CN210579453U - Double-deck circuit board of antidetonation type - Google Patents
Double-deck circuit board of antidetonation type Download PDFInfo
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- CN210579453U CN210579453U CN201921746060.2U CN201921746060U CN210579453U CN 210579453 U CN210579453 U CN 210579453U CN 201921746060 U CN201921746060 U CN 201921746060U CN 210579453 U CN210579453 U CN 210579453U
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- layer circuit
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Abstract
The utility model discloses an anti-seismic double-layer circuit board, which comprises two horizontal blocks which are distributed relatively, a vertical block which is positioned at one end of the inner side of the two horizontal blocks, and a double-layer circuit board body, wherein one end of the double-layer circuit board body is arranged in the horizontal block and can be propped into the vertical block, and the other end of the double-layer circuit board body extends out of the horizontal block; the utility model has the advantages that: through the designed buffer mechanism, the shock absorption effect on the double-layer circuit board body is increased by utilizing the matching of the spring and the abutting plate; the shock absorption effect on the double-layer circuit board body is further improved by the aid of the shock absorption pad; the arrangement of the air holes is beneficial to better ventilation through the air holes, and the damp of the double-layer circuit board body is reduced; the heat-conducting silicone grease is beneficial to better promoting the double-layer circuit board body to dissipate heat; through the perforation of seting up a plurality of interval distributions at the top of vertical piece, help utilizing the perforation to further increase the inside ventilative heat dissipation of placing in vertical piece of double-deck circuit board body.
Description
Technical Field
The utility model belongs to the technical field of the double-deck circuit board, concretely relates to double-deck circuit board of antidetonation type.
Background
A PCB board has two sides, a top layer and a bottom layer. This is a double layer circuit board. The double-layer circuit board is a PCB board with two sides coated with copper. The double-layer circuit board is coated with copper on both sides to form wires, and the wires between the two layers can be conducted through the via holes to form the required network connection.
The existing double-layer circuit board has the following defects when in use:
the double-layer circuit board has a deficiency in shock resistance.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a double-deck circuit board of antidetonation type to there is not enough problem in the aspect of the antidetonation of the double-deck circuit board that proposes in solving above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a double-deck circuit board of antidetonation type, includes two relative distribution's horizontal piece, is located the vertical piece of two horizontal piece inboard one ends, double-deck circuit board body, the horizontal piece is arranged in to the one end of double-deck circuit board body to can support into vertical piece, the horizontal piece is stretched out to the other end, the interior bottom of horizontal piece sets up buffer gear, and this buffer gear is including supporting board and spring, the one end and the interior bottom of supporting board connection of spring, the other end and horizontal piece are connected, double-deck circuit board body can arrange the top of supporting the board in.
Preferably, the spring is provided with a plurality of springs, and the springs are distributed at intervals.
Preferably, the cross section of the abutting plate is trapezoidal, and the long edge of the abutting plate abuts against the double-layer circuit board body.
Preferably, a shock pad is fixed to the inner bottom of the horizontal block, and the cross section of the shock pad is rectangular.
Preferably, a plurality of air holes distributed at intervals are formed in the horizontal block, and heat-conducting silicone grease is coated on the air holes.
Preferably, the section of the vertical block is U-shaped, and a plurality of through holes distributed at intervals are formed in the top of the vertical block in a penetrating manner.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) through the designed buffer mechanism, the shock absorption effect on the double-layer circuit board body is increased by utilizing the matching of the spring and the abutting plate;
(2) the shock absorption effect on the double-layer circuit board body is further improved by the aid of the shock absorption pad;
(3) the arrangement of the air holes is beneficial to better ventilation through the air holes, and the damp of the double-layer circuit board body is reduced; the heat-conducting silicone grease is beneficial to better promoting the double-layer circuit board body to dissipate heat;
(4) through the perforation of seting up a plurality of interval distributions at the top of vertical piece, help utilizing the perforation to further increase the inside ventilative heat dissipation of placing in vertical piece of double-deck circuit board body.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic side view of the present invention;
fig. 3 is a schematic view of the structure of fig. 2 in partial section according to the present invention;
in the figure: 1. a double-layer circuit board body; 2. a via hole; 3. a horizontal block; 4. a vertical block; 5. a resisting plate; 6. a spring; 7. a shock pad; 8. heat-conducting silicone grease; 9. air holes are formed; 10. and (6) perforating.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, fig. 2 and fig. 3, the present invention provides a technical solution: an anti-seismic double-layer circuit board comprises two horizontal blocks 3 which are distributed oppositely, a vertical block 4 which is positioned at one end of the inner side of the two horizontal blocks 3 and a double-layer circuit board body 1, wherein a plurality of through holes 2 are arranged on the double-layer circuit board body 1 in a penetrating way, one end of the double-layer circuit board body 1 is arranged in the horizontal block 3, and can be pushed into the vertical block 4, the other end extends out of the horizontal block 3, the inner bottom of the horizontal block 3 is provided with a buffer mechanism, the buffer mechanism comprises a resisting plate 5 and a spring 6, one end of the spring 6 is connected with the resisting plate 5, the other end is connected with the inner bottom of the horizontal block 3, the double-layer circuit board body 1 can be arranged at the top of the resisting plate 5, when in use, the double-layer circuit board body 1 applies pressure to the abutting plate 5, the spring 6 is compressed after the abutting plate 5 is pressed, the spring 6 is pressed to deform and then reset to push the abutting plate 5 to abut on the double-layer circuit board body 1, and the damping effect of the double-layer circuit board body 1 is increased by matching the spring 6 with the abutting plate 5.
In this embodiment, preferably, the springs 6 are provided in plurality, and the springs 6 are distributed at intervals, which facilitates the use of the springs 6 to better buffer the double-layer circuit board body 1.
In this embodiment, preferably, the cross section of the abutting plate 5 is trapezoidal, and the long side of the abutting plate 5 abuts against the double-layer circuit board body 1, which is beneficial to better utilize the trapezoidal abutting plate 5 to abut against the double-layer circuit board body 1.
In this embodiment, it is preferable that a damper pad 7 is fixed to the inner bottom of the horizontal block 3, and the damper pad 7 has a rectangular cross section, which contributes to further increase the damping effect on the double-layer circuit board body 1 by the damper pad 7.
In this embodiment, preferably, a plurality of air holes 9 are formed in the horizontal block 3, and the heat-conducting silicone grease 8 is coated on the air holes 9, so that better ventilation through the air holes 9 is facilitated, damping of the double-layer circuit board body 1 is reduced, and the heat-conducting silicone grease 8 is arranged to better promote the heat dissipation of the double-layer circuit board body 1.
In this embodiment, preferably, the cross section of the vertical block 4 is "U" shaped, and a plurality of through holes 10 distributed at intervals are formed through the top of the vertical block 4, which is helpful to further increase the ventilation and heat dissipation of the part of the double-layer circuit board body 1 placed in the vertical block 4 by using the through holes 10.
The utility model discloses a theory of operation and use flow: the damping pad 7 is fixed at the inner bottom of the horizontal block 3, one end of the spring 6 is connected with the abutting plate 5, the other end of the spring is connected with the inner bottom of the horizontal block 3, one end of the double-layer circuit board body 1 is arranged in the horizontal block 3 and can abut into the vertical block 4, and the other end of the spring extends out of the horizontal block 3;
the horizontal block 3 is provided with a plurality of air holes 9 distributed at intervals, the air holes 9 are coated with heat-conducting silicone grease 8, so that better ventilation through the air holes 9 is facilitated, the damp of the double-layer circuit board body 1 is reduced, and the arrangement of the heat-conducting silicone grease 8 is helpful for better promoting the heat dissipation of the double-layer circuit board body 1;
the top of the vertical block 4 is perforated with a plurality of through holes 10 distributed at intervals, which is helpful to further increase the ventilation and heat dissipation of the part of the double-layer circuit board body 1 placed in the vertical block 4 by using the through holes 10.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a double-deck circuit board of antidetonation type, includes horizontal piece (3) of two relative distributions, is located vertical piece (4) of the inboard one end of two horizontal pieces (3), double-deck circuit board body (1), its characterized in that: the double-layer circuit board is characterized in that one end of the double-layer circuit board body (1) is arranged in the horizontal block (3) and can be abutted into the vertical block (4), the other end of the double-layer circuit board body extends out of the horizontal block (3), a buffer mechanism is arranged at the inner bottom of the horizontal block (3), the buffer mechanism comprises an abutting plate (5) and a spring (6), one end of the spring (6) is connected with the abutting plate (5), the other end of the spring is connected with the inner bottom of the horizontal block (3), and the top of the abutting plate (5) can be arranged in the double-layer circuit board body (1).
2. An earthquake-resistant double-layer circuit board according to claim 1, characterized in that: the springs (6) are arranged in a plurality, and the springs (6) are distributed at intervals.
3. An earthquake-resistant double-layer circuit board according to claim 1, characterized in that: the cross section of the abutting plate (5) is trapezoidal, and the long side of the abutting plate (5) abuts against the double-layer circuit board body (1).
4. An earthquake-resistant double-layer circuit board according to claim 1, characterized in that: a damping pad (7) is fixed at the inner bottom of the horizontal block (3), and the section of the damping pad (7) is rectangular.
5. An earthquake-resistant double-layer circuit board according to claim 4, characterized in that: the horizontal block (3) is provided with a plurality of air holes (9) distributed at intervals, and the heat-conducting silicone grease (8) is coated on the air holes (9).
6. An earthquake-resistant double-layer circuit board according to claim 1, characterized in that: the cross section of the vertical block (4) is U-shaped, and a plurality of through holes (10) distributed at intervals are formed in the top of the vertical block (4) in a penetrating mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921746060.2U CN210579453U (en) | 2019-10-17 | 2019-10-17 | Double-deck circuit board of antidetonation type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921746060.2U CN210579453U (en) | 2019-10-17 | 2019-10-17 | Double-deck circuit board of antidetonation type |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210579453U true CN210579453U (en) | 2020-05-19 |
Family
ID=70661597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921746060.2U Active CN210579453U (en) | 2019-10-17 | 2019-10-17 | Double-deck circuit board of antidetonation type |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210579453U (en) |
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2019
- 2019-10-17 CN CN201921746060.2U patent/CN210579453U/en active Active
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