CN210567182U - Monitoring device for computer lab - Google Patents
Monitoring device for computer lab Download PDFInfo
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- CN210567182U CN210567182U CN201921644905.7U CN201921644905U CN210567182U CN 210567182 U CN210567182 U CN 210567182U CN 201921644905 U CN201921644905 U CN 201921644905U CN 210567182 U CN210567182 U CN 210567182U
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- Prior art keywords
- heat dissipation
- monitoring device
- dissipation case
- backup pad
- supporting plate
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- 238000012806 monitoring device Methods 0.000 title claims abstract description 39
- 230000017525 heat dissipation Effects 0.000 claims abstract description 60
- 239000004065 semiconductor Substances 0.000 claims abstract description 12
- 238000005057 refrigeration Methods 0.000 claims abstract description 11
- 239000007788 liquid Substances 0.000 claims abstract description 9
- 238000001179 sorption measurement Methods 0.000 claims description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 239000002826 coolant Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 9
- 239000000110 cooling liquid Substances 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000004887 air purification Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model discloses a monitoring device for computer lab belongs to monitoring device technical field, including first backup pad, the below of first backup pad is provided with the camera, and the lower surface of first backup pad is provided with the base corresponding with the camera, the upper surface of first backup pad is provided with heat dissipation mechanism, and heat dissipation mechanism includes the heat dissipation case, and the inside of heat dissipation case is provided with the coolant liquid, and the one end of heat dissipation case is provided with the blow off pipe, and the lower surface of heat dissipation case is inlayed with the semiconductor refrigeration piece, the opposite side of heat dissipation case is provided with negative pressure air fan, and negative pressure air fan's output is provided with the intake pipe; the utility model discloses simple structure, convenient to use has raising and lowering functions, and the user of being convenient for overhauls monitoring device, dispels the heat to the base through mutually supporting of heat dissipation case and semiconductor refrigeration piece during the use to prevent that the electronic component in the base from taking place to damage because the high temperature, guarantee the user to monitoring device's normal use.
Description
Technical Field
The utility model belongs to the technical field of monitoring device, concretely relates to monitoring device for computer lab.
Background
Chinese patent (publication number is CN 209130474U) discloses a machine room fortune dimension monitoring device, which comprises a fixed base, the spacing groove has been seted up to the bottom outer wall of fixing base, and the top inner wall of spacing groove has seted up the fixed slot, electronic guide rail is installed through the bolt to the top inner wall of fixed slot, and electronic guide rail's bottom outer wall installs the connecting block through the bolt, the mounting box is installed through the bolt to the bottom outer wall of connecting block, and the both ends outer wall of mounting box respectively with the both ends inner wall sliding connection of spacing groove.
The monitoring device has the advantages that the camera is connected with the moving end of the electric guide rail, so that the position of the camera can be moved by the electric guide rail, and the using number of the camera is reduced.
However, the monitoring device lacks a corresponding heat dissipation structure, so that the monitoring device has a poor heat dissipation effect, and is easily damaged due to over-high temperature.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a monitoring device for computer lab to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a monitoring device for computer lab, includes first backup pad, and the below of first backup pad is provided with the camera, and the lower surface of first backup pad is provided with the base corresponding with the camera, the upper surface of first backup pad is provided with heat dissipation mechanism, and heat dissipation mechanism includes the heat dissipation case, and the inside of heat dissipation case is provided with the coolant liquid, and the one end of heat dissipation case is provided with the blow off pipe, and the lower surface mosaic of heat dissipation case has the semiconductor refrigeration piece.
As a further aspect of the present invention: the other side of the heat dissipation box is provided with a negative pressure fan, the output end of the negative pressure fan is provided with an air inlet pipe, the bottom end of the heat dissipation box is provided with an air dissipation pipe corresponding to the air inlet pipe, and the upper surface of the air dissipation pipe is provided with an air outlet.
As a further aspect of the present invention: the top of heat dissipation case is provided with the adsorption plate, and the adsorption plate is the cuboid structure, has seted up on the adsorption plate and has adsorbed the through-hole.
As a further aspect of the present invention: the adsorption plate is made of activated carbon.
As a further aspect of the present invention: the dustproof plate is arranged above the heat dissipation box, and a support is arranged at the joint of the dustproof plate and the heat dissipation box.
As a further aspect of the present invention: a second supporting plate is arranged above the first supporting plate, and electric telescopic rods corresponding to the first supporting plate are arranged at two ends of the lower surface of the second supporting plate
As a further aspect of the present invention: the top end of the electric telescopic rod is fixedly connected with the second supporting plate in a welding mode, and the bottom end of the electric telescopic rod is fixedly connected with the first supporting plate in a welding mode.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses simple structure, high durability and convenient use, the lifting function has, the user of being convenient for overhauls monitoring device, mutually support through heat dissipation case and semiconductor refrigeration piece during the use dispels the heat to the base, thereby prevent that the electronic component in the base from taking place to damage because the temperature is too high, guarantee user to monitoring device's normal use, secondly, this device still has good dust removal function, make monitoring device can remove dust to the computer lab when playing the control effect, thereby make monitoring device's function abundanter, be worth promoting and using.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of a corresponding heat dissipation mechanism of the present invention;
fig. 3 is a schematic structural view of the corresponding air diffusing pipe of the present invention;
in the figure: 1-camera, 2-base, 3-first supporting plate, 4-electric telescopic rod, 5-second supporting plate, 6-heat dissipation mechanism, 61-semiconductor refrigeration piece, 62-blow-off pipe, 63-heat dissipation box, 64-bracket, 65-dust guard, 66-adsorption plate, 67-adsorption through hole, 68-heat dissipation liquid, 691-negative pressure fan, 692-air inlet pipe, 693-air dissipation pipe and 694-air outlet hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1:
referring to fig. 1-3, the present invention provides a technical solution: a monitoring device for a machine room comprises a first supporting plate 3, a camera 1 is arranged below the first supporting plate 3, a base 2 corresponding to the camera 1 is arranged on the lower surface of the first supporting plate 3, a heat dissipation mechanism 6 is arranged on the upper surface of the first supporting plate 3, the heat dissipation mechanism 6 comprises a heat dissipation box 63, heat dissipation liquid 68 is arranged inside the heat dissipation box 63, in the embodiment, the heat dissipation liquid 68 is preferably water, a drain pipe 62 is welded at one end of the heat dissipation box 63, and a semiconductor refrigeration sheet 61 is embedded on the lower surface of the heat dissipation box 63;
in order to make the use of the semiconductor refrigeration sheet 61 more convenient, in this embodiment, preferably, the semiconductor refrigeration sheet 61 is electrically connected to the power supply through a switch, and the cold end of the semiconductor refrigeration sheet 61 contacts with the first support plate 3, so that the first support plate 3 is cooled through the semiconductor refrigeration sheet 61, and the monitoring device is better in heat dissipation effect by matching with the use of the heat dissipation box 63 and the heat dissipation liquid 68, thereby preventing the monitoring device from being damaged due to overhigh temperature, and ensuring the normal use of the monitoring device by a user;
in order to make the functions of the heat dissipation mechanism 6 more abundant, in this embodiment, preferably, the other side of the heat dissipation box 63 is provided with a negative pressure fan 691, the negative pressure fan 691 is electrically connected with a power supply through a switch, an air inlet pipe 692 is arranged at an output end of the negative pressure fan 691, an air dissipation pipe 693 corresponding to the air inlet pipe 692 is arranged at a bottom end of the heat dissipation box 63, and an air outlet 694 is arranged on an upper surface of the air dissipation pipe 693;
in order to make the heat dissipation box 63 have a better air purification effect, in this embodiment, preferably, an adsorption plate 66 is disposed at the top end of the heat dissipation box 63, the adsorption plate 66 is of a rectangular parallelepiped structure, and an adsorption through hole 67 is formed in the adsorption plate 66;
in order to make the adsorption capability of the adsorption plate 66 stronger, in this embodiment, it is preferable that the adsorption plate 66 is made of activated carbon, and in order to make the dustproof effect of the heat dissipation mechanism 6 better, in this embodiment, it is preferable that a dustproof plate 65 is disposed above the heat dissipation box 63, and a bracket 64 is welded to a joint of the dustproof plate 65 and the heat dissipation box 63.
Example 2:
on the basis of embodiment 1, in order to facilitate the user to overhaul the monitoring device, in this embodiment, preferably, a second support plate 5 is arranged above the first support plate 3, two ends of the lower surface of the second support plate 5 are provided with electric telescopic rods 4 corresponding to the first support plate 3, the electric telescopic rods 4 are electrically connected with a power supply through switches, and when in use, the electric telescopic rods 4 are driven to extend, so that the heights of the camera 1 and the base 2 are reduced, thereby facilitating the user to overhaul the monitoring device, facilitating the overhaul of the monitoring device by the user, saving time and labor;
in order to make the use of the electric telescopic rod 4 more reliable, in this embodiment, preferably, the top end of the electric telescopic rod 4 is fixedly connected with the second support plate 5 by welding, and the bottom end of the electric telescopic rod 4 is fixedly connected with the first support plate 3 by welding.
The utility model discloses a theory of operation and use flow: when the monitoring device is used, the monitoring device is fixed through the second supporting plate 5, the camera 1 is used for monitoring, and the base 2 is cooled through the mutual matching of the semiconductor refrigerating sheet 61, the cooling box 63 and the cooling liquid 68, so that the cooling effect of the monitoring device is better, the monitoring device is prevented from being damaged due to overhigh temperature, and the normal use of the monitoring device by a user is ensured;
in addition, the power supply of the negative pressure fan 691 is switched on, so that air is pumped into the heat dissipation box 63, then the air uniformly enters the heat dissipation liquid 68 through the air outlet 694 on the air dissipation pipe 693, the air is adsorbed and purified through the heat dissipation liquid 68, dust in the air is removed, peculiar smell and harmful gas in the air are further adsorbed and purified through the adsorption plate 66, the heat dissipation mechanism 6 can purify the air while dissipating heat, and the function of the monitoring device is richer;
in addition, when the cooling liquid 68 adsorbs and purifies the air, the air can take away the heat in the cooling liquid 68 to play the heat dissipation effect to the cooling liquid 68, make the cooling effect of cooling liquid 68 to the heat dissipation case 63 better, thereby further promote monitoring device's radiating effect.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. The utility model provides a monitoring device for computer lab, includes first backup pad (3), and the below of first backup pad (3) is provided with camera (1), and the lower surface of first backup pad (3) is provided with base (2) corresponding with camera (1), its characterized in that: the upper surface of first backup pad (3) is provided with heat dissipation mechanism (6), and heat dissipation mechanism (6) are provided with heat dissipation liquid (68) including heat dissipation case (63) in the inside of heat dissipation case (63), and the one end of heat dissipation case (63) is provided with blow off pipe (62), and the lower surface of heat dissipation case (63) inlays and has semiconductor refrigeration piece (61).
2. The monitoring device for a machine room according to claim 1, wherein: the other side of heat dissipation case (63) is provided with negative-pressure air fan (691), and negative-pressure air fan's (691) output is provided with intake pipe (692), and the bottom of heat dissipation case (63) is provided with air-diffusing pipe (693) corresponding with intake pipe (692), and venthole (694) have been seted up to the upper surface of air-diffusing pipe (693).
3. The monitoring device for a machine room according to claim 2, wherein: the top of heat dissipation case (63) is provided with adsorption plate (66), and adsorption plate (66) are the cuboid structure, have seted up on adsorption plate (66) and have adsorbed through-hole (67).
4. The monitoring device for a machine room according to claim 3, wherein: the adsorption plate (66) is made of activated carbon.
5. The monitoring device for a machine room according to claim 4, wherein: a dustproof plate (65) is arranged above the heat dissipation box (63), and a support (64) is arranged at the joint of the dustproof plate (65) and the heat dissipation box (63).
6. The monitoring device for a machine room according to any one of claims 1 to 5, wherein: and a second supporting plate (5) is arranged above the first supporting plate (3), and electric telescopic rods (4) corresponding to the first supporting plate (3) are arranged at two ends of the lower surface of the second supporting plate (5).
7. The monitoring device for a machine room according to claim 6, wherein: the top end of the electric telescopic rod (4) is fixedly connected with the second supporting plate (5) in a welding mode, and the bottom end of the electric telescopic rod (4) is fixedly connected with the first supporting plate (3) in a welding mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921644905.7U CN210567182U (en) | 2019-09-29 | 2019-09-29 | Monitoring device for computer lab |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921644905.7U CN210567182U (en) | 2019-09-29 | 2019-09-29 | Monitoring device for computer lab |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210567182U true CN210567182U (en) | 2020-05-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921644905.7U Active CN210567182U (en) | 2019-09-29 | 2019-09-29 | Monitoring device for computer lab |
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| CN (1) | CN210567182U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113494671A (en) * | 2021-07-26 | 2021-10-12 | 郝子涵 | Network security monitoring device based on artificial intelligence |
-
2019
- 2019-09-29 CN CN201921644905.7U patent/CN210567182U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113494671A (en) * | 2021-07-26 | 2021-10-12 | 郝子涵 | Network security monitoring device based on artificial intelligence |
| CN113494671B (en) * | 2021-07-26 | 2023-08-29 | 北京汇志凌云数据技术有限责任公司 | Network security monitoring device based on artificial intelligence |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 361000 Room 302, No. 52, guanri Road, phase II, software park, Xiamen, Fujian Patentee after: Zeyu Technology Group Co.,Ltd. Address before: 361000 unit 302, 52 guanri Road, phase II, software park, Siming District, Xiamen City, Fujian Province Patentee before: Xiamen Zeyu Technology Engineering Co.,Ltd. |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A monitoring device for computer room Effective date of registration: 20220805 Granted publication date: 20200519 Pledgee: Xiamen Branch of PICC Pledgor: Zeyu Technology Group Co.,Ltd. Registration number: Y2022980012065 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231201 Granted publication date: 20200519 Pledgee: Xiamen Branch of PICC Pledgor: Zeyu Technology Group Co.,Ltd. Registration number: Y2022980012065 |