CN210589982U - Substrate for bismuth telluride refrigeration wafer slicing - Google Patents

Substrate for bismuth telluride refrigeration wafer slicing Download PDF

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Publication number
CN210589982U
CN210589982U CN201921299494.2U CN201921299494U CN210589982U CN 210589982 U CN210589982 U CN 210589982U CN 201921299494 U CN201921299494 U CN 201921299494U CN 210589982 U CN210589982 U CN 210589982U
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China
Prior art keywords
paraffin
substrate
cut
bismuth telluride
coil
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CN201921299494.2U
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Chinese (zh)
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余学田
余涛
冯超
李春和
张伟
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Asbestos Kuoshan New Materials Technology Co ltd
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Asbestos Kuoshan New Materials Technology Co ltd
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Abstract

The utility model relates to a be used for sliced substrate of bismuth telluride refrigeration wafer for solve among the prior art substrate and the different problem that leads to cutting speed to descend of work piece material, its structure includes: the substrate is of a composite structure, paraffin is used as a binder, the flexible film is fixed on the glass lining plate through the paraffin, a workpiece to be cut is also fixed through the paraffin, when the flexible film is cut, the slicing knife is directly cut into the flexible film, the glass lining plate cannot be cut, the cutting can be guaranteed, the hardness of the flexible film and the paraffin is low, the slicing speed cannot be influenced, and therefore the production efficiency is improved; the quick heater is the device that melts paraffin fast, compares in heating methods such as traditional electric bar, and the volume is littleer, and speed is faster.

Description

Substrate for bismuth telluride refrigeration wafer slicing
Technical Field
The utility model belongs to the technical field of the auxiliary assembly that cuts into slices, concretely relates to be used for sliced substrate of bismuth telluride refrigeration wafer.
Background
Bismuth telluride is a common thermoelectric material, has good electrical conductivity, but poor thermal conductivity, and is mostly used as a refrigerating sheet, in the preparation stage, bismuth telluride is firstly made into a rod shape, then the rod shape is cut into the sheets by a dicing saw, in the slicing process of the prior art, a silicon wafer or glass is used as a substrate, a workpiece to be cut is fixed by 502 glue for cutting, but in the actual operation, the cutting speed is reduced due to different hardness of the workpiece and hardness of the substrate, for example, a blade for cutting the bismuth telluride wafer can not cut glass, a blade for cutting the glass can not cut the bismuth telluride wafer, the blade needs to be reconfigured due to different hardness and components of the material, but in order to cut the bismuth telluride, the bismuth telluride wafer needs to be cut through and then a little glass is cut, so the bismuth telluride wafer is cut through by using the glass substrate, the damage to the blade is large, and the cutting speed must be reduced. For example: if the blade cuts the bismuth telluride wafer, the speed can reach 80 mm/s, but because the substrate medium is glass, the hardness is different from that of the bismuth telluride wafer, in order to ensure the service life of the blade, the cutting speed can only be forced to be reduced to 30 mm/s, even 20 mm/s, the production efficiency is greatly reduced, if the silicon wafer is used as the substrate, the price is more than 10 times of that of the glass substrate, and the silicon wafer is fragile, after the glue 502 is used for solidification, the hardness is relatively higher, and the cutting speed also needs to be reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a be used for sliced substrate of bismuth telluride refrigeration wafer not only can avoid adopting the glass substrate and the problem that the cutting speed that causes reduces, can also reduce the cutting resistance that the binder brought, protection slicing knife.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the substrate for slicing the bismuth telluride refrigeration wafer comprises a glass lining plate, a soft film and paraffin, wherein the glass lining plate is square plate glass, the soft film is a latticed plastic film, and the soft film is fixed on the glass lining plate through the paraffin.
Further, still include: a quick heater, the quick heater comprising: coil, melt wax sheet, shaping frame, the shaping frame is square frame, and the outside of shaping frame is connected with the coil for support coil, the coil is induction coil, is used for heating the melt wax sheet, the melt wax sheet is the disc that high carbon steel made, and the disc top is provided with the handle that insulating heat-insulating material made, conveniently removes the melt wax sheet.
Further, the area of the wax melting sheet is smaller than that of the molding frame.
The utility model discloses can have following beneficial effect at least:
(1) the soft film is used as the middle layer, the hardness of the soft film is low, and the soft film cannot be in contact with the glass lining plate in the cutting process, so that the cutting speed does not need to be reduced, and the slicing knife cannot be damaged.
(2) The paraffin is used as a binder, the paraffin can well connect the soft film and the workpiece to be cut, and the hardness after solidification is low, so that the resistance to the slicing knife is reduced.
Drawings
The accompanying drawings, which form a part of the specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
In the drawings:
fig. 1 schematically shows a structural schematic view of a top view angle of the present invention;
fig. 2 schematically illustrates a side view angle diagram of any section of the present invention;
wherein the figures include the following reference numerals:
11-glass lining plate, 12-soft film, 13-paraffin, 21-coil, 22-wax melting sheet, 23-forming frame and 3-workpiece to be cut.
Detailed Description
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure; unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application; as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Spatially relative terms, such as "above … …," "above … …," "above … …, above," "overlying" and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures; it will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.
Examples
As shown in fig. 1-2, a substrate for slicing a bismuth telluride refrigeration wafer is used to solve the problem of cutting speed reduction caused by different materials of the substrate and a workpiece in the prior art, and the structure of the substrate comprises: the device comprises a substrate and a quick heater, wherein the substrate is of a composite structure, paraffin 13 is used as a binder, a soft film 12 is fixed on a glass lining plate 11 through the paraffin 13, a workpiece 3 to be cut is also fixed by the paraffin 13, a slicing knife is directly cut into the soft film 12 when slicing is carried out, the cutting-off can be ensured without cutting the glass lining plate 11, and the slicing speed cannot be influenced due to the low hardness of the soft film 12 and the paraffin 13, so that the production efficiency is improved; the quick heater is the device that melts paraffin 13 fast, compares heating methods such as traditional electric bar, and the volume is littleer, and is fast.
The liner plate is of a three-layer composite structure and comprises a glass liner plate 11, a soft film 12 and paraffin 13, wherein the glass liner plate 11 is in the prior art, details are not described here, the soft film 12 is a latticed plastic film and is fixed on the glass liner plate 11 through the paraffin 13 before use, due to the latticed film, the molten paraffin 13 enters into a grid and contacts with the glass liner plate 11, so that the soft film 12 is fixed more firmly, the soft film 12 serves as a transition layer between the glass liner plate 11 and a workpiece 3 to be cut, the contact between a slicing knife and the glass liner plate 11 can be avoided while the cutting is ensured to be cut through, the slicing knife directly cuts the soft film 12, and the hardness of the soft film 12 and the solidified paraffin is low, so that the cutting speed does not need to be reduced, and the higher production efficiency is.
The quick heater includes: the device comprises a coil 21, a wax melting sheet 22 and a forming frame 23, wherein as shown in fig. 1, the forming frame 23 is a square frame, when the device is used, the forming frame 23 is placed on a glass lining plate 11, the space in the forming frame 23 is used for forming paraffin 13, the melted paraffin 13 is prevented from flowing out of the glass lining plate 11 and can be taken out after forming, the coil 21 is connected to the outer side of the forming frame 23, the forming frame 23 is used for supporting the coil 21, the coil 21 is an induction coil, the wax melting sheet 22 in the coil 21 can be rapidly heated after being electrified according to the induction heating principle, the device is higher in speed compared with the traditional heating mode such as an electric heating wire and the like, and the occupied volume is smaller; the wax melting sheet 22 is a disc made of high-carbon steel, a handle made of an insulating heat-insulating material is arranged at the top of the disc, the wax melting sheet 22 is convenient to move, as shown in fig. 1, the area of the disc of the wax melting sheet 22 is smaller than that of the forming frame 23, and the wax melting sheet is placed in the forming frame 23 when wax blocks need to be melted; the use of the quick heater can greatly accelerate the melting process of the paraffin 13, directly melt the paraffin 13 on the glass lining plate 11, and no additional equipment is needed, so that the time is saved.
The use of the present invention is described below with reference to fig. 2:
firstly, paving a soft film 12 on a glass lining plate 11, and pressing the soft film 12 by using a forming frame 23 to prevent the soft film 12 from moving;
secondly, the method comprises the following steps: adding solid paraffin 13 into the molding frame 23, and covering the soft film 12 with the solid paraffin 13;
then: the paraffin wax melting piece 22 is put on the paraffin wax 13, and the switch of the coil 21 is started, and the paraffin wax melting piece 22 in the coil 21 is rapidly heated according to the induction heating principle, and the paraffin wax 13 is melted.
And finally, closing a switch of the coil 21, melting the paraffin 13 by utilizing the preheating of the paraffin melting sheet 22, taking out the paraffin melting sheet 22 after the paraffin 13 is completely melted, putting the workpiece 3 to be cut into the paraffin 13 when the paraffin 13 is still in a liquid state, fixing the workpiece 3 to be cut and the soft film 12 on the glass lining plate 11 along with the solidification of the paraffin 13, and taking off the forming frame 23 to perform slicing operation.
As a preferred embodiment, the flexible film is a plastic flexible film.
In the present embodiment, the coil is a mature prior art, and can be purchased directly, and thus will not be described in detail.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (3)

1. A substrate for slicing a bismuth telluride refrigeration wafer is characterized in that: the glass lining plate is square plate glass, the soft film is a latticed plastic film, and the soft film is fixed on the glass lining plate through paraffin.
2. The substrate for bismuth telluride refrigeration wafer dicing as claimed in claim 1, wherein: further comprising: a quick heater, the quick heater comprising: coil, melt wax sheet, shaping frame, the shaping frame is square frame, and the outside of shaping frame is connected with the coil for support coil, the coil is induction coil, is used for heating the melt wax sheet, the melt wax sheet is the disc that high carbon steel made, and the disc top is provided with the handle that insulating heat-insulating material made, conveniently removes the melt wax sheet.
3. The substrate for bismuth telluride refrigeration wafer dicing as claimed in claim 2, wherein: the area of the wax melting sheet is smaller than that of the molding frame.
CN201921299494.2U 2019-08-12 2019-08-12 Substrate for bismuth telluride refrigeration wafer slicing Active CN210589982U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921299494.2U CN210589982U (en) 2019-08-12 2019-08-12 Substrate for bismuth telluride refrigeration wafer slicing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921299494.2U CN210589982U (en) 2019-08-12 2019-08-12 Substrate for bismuth telluride refrigeration wafer slicing

Publications (1)

Publication Number Publication Date
CN210589982U true CN210589982U (en) 2020-05-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113524473A (en) * 2021-07-09 2021-10-22 苏州晶方半导体科技股份有限公司 Method for cutting optical substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113524473A (en) * 2021-07-09 2021-10-22 苏州晶方半导体科技股份有限公司 Method for cutting optical substrate
CN113524473B (en) * 2021-07-09 2023-10-20 苏州晶方半导体科技股份有限公司 Method for cutting optical substrate

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