CN210518230U - PCB substrate - Google Patents
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- CN210518230U CN210518230U CN201922115683.6U CN201922115683U CN210518230U CN 210518230 U CN210518230 U CN 210518230U CN 201922115683 U CN201922115683 U CN 201922115683U CN 210518230 U CN210518230 U CN 210518230U
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Abstract
The embodiment of the utility model discloses PCB base plate. A PCB substrate includes: the substrate body comprises a copper-clad area and a non-copper-clad area, wherein the copper-clad area is arranged around the non-copper-clad area; the operational amplification module is arranged in the copper-clad area; the power amplification circuit module is arranged in the copper-clad area, and the operational amplification module is electrically connected with the power amplification circuit module; and the feedback network module is arranged in the non-copper-clad area and is electrically connected with the operational amplification module and the power amplification circuit module respectively. The influence of heat generated by the operational amplification module and the power amplification circuit module on the feedback network module can be reduced, the output signal drift phenomenon of the feedback network module due to temperature drift is reduced, and the output signal precision of the circuit on the PCB substrate is improved.
Description
Technical Field
The embodiment of the utility model provides a PCB base plate temperature is floated and is improved technical field, especially relates to a PCB base plate.
Background
In panel detection, the requirement for panel driving signals for the water rising ship height requires that the driving signals have excellent characteristics in the aspects of alternating current and direct current, such as wide output voltage range, high signal speed and high slew rate of tens of volts per microsecond or even hundreds of volts per microsecond; the overshoot is small; the driving current is large; high precision, within the voltage output range of plus or minus tens of volts, voltage precision within plus or minus 2mv, and the like.
In the prior art, a driving circuit is generally formed by a low-voltage high-speed operational amplifier, a discrete power element and the like so as to meet the requirements of panel driving signals.
However, in the operation process of the driving circuit, temperature drift is generated due to power consumption and the like, and further, the output voltage of the driving circuit drifts, and the accuracy of the output signal of the driving circuit is reduced. For example, in different output states, for example, in different detection screens, the output voltage changes from 0V to plus/minus tens of volts, the load current changes from milliamperes to amperes, and the power change of the driving circuit changes greatly, so the temperature drift change caused by power consumption is large, and the accuracy of the output signal of the driving circuit is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model provides a PCB base plate to improve the temperature of circuit on the PCB base plate and float the phenomenon, and then improve circuit output signal's on the PCB base plate precision.
To achieve the purpose, the utility model adopts the following technical proposal:
a PCB substrate includes:
the substrate comprises a substrate main body and a substrate, wherein the substrate main body comprises a copper-clad area and a non-copper-clad area, and the copper-clad area is arranged around the non-copper-clad area;
the operational amplification module is arranged in the copper-clad area;
the power amplification circuit module is arranged in the copper-clad area, and the operational amplification module is electrically connected with the power amplification circuit module;
and the feedback network module is arranged in the non-copper-clad area and is electrically connected with the operational amplification module and the power amplification circuit module respectively.
Optionally, the non-copper-clad region further includes a slot, and the slot is disposed along an edge of the feedback network module on the substrate main body; the slot comprises a notch which is arranged on one side of the feedback network module adjacent to the operational amplification module.
Optionally, the heat radiation isolation module is further included; the thermal radiation isolation module is arranged between the power amplification circuit module and the feedback network module.
Optionally, the chip model of the operational amplification module is ADA 4898.
Optionally, the feedback network module includes a feedback resistor; the feedback resistor is a pin resistor or a chip resistor.
Optionally, the copper-clad area includes a heat dissipation hole and/or a heat dissipation pad, and an orthographic projection of the power amplification circuit module on the substrate main body covers an orthographic projection of the heat dissipation hole and/or the heat dissipation pad on the substrate main body.
Optionally, a temperature sensor is further included; the temperature sensor is arranged on the feedback network module.
Optionally, the power amplifier further comprises a fan, and the fan is disposed on one side of the feedback network module, which is far away from the operational amplifier module and the power amplifier circuit module.
Optionally, the device further comprises a signal input terminal, a first emitter follower module, a second emitter follower module, a first mirror current module, a second mirror current module and a signal output terminal;
a first input end of the operational amplification module is used as the signal input end;
the first emitter follower module comprises an input end, an output end, a first current end and a second current end, and the input end of the first emitter follower module is electrically connected with the output end of the operational amplification module;
a first output end of the first mirror current module is electrically connected with a first current end of the first emitter follower module;
a first input end of the second mirror current module is electrically connected with a second current end of the first emitter follower module;
the second emitter follower module comprises a first current end, a second current end and an output end, the first current end of the second emitter follower module is electrically connected with the second output end of the first mirror current module, and the second current end of the second emitter follower module is electrically connected with the second input end of the second mirror current module;
the input end of the power amplification circuit module is electrically connected with the output end of the second emitter follower module, and the output end of the power amplification circuit module is used as the signal output end;
the feedback network module comprises a first input end, a second input end, a first output end and a second output end; a first input end of the feedback network module is electrically connected with the signal output end, and a first output end of the feedback network module is electrically connected with an output end of the first emitter follower module; the feedback network module is used for providing a current feedback signal to the first emitter follower module; the second input end of the feedback network module is electrically connected with the signal output end, and the second output end of the feedback network module is electrically connected with the second input end of the operational amplification module; the feedback network module is used for providing a voltage feedback signal for the operational amplification module.
Optionally, the feedback network module includes a current feedback module and a voltage feedback module;
the input end of the current feedback module is used as the first input end of the feedback network module, and the output end of the current feedback module is used as the first output end of the feedback network module;
the input end of the voltage feedback module is used as the second input end of the feedback network module, and the output end of the voltage feedback module is used as the second output end of the feedback network module.
According to the technical scheme of the utility model, the substrate main body of the PCB substrate comprises a copper-clad area and a non-copper-clad area, and the copper-clad area is arranged around the non-copper-clad area; the operational amplification module is arranged in the copper-clad area; the power amplification circuit module is arranged in the copper-clad area, and the operational amplification module is electrically connected with the power amplification circuit module; and the feedback network module is arranged in the non-copper-clad area and is electrically connected with the operational amplification module and the power amplification circuit module respectively. The feedback network module is arranged in the non-copper-clad region, and the operational amplification module and the power amplification circuit module are arranged in the copper-clad region, so that heat energy generated by the operational amplification module and the power amplification circuit module is isolated in the copper-clad region and cannot be conducted to the feedback network module in the non-copper-clad region through copper cladding, the influence of heat generated by the operational amplification module and the power amplification circuit module on the feedback network module can be reduced, the output signal drift phenomenon of the feedback network module due to temperature drift is reduced, and the output signal precision of a circuit on a PCB substrate is improved.
Drawings
Fig. 1 is a schematic structural diagram of a PCB substrate according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another PCB substrate according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another PCB substrate according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another PCB substrate according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
When a circuit on a Printed Circuit Board (PCB) works, due to temperature drift caused by factors such as power consumption of the circuit itself, the accuracy of an output signal of the circuit is reduced, so that the PCB cannot provide a signal with high accuracy, and the use range of the PCB is limited. For example, when the circuit on the PCB includes the high-speed operational amplifier module and the power amplifier circuit module, the power consumption of the high-speed operational amplifier module and the power amplifier circuit module is relatively high, and the generated heat may cause temperature drift of other circuit modules, which may further cause voltage drift of the output signal of the circuit, and decrease the precision. Illustratively, the feedback network module generally includes a feedback resistor. Under different output voltages, the current of the feedback resistor changes by tens of times, and under the influence of heat generated by power consumption of the power amplification circuit module, the resistance value changes slightly, and the slight change of the feedback resistor causes drift of a circuit output signal at the moment, so that the precision of the circuit output signal is reduced.
To the technical problem, the embodiment of the utility model provides a PCB base plate. Fig. 1 is a schematic structural diagram of a PCB substrate according to an embodiment of the present invention. As shown in fig. 1, a PCB substrate includes:
a substrate body 100 including a copper-clad region 110 and a non-copper-clad region 120, the copper-clad region 110 being disposed around the non-copper-clad region 120;
the operational amplification module 111 is arranged in the copper-clad area 110;
the power amplification circuit module 112 is arranged in the copper-clad area 110, and the operational amplification module 111 is electrically connected with the power amplification circuit module 112;
and the feedback network module 121 is arranged in the non-copper-clad area 120, and the feedback network module 121 is electrically connected with the operational amplification module 111 and the power amplification circuit module 112 respectively.
Specifically, the substrate body 100 is a support for electronic components and is a carrier for electrical connection of the electronic components. Illustratively, the substrate body 100 may be an FR4 substrate. The input end of the operational amplification module 111 is used for inputting an analog signal, and the output end of the operational amplification module 111 is electrically connected to the input end of the power amplification circuit module 112, and is used for amplifying the input analog signal and outputting the amplified signal to the power amplification circuit module 112. Illustratively, the operational amplification module 111 may be an operational amplifier. The power amplifying circuit module 112 may be an operational amplifier, and is configured to further perform mathematical operations such as addition, subtraction, differentiation, and integration on the analog signal output by the operational amplifying module 111, so as to achieve power amplification of the analog signal, and output the amplified signal.
The input end of the feedback network module 121 is electrically connected to the output end of the power amplification circuit module 112, the output end of the feedback network module 121 is electrically connected to the operational amplification module 111, the feedback network module 121 is configured to feed back the signal output by the power amplification circuit module 112 to the operational amplification module 111, and adjust the output signal of the circuit according to the signal output by the power amplification circuit module 112 through the operational amplification module 111, so as to ensure the stability of the output signal of the circuit;
because the feedback network module 121 is arranged in the non-copper-clad region, and the operational amplification module 111 and the power amplification circuit module 112 are arranged in the copper-clad region 110, the heat energy generated by the operational amplification module 111 and the power amplification circuit module 112 is isolated in the copper-clad region 110 and cannot be conducted to the feedback network module 121 in the non-copper-clad region 120 through copper cladding, so that the influence of the heat generated by the operational amplification module 111 and the power amplification circuit module 112 on the feedback network module 121 can be reduced, the output signal drift phenomenon of the feedback network module 121 due to temperature drift is reduced, and the output signal precision of the circuit on the PCB substrate is improved.
On the basis of the above technical scheme, the operational amplification module 111 may have a heat dissipation pad for increasing the heat dissipation effect of the operational amplification module 111, thereby reducing the influence of temperature drift on the accuracy of the output signal of the PCB substrate. Illustratively, the operational amplifier module 111 may be an operational amplifier with a chip model of ADA 4898. The bottom of the ADA4898 chip is provided with a heat dissipation pad, so that most of heat generated by the chip can be dissipated through the heat dissipation pad, the temperature rise of the operational amplification module 111 is reduced, and the performance change caused by the temperature rise of the operational amplification module 111 is reduced; on the other hand, for a high-speed circuit, the feedback loop is usually required to be as close to the operational amplifier module 111 as possible, so that the feedback loop is as short as possible, otherwise the speed is affected. However, at this time, the temperature rise of the operational amplification module 111 itself will also affect the feedback network module through conduction and radiation. The temperature rise of the operational amplification module 111 is reduced, the temperature rise of the feedback network module 121 can be further reduced, the output voltage drift caused by the temperature drift is reduced, and the precision of the output voltage is improved.
Fig. 2 is a schematic structural diagram of another PCB substrate according to an embodiment of the present invention. As shown in fig. 2, the non-copper-clad region 120 further includes a slot 122, the slot 122 is disposed along an edge of the feedback network module 121 on the substrate body 100; the slot 122 includes a notch, and the notch is disposed on one side of the feedback network module 121 adjacent to the operational amplifier module 111.
Specifically, as shown in fig. 2, the slot 122 may penetrate through the substrate main body 100 to form a slot, so that air forms convection on the upper and lower surfaces of the substrate main body 10, and the feedback network module 121 is cooled by air cooling, thereby increasing the heat dissipation efficiency of the feedback network module 121, further reducing the temperature rise of the feedback network module 121, reducing the influence of temperature drift on the feedback network module 121, and improving the accuracy of the circuit output signal.
In addition, the copper-clad area 110 at the notch is connected with the non-copper-clad area 120, and is used for realizing the electrical connection between the feedback network module 121 and other modules of the circuit in the copper-clad area 110. For example, a line may be provided to electrically connect the feedback network module 121 to the operational amplifier module 111 and the power amplifier circuit module 112. The notch can be minimized, so that the heat conduction of the copper-clad area 110 to the non-copper-clad area 120 can be minimized. The size of the slot can be determined according to the space occupied by the wires connecting the feedback network module 121 and the copper-clad area 110.
Fig. 3 is a schematic structural diagram of another PCB substrate according to an embodiment of the present invention. As shown in fig. 3, the PCB substrate further includes a thermal radiation isolation module 113; the thermal radiation isolation module 113 is disposed between the power amplification circuit module 112 and the feedback network module 121.
Specifically, the thermal radiation isolation module 113 may be a material having a poor thermal conduction effect. The thermal radiation isolation module 113 is disposed between the power amplifier circuit module 112 and the feedback network module 121, and is configured to block heat generated by the power amplifier circuit module 112 from being conducted to the feedback network module 121 in a thermal radiation manner, so that temperature drift of the feedback network module 121 due to a large amount of heat generated by the power amplifier circuit module 112 when a large current is output is avoided, circuit output signal drift caused by the temperature drift of the feedback network module 121 is avoided, and accuracy of a signal output by the PCB substrate is improved. For example, the thermal radiation isolation module 113 may be made of a non-metal material, and performs thermal radiation isolation on the power amplification circuit module 112 and the feedback network module 121, so as to reduce the influence of the thermal radiation of the power amplification circuit module 112 on the feedback network module 121.
On the basis of the technical schemes, the feedback network module comprises a feedback resistor; the feedback resistor may be a pin resistor or a chip resistor.
Specifically, the feedback resistor can be a low-temperature drift resistor, so that the influence of temperature rise on the feedback resistor is reduced, and further, the precision reduction of a circuit output signal caused by temperature drift is reduced. And the feedback resistor can be welded on the substrate main body in a hanging manner, so that the heat conduction of the copper-clad area to the feedback resistor can be further reduced. And when the feedback resistor is welded on the substrate main body in a suspension manner, the heat dissipation area of the feedback resistor can be increased, so that the heat dissipation effect of the feedback resistor is increased, and the temperature drift of the feedback resistor is reduced.
Illustratively, the feedback resistance may be a pin resistance or a chip resistance. When the feedback resistor is a pin resistor, the pin resistor is soldered to the substrate body in suspension, for example, by raising the pin resistor to a 10mm solder height of the substrate body. When the feedback resistor is a chip resistor, the chip resistor can be assisted to be welded in a suspension manner through a metal contact pin; the feedback resistor is far away from the substrate main body as far as possible, so that the effects of reducing heat conduction of the substrate main body to the feedback resistor due to temperature rise, accelerating heat dissipation of the feedback resistor and reducing temperature change of the feedback resistor are achieved.
It should be noted that, in other embodiments, the feedback network module may be separately designed as a sub-PCB substrate, and the temperature drift influence of heat generated by power consumption of other modules of the circuit on the feedback network module may also be avoided. At this time, the sub-PCB substrate where the feedback network module is located is electrically connected with the PCB substrate where the other modules of the circuit are located through the connector.
On the basis of the technical schemes, the copper-clad area can further comprise heat dissipation holes and/or heat dissipation welding discs, and the orthographic projection of the power amplification circuit module on the substrate main body covers the heat dissipation holes and/or the orthographic projection of the heat dissipation welding discs on the substrate main body.
Specifically, the radiating holes and/or the radiating welding discs are arranged on one side, close to the substrate main body, of the power amplification circuit module, so that the radiating performance of the power amplification circuit module can be increased, the temperature change of the power amplification circuit module is reduced, the temperature drift of the power amplification circuit module is further reduced, and the precision of the PCB substrate output signals is improved.
On the basis of the technical schemes, the PCB substrate can also comprise a temperature sensor; the temperature sensor is arranged on the substrate main body.
Specifically, the temperature sensor is arranged on the substrate main body, the temperature sensor can measure the temperature on the substrate main body, the temperature measured by the temperature sensor is transmitted to the compensation unit (the compensation unit can be arranged outside the PCB substrate), the compensation unit compensates the output signal of the PCB substrate according to different input compensation values of the temperature change, and the precision of the output signal of the PCB substrate is improved.
In addition, the temperature variation of the base plate main part of PCB base plate is right the utility model discloses the chip influence of the operational amplification module of chooseing for use is less relatively, nevertheless influences feedback network module relatively obviously, consequently can set up temperature sensor in the copper district that covers that is close to non-copper district for temperature sensor is close to feedback network module, can survey the temperature variation of feedback network module in real time, and the better output signal according to the temperature variation to the PCB base plate compensates.
On the basis of the technical schemes, the PCB substrate can further comprise a fan, and the fan is arranged on one side of the feedback network module, which is far away from the operation amplification module and the power amplification circuit module.
Specifically, the fan can further radiate the heat of the substrate main body, and when the fan is used for radiating heat, the feedback network module is kept to be placed at the upper wind heads of other heat sources of the substrate main body, so that the feedback network module is prevented from being influenced by the other heat sources.
Fig. 4 is a schematic structural diagram of another PCB substrate according to an embodiment of the present invention. As shown in fig. 4, the PCB substrate further includes a signal input terminal a, a first emitter follower module 114, a second emitter follower module 115, a first mirror current module 116, a second mirror current module 117, and a signal output terminal b; a first input end of the operational amplification module 111 is used as a signal input end a; the first emitter follower module 114 includes an input end e, an output end f, a first current end g and a second current end h, and the input end e of the first emitter follower module 114 is electrically connected to the output end of the operational amplifier module 111; the first output terminal d of the first mirror current module 116 is electrically connected to the first current terminal g of the first emitter follower module 114; a first input terminal l of the second mirror current module 117 is electrically connected with the second current terminal h of the first emitter follower module 114; the second emitter follower module 115 comprises a first current end m, a second current end n and an output end k, the first current end m of the second emitter follower module 115 is electrically connected with the second output end i of the first mirror current module 116, and the second current end n of the second emitter follower module 115 is electrically connected with the second input end p of the second mirror current module 117; the input end of the power amplification circuit module 112 is electrically connected to the output end k of the second emitter follower module 115, and the output end of the power amplification circuit module 112 serves as a signal output end b; the feedback network module 121 includes a first input terminal r, a second input terminal t, a first output terminal s, and a second output terminal u; a first input end r of the feedback network module 121 is electrically connected with the signal output end b, and a first output end s of the feedback network module 121 is electrically connected with an output end f of the first emitter follower module 114; the feedback network module 121 is configured to provide a current feedback signal to the first emitter follower module 114; a second input end t of the feedback network module 121 is electrically connected to the signal output end b, and a second output end u of the feedback network module 121 is electrically connected to a second input end c of the operational amplification module 111; the feedback network module 121 is configured to provide a voltage feedback signal to the operational amplifier module 111.
Illustratively, the feedback network module 121 includes a current feedback module 123 and a voltage feedback module 124; the input end of the current feedback module 123 serves as the first input end r of the feedback network module 121, and the output end of the current feedback module 123 serves as the first output end s of the feedback network module 121; the input terminal of the voltage feedback module 124 serves as the second input terminal t of the feedback network module 121, and the output terminal of the voltage feedback module 124 serves as the second output terminal u of the feedback network module 121.
Specifically, by providing a signal input terminal a, an operational amplification module 111, a current feedback module 123, a voltage feedback module 124, a first emitter follower module 114, a second emitter follower module 115, a first mirror current module 116, a second mirror current module 117, a power amplification circuit module 112, and a signal output terminal b; wherein, when current feedback module 123 provides current feedback signal from signal output part b to first emitter follower module 114, voltage feedback module 124 also provides voltage feedback signal from signal output part b to operational amplifier module 111, and voltage feedback module 124 mainly influences panel drive circuit's speed, and current feedback module 123 mainly influences panel drive circuit's precision, consequently, the embodiment of the utility model provides an adopt voltage feedback module 124 and current feedback module 123 simultaneously, realized that precision adjustment and speed adjustment compromise. In addition, the embodiment of the utility model provides a flexibility of circuit on the PCB base plate is better, through adjusting the component parameter of voltage feedback module 124 and current feedback module 123, can adjust the performance focus point of circuit on the PCB base plate in a flexible way, for example, when exporting direct current signal, improve the precision and reduce speed to reduce the output ripple; when an ac signal is output, a greater overshoot can be tolerated, thus reducing accuracy and increasing speed.
Note that the above is only a preferred embodiment of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.
Claims (10)
1. A PCB substrate, comprising:
the substrate comprises a substrate main body and a substrate, wherein the substrate main body comprises a copper-clad area and a non-copper-clad area, and the copper-clad area is arranged around the non-copper-clad area;
the operational amplification module is arranged in the copper-clad area;
the power amplification circuit module is arranged in the copper-clad area, and the operational amplification module is electrically connected with the power amplification circuit module;
and the feedback network module is arranged in the non-copper-clad area and is electrically connected with the operational amplification module and the power amplification circuit module respectively.
2. The PCB substrate of claim 1, wherein the non-copper-clad region further comprises a slot disposed along an edge of the feedback network module on the substrate body; the slot comprises a notch which is arranged on one side of the feedback network module adjacent to the operational amplification module.
3. The PCB substrate according to claim 1, further comprising a thermal radiation isolation module; the thermal radiation isolation module is arranged between the power amplification circuit module and the feedback network module.
4. The PCB substrate of claim 1, wherein the operational amplification module has a chip model of ADA 4898.
5. The PCB substrate of claim 1, wherein the feedback network module comprises a feedback resistor; the feedback resistor is a pin resistor or a chip resistor.
6. The PCB substrate of claim 1, wherein the copper-clad region comprises a heat dissipation hole and/or a heat dissipation pad, and an orthographic projection of the power amplification circuit module on the substrate body covers an orthographic projection of the heat dissipation hole and/or the heat dissipation pad on the substrate body.
7. The PCB substrate of claim 1, further comprising a temperature sensor; the temperature sensor is disposed on the substrate body.
8. The PCB substrate of claim 1, further comprising a fan; the fan is arranged on one side of the feedback network module, which is far away from the operation amplification module and the power amplification circuit module.
9. The PCB substrate of claim 1, further comprising a signal input, a first emitter follower module, a second emitter follower module, a first mirror current module, a second mirror current module, and a signal output;
a first input end of the operational amplification module is used as the signal input end;
the first emitter follower module comprises an input end, an output end, a first current end and a second current end, and the input end of the first emitter follower module is electrically connected with the output end of the operational amplification module;
a first output end of the first mirror current module is electrically connected with a first current end of the first emitter follower module;
a first input end of the second mirror current module is electrically connected with a second current end of the first emitter follower module;
the second emitter follower module comprises a first current end, a second current end and an output end, the first current end of the second emitter follower module is electrically connected with the second output end of the first mirror current module, and the second current end of the second emitter follower module is electrically connected with the second input end of the second mirror current module;
the input end of the power amplification circuit module is electrically connected with the output end of the second emitter follower module, and the output end of the power amplification circuit module is used as the signal output end;
the feedback network module comprises a first input end, a second input end, a first output end and a second output end; a first input end of the feedback network module is electrically connected with the signal output end, and a first output end of the feedback network module is electrically connected with an output end of the first emitter follower module; the feedback network module is used for providing a current feedback signal to the first emitter follower module; the second input end of the feedback network module is electrically connected with the signal output end, and the second output end of the feedback network module is electrically connected with the second input end of the operational amplification module; the feedback network module is used for providing a voltage feedback signal for the operational amplification module.
10. The PCB substrate of claim 1, wherein the feedback network module comprises a current feedback module and a voltage feedback module;
the input end of the current feedback module is used as the first input end of the feedback network module, and the output end of the current feedback module is used as the first output end of the feedback network module;
the input end of the voltage feedback module is used as the second input end of the feedback network module, and the output end of the voltage feedback module is used as the second output end of the feedback network module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922115683.6U CN210518230U (en) | 2019-11-29 | 2019-11-29 | PCB substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922115683.6U CN210518230U (en) | 2019-11-29 | 2019-11-29 | PCB substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210518230U true CN210518230U (en) | 2020-05-12 |
Family
ID=70575606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922115683.6U Active CN210518230U (en) | 2019-11-29 | 2019-11-29 | PCB substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210518230U (en) |
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2019
- 2019-11-29 CN CN201922115683.6U patent/CN210518230U/en active Active
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