CN210569356U - Heat pump system with semiconductor thermoelectric power generation - Google Patents
Heat pump system with semiconductor thermoelectric power generation Download PDFInfo
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- CN210569356U CN210569356U CN201921400344.6U CN201921400344U CN210569356U CN 210569356 U CN210569356 U CN 210569356U CN 201921400344 U CN201921400344 U CN 201921400344U CN 210569356 U CN210569356 U CN 210569356U
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Abstract
The utility model provides a heat pump system with semiconductor thermoelectric power generation, which comprises a compressor, a condenser, a semiconductor power generation device, a first electronic expansion valve, an evaporator and a storage battery electrically connected with the semiconductor power generation device, wherein the semiconductor power generation device is provided with a hot end pipeline and a cold end pipeline, the input end of the hot end pipeline is connected with the output port of the condenser, and the output end of the hot end pipeline is connected with the input end of the first electronic expansion valve; the output end of the first electronic expansion valve is connected with the input end of the cold end pipeline, and the output end of the cold end pipeline is connected with the input port of the evaporator; the storage battery is electrically connected with the first electronic expansion valve. The heat pump system recovers the temperatures of the outlet section of the condenser and the outlet section of the first expansion valve by arranging the semiconductor power generation device, generates power by utilizing the temperature difference between the outlet section of the condenser and the outlet section of the first expansion valve, stores the generated electric energy by the storage battery, supplies power to various electrical elements in the heat pump system, further reduces the power consumption of the heat pump system, and enables the heat pump system to achieve higher energy efficiency.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a heat pump field especially relates to a heat pump system with semiconductor thermoelectric generation.
[ background of the invention ]
The heat pump system is a device for transferring the heat energy of a low-level heat source to a high-level heat source, has the characteristics of high efficiency, energy conservation, environmental protection and the like, is popular among people, and when the existing heat pump system works, large temperature difference can be generated between the outlet end of a condenser and the outlet end of an expansion valve through pipelines of the condenser and the expansion valve, and the temperature difference is not recycled.
[ Utility model ] content
The utility model aims at overcoming above-mentioned problem, we provide a heat pump system with semiconductor thermoelectric generation, and it utilizes thermoelectric generation through setting up semiconductor power generation facility to get up the electrical components power consumption in the confession system with electric energy storage, further reduce the power consumption of heat pump system during operation.
In order to achieve the above object, the utility model provides a heat pump system with semiconductor thermoelectric generation, its characterized in that: the semiconductor power generation device is provided with a hot end pipeline and a cold end pipeline, the input end of the hot end pipeline is connected with the output port of the condenser, and the output end of the hot end pipeline is connected with the input end of the first electronic expansion valve; the output end of the first electronic expansion valve is connected with the input end of the cold end pipeline, and the output end of the cold end pipeline is connected with the input port of the evaporator; the storage battery is electrically connected with the first electronic expansion valve.
In one or more embodiments, the heat pump system further comprises a heat exchanger and a second electronic expansion valve; the input port of a first pipeline of the heat exchanger is connected with the output end of a hot end pipeline, and the output port of the heat exchanger is connected with the input end of a first electronic expansion valve; the input end of the second electronic expansion valve is connected between the first pipeline and the first electronic expansion valve, the output end of the second electronic expansion valve is connected with the input port of the second pipeline of the heat exchanger, and the output port of the second pipeline is connected with the input port of the compressor.
In one or more embodiments, the second electronic expansion valve is electrically connected to the battery.
In one or more embodiments, the heat exchanger is a plate heat exchanger.
In one or more embodiments, a check valve is disposed between the output of the second pipeline and the compressor.
In one or more embodiments, the hot end pipeline and the cold end pipeline of the semiconductor power generation device both use copper pipes.
Compared with the prior art, the utility model the effect that exists is:
because the utility model adopts the above scheme, heat pump system is through setting up semiconductor power generation facility, retrieves the temperature of condenser export section and first expansion valve export section, utilizes the difference in temperature of the two to generate electricity to electric energy storage through the battery will produce, each electrical components power supply in the heat pump system is used, has further reduced heat pump system's power consumption, makes heat pump system reach higher efficiency.
[ description of the drawings ]
Fig. 1 is a schematic view of the connection relationship between the components of the heat pump system according to the embodiment of the present invention.
[ detailed description ] embodiments
In order to deepen the understanding of the present invention, the present invention will be further described in detail with reference to the following embodiments and the attached drawings, and the embodiments are only used for explaining the present invention, and do not constitute the limitation to the protection scope of the present invention.
Referring to the attached drawing 1, the utility model provides a heat pump system with semiconductor thermoelectric generation, it includes compressor 1, condenser 2, semiconductor power generation device 3, first electronic expansion valve 4, evaporimeter 5 and battery 6 with semiconductor power generation device 3 electricity is connected, battery 6 stores the produced electric energy of semiconductor power generation device 3, semiconductor power generation device 3 is equipped with hot junction pipeline 31 and cold junction pipeline 32, wherein, the delivery outlet of compressor 1 is connected with the input port of condenser 2, the delivery outlet of condenser 2 is connected with the input of hot junction pipeline 31, the output of hot junction pipeline 31 is connected with the input of first electronic expansion valve 4, the output of first electronic expansion valve 4 is connected with the input port of evaporimeter 5, the input port of evaporimeter 5 is connected with the input port of compressor 1, from this forms the heat pump loop, battery 6 is connected with first electronic expansion valve 4 electricity, for supplying power to the first electronic expansion valve 4.
In the heat pump system in the embodiment, the semiconductor power generation device is arranged to recover the temperatures of the outlet section of the condenser and the outlet section of the first expansion valve, the temperature difference between the outlet section of the condenser and the outlet section of the first expansion valve is utilized to generate power, the generated electric energy is stored by the storage battery and is supplied to various electrical elements in the heat pump system, the power consumption of the heat pump system is further reduced, and the heat pump system achieves higher energy efficiency.
Preferably, the heat pump system further comprises a heat exchanger 7 and a second electronic expansion valve 8; the input port of a first pipeline 71 of the heat exchanger 7 is connected with the output end of the hot end pipeline 31, and the output port of the first pipeline is connected with the input end of the first electronic expansion valve 4; the input end of the second electronic expansion valve 8 is connected between the first pipeline 71 and the first electronic expansion valve 4, the output end is connected with the input port of the second pipeline 72 of the heat exchanger 7, the output port of the second pipeline 72 is connected with the input port of the compressor 1, by additionally arranging the heat exchanger 7 and the second electronic expansion valve 8, when the second electronic expansion valve 8 is opened, a part of the refrigerant is throttled by the second electronic expansion valve 8 and then returns to the compressor 1 through the second pipeline 72 of the heat exchanger 7, and the refrigerant with lower temperature evaporates and absorbs heat when passing through the second pipeline 72, so that the heat exchanger 7 is in a lower temperature state, the temperature of the refrigerant passing through the first loop 71 is further reduced, the further reduced refrigerant is throttled by the first electronic expansion valve 4 and then is output into the refrigerant with lower temperature and is conveyed to the cold end pipeline 32 of the semiconductor power generation device, and the cold end pipeline 32 and the hot end pipeline 31 form larger temperature, thereby generating more electrical energy.
Preferably, the second electronic expansion valve 8 is electrically connected with the storage battery 6, and the storage battery 6 supplies power to the second electronic expansion valve 8, so that energy consumption is reduced. The heat exchanger 7 is a plate heat exchanger, and the plate heat exchanger has the advantages of long service life and small heat loss. A check valve 9 is arranged between the output port of the second pipeline 72 and the compressor 1 to ensure the flow direction of the refrigerant. The hot end pipeline 31 and the cold end pipeline 32 of the semiconductor power generation device 3 both adopt copper pipes, and the copper pipes are easy to bend and have good conductivity.
In addition to the above embodiments, the present invention can also have other embodiments, and the technical solutions formed by equivalent replacement or equivalent transformation are adopted and all fall within the protection scope of the present invention.
Claims (6)
1. A heat pump system with semiconductor thermoelectric power generation is characterized in that: the semiconductor power generation device comprises a compressor (1), a condenser (2), a semiconductor power generation device (3), a first electronic expansion valve (4), an evaporator (5) and a storage battery (6) electrically connected with the semiconductor power generation device (3), wherein the semiconductor power generation device (3) is provided with a hot end pipeline (31) and a cold end pipeline (32), the input end of the hot end pipeline (31) is connected with the output port of the condenser (2), and the output end of the hot end pipeline is connected with the input end of the first electronic expansion valve (4); the output end of the first electronic expansion valve (4) is connected with the input end of the cold end pipeline (32), and the output end of the cold end pipeline (32) is connected with the input port of the evaporator (5); the storage battery (6) is electrically connected with the first electronic expansion valve (4).
2. The heat pump system with semiconductor thermoelectric power generation according to claim 1, wherein: the heat pump system also comprises a heat exchanger (7) and a second electronic expansion valve (8);
an input port of a first pipeline (71) of the heat exchanger (7) is connected with an output end of the hot end pipeline (31), and an output port of the first pipeline is connected with an input end of the first electronic expansion valve (4);
the input end of the second electronic expansion valve (8) is connected between the first pipeline (71) and the first electronic expansion valve (4), the output end of the second electronic expansion valve is connected with the input port of the second pipeline (72) of the heat exchanger (7), and the output port of the second pipeline (72) is connected with the input port of the compressor (1).
3. The heat pump system with semiconductor thermoelectric power generation according to claim 2, wherein: the second electronic expansion valve (8) is electrically connected with the storage battery (6).
4. The heat pump system with semiconductor thermoelectric power generation according to claim 2, wherein: the heat exchanger (7) is a plate heat exchanger.
5. The heat pump system with semiconductor thermoelectric power generation according to claim 2, wherein: and a one-way valve (9) is arranged between the output port of the second pipeline (72) and the compressor (1).
6. A heat pump system with semiconductor thermoelectric power generation according to any one of claims 1-5, characterized in that: and a hot end pipeline (31) and a cold end pipeline (32) of the semiconductor power generation device (3) both adopt copper pipes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921400344.6U CN210569356U (en) | 2019-08-27 | 2019-08-27 | Heat pump system with semiconductor thermoelectric power generation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921400344.6U CN210569356U (en) | 2019-08-27 | 2019-08-27 | Heat pump system with semiconductor thermoelectric power generation |
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| CN210569356U true CN210569356U (en) | 2020-05-19 |
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| CN201921400344.6U Active CN210569356U (en) | 2019-08-27 | 2019-08-27 | Heat pump system with semiconductor thermoelectric power generation |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112910377A (en) * | 2021-01-29 | 2021-06-04 | 上海第二工业大学 | Photovoltaic thermoelectric heat pump coupling system |
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2019
- 2019-08-27 CN CN201921400344.6U patent/CN210569356U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112910377A (en) * | 2021-01-29 | 2021-06-04 | 上海第二工业大学 | Photovoltaic thermoelectric heat pump coupling system |
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