CN210586280U

CN210586280U - Quartz groove for cleaning silicon wafer

Info

Publication number: CN210586280U
Application number: CN201921444123.9U
Authority: CN
Inventors: 高翔鹰; 张少阳; 裴文龙; 陈晨
Original assignee: Suzhou Core Silicon Electronics Technology Co ltd
Current assignee: Suzhou Core Silicon Electronics Technology Co ltd
Priority date: 2019-09-02
Filing date: 2019-09-02
Publication date: 2020-05-22
Anticipated expiration: 2029-09-02

Abstract

The utility model discloses a silicon chip washs and uses quartz cell, including the water jacket and the inside groove that have square structure, water jacket and inside groove cover are established and are bilayer structure, the notch face of inside groove is less than the notch face of water jacket, the notch position of inside groove is the sawtooth structure, is used for making washing liquid overflow in the inside groove is to the water jacket in, be provided with circulation pipeline, its characterized in that between water jacket and the inside groove: the silicon wafer support structure is characterized in that a support frame used for placing a silicon wafer is arranged in the inner groove, the support frame is not in contact with the inner groove, and the support frame is supported by a vertical frame arranged on the outer side of the outer groove. The beneficial effects of the utility model are mainly embodied in that: the bearing capacity of the quartz groove is reduced, the inner quartz groove is hardly stressed through the support arrangement of the vertical frame, and the bearing capacity of the inner quartz groove is greatly reduced; the service life of the quartz groove is prolonged; the auxiliary monitoring device improves safety and liberates manpower.

Description

Quartz groove for cleaning silicon wafer

Technical Field

The utility model relates to a semiconductor material technical field particularly, especially relates to a silicon chip washs and uses quartz groove.

Background

In the semiconductor industry, the cleaning of silicon wafers is typically performed in quartz baths. The quartz tank generally comprises a quartz tank body and a thermocouple protection tube arranged in the quartz tank body, wherein a liquid outlet is formed in the bottom of the quartz tank body, and waste liquid generated after cleaning the silicon wafer is discharged from the liquid outlet. HF acid and H are generally adopted for cleaning₂O₂When the acid solution is used for cleaning, some products are generated and deposited at the bottom of the quartz tank in the cleaning process, so that the inside of the quartz tank needs to be cleaned frequently, meanwhile, a certain special cleaning solution is added into the quartz tank easily in the cleaning process, and the quartz tank is limited in volume and can only be discharged from a waste liquid discharge port, so that the automatic circulation flow of the cleaning solution is difficult to realize, and the waste of resources is caused.

The double-layer quartz groove for cleaning the silicon wafers, as described in chinese patent CN201110198571.7, comprises an inner groove and an outer groove, wherein the inner groove is used for placing the silicon wafers to be cleaned, and since the inner groove needs to directly bear a large number of silicon wafers, the inner groove may be cracked or damaged by stress in the past, resulting in the scrapping of the whole quartz groove. In addition, the equipment that is arranged in the condition of the washing liquid in the outer groove of monitoring is not related to in this patent, lacks intelligent device, has increased human labor and has certain potential safety hazard.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming the defects existing in the prior art and providing a quartz groove for cleaning silicon wafers.

The purpose of the utility model is realized through the following technical scheme:

a quartz tank for cleaning silicon wafers comprises an outer tank and an inner tank which are of square structures, wherein the outer tank and the inner tank are sleeved to form a double-layer structure, the notch surface of the inner tank is lower than that of the outer tank, the notch position of the inner tank is of a sawtooth structure and is used for enabling cleaning liquid in the inner tank to overflow into the outer tank, and a circulating pipeline is arranged between the outer tank and the inner tank; the silicon wafer support is characterized in that a support frame used for placing a silicon wafer is arranged in the inner groove, and the support frame is not in contact with the inner groove. The support frame is supported by a vertical frame arranged outside the outer groove.

Preferably, the support frame is a quartz rectangular frame, and sawtooth protrusions used for clamping the silicon wafer are symmetrically arranged on two long sides of the support frame.

Preferably, a first L-shaped quartz rod and a second L-shaped quartz rod are fixedly arranged on two short edges of the supporting frame respectively, and free ends of the first L-shaped quartz rod and the second L-shaped quartz rod extend out of the cross section of the outer groove and are clamped and fixed on the stand through connecting pieces.

Preferably, a liquid inlet plate is arranged on one side of the notch of the outer tank in a crossing mode, and the free end of the first L-shaped quartz rod is arranged above the upper surface of the liquid inlet plate in a crossing mode.

Preferably, a liquid inlet hole and a monitoring hole are formed in the liquid inlet plate, and the liquid inlet hole can be used for injecting liquid; the monitoring hole is inserted into an auxiliary monitoring device.

Preferably, the bottom end of one side of the outer tank is provided with an outer tank circulation and outer liquid discharge pipe, and the outer tank circulation and outer liquid discharge pipe is connected with the circulation pipeline and a pump and then communicated to the inner tank.

Preferably, an inner circulation pipe for communicating with the circulation pipeline and an inner liquid discharge pipe for discharging liquid in the inner tank are arranged at the lower part of one side of the inner tank, and the outer end of the inner circulation pipe is connected with the pump.

Preferably, the inner end of the inner circulating pipe extends into the inner groove, and liquid outlet holes with uniform sizes are formed in the pipe wall.

Preferably, a safety pipe is arranged at the upper end of one side of the outer groove.

Preferably, a thermocouple protective tube is further arranged in the groove body of the quartz groove for cleaning the silicon wafer.

The beneficial effects of the utility model are mainly embodied in that:

1. the quartz inner groove is hardly stressed due to the support arrangement of the vertical frame, so that the pressure of the silicon wafer on the quartz inner groove is greatly reduced, and the risk of stress cracking or damage of the inner groove is reduced;

2. the support frame is not contacted with the bottom of the inner groove, namely, the silicon wafer is not directly contacted with the quartz groove, so that the risks caused by friction, collision and the like between the silicon wafer and the quartz groove are reduced;

3. liquid outlet holes with uniform size are formed in the inner circulating pipe in the inner groove, so that the impact force of cleaning liquid on the silicon wafer when the cleaning liquid enters the inner groove is reduced;

4. the safety is improved, the through hole arranged on the liquid inlet plate can be used for injecting liquid or installing an auxiliary monitoring device, the height or the temperature of cleaning liquid in the groove can be detected, and the safety is improved while manpower is liberated.

Drawings

The technical scheme of the utility model is further explained by combining the attached drawings as follows:

FIG. 1: the utility model is a three-dimensional view;

FIG. 2: the front view of the utility model;

FIG. 3: the utility model discloses a top view.

Detailed Description

The present invention will be described in detail below with reference to specific embodiments shown in the drawings. However, these embodiments are not limited to the present invention, and structural, method, or functional changes made by those skilled in the art according to these embodiments are all included in the scope of the present invention.

The present invention is not limited to the above embodiments, and structural, methodological, or functional changes made by those skilled in the art according to the embodiments are all included in the scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

As shown in fig. 1 to 3, the present invention discloses a quartz cell for cleaning silicon wafers, comprising an outer cell 31 and an inner cell 32 having a square structure. The outer groove 31 and the inner groove 32 are sleeved to form a double-layer structure, which is the prior art and will not be described herein.

The bottom end of one side of the outer tank 31 is provided with an outer tank circulation and drainage pipe 311 for discharging liquid in the tank, and the outer tank circulation and drainage pipe 311 is connected with a circulation pipeline and a pump and then communicated to the inner tank 32, so that the outer tank and the inner tank can form a loop. The one side upper end of outer tank 31 is equipped with safety tube 312, for avoiding because of level sensor is malfunctioning can't stop the fluid infusion, lets unnecessary washing liquid or other liquid that exceed the relief height flow out the outer tank, causes the potential safety hazard.

In accordance with the prior art, the notch surface of the inner tank 32 is lower than the notch surface of the outer tank 31, and the notch position of the inner tank 32 is a sawtooth structure, so that the cleaning liquid in the inner tank 32 overflows from the sawtooth structure to the outer tank 31; meanwhile, since the notch of the inner tank 32 is lower than the notch of the outer tank 31, it is possible to ensure that the liquid does not flow out of the tank during the overflow.

The circulation line is provided between the outer tank 31 and the inner tank 32. An inner circulation pipe 321 for communicating with the circulation pipeline and an inner liquid discharge pipe 322 for discharging liquid in the inner groove are arranged at the lower part of one side of the inner groove 32, so that the inner end of the inner circulation pipe 321 is extended into the inner groove 32 to avoid impact force on silicon wafers in the groove when the liquid enters the inner circulation pipe 321, liquid outlet holes 3211 with uniform size are arranged on the pipe wall of the inner circulation pipe 321, and the impact force of water flow on the silicon wafers is greatly reduced by the design of the liquid outlet holes 3211.

The utility model discloses a focus lies in: the inner groove 32 is internally provided with a rectangular quartz frame support frame 4 for placing a silicon wafer, and the support frame 4 is supported by a vertical frame 1 arranged outside the outer groove 31. As shown in fig. 3, the two long sides of the supporting frame 4 are symmetrically provided with sawtooth protrusions 43 for clamping the silicon wafer, and the supporting frame 4 is not in contact with the inner groove 32, so that the silicon wafer does not touch the groove wall when being placed in the supporting frame 4, the groove wall is not easy to break or damage, the silicon wafer is prevented from being damaged, and the service life of the quartz groove is prolonged.

And two short sides of the support frame 4 are respectively and fixedly provided with a first L-shaped quartz rod 41 and a second L-shaped quartz rod 42, and the free ends of the first L-shaped quartz rod 41 and the second L-shaped quartz rod 42 extend out of the cross section of the outer groove 31 and are clamped and fixed on the vertical frame 1 through a connecting piece 5. The connecting member 5 may be a clamping plate, which is not described in detail herein.

The free end of the first L-shaped quartz rod 41 is arranged above the upper surface of the liquid inlet plate 2 in a crossing manner, and the liquid inlet plate 2 is arranged on one side of the notch of the outer tank 31 in a crossing manner. The liquid inlet plate 2 is provided with a liquid inlet hole 21 and a monitoring hole 22, and the liquid inlet hole 21 can be used for connecting a perfusion tube for liquid injection; the monitoring hole 22 may be used to insert an auxiliary monitoring device, which includes a liquid level sensor, a temperature sensor, etc.

In addition, the design of the liquid inlet plate 2 also enhances the supporting force, and the contact area of the liquid inlet plate and the supporting frame 4 is increased, so that the pressure of the supporting frame 4 on the outer tank and the stand is reduced.

In the preferred embodiment, the vertical frame 1 and the liquid inlet plate 2 can be made of metal materials or rigid plastics, and the vertical frame 1 and the liquid inlet plate 2 do not need to be in direct contact with liquid in the tank, so that the vertical frame and the liquid inlet plate are made of metal materials or rigid plastics, and are not easy to damage compared with quartz materials.

Consistent with the prior art, a thermocouple guard tube (not shown in the figure) is further arranged in the groove body of the quartz groove for cleaning the silicon wafer, the thermocouple guard tube is used for heating liquid in the groove, and the molecular motion of the liquid is accelerated after the liquid is heated, so that the cleaning force is enhanced, and the cleaning time is shortened.

The working principle is as follows:

cleaning liquid or other liquid is inserted into the liquid inlet hole 21 of the liquid inlet plate 2 through the quartz tube, and a liquid level sensor, a temperature sensor, etc. are inserted into the monitoring hole 22 of the liquid inlet plate 2, and the cleaning liquid is injected into the inner groove 32. When the inner tank 32 is filled with liquid, the liquid overflows into the outer tank 31 through the saw teeth of the inner tank opening, the liquid in the outer tank 31 reaches the height set by the liquid level sensor, or the liquid supply into the inner tank is stopped when the temperature in the tank reaches the temperature set by the temperature sensor; after the liquid supply is stopped, the liquid in the inner and outer tanks is circulated, i.e., the cleaning liquid in the outer tank 31 flows from the circulation line to the inner circulation pipe 321 and into the inner tank 32 by the pump. Finally, the waste liquid formed by the used liquid is discharged out of the tank, the waste liquid in the inner tank 32 is discharged through the inner liquid discharge pipe 322, and the waste liquid in the outer tank 31 is discharged through the outer tank circulation and the outer liquid discharge pipe 311.

It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.

The above list of details is only for the practical implementation of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent implementations or modifications that do not depart from the technical spirit of the present invention should be included in the scope of the present invention.

Claims

1. A quartz tank for cleaning silicon wafers comprises an outer tank (31) and an inner tank (32) which are of square structures, wherein the outer tank (31) and the inner tank (32) are sleeved to form a double-layer structure, the notch surface of the inner tank (32) is lower than that of the outer tank (31), the notch position of the inner tank (32) is of a sawtooth structure and used for enabling cleaning liquid in the inner tank (32) to overflow into the outer tank (31), and a circulating pipeline is arranged between the outer tank (31) and the inner tank (32), and the quartz tank is characterized in that: the silicon wafer support is characterized in that a support frame (4) used for placing a silicon wafer is arranged in the inner groove (32), the support frame (4) is not in contact with the inner groove (32), and the support frame (4) is supported by a vertical frame (1) arranged on the outer side of the outer groove (31).

2. The quartz cell for cleaning silicon wafers as set forth in claim 1, wherein: the support frame (4) is a quartz rectangular frame, and sawtooth protrusions (43) used for clamping the silicon wafer are symmetrically arranged on two long edges.

3. The quartz cell for cleaning silicon wafers as set forth in claim 2, wherein: the quartz rod supporting frame is characterized in that a first L-shaped quartz rod (41) and a second L-shaped quartz rod (42) are fixedly arranged on two short sides of the supporting frame (4) respectively, and free ends of the first L-shaped quartz rod (41) and the second L-shaped quartz rod (42) extend out of the cross section of the outer groove (31) and are clamped and fixed on the vertical frame (1) through a connecting piece (5).

4. The quartz cell for cleaning silicon wafers according to claim 3, wherein: one side of the notch of the outer groove (31) is provided with a liquid inlet plate (2) in a crossing mode, and the free end of the first L-shaped quartz rod (41) is arranged above the upper surface of the liquid inlet plate (2) in a crossing mode.

5. The quartz cell for cleaning silicon wafers according to claim 4, wherein: a liquid inlet hole (21) and a monitoring hole (22) are formed in the liquid inlet plate (2), and the liquid inlet hole (21) can be used for injecting liquid; the monitoring hole (22) is used for inserting an auxiliary monitoring device.

6. The quartz cell for cleaning silicon wafers according to any one of claims 1 to 5, characterized in that: and the bottom end of one side of the outer tank (31) is provided with an outer tank circulation and outer liquid discharge pipe (311), and the outer tank circulation and outer liquid discharge pipe (311) is connected with the circulation pipeline and a pump and then communicated to the inner tank (32).

7. The quartz cell for cleaning silicon wafers according to claim 6, wherein: an inner circulating pipe (321) communicated with the circulating pipeline and an inner liquid discharging pipe (322) used for discharging liquid in the inner groove are arranged at the lower part of one side of the inner groove (32), and the outer end of the inner circulating pipe (321) is connected with the pump.

8. The quartz cell for cleaning silicon wafers as set forth in claim 7, wherein: the inner end of the inner circulating pipe (321) extends into the inner groove (32) and the pipe wall of the inner circulating pipe is provided with liquid outlet holes (3211) with uniform size.

9. The quartz cell for cleaning silicon wafers according to any one of claims 1 to 5, characterized in that: a safety pipe (312) is arranged at the upper end of one side of the outer groove (31).

10. The quartz cell for cleaning silicon wafers as set forth in claim 1, wherein: and an electric thermocouple protective tube is also arranged in the groove body of the quartz groove for cleaning the silicon wafer.