bus, and the 485 chip is connected with 485 terminal equipment;

2. The digital chip multi-address long-distance communication module according to claim 1, wherein an I2C address input pin of the digital probe chip is connected to one end of a first resistor and one end of a second resistor, the other end of the first resistor is connected to a power supply voltage, the other end of the second resistor is connected to ground, the power supply of the digital probe chip is connected to a second decoupling capacitor, and the other end of the second decoupling capacitor is connected to ground.

3. The digital chip multi-address long-distance communication module of claim 1 or 2, wherein the digital probe chip is a temperature and humidity sensor of SHT30 type.

4. The digital-chip multi-address long-distance communication module of claim 1, wherein the model of the MCU chip is STC8F2K16S 2.

5. The digital chip multi-address long-distance communication module of claim 1, wherein said 485 chip is SN75176 BP.

6. The digital chip multi-address long-distance communication module of claim 1 or 5, wherein a power supply of the 485 chip is terminated with one end of a third decoupling capacitor, and the other end of the third decoupling capacitor is grounded.

7. The digital chip multi-address long distance communication module of claim 1, wherein the first input of the 485 terminal device is connected to one terminal of a first voltage regulator, and the other terminal of the first voltage regulator is connected to ground.

8. The digital chip multi-address long distance communication module of claim 1 or 7, wherein the second input of the 485 terminal device is connected to one end of a second voltage regulator, and the other end of the second voltage regulator is connected to ground.

9. The digital chip multi-address long distance communication module of claim 1, wherein the MCU chip is connected with a digital probe chip within a plurality of digital probes.

10. The digital chip multi-address long distance communication module of claim 1, wherein the other end of said first decoupling capacitor is grounded.