CN210579222U - Carrier band for improving electrostatic adsorption of silicon microphone - Google Patents
Carrier band for improving electrostatic adsorption of silicon microphone Download PDFInfo
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- CN210579222U CN210579222U CN201921764949.3U CN201921764949U CN210579222U CN 210579222 U CN210579222 U CN 210579222U CN 201921764949 U CN201921764949 U CN 201921764949U CN 210579222 U CN210579222 U CN 210579222U
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- silicon microphone
- groove
- recess
- carrier tape
- carrier
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Abstract
The utility model provides an improve silicon microphone electrostatic adsorption's carrier band, the carrier band is including bearing main part and lid area, a surface that bears the main part has an at least recess, the recess is used for holding silicon microphone, lid area can cover bear the main part upper surface, with sealed the recess, recess bottom and/or lateral wall have an at least fretwork hole, so that the recess quilt lid area seals the back, recess and external intercommunication. The utility model has the advantages of, set up the fretwork hole in the recess bottom and/or the lateral wall of carrier band the recess quilt cover area sealed back, recess and external intercommunication can be balanced the inside and outside atmospheric pressure of recess reduces the recess bottom with electrostatic absorption between the silicon microphone bottom reduces the effort that external equipment absorbs the silicon microphone, appears throwing the material problem when avoiding external equipment to pick up the silicon microphone.
Description
Technical Field
The utility model relates to a silicon microphone packing field especially relates to an improve silicon microphone electrostatic adsorption's carrier band.
Background
Silicon microphones, also known as MEMS microphones, are microphones fabricated based on MEMS technology. The MEMS microphone is made up of a MEMS sensor, an ASIC amplifier, an acoustic cavity, and a circuit board with RF suppression circuitry. The MEMS sensor chip is a micro capacitor formed by a silicon diaphragm and a silicon back plate, and can convert sound pressure change into capacitance change, and then the capacitance change is reduced by an ASIC chip and is converted into an electric signal, so that the sound-electricity conversion is realized.
During storage and transportation of the silicon microphone, the silicon microphone is usually packaged by a carrier tape. Some silicon microphone products are packaged with the sound holes facing upwards, so that a client side can conveniently pick up and do not suck the vibrating diaphragm, a layer of mylar (an adhesive tape which is used for preventing the MEMS film from being sucked and broken and is stuck to the sound holes and preventing foreign matters) is usually stuck to the sound holes, and in the process of storing and moving the silicon microphone, the mylar and a cover tape at the top of a carrier tape rub to generate static electricity, so that the bottom of the silicon microphone product and the bottom of the carrier tape generate electrostatic adsorption. When an external device picks up the silicon microphone, the force of the device to suck the silicon microphone is often required to be increased in order to overcome the electrostatic attraction, which may cause a material throwing problem when the device picks up the silicon microphone.
Therefore, how to avoid electrostatic adsorption between the bottom of the silicon microphone product and the bottom of the carrier tape is a technical problem that needs to be solved at present.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that an improve silicon microphone electrostatic adsorption's carrier band is provided, its electrostatic adsorption that can reduce the bottom of silicon microphone product bottom and carrier band appears throwing the material problem when avoiding external equipment to pick up the silicon microphone.
In order to solve the problem, the utility model provides an improve silicon microphone electrostatic adsorption's carrier band, including bearing main part and lid area, a surface that bears the main part has an at least recess, the recess is used for holding silicon microphone, lid area can cover bear the main part upper surface, in order to seal the recess, recess bottom and/or lateral wall have an at least fretwork hole, so that the recess quilt after the lid area is sealed, recess and external intercommunication.
Further, the central region of the bottom of the groove is removed and the edge region of the bottom of the groove is retained to form a hollow hole in the bottom of the groove.
Further, the edge upper surface of the bottom of the groove is provided with at least one protruding part which can support the silicon microphone so as to reduce the contact area of the silicon microphone and the bottom of the groove.
Further, the area of the cross section of the hollow hole is smaller than that of the bottom of the silicon microphone.
Further, the edge of the bottom of the groove is wavy to reduce the contact area of the silicon microphone and the bottom of the groove.
Further, a plurality of through holes penetrate through the bottom and/or the side wall of the groove, so that a plurality of hollow holes are formed in the bottom and/or the side wall of the groove.
Further, the bottom of the groove is wavy, or the bottom of the groove is provided with a protruding part extending towards the inside of the groove.
Further, the bearing main body is provided with a plurality of grooves which are arranged in a matrix.
Further, one of the recesses is sealed with one of the cover tapes, or a plurality of the recesses are sealed with the same cover tape.
Further, the carrier tape also comprises a sealing film, and the sealing film can be attached to the sound hole of the silicon microphone.
The utility model has the advantages of, set up the fretwork hole in the recess bottom and/or the lateral wall of carrier band the recess quilt cover area sealed back, recess and external intercommunication can be balanced the inside and outside atmospheric pressure of recess reduces the recess bottom with electrostatic absorption between the silicon microphone bottom reduces the effort that external equipment absorbs the silicon microphone, appears throwing the material problem when avoiding external equipment to pick up the silicon microphone.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of a carrier tape according to the present invention;
FIG. 2 is a schematic diagram of a carrier tape carrying a silicon microphone according to the present invention;
fig. 3 is a schematic structural diagram of a second embodiment of the carrier tape of the present invention;
fig. 4 is a schematic structural diagram of a third embodiment of the carrier tape of the present invention;
fig. 5 is a schematic structural diagram of a fourth embodiment of the carrier tape of the present invention;
FIG. 6 is a schematic diagram of a carrier tape carrying a silicon microphone according to the present invention;
fig. 7 is a schematic structural diagram of a fifth embodiment of a carrier tape according to the present invention;
FIG. 8 is a schematic diagram of a carrier tape carrying a silicon microphone according to the present invention;
fig. 9 is a schematic structural view of a sixth embodiment of the carrier tape;
figure 10 is a schematic diagram of the structure of the carrier tape carrying silicon microphone;
fig. 11 is a schematic structural view of a seventh embodiment of the carrier tape;
figure 12 is a schematic diagram of the structure of the carrier tape carrying silicon microphone;
fig. 13 is a schematic structural view of a seventh embodiment of the carrier tape;
fig. 14 is a schematic diagram of the structure of the carrier tape carrying silicon microphone.
Detailed Description
The following describes in detail a specific embodiment of a carrier tape for improving electrostatic absorption of a silicon microphone according to the present invention with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a first embodiment of the present invention for improving electrostatic adsorption of a silicon microphone. Referring to fig. 1, the carrier tape includes a carrier body 10 and a cover tape 11.
One surface of the bearing body 10 has at least one groove 101. When a surface of the bearing body 10 has a plurality of grooves 101, the grooves 101 may be arranged in a matrix. In the present embodiment, the surface of the carrier body 10 has a plurality of grooves 101, and only three grooves 101 are illustrated in fig. 1 for clarity of description of the structure of the carrier tape of the present invention.
The recess 101 is for receiving a silicon microphone. Fig. 2 is a schematic structural view of the carrier tape for improving electrostatic adsorption of the silicon microphone according to the present invention. Referring to fig. 2, the silicon microphone 20 is disposed in the recess 101. The bottom of the silicon microphone 20 is in contact with the bottom of the recess 101, i.e. the bottom of the recess 101 supports the silicon microphone 20. The sound hole 21 at the top of the silicon microphone is facing the opening of the recess 101, i.e. the sound hole 21 at the top of the silicon microphone 20 is exposed to the opening of the recess 101.
The cover tape 11 can cover the upper surface of the carrier body 10 to seal the recess 101. Wherein one of the recesses 101 can be sealed with one of the cover tapes 11, that is, the carrier tape includes a plurality of cover tapes 11, one cover tape 11 corresponding to each of the recesses 101; alternatively, a plurality of recesses 101 may be sealed with the same cover tape 11, i.e., one cover tape 11 extends to seal a plurality of recesses 101. When the carrier tape is used, the silicon microphone 20 is placed in the recess 101 and the cover tape 11 covers the surface of the carrier body 10 to seal the recess 101.
In general, referring to fig. 2, the sound hole 21 on the top of the silicon microphone 20 is exposed to the opening of the groove 101, and a sealing film 12 is attached to the sound hole 21 for the convenience of the client to pick up and not to damage the diaphragm of the silicon microphone 20. During the process of storing and moving the silicon microphone 20, the sealing film 12 rubs against the cover tape 11 to generate static electricity, so that the bottom of the silicon microphone 20 and the bottom of the groove 101 generate electrostatic adsorption, which often causes a material throwing problem when external equipment picks up the silicon microphone 20.
In order to avoid the above problem, the bottom and/or the sidewall of the groove 101 of the carrier tape of the present invention has at least one hollow hole 110. After the groove 101 is sealed by the cover tape 11, the groove 101 is communicated with the outside through the hollow hole 110, so that the air pressure inside and outside the groove 101 is kept balanced, the electrostatic adsorption between the bottom of the groove 101 and the bottom of the silicon microphone 20 can be reduced, the acting force of external equipment for picking up the silicon microphone 20 is reduced, and the problem of material throwing when the external equipment picks up the silicon microphone 20 is avoided.
In this embodiment, a hollow hole 110 is formed at the bottom of the groove 101, so that the contact area between the bottom of the groove 101 and the silicon microphone 20 is also reduced, thereby further reducing the electrostatic adsorption between the bottom of the silicon microphone 20 and the bottom of the groove 101, and avoiding the problem of material throwing when an external device picks up the silicon microphone 20.
In a second embodiment of the present invention, the side wall of the groove 101 has a hollow hole. Fig. 3 is a schematic structural view of a second embodiment of a carrier tape according to the present invention, please refer to fig. 3, in which the side wall of the groove has a hollow hole 120. In a third embodiment of the present invention, please refer to fig. 4, which is a schematic structural diagram of the third embodiment of the carrier tape of the present invention, the bottom of the groove 101 has a hollow hole 110, and the side wall of the groove 101 has a hollow hole 120.
Further, in the first embodiment, the central area of the bottom of the groove 101 is removed, and the edge area of the bottom of the groove 101 is remained, so as to form a hollow hole 110 at the bottom of the groove 101. Wherein the area of the cross section of the through hole 110 is smaller than the area of the bottom of the silicon microphone 20, so that the edge of the bottom of the groove 101 can support the silicon microphone 20. The hollow hole 110 is formed at the bottom of the groove 101, so that the central area of the bottom of the groove 101 is not in contact with the bottom of the silicon microphone 20, thereby reducing the contact area between the two, and further reducing the electrostatic adsorption between the bottom of the silicon microphone 20 and the bottom of the groove 101.
The utility model discloses still provide a fourth embodiment of carrier band. Fig. 5 is a schematic structural diagram of a fourth embodiment of the carrier tape, referring to fig. 5, the fourth embodiment is different from the first embodiment in that an upper surface of an edge of a bottom of the groove 101 has at least one protrusion 102, i.e., the protrusion 102 extends toward an inside of the groove 101. The boss 102 is capable of supporting the silicon microphone 20. Fig. 6 is a schematic structural view of the carrier tape carrying silicon microphone, please refer to fig. 6, the silicon microphone 20 is disposed in the groove 101, and the protrusion 102 supports the bottom of the silicon microphone 20 to further reduce the contact area between the silicon microphone and the bottom of the groove 101, thereby reducing the electrostatic attraction between the bottom of the silicon microphone 20 and the bottom of the groove 101.
The utility model discloses still provide a fifth embodiment of carrier band. Fig. 7 is a schematic structural view of a third embodiment of the carrier tape, and referring to fig. 7, the fifth embodiment is different from the first embodiment in that the edge of the bottom of the groove 101 is wavy, and the peak position of the wavy shape is used for supporting the silicon microphone. Fig. 8 is a schematic structural view of the carrier tape carrying silicon microphone, please refer to fig. 8, the silicon microphone 20 is disposed in the groove 101, the bottom edge of the groove 101 is wavy, and the wavy peak positions support the silicon microphone 20, so as to further reduce the contact area between the silicon microphone 20 and the bottom of the groove 101, and further reduce the electrostatic adsorption between the bottom of the silicon microphone 20 and the bottom of the groove 101.
The utility model discloses still provide a sixth embodiment of carrier band. Fig. 9 is a schematic structural view of a sixth embodiment of the carrier tape, and referring to fig. 9, the sixth embodiment is different from the first embodiment in that a plurality of through holes 103 penetrate through the bottom of the groove 101 to form a plurality of hollowed-out holes at the bottom of the groove 101. In this embodiment, the through holes 103 are randomly or regularly distributed at the bottom of the groove 101 to form a plurality of hollow holes at the bottom of the groove 101, so that the contact area between the silicon microphone 20 and the bottom of the groove 101 is reduced while the air pressure inside and outside the groove 101 is balanced, and the electrostatic adsorption between the bottom of the silicon microphone 20 and the bottom of the groove 101 is further reduced. Fig. 10 is a schematic structural view of the carrier tape carrying silicon microphone, please refer to fig. 10, the silicon microphone 20 is disposed in the groove 101, and the silicon microphone 20 is supported at a position where no through hole 103 is disposed at the bottom of the groove 101, so as to further reduce the contact area between the silicon microphone 20 and the bottom of the groove 101, and further reduce the electrostatic adsorption between the bottom of the silicon microphone 20 and the bottom of the groove 101.
The utility model discloses still provide a seventh embodiment of carrier band. Fig. 11 is a schematic structural view of a seventh embodiment of the carrier tape, and referring to fig. 11, the seventh embodiment is different from the second embodiment in that the bottom of the groove 101 is wavy, and the peak position of the wavy shape is used for supporting the silicon microphone. Fig. 12 is a schematic structural view of the carrier tape carrying the silicon microphone, please refer to fig. 12, the silicon microphone 20 is disposed in the groove 101, the bottom of the groove 101 is wavy, and the wavy peak positions support the silicon microphone 20, so as to further reduce the contact area between the silicon microphone 20 and the bottom of the groove 101, and further reduce the electrostatic adsorption between the bottom of the silicon microphone 20 and the bottom of the groove 101.
The utility model discloses still provide an eighth embodiment of carrier band. Fig. 13 is a schematic structural view of a seventh embodiment of the carrier tape, and referring to fig. 13, the seventh embodiment is different from the second embodiment in that the bottom of the groove 101 is wavy, and the peak position of the wavy shape is used for supporting the silicon microphone. Fig. 14 is a schematic structural view of the carrier tape carrying silicon microphone, and referring to fig. 14, the silicon microphone 20 is disposed in the recess 101, and the bottom of the recess 101 is provided with a protrusion 102 extending towards the inside of the recess 101, and the protrusion 102 can support the silicon microphone 20. Fig. 14 is a schematic view of the structure of the carrier tape carrying silicon microphone, please refer to fig. 14, the silicon microphone 20 is disposed in the recess 101, and the protrusion 102 supports the bottom of the silicon microphone 20 to further reduce the contact area between the silicon microphone and the bottom of the recess 101, thereby reducing the electrostatic attraction between the bottom of the silicon microphone 20 and the bottom of the recess 101. The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A carrier tape for improving electrostatic adsorption of a silicon microphone comprises a carrier body and a cover tape, wherein at least one groove is formed in one surface of the carrier body and used for accommodating the silicon microphone, the cover tape can cover the upper surface of the carrier body to seal the groove, and at least one hollow hole is formed in the bottom and/or the side wall of the groove so that the groove is communicated with the outside after the groove is sealed by the cover tape.
2. The carrier tape of claim 1, wherein a central region of the bottom of the groove is removed and an edge region of the bottom of the groove is retained to form a hollow hole in the bottom of the groove.
3. The carrier tape of claim 2, wherein the top surface of the edge of the bottom of the recess has at least one protrusion capable of supporting the silicon microphone to reduce the contact area of the silicon microphone with the bottom of the recess.
4. The carrier tape of claim 2, wherein the area of the cross section of the aperture is smaller than the area of the bottom of the silicon microphone.
5. The carrier tape of claim 2, wherein the edges of the recess bottom are wavy to reduce the contact area of the silicon microphone with the recess bottom.
6. The carrier tape of claim 1, wherein a plurality of through holes extend through the groove bottom and/or the sidewalls to form a plurality of hollowed-out holes in the groove bottom and/or the sidewalls.
7. The carrier tape according to claim 1, wherein the bottom of the groove is wavy or provided with a protrusion extending toward the inside of the groove.
8. The carrier tape of claim 1, wherein the carrier body has a plurality of pockets arranged in a matrix.
9. The carrier tape of claim 1, wherein one of the pockets is sealed with one of the cover tapes, or a plurality of the pockets are sealed with the same cover tape.
10. The carrier tape of claim 1, further comprising a sealing membrane capable of fitting at the acoustic holes of the silicon microphone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921764949.3U CN210579222U (en) | 2019-10-21 | 2019-10-21 | Carrier band for improving electrostatic adsorption of silicon microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921764949.3U CN210579222U (en) | 2019-10-21 | 2019-10-21 | Carrier band for improving electrostatic adsorption of silicon microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210579222U true CN210579222U (en) | 2020-05-19 |
Family
ID=70659388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921764949.3U Ceased CN210579222U (en) | 2019-10-21 | 2019-10-21 | Carrier band for improving electrostatic adsorption of silicon microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210579222U (en) |
-
2019
- 2019-10-21 CN CN201921764949.3U patent/CN210579222U/en not_active Ceased
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| IW01 | Full invalidation of patent right | ||
| IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20220331 Decision number of declaring invalidation: 54975 Granted publication date: 20200519 |