CN210523140U - Production system for chip detection and packaging and pressure-resistant testing device thereof - Google Patents

Abstract

The utility model provides a chip detection and packaging production system and a pressure-resistant testing device thereof, which relate to the technical field of chip manufacturing and comprise a frame and a feeding mechanism assembly, a feeding conveyer belt, a testing clamp, a screening mechanism, a discharging conveyer belt, a defective product collecting assembly and a transferring mechanism, wherein the feeding mechanism assembly is sequentially arranged on the frame and used for feeding, the feeding conveyer belt is used for communicating the feeding mechanism assembly and conveying chips, the testing clamp is used for testing the pressure resistance of the chips, the screening mechanism is used for screening the defective products and the defective products, the discharging conveyer belt is used for conveying the defective products, the defective product collecting assembly is arranged on the frame and used for collecting the defective products, and the transferring mechanism is used for transferring the chips among; the utility model relates to a rationally, adopt transport mechanism to transport the chip between feeding conveyer belt, test fixture, screening mechanism and ejection of compact conveyer belt, realize testing one by one of chip, avoid the leakage, screening mechanism can sieve yields and defective products simultaneously.

Description

Production system for chip detection and packaging and pressure-resistant testing device thereof

Technical Field

The utility model relates to a chip manufacturing technical field particularly, relates to a production system and withstand voltage testing arrangement of chip detection, packing.

Background

SMDs (Surface Mounted Devices), Surface mount Devices, are mainly composed of rectangular sheet materials, cylindrical sheet materials, composite sheet materials, and irregular sheet materials. For a rectangular sheet type surface mounting device, various specification parameters of a finished product need to be detected after production is finished, and after the product is detected to be qualified, the product is packaged through packaging equipment such as a packaging machine, and the production work of the whole electronic product is finished. Wherein the withstand voltage to the chip detects mainly depending on the manual work one by one, and detection efficiency is low, and leads to the leakage easily, and quality anomaly factor is difficult to the management and control.

SUMMERY OF THE UTILITY MODEL

A first object of the utility model is to provide a withstand voltage testing arrangement of chip, it adopts transport mechanism to transport the chip between feeding conveyer belt, test fixture, screening mechanism and ejection of compact conveyer belt, realizes testing one by one of chip, avoids the leakage, and screening mechanism can sieve yields and defective products simultaneously.

A second object of the present invention is to provide a chip detecting and packaging production system, which employs the above-mentioned chip voltage withstanding testing apparatus.

The embodiment of the utility model is realized like this:

a chip pressure resistance testing device comprises a rack, a blanking mechanism assembly, a feeding conveyer belt, a testing clamp, a screening mechanism, a discharging conveyer belt, a defective product collecting assembly and a transferring mechanism, wherein the blanking mechanism assembly is sequentially arranged on the rack and used for blanking, the feeding conveyer belt is used for communicating the blanking mechanism assembly and conveying chips, the testing clamp is used for testing the pressure resistance of the chips, the screening mechanism is used for screening good products and defective products, the discharging conveyer belt is used for conveying the good products, the defective product collecting assembly is arranged on the rack and used for collecting defective products, and the transferring mechanism is used for transferring the chips among the feeding conveyer belt, the testing clamp;

the defective product collecting assembly comprises a defective product collecting mechanism for receiving defective products and a defective product pushing cylinder for pushing the defective products into the defective product collecting mechanism from the screening mechanism; the feeding conveyer belt, the test fixture and the discharging conveyer belt are positioned on the same straight line; screening mechanism locates between test fixture and the ejection of compact conveyer belt, and screening mechanism includes the screening piece, screening piece slidable installs in the frame and is used for butt joint test fixture or defective products collection subassembly, and the screening piece is fixed in the output of screening cylinder, the screening cylinder is installed in the frame.

Further, unloading mechanism assembly includes that the unloading material says and connects the lower flitch of saying the upper end at the unloading material, is provided with a pair of relative setting and is used for holding the material pipe holding tank of material pipe on the flitch down, the material pipe holding tank bottom that is close to unloading material way one end is equipped with the material export that the intercommunication unloading material was said, one side of flitch is provided with empty material pipe collecting vat down, the opposite side of flitch is provided with the pushing equipment who is used for pushing empty material pipe into empty material pipe collecting vat down, the bottom of two material pipe holding tanks that are close to empty material pipe collecting vat one side all is provided with empty material pipe exit.

Furthermore, the blanking mechanism further comprises a abutting mechanism for abutting against the material pipe, the abutting mechanism comprises an abutting block, and the abutting block is hinged to a material pipe accommodating groove close to the blanking material channel and used for abutting against the material pipe from an empty material pipe outlet so that the material pipe is opposite to the material outlet.

Further, the unloading material is said and is used for making the chip get into in groups including the interval setting feeding conveyor belt's stock stop, stock stop includes first stock stop and second stock stop, the material is said and is used for realizing keeping off the material and the blowing under the equal reciprocating type business turn over of first stock stop and second stock stop.

Furthermore, the feeding conveyer belt is provided with an arrangement mechanism for arranging a group of chips in order, the arrangement mechanism comprises a pair of arrangement clamping plates and a finger cylinder, the pair of arrangement clamping plates are respectively positioned on two sides of the feeding conveyer belt, and the finger cylinder is arranged on the feeding conveyer belt and connected with the output end of the finger cylinder through the pair of arrangement clamping plates.

Further, test fixture is including inhaling tight mechanism and a pair of conducting strip that bears that is used for bearing chip pin foot row, it includes adsorption magnet and adsorption cylinder to inhale tight mechanism, adsorption magnet locates to bear the conducting strip below and can be close to or keep away from and bear the conducting strip and be used for inhaling tightly or relaxing the chip, adsorption cylinder install in frame and its output are connected adsorption magnet is used for driving adsorption magnet and is close to or keeps away from and bear the conducting strip.

Further, the transport mechanism includes fixed plate, translation board, translation cylinder, suction plate, absorption cylinder and suction mechanism, the fixed plate is located the frame, but the translation board horizontal slip connect in the fixed plate, the translation cylinder is installed and is connected the translation board and be used for driving the translation board and slide in fixed plate and its output, but the suction plate vertical slip connect in the translation board, the absorption cylinder is installed and is connected the suction plate and be used for driving the sliding plate translation in translation board and its output, suction mechanism install in the suction plate is used for absorbing and placing the chip.

Further, suction means is including contact strip, magnetic stripe and getting and put the cylinder, contact strip install in the suction plate is used for contacting with the chip when absorbing the chip, get to put the cylinder and install in suction plate and its output and connect the magnetic stripe, the magnetic stripe can be close to or keep away from contact strip and be used for absorbing and relaxing the chip.

Furthermore, the defective product collecting mechanism comprises a defective product channel and a material pipe switching support connected to the discharge end of the defective product channel, the material pipe switching support is provided with a material pipe switching fixing table, the material pipe switching fixing table is provided with at least two material pipe accommodating grooves, a material pipe fixing part used for pressing the material pipe is arranged on the material pipe switching fixing table, and the material pipe fixing part is provided with an elastic pressing piece part corresponding to the material pipe accommodating grooves and located above the material pipe accommodating grooves; the material pipe switching support is provided with a material pipe switching cylinder which is used for driving the material pipe switching fixing table to move and enabling the material pipe accommodating groove to be in butt joint with the poor product material channel.

A production system for chip detection and packaging adopts the chip voltage withstanding testing device.

The utility model has the advantages that:

the utility model discloses when using, the chip is from unloading mechanism assembly unloading gradually and is fallen into feeding conveyer belt, feeding conveyer belt transports the chip towards the test fixture direction, be close to the test fixture at the chip after, feeding conveyer belt pause transportation, transport mechanism transports the chip on the feeding conveyer belt to the test fixture on, and simultaneously, if there is the chip on the test fixture, transport mechanism transports the chip on the test fixture to the screening piece, if there is the chip on the screening piece, transport mechanism transports the chip on the screening piece to ejection of compact conveyer belt, accomplish transporting one by one and testing of chip, in addition, if the chip at the test fixture test is the defective products, the chip is transported to the screening piece after, the screening piece collects the mechanism butt joint with the defective products, the defective products pushes the cylinder and pushes the defective products into the defective products collection mechanism.

The utility model relates to a rationally, adopt transport mechanism to transport the chip between feeding conveyer belt, test fixture, screening mechanism and ejection of compact conveyer belt, realize testing one by one of chip, avoid the leakage, screening mechanism can sieve yields and defective products simultaneously.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a chip withstand voltage testing apparatus provided in embodiment 1 of the present invention;

fig. 2 is a schematic view of a first view structure of a blanking mechanism assembly provided in embodiment 1 of the present invention;

fig. 3 is a schematic view of a second view structure of the blanking mechanism assembly provided in embodiment 1 of the present invention;

fig. 4 is a schematic view of the feeding conveyer belt, the testing jig, the screening mechanism, and the discharging conveyer belt according to embodiment 1 of the present invention;

fig. 5 is a schematic structural view of a feeding conveyer belt provided in embodiment 1 of the present invention;

fig. 6 is a first schematic structural diagram of a test fixture provided in embodiment 1 of the present invention;

fig. 7 is a schematic structural diagram of a test fixture provided in embodiment 1 of the present invention;

fig. 8 is a schematic view of the material tube switching bracket and the material tube switching fixing table according to embodiment 1 of the present invention;

fig. 9 is a schematic structural view of a transfer mechanism provided in embodiment 1 of the present invention;

icon: 11-a rack, 12-a blanking mechanism assembly, 121-a blanking channel, 1211-a material stopping mechanism, 1211 a-a first material stopping rod, 1211 b-a second material stopping rod, 122-a blanking plate, 123-a material pipe accommodating groove, 124-a material outlet, 125-an empty material pipe collecting groove, 126-a material pushing mechanism, 127-an empty material pipe outlet, 128-a pressing mechanism, 1281-a pressing block, 1282-a pressing cylinder, 13-a feeding conveying belt, 131-an arrangement mechanism, 1311-an arrangement clamping plate, 1312-a finger cylinder, 14-a test clamp, 141-a suction mechanism, 1411-an adsorption magnet, 1412-an adsorption cylinder, 142-a bearing conductive sheet, 15-a screening mechanism, 151-a screening block, 152-a screening cylinder and 16-a discharging conveying belt, 17-defective product collection component, 171-defective product collection mechanism, 1711-defective product material channel, 1712-material tube switching bracket, 1713-material tube switching fixing table, 1713 a-material tube receiving groove, 1714-material tube fixing piece, 1714 a-elastic pressing piece part, 1715-material tube switching cylinder, 172-defective product pushing cylinder, 18-transfer mechanism, 181-fixing plate, 182-translation plate, 183-translation cylinder, 184-suction plate, 185-suction cylinder, 186-suction mechanism, 1861-contact strip, 1862-magnetic strip and 1863-picking and placing cylinder.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

The terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

The terms "parallel", "perpendicular", etc. do not require that the components be absolutely parallel or perpendicular, but may be slightly inclined. For example, "parallel" merely means that the directions are more parallel relative to "perpendicular," and does not mean that the structures are necessarily perfectly parallel, but may be slightly tilted.

The terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal, vertical or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

Furthermore, the terms "substantially", and the like are intended to indicate that the relative terms are not necessarily strictly required, but may have some deviation. For example: "substantially equal" does not mean absolute equality, but it is difficult to achieve absolute equality in actual production and operation, and certain deviations generally exist. Thus, in addition to absolute equality, "substantially equal" also includes the above-described case where there is some deviation. In this case, unless otherwise specified, terms such as "substantially", and the like are used in a similar manner to those described above.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1

Referring to fig. 1, the present embodiment provides a device for testing a chip voltage endurance, which includes a frame 11, a feeding mechanism assembly 12 sequentially installed on the frame 11 for feeding, a feeding conveyor 13 for communicating the feeding mechanism assembly 12 and conveying chips, a testing fixture 14 for testing a voltage endurance of the chips, a screening mechanism 15 for screening good products and defective products, a discharging conveyor 16 for conveying the good products, a defective product collecting assembly 17 installed on the frame 11 for collecting the defective products, and a transferring mechanism 18 for transferring the chips among the feeding conveyor 13, the testing fixture 14, the screening mechanism 15, and the discharging conveyor 16.

The frame 11 is arranged on the working platform; the bottom of the frame 11 is provided with universal wheels, so that the device can be conveniently transferred, meanwhile, in order to ensure the stability of the device in use, the bottom of the frame 11 is provided with a jacking mechanism, and after the device is moved to a working position, the jacking mechanism jacks up the frame 11, so that the universal wheels are not stressed, and the frame 11 is not easy to move.

In this embodiment, referring to fig. 6, the test fixture 14 includes a pair of carrying conductive sheets 142 for carrying pin rows of a chip, and in order to ensure the connection between the chip and the carrying conductive sheets 142, in some embodiments, referring to fig. 7, the test fixture 14 further includes a tightening mechanism 141, the tightening mechanism 141 includes an attracting magnet 1411 and an attracting cylinder 1412, the attracting magnet 1411 is disposed below the carrying conductive sheets 142 and can be close to or far from the carrying conductive sheets 142 for tightening or loosening the chip, the attracting cylinder 1412 is mounted on the frame 11, and an output end of the attracting cylinder 1412 is connected to the attracting magnet 1411 for driving the attracting magnet 1411 to be close to or far from the carrying conductive sheets 142.

Referring to fig. 4, the defective product collecting unit 17 includes a defective product collecting mechanism 171 for receiving defective products and a defective product pushing cylinder 172 for pushing the defective products from the screening mechanism 15 into the defective product collecting mechanism 171; the feeding conveyer belt 13, the test fixture 14 and the discharging conveyer belt 16 are positioned on a straight line; screening mechanism 15 is located between test fixture 14 and ejection of compact conveyer belt 16, and screening mechanism 15 includes screening piece 151, and screening piece 151 slidable installs in frame 11 and is used for butt joint test fixture 14 or defective products collection component 17, and screening piece 151 is connected in the output of screening cylinder 152, and screening cylinder 152 installs in frame 11.

Referring to fig. 9, the transferring mechanism 18 includes a fixing plate 181, a translating plate 182, a translating cylinder 183, an absorbing plate 184, an absorbing cylinder 185 and an absorbing mechanism 186, the fixing plate 181 is disposed on the frame 11, the translating plate 182 is horizontally slidably connected to the fixing plate 181, the translating cylinder 183 is mounted on the fixing plate 181 and has an output end connected to the translating plate 182 for driving the translating plate 182 to slide, the absorbing plate 184 is vertically slidably connected to the translating plate 182, the absorbing cylinder 185 is mounted on the translating plate 182 and has an output end connected to the absorbing plate 184 for driving the translating plate to translate, and the absorbing mechanism 186 is mounted on the absorbing plate 184 for absorbing and placing the chip; in this embodiment, the sucking mechanism 186 includes a contact strip 1861, a magnetic stripe 1862, and a pick-and-place cylinder 1863, the contact strip 1861 is installed on the sucking plate 184 for contacting the chip when sucking the chip, the pick-and-place cylinder 1863 is installed on the sucking plate 184 and the output end thereof is connected to the magnetic stripe 1862, and the magnetic stripe 1862 can be close to or far from the contact strip 1861 for sucking and releasing the chip.

The utility model discloses the principle of realization does: the chip from unloading mechanism assembly 12 unloading gradually falls into feeding conveyer belt 13, feeding conveyer belt 13 transports the chip towards test fixture 14 direction, after the chip is close to test fixture 14, feeding conveyer belt 13 pauses the transportation, transport mechanism 18 transports the chip on feeding conveyer belt 13 to test fixture 14, simultaneously, if there is the chip on test fixture 14, transport mechanism 18 transports the chip on test fixture 14 to screening piece 151, if there is the chip on screening piece 151, transport mechanism 18 transports the chip on screening piece 151 to ejection of compact conveyer belt 16, to accomplish transporting and testing one by one of chip, in addition, if the chip that tests at test fixture 14 is the defective products, after the chip transports screening piece 151, screening piece 151 and defective products collection mechanism 171 dock, defective products push cylinder 172 pushes the defective products into defective products collection mechanism 171.

In this embodiment, a material pipe is adopted to feed the feeding conveyer belt 13, so a feeding mechanism assembly 12 for placing stacked material pipes needs to be arranged, referring to fig. 2 and fig. 3, the feeding mechanism assembly 12 includes a feeding channel 121 and a feeding plate 122 connected to the upper end of the feeding channel 121, a pair of material pipe accommodating grooves 123 which are oppositely arranged and used for accommodating material pipes are arranged on the feeding plate 122, a material outlet 124 communicated with the feeding channel 121 is arranged at the bottom of the material pipe accommodating groove 123 near one end of the feeding channel 121, an empty pipe collecting tank 125 is arranged at one side of the feeding plate 122, a pushing mechanism 126 for pushing an empty material pipe into the empty pipe collecting tank 125 is arranged at the other side of the feeding plate 122, and empty pipe exit ports 127 are arranged at the bottoms of the two material pipe accommodating grooves 123 near one side of the empty pipe; after the empty pipe is completely withdrawn, the fallen pipe may not be aligned with the material outlet 124, therefore, in some embodiments, the blanking mechanism further includes a tightening mechanism 128 for tightening the pipe, the tightening mechanism 128 includes a tightening block 1281, the tightening block 1281 is hinged to the pipe receiving groove 123 near the blanking channel 121 for tightening the pipe from the empty pipe withdrawing port 127 so that the pipe faces the material outlet 124, and the tightening force of the tightening block 1281 can be derived from 1, 2, and elastic potential energy of a torsion spring, etc., when the mode 1 is adopted, the tightening cylinder 1282 is installed on the pipe receiving groove 123 near the blanking channel 121, and the output end of the tightening cylinder faces downward to abut against the tightening block 1281, the tightening block 1281 rotates around the hinge point to turn the tightening force to the pipe, when the empty pipe is withdrawn, the tightening block 1281 extends into the empty pipe withdrawing port 127 under the action of gravity to affect the falling and abutting of the pipe, therefore, the output end of the tightening cylinder 1282 can be connected with the abutting block 1281 so as to be taken out of the abutting block 1281 when the tightening cylinder 1282 retracts, and the output end of the tightening cylinder 1282 must be hinged with the abutting block 1281.

In order to increase the detection rate, in practical production, several chips are often grouped to perform pressure resistance detection, in order to make the chips come out of the feeding mechanism assembly 12 and enter the feeding conveyor belt 13 to be transported in groups, in this embodiment, referring to fig. 3, the feeding channel 121 includes a material stopping mechanism 1211 arranged at intervals to make the chips enter the feeding conveyor belt 13 in groups, the material stopping mechanism 1211 includes a first material stopping rod 1211a and a second material stopping rod 1211b, both the first material stopping rod 1211a and the second material stopping rod 1211b can be reciprocated in and out of the feeding channel 121 to realize material stopping and material discharging, for example, a test is performed for 4 chips in a group, then the interval between the first material stopping rod 1211a and the second material stopping rod 1211b is the length of 4 chips, when in use, the first material stopping rod 1211a located below is inserted into the feeding channel 121 first, the chips are stopped by the first material stopping rod 1211a, then, the second stopping rod 1211b is inserted into the discharging channel 121 to abut against the fifth chip, and then the first stopping rod 1211a leaves the discharging channel 121 to discharge a group of chips, and the above operations are repeated.

Due to the structural features of the test fixture 14, if a group of chips are not aligned, the chips may fall from between the carrier pads 142, therefore, in order to ensure a group of chips to be aligned, referring to fig. 5, the feeding conveyor 13 is provided with an aligning mechanism 131 for aligning a group of chips, the aligning mechanism 131 includes a pair of aligning clamp plates 1311 and a finger cylinder 1312, the pair of aligning clamp plates 1311 are respectively located at two sides of the feeding conveyor 13, the finger cylinder 1312 is installed on the feeding conveyor 13 and an output end of the finger cylinder 1312 is connected to the pair of aligning clamp plates 1311, after the chip group is conveyed to the position to be sucked by the feeding conveyer belt 13, the feeding conveyer belt 13 is paused, the finger cylinder 1312 is started, the pair of arrangement clamping plates 1311 clamp the chip group into a straight line, and the position of the pair of arrangement clamping plates 1311 preferably corresponds to the position to be sucked, so that the chips after arrangement are prevented from being disordered by the conveying of the feeding conveyer belt 13.

In order to further reduce the frequency of manually replacing defective material tubes, in this embodiment, referring to fig. 8, the defective product collecting mechanism 171 includes a defective product material channel 1711 and a material tube switching bracket 1712 connected to a discharge end of the defective product material channel 1711, the material tube switching bracket 1712 is provided with a material tube switching fixing base 1713, the material tube switching fixing base 1713 is provided with at least two material tube accommodating grooves 1713a, the material tube switching fixing base 1713 is provided with a material tube fixing member 1714 for pressing the material tubes, and the material tube fixing member 1714 is provided with an elastic pressing sheet portion 1714a corresponding to the material tube accommodating grooves 1713a and located above the material tube accommodating grooves 1713 a; the material tube switching bracket 1712 is provided with a material tube switching cylinder 1715 for driving the material tube switching fixing base 1713 to move and enabling the material tube accommodating groove 1713a to be in butt joint with the defective material channel 1711.

Example 2

A chip testing and packaging production system adopts the chip pressure-resistant testing device mentioned in the embodiment 1.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. The utility model provides a chip withstand voltage testing arrangement, includes frame (11), its characterized in that: the device comprises a blanking mechanism assembly (12) which is sequentially arranged on a rack (11) and used for blanking, a feeding conveyer belt (13) which is used for communicating the blanking mechanism assembly (12) and conveying chips, a test fixture (14) which is used for testing the pressure resistance of the chips, a screening mechanism (15) which is used for screening good products and defective products, a discharging conveyer belt (16) which is used for conveying the good products, a defective product collecting assembly (17) which is arranged on the rack (11) and used for collecting the defective products, and a transfer mechanism (18) which is used for transferring the chips among the feeding conveyer belt (13), the test fixture (14), the screening mechanism (15) and the discharging conveyer belt (16);

the defective product collecting assembly (17) comprises a defective product collecting mechanism (171) for receiving the defective products and a defective product pushing cylinder (172) for pushing the defective products from the screening mechanism (15) into the defective product collecting mechanism (171); the feeding conveyer belt (13), the test fixture (14) and the discharging conveyer belt (16) are positioned on the same straight line; screening mechanism (15) are located between test fixture (14) and ejection of compact conveyer belt (16), and screening mechanism (15) are including screening piece (151), screening piece (151) slidable install in frame (11) and be used for butt joint test fixture (14) or defective products collection component (17), and screening piece (151) are connected in the output of screening cylinder (152), screening cylinder (152) are installed in frame (11).

2. The chip withstand voltage testing apparatus according to claim 1, wherein: the blanking mechanism assembly (12) comprises a blanking channel (121) and a blanking plate (122) connected to the upper end of the blanking channel (121), a pair of material pipe accommodating grooves (123) which are oppositely arranged and used for accommodating material pipes are formed in the blanking plate (122), a material outlet (124) communicated with the blanking channel (121) is formed in the bottom of the material pipe accommodating groove (123) close to one end of the blanking channel (121), an empty material pipe collecting groove (125) is formed in one side of the blanking plate (122), a pushing mechanism (126) used for pushing the empty material pipe into the empty material pipe collecting groove (125) is arranged on the other side of the blanking plate (122), and an empty material pipe withdrawing outlet (127) is formed in the bottom of the two material pipe accommodating grooves (123) close to one side of the empty material pipe (125).

3. The chip withstand voltage testing apparatus according to claim 2, wherein: the blanking mechanism further comprises a pressing mechanism (128) used for pressing the material pipe tightly, the pressing mechanism (128) comprises a pressing block (1281), and the pressing block (1281) is hinged to a material pipe accommodating groove (123) close to the blanking material channel (121) and used for pressing the material pipe tightly from the empty material pipe outlet (127) so that the material pipe is opposite to the material outlet (124).

4. The chip withstand voltage testing apparatus according to claim 2, wherein: the feeding channel (121) comprises material blocking mechanisms (1211) which are arranged at intervals and used for enabling chips to enter the feeding conveying belt (13) in a group mode, each material blocking mechanism (1211) comprises a first material blocking rod (1211a) and a second material blocking rod (1211b), and the first material blocking rod (1211a) and the second material blocking rod (1211b) can move in and out of the feeding channel (121) in a reciprocating mode and are used for achieving material blocking and material discharging.

5. The chip withstand voltage testing apparatus according to claim 4, wherein: the feeding conveying belt (13) is provided with an arranging mechanism (131) used for arranging a group of chips in order, the arranging mechanism (131) comprises a pair of arranging clamping plates (1311) and finger cylinders (1312), the pair of arranging clamping plates (1311) are respectively located on two sides of the feeding conveying belt (13), the finger cylinders (1312) are installed on the feeding conveying belt (13), and the output ends of the finger cylinders (1312) are connected with the pair of arranging clamping plates (1311).

6. The chip withstand voltage testing apparatus according to claim 1, wherein: test fixture (14) including inhale tight mechanism (141) and a pair of electrically conductive piece (142) that bear that are used for bearing chip pin foot row, inhale tight mechanism (141) including adsorption magnet (1411) and adsorption cylinder (1412), adsorption magnet (1411) are located and are born electrically conductive piece (142) below and can be close to or keep away from and bear electrically conductive piece (142) and be used for inhaling tightly or relaxing the chip, adsorption cylinder (1412) install in frame (11) and its output connect adsorption magnet (1411) are used for driving adsorption magnet (1411) to be close to or keep away from and bear electrically conductive piece (142).

7. The chip withstand voltage testing apparatus according to claim 1, wherein: the transfer mechanism (18) comprises a fixing plate (181), a translation plate (182), a translation cylinder (183), an absorption plate (184), an absorption cylinder (185) and an absorption mechanism (186), wherein the fixing plate (181) is arranged on the rack (11), the translation plate (182) is horizontally slidably connected to the fixing plate (181), the translation cylinder (183) is installed on the fixing plate (181) and the output end of the translation cylinder is connected with the translation plate (182) to drive the translation plate (182) to slide, the absorption plate (184) is vertically slidably connected to the translation plate (182), the absorption cylinder (185) is installed on the translation plate (182) and the output end of the translation cylinder is connected with the absorption plate (184) to drive the sliding plate to translate, and the absorption mechanism (186) is installed on the absorption plate (184) to absorb and place chips.

8. The chip withstand voltage testing apparatus according to claim 7, wherein: the sucking mechanism (186) comprises a contact strip (1861), a magnetic strip (1862) and a taking and placing cylinder (1863), the contact strip (1861) is installed on the sucking plate (184) and is used for contacting with a chip when sucking the chip, the taking and placing cylinder (1863) is installed on the sucking plate (184) and the output end of the taking and placing cylinder is connected with the magnetic strip (1862), and the magnetic strip (1862) can be close to or far away from the contact strip (1861) and is used for sucking and loosening the chip.

9. The chip withstand voltage testing apparatus according to claim 7, wherein: the defective product collecting mechanism (171) comprises a defective product material channel (1711) and a material pipe switching support (1712) connected to the discharge end of the defective product material channel (1711), the material pipe switching support (1712) is provided with a material pipe switching fixing table (1713), at least two material pipe accommodating grooves (1713a) are formed in the material pipe switching fixing table (1713), a material pipe fixing piece (1714) used for pressing the material pipe is arranged on the material pipe switching fixing table (1713), and the material pipe fixing piece (1714) is provided with an elastic pressing piece portion (1714a) corresponding to the material pipe accommodating groove (1713a) and located above the material pipe accommodating groove (1713 a); the material pipe switching support (1712) is provided with a material pipe switching cylinder (1715) which is used for driving the material pipe switching fixing table (1713) to move and enables the material pipe accommodating groove (1713a) to be butted with the defective product material channel (1711).

10. A production system for chip detection and packaging is characterized in that: the chip withstand voltage testing apparatus according to any one of claims 1 to 9 is used.

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