CN210514405U - Overvoltage preventing structure for testing B2B connector - Google Patents
Overvoltage preventing structure for testing B2B connector Download PDFInfo
- Publication number
- CN210514405U CN210514405U CN201921183204.8U CN201921183204U CN210514405U CN 210514405 U CN210514405 U CN 210514405U CN 201921183204 U CN201921183204 U CN 201921183204U CN 210514405 U CN210514405 U CN 210514405U
- Authority
- CN
- China
- Prior art keywords
- spring unit
- connector
- mounting panel
- test module
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Measuring Leads Or Probes (AREA)
Abstract
The utility model aims at providing a simple structure, test stability height and have the test B2B connector of protection product prevent excessive pressure structure. The utility model discloses a test module and locating the spring unit of test module bottom, spring unit include with excessive pressure spring unit, guide spring unit and the buffer spring unit that test module's bottom connected gradually, be equipped with on guide spring unit's the bottom with test module signal of telecommunication connection's probe, the one end of probe can be passed the buffer spring unit. The utility model discloses be applied to B2B connector test equipment's technical field.
Description
Technical Field
The utility model relates to a test B2B connector prevent excessive pressure structure.
Background
The existing non-mapping test industry tests the B2B connector mainly uses the test pin module to press the B2B connector on the product to be tested, so that the test probe in the test pin module contacts the test point of B2B on the product to be tested, and then derives the signal on the product B2B to test. In a test method for automatically testing a plurality of B2B connectors, a test pin module is often used to test a plurality of B2B connectors on a product. The traditional test pin module is provided with two layers of springs, wherein the first layer of spring is used for floating, and the test pin module can be smoothly guided into a B2B connector to be tested during pressing; the second layer of springs is used for protecting the test probes, and when the inner groove of the test probe module is led into the B2B to be tested, the test probes are exposed and contacted to conduct the B2B to be tested, so that a signal test is conducted.
The traditional two-layer spring test needle module has the defects that the welding height difference of the B2B connector to be tested cannot be compatible, the test needle module is firstly led into the B2B under the floating action of the first layer of springs in the process of contact testing of the B2B connector, the second layer of springs are compressed to expose a signal of the B2B connector, and the limiting column acts on the carrier plate at the moment to limit the test needle module.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that overcome prior art not enough, provide a simple structure, test stability height and have the test B2B connector of protection product prevent excessive pressure structure.
The utility model adopts the technical proposal that: the utility model discloses a test module and locating the spring unit of test module bottom, spring unit include with excessive pressure spring unit, guide spring unit and the buffer spring unit that test module's bottom connected gradually, be equipped with on guide spring unit's the bottom with test module signal of telecommunication connection's probe, the one end of probe can be passed the buffer spring unit.
Further, the overvoltage spring assembly comprises a first mounting plate arranged on the test module, a second mounting plate arranged below the first mounting plate in an adaptive mode, and a plurality of first springs arranged between the first mounting plate and the second mounting plate.
Further, the guide spring assembly comprises a third mounting plate and a plurality of second springs, wherein the third mounting plate is arranged below the second mounting plate, and the second springs are arranged between the second mounting plate and the third mounting plate.
Furthermore, a flexible circuit board is arranged on the bottom of the third mounting plate, one end of the flexible circuit board is connected with the probe electric signal, and the other end of the flexible circuit board is connected with the test module electric signal.
Furthermore, the buffer spring assembly comprises a fourth mounting block arranged at the bottom of the third mounting block, a contact block arranged below the fourth mounting block, and a plurality of third springs arranged between the fourth mounting block and the contact block.
Furthermore, a first through hole and a convex block are arranged on the fourth mounting block, a plurality of needle holes which are matched with the probes and communicated with the first through hole are formed in the convex block, a second through hole which is communicated with the needle holes is formed in the contact block, one end of each probe sequentially penetrates through the first through hole and the corresponding needle hole, and the end of each probe extends into the corresponding second through hole.
The utility model has the advantages that: when the test module passes through in the leading-in product that awaits measuring of second spring, the third spring is compressed completely and is exposed behind the probe, will further to prevent excessive pressure first spring compresses, after compressing a certain amount, spacing post contact on the test module bears the carrier plate of product, utilizes the clearance of first spring compression to guarantee to await measuring under the condition that B2B connector actual height is inconsistent with theoretical height, the test can be stable and do not damage the connector, its simple structure, practicality are strong.
Drawings
Fig. 1 is an exploded schematic view of the present invention.
Detailed Description
As shown in fig. 1, in this embodiment, the utility model discloses a test module and locating the spring unit of test module bottom, spring unit include with overvoltage spring unit 1, guide spring unit 2 and buffer spring unit 3 that test module's bottom connected gradually, be equipped with on guide spring unit 2's the bottom with test module electrical signal connection's probe 4, the one end of probe 4 can pass buffer spring unit 3, and in this design, the test product is B2B connector 17.
Overvoltage spring assembly 1 is including locating first mounting panel 5, adaptation on the test module are installed second mounting panel 6 and a plurality of below first mounting panel 5 are located first mounting panel 5 with first spring 7 between the second mounting panel 6.
Direction spring assembly 2 is including locating third mounting panel 8 and a plurality of second mounting panel 6 below are located second mounting panel 6 with second spring 9 between the third mounting panel 8, be equipped with flexible circuit board 10 on the bottom of third mounting panel 8, flexible circuit board 10's one end with 4 signal connection of telecommunication of probe, flexible circuit board 10's the other end with test module signal connection of telecommunication.
Buffer spring subassembly 3 is including installing fourth mounting panel 11, the locating of third mounting panel bottom contact block 12 and a plurality of below the fourth mounting panel 11 are located fourth mounting panel 11 with third spring 13 between the contact block 12, be equipped with first through-hole 14 and lug 15 on the fourth mounting panel 11, be equipped with a plurality of on the lug 15 with probe 4 looks adaptation and with the pinhole that first through-hole 14 is linked together, be equipped with on the contact block 12 with the second through-hole 16 that the pinhole is linked together, the one end of probe 4 passes in proper order first through-hole 14 with pinhole and this end stretch into in the second through-hole 16.
The utility model discloses be applied to B2B connector test equipment's technical field.
Claims (6)
1. An overvoltage protection structure for testing a B2B connector, comprising: it includes test module and locates the spring unit of test module bottom, spring unit include with overvoltage spring unit (1), guide spring unit (2) and buffer spring unit (3) that test module's bottom connected gradually, be equipped with on the bottom of guide spring unit (2) with test module signal of telecommunication connection's probe (4), the one end of probe (4) can be passed buffer spring unit (3).
2. The overpressure preventing structure for testing B2B connector as claimed in claim 1, wherein: overvoltage spring assembly (1) is including locating first mounting panel (5), adaptation on the test module are installed second mounting panel (6) and a plurality of first mounting panel (5) below are located first mounting panel (5) with first spring (7) between second mounting panel (6).
3. The overpressure preventing structure for testing B2B connector as claimed in claim 2, wherein: the guide spring assembly (2) comprises a third mounting plate (8) and a plurality of second springs (9), wherein the third mounting plate (8) is arranged below the second mounting plate (6), and the second springs (9) are arranged between the second mounting plate (6) and the third mounting plate (8).
4. The overpressure preventing structure for testing B2B connector as claimed in claim 3, wherein: be equipped with flexible circuit board (10) on the bottom of third mounting panel (8), the one end of flexible circuit board (10) with probe (4) signal of telecommunication connects, the other end of flexible circuit board (10) with test module signal of telecommunication connects.
5. The overpressure preventing structure for testing B2B connector as claimed in claim 1, wherein: buffer spring subassembly (3) include fourth mounting panel (11), locate contact piece (12) and a plurality of fourth mounting panel (11) below are located fourth mounting panel (11) with third spring (13) between contact piece (12).
6. The overpressure preventing structure for testing B2B connector as claimed in claim 5, wherein: be equipped with first through-hole (14) and lug (15) on fourth mounting panel (11), be equipped with on lug (15) a plurality of with probe (4) looks adaptation and with the pinhole that first through-hole (14) are linked together, be equipped with on contact piece (12) with second through-hole (16) that the pinhole is linked together, the one end of probe (4) passes in proper order first through-hole (14) with the pinhole and this end stretch into in second through-hole (16).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921183204.8U CN210514405U (en) | 2019-07-25 | 2019-07-25 | Overvoltage preventing structure for testing B2B connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921183204.8U CN210514405U (en) | 2019-07-25 | 2019-07-25 | Overvoltage preventing structure for testing B2B connector |
Publications (1)
Publication Number | Publication Date |
---|---|
CN210514405U true CN210514405U (en) | 2020-05-12 |
Family
ID=70585213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201921183204.8U Active CN210514405U (en) | 2019-07-25 | 2019-07-25 | Overvoltage preventing structure for testing B2B connector |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN210514405U (en) |
-
2019
- 2019-07-25 CN CN201921183204.8U patent/CN210514405U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105807213A (en) | Testing device for flat lead chip | |
CN210775685U (en) | Detect tool that cell-phone camera was used | |
CN105676114A (en) | Flat pin chip tester | |
CN210514405U (en) | Overvoltage preventing structure for testing B2B connector | |
CN109884507A (en) | QFN chip high-frequency test seat | |
CN211505623U (en) | Test socket for electronic chip and electronic connector | |
CN205450202U (en) | A testing arrangement for flat pin chip | |
CN216957971U (en) | Single-face crimping clamp for double-layer soft board of light emitting device | |
CN214252492U (en) | Fingerprint module testing arrangement | |
CN213600836U (en) | Integrated tester board card detection device | |
CN213240339U (en) | Connecting device for electronic component test | |
CN212621224U (en) | Contact pressure detection device for moving contact of isolating switch | |
CN211453702U (en) | Battery module test connector | |
CN109085391B (en) | Electronic equipment testing device and electronic equipment | |
CN218938322U (en) | Straight-through type binding post test unit and straight-through type binding post quick testing device | |
CN205941605U (en) | Contact conduction structure , contact switch on device and board to board tester | |
CN207008006U (en) | A kind of dog-type radio frequency testing head | |
CN110366325A (en) | A kind of compression bonding apparatus and method for pcb board connector | |
CN218956635U (en) | Small-size B2B connection structure | |
CN219434991U (en) | Test fixture of crimping formula chip | |
CN108680773A (en) | A kind of test contact chip connector | |
CN208675234U (en) | NFC chip pressing device | |
CN211785686U (en) | Board-to-board connector socket test probe and test fixture | |
CN205595310U (en) | Semiconductor device is with test seat | |
CN213813708U (en) | A whole stamping forming shell fragment probe for test fixture |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |