CN210535635U - Automatic wafer slide glass device inclines - Google Patents
Automatic wafer slide glass device inclines Download PDFInfo
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- CN210535635U CN210535635U CN201921736780.0U CN201921736780U CN210535635U CN 210535635 U CN210535635 U CN 210535635U CN 201921736780 U CN201921736780 U CN 201921736780U CN 210535635 U CN210535635 U CN 210535635U
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Abstract
The utility model discloses an automatic slope wafer slide glass device puts into the device with the wafer, will automatic slope wafer slide glass device puts into the cleaning machine perpendicularly, washs the operation. During operation, one side of the automatic telescopic rod, which is far away from the connecting main shaft, exceeds the bottommost end of the slide glass device, and meanwhile, the length of the automatic telescopic rod is longer than other vertical rod bodies. Thereby realizing the functions of automatic inclination and restoration. Thereby improving the uniformity and the efficiency of wafer cleaning and simultaneously achieving the purposes of automatic inclination, high efficiency, environmental protection and energy conservation.
Description
Technical Field
The utility model relates to a wafer washs the field, especially relates to an automatic slope wafer slide glass device.
Background
With the utility model discloses the closest prior art is the slide glass device of wafer cleaning machine, and the slide glass device among the current wafer cleaning machine can not the automatic tilting, and prior art is lower to wafer abluent efficiency simultaneously.
SUMMERY OF THE UTILITY MODEL
Therefore, it is desirable to provide an automatic tilting wafer carrier device to improve the uniformity and efficiency of wafer cleaning, and achieve the purposes of automatic tilting, high efficiency, environmental protection and energy saving.
In order to achieve the above object, the inventor provides an automatic inclined wafer slide device, which comprises an automatic telescopic rod, a plurality of wafer layering grids and slide main shafts on two sides;
the wafer layering grids are arranged in parallel, each wafer layering grid is respectively and rotatably connected with the slide glass main shafts on the two sides, and the wafer layering grids are used for placing wafers to be cleaned;
the automatic telescopic rod is movably connected with each wafer layering grid, one side, far away from the slide glass main shaft, of the automatic telescopic rod exceeds the bottom end of the slide glass device when the slide glass device is lifted, and the automatic telescopic rod is jacked up to drive the wafer layering grids to deflect up and down around the rotary connection position of the slide glass main shaft and the wafer layering grids when the slide glass device is placed.
Furthermore, the wafer layering grid consists of a horizontal rod, a cavity for accommodating a wafer and a blocking object;
the cavity is positioned above the horizontal rod, and the horizontal rod is respectively and rotatably connected with the slide glass main shafts on the two sides;
the automatic telescopic rod is hinged with the horizontal rod;
the obstacle is positioned on the horizontal rod and used for preventing the wafer from inclining and sliding down.
Furthermore, the wafer layering grid comprises a slide glass tray rear part and a slide glass tray front part movable door;
the rear part of the slide glass tray is hinged with the movable door at the front part of the slide glass tray in a rotating way around the vertical direction;
the horizontal rod on the movable door at the front part of the slide glass tray is hinged with a movable door frame at the front part of the slide glass tray, which is far away from the slide glass main shaft;
the connecting part of the rear part of the slide glass tray and the movable door at the front part of the slide glass tray is positioned on one side of the slide glass main shaft, which is far away from the rear part of the slide glass tray.
Further, the barrier is a bump, and the bump is located at the rear of the slide tray.
Further, the obstacle is a rod, the rod is perpendicular to the wafer layering grids, and the rod is rotatably connected with the horizontal rod at the rear part of the slide glass tray.
Furthermore, the number of the movable doors at the front part of the slide bearing disc is two, and the movable doors are respectively hinged at the left side and the right side of the rear part of the slide bearing disc in a rotating manner.
Furthermore, the slide glass tray front movable door also comprises a hydraulic telescopic rod.
Further, the slide glass device also comprises a slide glass top tray and a slide glass bottom tray;
the slide glass top plate is fixedly connected with the slide glass base plate through a slide glass main shaft.
Further, the device also comprises a connecting spindle connected with the top of the slide glass device.
Further, the automatic wafer-tilting slide device further comprises a power mechanism, wherein the power mechanism is connected with the connecting main shaft and used for moving the automatic wafer-tilting slide device.
Different from the prior art, when the technical scheme is used, the wafers are placed into the device, and when the wafer layering grid is loaded with a certain number of wafers. And vertically placing the automatic inclined wafer slide device into a cleaning machine for cleaning operation by moving the slide device. During operation, one side of the automatic telescopic rod, which is far away from the slide glass main shaft, exceeds the bottommost end of the slide glass device, and meanwhile, the length of the automatic telescopic rod is longer than other vertical rod bodies. When the automatic telescopic rod is placed at the bottom of the cleaning tank, the automatic telescopic rod is subjected to the reaction force of the cleaning tank on the automatic telescopic rod, so that the automatic telescopic rod is subjected to vertical upward pressure to move upwards. Meanwhile, each wafer layering grid is respectively and rotatably connected with the slide glass main shafts on the two sides, and when the automatic telescopic rod moves upwards under the action of vertical upward pressure, the slide glass device rotates by taking the connection part of the slide glass main shafts and the wafer layering grids as an axis, so that the slide glass device deflects up and down, and the function of automatic inclination is realized. When the wafer is taken out upwards after being cleaned, the pressure on the automatic telescopic rod is gradually reduced, and the slide glass device is enabled to be restored to the horizontal state due to the influence of the self gravity factor. It should be noted that the center of gravity of the automatic telescopic rod is the same as that of the slide glass device, and specifically, when the center of gravity of the slide glass device is located in front of the slide glass main shaft, the automatic telescopic rod is located at the front; and similarly, when the center of gravity is positioned at the back, the automatic telescopic rod is positioned at the back of the slide glass device. Realize the automatic slope of wafer slide glass device through above-mentioned scheme and recovered the function and promoted abluent homogeneity of wafer, high efficiency, the utility model discloses carried out upgrading transformation to the structure of slide glass device on the basis of the slide glass device of wafer cleaning machine, reached automatic slope, high-efficient, environmental protection, energy-conserving purpose.
Drawings
FIG. 1 is a schematic view of an automatically tilting wafer slide apparatus;
FIG. 2 is a front movable door of a slide tray of an automatic tilting wafer slide apparatus;
FIG. 3 is a schematic view of a hinge structure of a wafer carrier device in a horizontal and tilted state;
FIG. 4 is a schematic view of the positional relationship between the connecting part of the slide glass main shaft and the rear part of the slide glass tray and the connecting part of the movable door at the rear part of the slide glass tray and the front part of the slide glass tray in the automatic tilting wafer slide glass device;
FIG. 5 is a schematic view of an automatically tilting wafer carrier apparatus filled with wafers;
FIG. 6 is a schematic view of a wafer carrier device with bumps as stops;
description of reference numerals:
1. connecting the main shaft;
2. a slide device;
3. the wafer is divided into layers;
4. a movable door at the front part of the slide glass tray;
5. a slide main shaft;
6. the rear part of the slide tray;
7. a bump;
8. a rod;
9. automatically telescoping the rod;
10. a slide tray;
11. slide glass top plate
12. A horizontal bar;
13. a hinge joint;
14. the joint is rotated.
Detailed Description
To explain technical contents, structural features, and objects and effects of the technical solutions in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1 to 6, the present embodiment provides an automatic tilting wafer slide device, wherein the slide device 2 includes an automatic telescopic rod 9, a plurality of wafer layering compartments 3, and slide spindles 5 at two sides. The plurality of wafer layering grids 3 are arranged in parallel, and each wafer layering grid 3 is respectively connected with the slide glass main shafts 5 on the two sides in a rotating mode. The automatic telescopic rod 9 is movably connected with each wafer layering grid 3, when the slide glass device 2 is lifted, one side, far away from the slide glass main shaft 5, of the automatic telescopic rod 9 exceeds the bottom end of the slide glass device 2, and when the slide glass device 2 is placed, the automatic telescopic rod 9 is jacked up to drive the wafer layering grids 3 to deflect up and down around the rotating connection position of the slide glass main shaft 5 and the wafer layering grids 3. In the technical scheme, during actual operation, the wafers are placed in the slide glass device 2, and when the wafer layering grid 3 is loaded with a certain number of wafers. And vertically placing the automatic inclined wafer slide device 2 into a cleaning machine for cleaning operation by moving the slide device 2. During operation, one side of the automatic telescopic rod 9, which is far away from the slide glass device 2, exceeds the bottommost end of the slide glass device 2, and meanwhile, the length of the automatic telescopic rod 9 is longer than that of other vertical rod bodies. When the automatic telescopic rod 9 is placed at the bottom of the washing tank, the automatic telescopic rod 9 is subjected to the reaction force of the washing tank to the automatic telescopic rod, so that the automatic telescopic rod is pressed vertically upwards to move upwards. Meanwhile, each of the plurality of wafer layering grids 3 is respectively and rotatably connected with the slide glass main shafts 5 on the two sides, when the automatic telescopic rod 9 is pressed vertically upwards to move upwards, the slide glass device 2 rotates by taking the connection part of the slide glass main shaft 5 and the wafer layering grid 3 as an axis, so that the wafer layering grid 3 deflects up and down, each wafer layering grid 3 deflects and inclines, and the function of automatic inclination is achieved. When the wafer is taken out upwards after being cleaned, the pressure applied to the automatic telescopic rod 9 is gradually reduced, and the slide glass device 2 is enabled to be in a horizontal state due to the influence of self gravity factors or internal elasticity. It should be noted that: in order to enable the slide glass device to be restored to a horizontal state, when the slide glass device is lifted, the automatic telescopic rod can return to the bottom end of the automatic telescopic rod to extend out of the bottom of the slide glass device. If the spring mode can be adopted, the spring is connected with the automatic telescopic rod or the wafer layering grid, and the spring is used for driving the wafer layering grid to return to the horizontal state and the automatic telescopic rod extends out of the bottom of the slide glass device. Or in a gravity mode, the automatic telescopic rod 9 is positioned at the same side with the gravity center of the slide glass device 2, and specifically, when the gravity center of the slide glass device 2 is positioned in front of the slide glass main shaft 5, the rod 9 of the automatic telescopic rod is positioned at the front part; similarly, when the center of gravity is located at the back, the automatic telescopic rod 9 is located at the back of the slide glass device 2. Realize wafer slide glass device 2's automatic slope and recovered function through above-mentioned scheme and promoted wafer abluent homogeneity, high efficiency, the utility model discloses carried out upgrading transformation to slide glass device 2's structure on wafer cleaning machine's slide glass device 2's basis, reached automatic slope, high-efficient, environmental protection, energy-conserving purpose.
Referring to fig. 1, in the present embodiment, the wafer layer lattice is composed of a horizontal rod 12, a cavity for accommodating a wafer, and a barrier, and the wafer layer lattice is used for placing a wafer to be cleaned. The cavity is positioned above the horizontal rod 12, and the rotating connection part 14 of the horizontal rod 12 and the slide glass main shafts 5 at the two sides is positioned between the horizontal rod 12 and the slide glass main shafts 5. The blocking object is positioned on the horizontal rod 12 and used for blocking the wafer from inclining and sliding off. Each horizontal bar 12 in the moveable door 4 in the front of the slide tray is at the same level as each horizontal bar 12 in the rear 6 of the slide tray to ensure that the wafers are stable in the grid. Meanwhile, the vertical movement of the automatic lifting and shrinking rod 9 and the inclination of the slide glass device 2 are realized through the hinged connection of the horizontal rod 12 and the automatic lifting and shrinking rod 9. In the operation process, the automatic lifting and contracting rod 9 applies an upward force to the horizontal rod 12 at the position to enable the horizontal rod to rotate upwards around the connecting part of the slide glass main shaft 5 and the wafer layering grid 3, and the automatic lifting and contracting rod is ensured not to incline and deform due to rotation through the hinged connection of the horizontal rod 12 body and the automatic lifting and contracting rod 9, so that the wafer is further ensured to be stably placed in the layering grid, and the uniformity and the efficiency of wafer cleaning are improved.
In the present embodiment, the wafer compartment 3 is composed of a horizontal rod 12, a cavity for accommodating a wafer, and a stopper member. In the present embodiment, the wafer layering compartment 3 is divided into three parts, namely, a slide tray rear part 6 and a slide tray front movable door 4 without changing the components of the wafer layering compartment 3. The rear part 6 of the slide glass tray is hinged with the movable door 4 at the front part of the slide glass tray in a rotating way around the vertical direction. The horizontal rod 12 on the movable door at the front part of the slide glass tray is hinged with the movable door frame at the front part of the slide glass tray at one side far away from the slide glass main shaft 5. The hinge 13 of the slide tray rear part 6 and the slide tray front part movable door 4 is positioned on one side of the slide main shaft 5 far away from the slide tray rear part 6, and the hinge 13 is positioned on the front side of the rotary connection part 14 as shown in fig. 3 and 4. In use, a wafer is placed in the slide loading device 2 and the movable door 4 at the front of the slide loading tray is manually closed, as shown in the left side of fig. 2. And moving the wafer carrying device 2, and vertically placing the automatic inclined wafer carrying device 2 into a cleaning machine for cleaning. In the above embodiment, the center of gravity of the automatic telescopic rod 9 and the center of gravity of the slide glass device 2 are located on the same side, specifically, when the center of gravity is located at the front movable door 4 of the slide glass tray, the automatic telescopic rod 9 is connected to the horizontal rod 12 close to one side of the front movable door 4 of the slide glass tray, otherwise, the automatic telescopic rod is located at the horizontal rod 12 at one side of the rear portion 6 of the slide glass tray. While the stop will prevent the wafer from sliding off when deflected by the slide mount 2. The automatic inclination and recovery functions of the wafer slide device 2 are realized through the scheme, so that the uniformity and the efficiency of wafer cleaning are improved.
Referring to fig. 6, in the present embodiment, the blocking object may be a bump 7 located on the wafer layer 3 for blocking the wafer from tilting and sliding off. The bumps 7 are arranged on the vertical line of the rear part 6 of the slide glass tray, can be arranged in a plurality, and are not connected with another wafer layering grid 3. The bumps 7 prevent the wafer placed in the slide device 2 from sliding off when the slide device 2 is tilted.
Referring to fig. 3, in the present embodiment, the blocking member may also be a rod 8, and the rod 8 and the wafer lamination lattice 3 are perpendicular to each other and are connected to each other by a hinge. When cleaning the wafer, the rod 8 will prevent the wafer from sliding down, and at the same time ensure that the wafer is stably placed on the wafer layering grid 3. Meanwhile, when the automatic telescopic rod 9 is positioned on one side of the movable door 4 at the front part of the slide glass tray, the automatic telescopic rod applies upward thrust to the movable door 4 at the front part of the slide glass tray, so that the movable door 4 at the front part of the slide glass tray upwards rotates around a connecting part of the slide glass main shaft 5 and the slide glass tray rear part 6, the slide glass tray rear part 6 rotates downwards, and the rod 8 is ensured not to incline and deform due to rotation through the hinged connection of the wafer layering grids 3 and the rod 8. Therefore, the wafer is further ensured to be stably placed in the layering grid, and the uniformity and the efficiency of wafer cleaning are improved.
Referring to fig. 1, in the present embodiment, the number of the movable doors 4 at the front of the slide tray is two, and the movable doors are respectively hinged to the left and right sides of the rear portion 6 of the slide tray. The provision of a two-sided flap will further ensure that the wafer located in the slide mount 2 is stable, while ensuring that the wafer does not slide off due to tilting of the slide mount 2.
In this embodiment, the slide tray front movable door 4 further comprises a hydraulic telescopic rod. When the movable door 4 in the front of the slide glass tray is closed, the movable door 4 can be externally connected with a hydraulic telescopic rod, so that the function of automatically opening and closing the movable door 4 in the front of the slide glass tray is realized.
Referring to fig. 2, in the present embodiment, the slide loading device 2 further includes a slide loading top tray 11 and a slide loading bottom tray 10. The slide glass top plate 11 is fixedly connected with the slide glass bottom plate 10 through a slide glass main shaft 5. The slide top tray 11 and the slide bottom tray 10 will further improve the stability of the slide device 2, in this embodiment, the automatic telescopic rod 9 may also be hinged to the slide bottom tray 10, but when the center of gravity of the slide device 2 is located at the front movable door 4 of the slide tray, the automatic telescopic rod 9 will be hinged to the level located in the front movable door 4 of the slide tray.
In this embodiment, the automatic tilting wafer carrier device 2 further includes a connecting main shaft 1 connected to the top of the carrier device 2, and a power mechanism externally connected to the connecting main shaft 1, where the power mechanism is connected to the connecting main shaft 1 and used for moving the automatic tilting wafer carrier device.
It should be noted that, although the above embodiments have been described herein, the scope of the present invention is not limited thereby. Therefore, based on the innovative concept of the present invention, the changes and modifications of the embodiments described herein, or the equivalent structure or equivalent process changes made by the contents of the specification and the drawings of the present invention, directly or indirectly apply the above technical solutions to other related technical fields, all included in the scope of the present invention.
Claims (10)
1. An automatic wafer tilting slide device is characterized by comprising an automatic telescopic rod, a plurality of wafer layering grids and slide main shafts on two sides;
the wafer layering grids are arranged in parallel, each wafer layering grid is respectively and rotatably connected with the slide glass main shafts on the two sides, and the wafer layering grids are used for placing wafers to be cleaned;
the automatic telescopic rod is movably connected with each wafer layering grid, one side, far away from the slide glass main shaft, of the automatic telescopic rod exceeds the bottom end of the slide glass device when the slide glass device is lifted, and the automatic telescopic rod is jacked up to drive the wafer layering grids to deflect up and down around the rotary connection position of the slide glass main shaft and the wafer layering grids when the slide glass device is placed.
2. The apparatus of claim 1, wherein the wafer stage comprises a horizontal rod, a cavity for receiving a wafer, and a stopper;
the cavity is positioned above the horizontal rod, and the horizontal rod is respectively and rotatably connected with the slide glass main shafts on the two sides;
the automatic telescopic rod is hinged with the horizontal rod;
the obstacle is positioned on the horizontal rod and used for preventing the wafer from inclining and sliding down.
3. The apparatus of claim 2, wherein the wafer stage comprises a rear tray, a front movable door;
the rear part of the slide glass tray is hinged with the movable door at the front part of the slide glass tray in a rotating way around the vertical direction;
the horizontal rod on the movable door at the front part of the slide glass tray is hinged with a movable door frame at the front part of the slide glass tray, which is far away from the slide glass main shaft;
the connecting part of the rear part of the slide glass tray and the movable door at the front part of the slide glass tray is positioned on one side of the slide glass main shaft, which is far away from the rear part of the slide glass tray.
4. The apparatus of claim 2 or 3, wherein the stop is a bump and the bump is located at the rear of the carrier plate.
5. The apparatus as claimed in claim 2 or 3, wherein the stopper is a rod, the rod is perpendicular to the wafer layering grid, and the rod is rotatably connected to the horizontal rod at the rear of the wafer loading tray.
6. The apparatus as claimed in claim 3, wherein the number of the movable doors at the front of the slide tray is two, and the movable doors are respectively hinged at the left and right sides of the rear of the slide tray.
7. The apparatus of claim 3, wherein the moveable door in front of the slide tray further comprises a hydraulic telescoping rod.
8. The apparatus of claim 1, further comprising a top slide tray, a bottom slide tray;
the slide glass top plate is fixedly connected with the slide glass base plate through a slide glass main shaft.
9. The apparatus of claim 1, further comprising a spindle attached to the top of the slide apparatus.
10. The apparatus of claim 9, further comprising a power mechanism coupled to the spindle for moving the apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921736780.0U CN210535635U (en) | 2019-10-16 | 2019-10-16 | Automatic wafer slide glass device inclines |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921736780.0U CN210535635U (en) | 2019-10-16 | 2019-10-16 | Automatic wafer slide glass device inclines |
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| CN210535635U true CN210535635U (en) | 2020-05-15 |
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| CN201921736780.0U Active CN210535635U (en) | 2019-10-16 | 2019-10-16 | Automatic wafer slide glass device inclines |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828341A (en) * | 2019-10-16 | 2020-02-21 | 福建省福联集成电路有限公司 | Automatic wafer slide glass device inclines |
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2019
- 2019-10-16 CN CN201921736780.0U patent/CN210535635U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828341A (en) * | 2019-10-16 | 2020-02-21 | 福建省福联集成电路有限公司 | Automatic wafer slide glass device inclines |
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