CN210605296U - Liquid crystal writing board - Google Patents
Liquid crystal writing board Download PDFInfo
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- CN210605296U CN210605296U CN201921735174.7U CN201921735174U CN210605296U CN 210605296 U CN210605296 U CN 210605296U CN 201921735174 U CN201921735174 U CN 201921735174U CN 210605296 U CN210605296 U CN 210605296U
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- conductive glass
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- upper substrate
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 239000011521 glass Substances 0.000 claims abstract description 28
- 239000004986 Cholesteric liquid crystals (ChLC) Substances 0.000 claims abstract description 25
- 239000003292 glue Substances 0.000 claims abstract description 14
- 239000002131 composite material Substances 0.000 claims abstract description 12
- 239000000203 mixture Substances 0.000 claims abstract description 11
- 238000005538 encapsulation Methods 0.000 claims abstract description 9
- 239000008187 granular material Substances 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- 239000004005 microsphere Substances 0.000 claims description 17
- 239000002245 particle Substances 0.000 claims description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 13
- 125000006850 spacer group Chemical group 0.000 claims description 11
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000000178 monomer Substances 0.000 claims description 5
- 239000008393 encapsulating agent Substances 0.000 claims 2
- 239000011324 bead Substances 0.000 claims 1
- 230000031700 light absorption Effects 0.000 abstract description 10
- 238000004806 packaging method and process Methods 0.000 description 19
- -1 polyethylene naphthalate Polymers 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000005341 toughened glass Substances 0.000 description 4
- 229920002284 Cellulose triacetate Polymers 0.000 description 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000012945 sealing adhesive Substances 0.000 description 3
- 238000001723 curing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Images
Abstract
The utility model relates to a liquid crystal writing board, including the infrabasal plate, the intermediate level, the upper substrate, the intermediate level clamp is established and is formed composite bed structure between infrabasal plate and upper substrate, composite bed structure encapsulates into integrative liquid crystal writing board through the encapsulation glue, the infrabasal plate includes the conductive glass layer, the conductive glass layer includes light-absorption layer, conducting layer A, the intermediate level includes bistable cholesteric liquid crystal mixture layer, bistable cholesteric liquid crystal mixture layer includes bistable cholesteric liquid crystal, photopolymer, interval granule, the upper substrate includes the conducting film, the conducting film is including preventing dazzling wearing layer, conducting layer B. The utility model discloses a infrabasal plate with stereoplasm conductive glass combines the encapsulation to glue the banding, has the light and avoid the marginal brilliant characteristics of leaking of structure.
Description
Technical Field
The utility model relates to a liquid crystal board, in particular to modified liquid crystal board belongs to the liquid crystal board field.
Background
At present, the bistable cholesteric liquid crystal writing board is widely applied to various products such as a mobile notepad, a writing board in a meeting room, a blackboard in a classroom and the like due to the advantages of light weight, no need of an oil pen, chalk and the like. The bistable cholesteric liquid crystal display technique belongs to the reflection type display technique, in the liquid crystal screen of liquid crystal electronic writing board, the cholesteric liquid crystal is flat, and is arranged into layers, the molecules in the layers are mutually parallel, the long axis of the molecule is parallel to the layer plane, the long axis direction of the molecule of different layers is slightly changed, and the cholesteric liquid crystal can be arranged into a helical structure along the normal direction of the layer, and has two forms of plane state texture and focal conic state texture. The thread distance of the cholesteric liquid crystal is 300nm, the same magnitude as the visible light wavelength, the spiral distance can be changed along with the difference of external pressure, temperature, electric field conditions and the twisting force of the liquid crystal, the external light can be modulated by a method of adjusting the spiral, and the cholesteric liquid crystal is characterized in that a plane state texture and a focal conic state texture can stably exist under a certain boundary condition under the condition of zero field, can display in black and white, monochrome or color, realizes the conversion of two states by utilizing the action of an external electric field, and has the bistable characteristic. Under the condition of writing pressure, the cholesteric liquid crystal presents a plane texture, reflects the display of external ambient light, and restores a focal conic texture after an external electric field is applied to eliminate the display. The structure of the liquid crystal writing board is a sandwich structure of sandwich cholesteric liquid crystal between two layers of conducting film substrates at present, but because the conducting film is soft, when pressure is applied, the base material can deform, so a layer of hard board can be attached to the back of the three-layer structure, the thickness and the weight of the writing board are increased, and the four sides of the liquid crystal writing board have the characteristic of liquid crystal leakage.
SUMMERY OF THE UTILITY MODEL
The utility model discloses liquid crystal writing board discloses new scheme, adopts the infrabasal plate that has stereoplasm conductive glass, combines the encapsulation to glue the banding, and it is heavy to have solved the structure that current product exists, and technology is complicated to and the marginal problem of leaking the brilliant.
The utility model discloses liquid crystal writing board includes the infrabasal plate, the intermediate level, the upper substrate, the intermediate level presss from both sides and forms composite bed structure between infrabasal plate and upper substrate, composite bed structure encapsulates into integrative liquid crystal writing board through the encapsulation glue, the infrabasal plate includes the conductive glass layer, the conductive glass layer includes the light-absorption layer, conducting layer A, the intermediate level includes bistable cholesteric liquid crystal mixture layer, bistable cholesteric liquid crystal mixture layer includes bistable cholesteric liquid crystal, photopolymer, interval granule, the upper substrate includes the conducting film, the conducting film is including preventing dazzling wearing layer, conducting layer B.
Furthermore, the packaging adhesive of the scheme comprises a sealing adhesive edge sleeve surrounding the edge of the composite layer structure.
Further, the packaging adhesive of the scheme comprises a closed adhesive dispensing ring formed by dispensing on the edge of the bonding surface of the lower substrate.
Furthermore, the packaging adhesive of the scheme also comprises a dispensing diagonal line between opposite inner angle ends of the dispensing ring.
Furthermore, the conductive glass layer of the scheme is a rigid optical conductive glass layer, the thickness of the rigid optical conductive glass layer is 0.5 mm-5 mm, the conductive layer A is indium tin oxide or a nano silver wire, the sheet resistance value of the conductive layer A is 10 omega/□ -150 omega/□, and the light absorption layer is a black ink layer or a black adhesive film layer.
Furthermore, the thickness of the rigid optical conductive glass layer in the scheme is 1 mm-2 mm.
Furthermore, the photosensitive polymer is an ultraviolet polymerizable monomer, the spacer particles are spacer microspheres, and the particle size of the spacer microspheres is 3-20 um.
Furthermore, the particle size of the spacing microspheres in the scheme is 3-10 um.
Furthermore, the conductive film of the scheme is a soft conductive anti-dazzle film, the base material of the soft conductive anti-dazzle film is at least one of polyethylene glycol terephthalate, polycarbonate, polyimide, polyethylene naphthalate, cycloolefin polymer and cellulose triacetate, the thickness of the soft conductive anti-dazzle film is 0.1-1 mm, the conductive layer B is indium tin oxide or a nano silver wire, the sheet resistance value of the conductive layer B is 10 omega/□ -150 omega/□, the haze value of the anti-dazzle wear-resistant layer is 5-30%, and the hardness of the anti-dazzle wear-resistant layer is greater than 2H.
Furthermore, the thickness of the soft conductive anti-dazzle film is 0.125 mm-0.3 mm, and the haze value of the anti-dazzle wear-resistant layer is 10% -20%.
The utility model discloses liquid crystal board adopts the infrabasal plate that has stereoplasm conductive glass, combines the encapsulation to glue the banding, has the characteristics that the structure is light and avoid the edge to leak the brilliant.
Drawings
FIG. 1 is a diagram of a first example of a liquid crystal tablet.
FIG. 2 is a diagram of a second example of a liquid crystal tablet.
Fig. 3 is a schematic diagram of a first example of the packaging adhesive.
Fig. 4 is a schematic diagram of a second example of the packaging adhesive.
Wherein 100 is a lower substrate, 200 is an intermediate layer, 210 is a spacer microsphere, 300 is an upper substrate, 410 is a sealing edge sleeve, 420 is a dispensing ring, and 430 is a dispensing diagonal line.
Detailed Description
As shown in fig. 1 and 2, the utility model discloses liquid crystal writing board includes the infrabasal plate, the intermediate level, the upper substrate, the intermediate level presss from both sides and forms composite bed structure between infrabasal plate and upper substrate, composite bed structure encapsulates into integrative liquid crystal writing board through the encapsulation glue, the infrabasal plate includes the conductive glass layer, the conductive glass layer includes the light-absorbing layer, conducting layer A, the intermediate level includes bistable cholesteric liquid crystal mixture layer, bistable cholesteric liquid crystal mixture layer includes bistable cholesteric liquid crystal, photopolymer, the interval granule, the upper substrate includes the conducting film, the conducting film is including preventing dazzling wearing layer, conducting layer B. According to the scheme, the lower substrate with the hard conductive glass is combined with the packaging glue for edge sealing, and the problems that the existing product is heavy in structure, complex in process and edge leakage are effectively solved.
In order to realize the packaging of the packaging adhesive, the scheme discloses the following specific modes.
Example one
As shown in fig. 1, the package adhesive of the present disclosure includes an adhesive edge sheath surrounding the edge of the composite layer structure, and the lower substrate, the middle layer, and the upper substrate are first formed into the composite layer structure, and then edge sealing is performed.
Example two
As shown in fig. 2 and 3, the package adhesive of the present embodiment includes a closed dispensing ring formed by dispensing on the edge of the bonding surface of the lower substrate, the adhesive is applied by dispensing, and then the lower substrate, the middle layer, and the upper substrate are bonded.
EXAMPLE III
As shown in fig. 4, based on the second embodiment, the package adhesive of the present disclosure further includes a dispensing diagonal line between opposite inner corner ends of the dispensing ring.
In order to realize the function of the lower substrate, the conductive glass layer of the scheme is a rigid optical conductive glass layer, the thickness of the rigid optical conductive glass layer is 0.5 mm-5 mm, the conductive layer A is indium tin oxide or a nano silver wire, the sheet resistance value of the conductive layer A is 10 omega/□ -150 omega/□, and the light absorption layer is a black ink layer or a black film pasting layer. Based on the above scheme, the thickness of the rigid optical conductive glass layer in the scheme is preferably 1 mm-2 mm.
In order to realize the function of the intermediate layer, the photosensitive polymer is an ultraviolet polymerizable monomer, the spacing particles are spacing microspheres, and the particle size of the spacing microspheres is 3-20 um. Based on the scheme, the preferred particle size of the interval microsphere is 3-10 um.
In order to realize the function of the upper substrate, the conductive film of the scheme is a soft conductive anti-dazzle film, the base material of the soft conductive anti-dazzle film is at least one of polyethylene terephthalate, polycarbonate, polyimide, polyethylene naphthalate, cycloolefin polymer and cellulose triacetate, the thickness of the soft conductive anti-dazzle film is 0.1-1 mm, the conductive layer B is indium tin oxide or nano silver wires, the sheet resistance value of the conductive layer B is 10 omega/□ -150 omega/□, the haze value of the anti-dazzle wear-resistant layer is 5-30%, and the hardness of the anti-dazzle wear-resistant layer is more than 2H. Based on the scheme, the thickness of the soft conductive anti-dazzle film is preferably 0.125-0.3 mm, and the haze value of the anti-dazzle wear-resistant layer is preferably 10-20%.
This scheme discloses a structure of bistable cholesteric liquid crystal board, current liquid crystal board structure adopts the mode formation sandwich structure of coating cholesteric liquid crystal in the middle of the double-deck conductive film base plate, because the conductive film is softer, when exerting pressure, the substrate can warp, thereby can laminate the one deck hardboard at the three layer construction back again, then the deaeration again, the thickness and the weight of writing board have been increased, and the technology is complicated, equipment drops into greatly, the liquid crystal board four sides has the problem of leaking the liquid crystal, the liquid crystal board structure that this scheme disclosed aims at solving the heaviness of current structure, the technology is complicated and the problem of leaking the brilliant. Therefore, the scheme discloses a liquid crystal writing board structure, as shown in fig. 1, the lower layer is conductive glass with a light absorption layer, the middle layer is bistable cholesteric liquid crystal, photosensitive polymer, spacer particle mixture and packaging adhesive, and the upper layer is a conductive film with an anti-glare and wear-resistant layer. The lower substrate is made of conductive glass with a light absorption layer, the middle layer is made of a mixture of bistable cholesteric liquid crystal, photosensitive polymers and spacing particles, the upper substrate is made of a conductive film with an anti-dazzle wear-resistant layer and packaging glue with four sides and diagonal lines, the packaging glue adopts two modes, firstly, the sandwich structure is formed and then edge sealing is carried out, and the other mode is that the packaging glue is arranged at a front point of the upper substrate and the lower substrate in a laminating mode.
As shown in FIG. 1, the lower substrate of the scheme is rigid optical conductive toughened glass with the thickness of 0.5 mm-5 mm, preferably 1 mm-2 mm, the conductive layer is indium tin oxide or a nano silver wire, the sheet resistance value is 10 omega/□ -150 omega/□, and preferably the conductive layer of the nano silver wire. The light absorption layer of the lower substrate is realized by printing or spraying black ink, or by attaching a black film.
The upper substrate of the scheme is a soft conductive anti-dazzle film, the base material of the film is polyethylene terephthalate, polycarbonate, polyimide, polyethylene naphthalate, cycloolefin polymer, cellulose triacetate and the like, and the thickness is 0.1 mm-1 mm, preferably 0.125 mm-0.3 mm. The conductive layer is indium tin oxide and nano silver wire with sheet resistance value of 10 omega/□ -150 omega/□, and the nano silver conductive layer is preferred. The haze value of the anti-dazzle layer is 5-30%, preferably 10-20%, and the hardness is more than 2H.
The intermediate layer bistable cholesteric liquid crystal mixture comprises liquid crystal, ultraviolet polymerizable monomers and spacer microspheres. The uv polymerizable monomers form a polymer network that anchors the helical pitch of the chiral compound. The spacer microspheres uniformly control the thickness of the liquid crystal layer, so that the use amount of liquid crystal can be effectively reduced, the production cost is reduced, and the driving voltage of the liquid crystal film is reduced. The particle size of the spacing microspheres is 3 um-20 um, preferably 3 um-10 um.
The packaging adhesive can be subjected to thermal curing and ultraviolet curing, and has the functions of preventing liquid crystal leakage and supporting the upper substrate and the lower substrate. Therefore, the scheme discloses a liquid crystal writing board structure, the lower substrate adopts hard conductive glass, and the edge sealing is realized by adopting the packaging adhesive, so that the problems of heavy structure, complex process and edge crystal leakage of the existing like products are effectively solved. Specific examples are disclosed below.
Example 1
The lower substrate is conductive toughened glass with the thickness of 1.1mm, the conductive layer is indium tin oxide, the sheet resistance value is 150 omega/□, and the light absorption layer is realized by printing black ink. The upper substrate is a soft conductive anti-dazzle film, the base material of the film is polyethylene terephthalate, the thickness of the film is 0.125mm, the conductive layer is indium tin oxide, and the sheet resistance value is 150 omega/□. The haze value of the antiglare layer was 15% and the hardness was 3H. The particle size of the spacing microspheres in the middle layer is 5um, and the upper substrate and the lower substrate are fixed by the packaging adhesive through external ultraviolet curing as shown in figure 1.
Example 2
The lower substrate is conductive toughened glass with the thickness of 1.1mm, the conductive layer is a nano silver wire and has the square resistance value of 50 omega/□, and the light absorption layer is realized by attaching a black film to the lower layer of the glass. The upper substrate is a soft conductive anti-dazzle film, the base material of the film is polyethylene terephthalate, the thickness of the film is 0.125mm, the conductive layer is a nano silver wire, and the square resistance value is 50 omega/□. The haze value of the antiglare layer was 15% and the hardness was 3H. The particle size of the spacing microspheres in the middle layer is 5um, the upper substrate and the lower substrate are fixed by the packaging adhesive through external thermosetting as shown in fig. 2, the spacing microspheres of 5um are mixed in the packaging adhesive, and the edge sealing adhesive is coated on the four sides of the lower substrate in a dispensing manner as shown in fig. 3.
Example 3
The lower substrate is conductive toughened glass with the thickness of 1.1mm, the conductive layer is a nano silver wire and has the square resistance value of 50 omega/□, and the light absorption layer is realized by attaching a black film to the lower layer of the glass. The upper substrate is a soft conductive anti-dazzle film, the base material of the film is polyethylene terephthalate, the thickness of the film is 0.125mm, the conductive layer is a nano silver wire, and the square resistance value is 50 omega/□. The haze value of the antiglare layer was 15% and the hardness was 3H. The particle size of the spacing microspheres in the middle layer is 5um, the upper substrate and the lower substrate are fixed by the packaging adhesive through external thermosetting as shown in fig. 2, the spacing microspheres of 5um are mixed in the packaging adhesive, and the edge sealing adhesive is coated on the four sides and the diagonal line of the lower substrate in a dispensing manner as shown in fig. 4.
The devices, components, etc. disclosed in this embodiment may be implemented in any conventional and customary manner known in the art, unless otherwise specified.
The liquid crystal writing board of the scheme is not limited to the contents disclosed in the specific embodiments, the technical schemes presented in the embodiments can be extended based on the understanding of the person skilled in the art, and the simple alternatives made by the person skilled in the art according to the scheme and the common general knowledge also belong to the scope of the scheme.
Claims (8)
1. The utility model provides a liquid crystal wordpad, characterized by includes infrabasal plate, intermediate level, upper substrate, the intermediate level presss from both sides and establishes the infrabasal plate with form composite layer structure between the upper substrate, composite layer structure encapsulates into integrative liquid crystal wordpad through the encapsulation glue, the infrabasal plate includes the conductive glass layer, the conductive glass layer includes light-absorbing layer, conducting layer A, the intermediate level includes bistable cholesteric liquid crystal mixture layer, bistable cholesteric liquid crystal mixture layer includes bistable cholesteric liquid crystal, photopolymer, interval granule, the upper substrate includes the conducting film, the conducting film is including preventing dazzling wearing layer, conducting layer B.
2. The liquid crystal tablet of claim 1, wherein the encapsulant comprises an encapsulant rim around the edge of the composite layer structure.
3. The liquid crystal tablet of claim 1, wherein the encapsulation glue comprises a closed glue dispensing ring formed by glue dispensing on the edge of the bonding surface of the lower substrate.
4. The liquid crystal tablet of claim 3, wherein the encapsulation adhesive further comprises a dispensing diagonal between opposite inner corner ends of the dispensing ring.
5. The liquid crystal tablet of claim 1, wherein the conductive glass layer is a rigid optically conductive glass layer having a thickness of 0.5mm to 5mm, the conductive layer a is indium tin oxide or a nano silver wire, the sheet resistance of the conductive layer a is 10 Ω/□ to 150 Ω/□, and the light absorbing layer is a black ink layer or a black film layer.
6. The liquid crystal tablet of claim 5 wherein the rigid optically conductive glass layer has a thickness of 1mm to 2 mm.
7. The liquid crystal tablet of claim 1, wherein the photosensitive polymer is an ultraviolet polymerizable monomer, the spacer particles are spacer microspheres, and the spacer microspheres have a particle size of 3-20 um.
8. The liquid crystal tablet of claim 7, wherein the spacer beads have a particle size of 3um to 10 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921735174.7U CN210605296U (en) | 2019-10-16 | 2019-10-16 | Liquid crystal writing board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921735174.7U CN210605296U (en) | 2019-10-16 | 2019-10-16 | Liquid crystal writing board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210605296U true CN210605296U (en) | 2020-05-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921735174.7U Active CN210605296U (en) | 2019-10-16 | 2019-10-16 | Liquid crystal writing board |
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| Country | Link |
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| CN (1) | CN210605296U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022111092A1 (en) * | 2020-11-25 | 2022-06-02 | 京东方科技集团股份有限公司 | Writing panel and preparation method therefor, and writing board |
-
2019
- 2019-10-16 CN CN201921735174.7U patent/CN210605296U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022111092A1 (en) * | 2020-11-25 | 2022-06-02 | 京东方科技集团股份有限公司 | Writing panel and preparation method therefor, and writing board |
| US11940701B2 (en) | 2020-11-25 | 2024-03-26 | Beijing Boe Optoelectronics Technology Co., Ltd. | Writing panel and manufacturing method therefor, and writing board |
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| GR01 | Patent grant | ||
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Address after: Room 303, Building 2, No. 117, the Pearl River Road, High tech Zone, Suzhou City, Jiangsu Province, 215122 Patentee after: Suzhou Oulaishi New Material Technology Co.,Ltd. Address before: Room 106, Building 3, 618 Fengting Avenue, Suzhou Industrial Park, Suzhou City, Jiangsu Province, 215122 Patentee before: Suzhou olais Electronic Technology Co.,Ltd. |
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