CN210504152U - Capacity automated inspection garbage bin with infrared induction function - Google Patents

Abstract

The utility model discloses a capacity automated inspection garbage bin with infrared induction function, including garbage bin main part and the infrared induction module, ultrasonic ranging module, procedure that are located the garbage bin main part inside burn and write module and power module, ultrasonic ranging module burns and writes the module communication connection with infrared induction module and procedure respectively, and the procedure burns and writes the module and communicates with infrared induction module, and power module burns and writes the module electric connection with infrared induction module, ultrasonic ranging module and procedure respectively; the utility model provides a simple function, the practicality that prior art exists hang down and the user can't learn the problem of surplus capacity in the garbage bin.

Description

Capacity automated inspection garbage bin with infrared induction function

Technical Field

The utility model belongs to the technical field of intelligent garbage bin, concretely relates to capacity automated inspection garbage bin with infrared induction function.

Background

Ultrasonic waves are often used for measuring distances because of strong directivity, slow energy consumption and long propagation distance in a medium, and for example, a distance meter, a level meter and the like can be realized by ultrasonic waves. The ultrasonic detection is often rapid and convenient, the calculation is simple, the real-time control is easy to realize, and the requirement of industrial practicality can be met in the aspect of measurement precision, so that the ultrasonic detection is widely applied to intelligent robots.

The problems existing in the prior art are as follows:

(1) the existing garbage can only store garbage, and has simple function and low practicability;

(2) the residual capacity in the existing garbage can be seen only by opening, and a user cannot know the residual capacity in the garbage can.

SUMMERY OF THE UTILITY MODEL

Not enough to the above-mentioned among the prior art, the utility model provides a pair of capacity automated inspection garbage bin with infrared induction function has solved the problem that the function is simple, the practicality is low and the user that prior art exists can't learn residual capacity in the garbage bin.

In order to achieve the above object, the utility model adopts the following technical scheme:

the utility model provides a capacity automated inspection garbage bin with infrared induction function, includes the garbage bin main part and is located the inside infrared induction module of garbage bin main part, ultrasonic ranging module, procedure and burns writing module and power module, and ultrasonic ranging module burns writing module communication connection with infrared induction module and procedure respectively, and the procedure burns writing module and infrared induction module communication connection, and power module burns writing module electric connection with infrared induction module, ultrasonic ranging module and procedure respectively.

Further, infrared induction module is including all being located inside and the infrared induction main circuit, the infrared receiving state display circuit and the infrared induction receiving circuit of communication connection in proper order of garbage bin main part.

Further, the infrared sensing main circuit comprises a first microcontroller, a first input port, a second input port, a first output port, a second output port, a total output port and resistors R1-R12, wherein the 1 st pin of the first microcontroller is connected with a node LED2_38K, the 16 th pin thereof is connected with a node LED1_38K, the 6 th pin thereof is connected with a node VCC _5, the 8 th pin thereof is grounded, the 9 th pin thereof is connected with a node RX1 through a resistor R11 and is connected with a node VCC _5 through a resistor R11 and a resistor R12 connected in series, the 10 th pin thereof is connected with a node TX1 through a resistor R9 and is connected with a node TX _5 through a resistor R9 and a resistor R10 connected in series, the 11 th pin thereof is connected with a node LED through a resistor R7 and is connected with a node VCC _5 through a resistor R7 and a resistor R8 connected in series, the 12 th pin thereof is connected with a node TX _ HW _5 through a resistor R5, and is connected with the node VCC _5 through the resistor R5 and the resistor R6 connected in series, the 13 th pin thereof is connected with the node LED2_ HW through the resistor R3, and is connected with the node VCC _5 through the resistor R3 and the resistor R4 connected in series, and the 14 th pin thereof is connected with the node LED1_ HW through the resistor R1, and is connected with the node VCC _5 through the resistor R1 and the resistor R2 connected in series;

the 1 st pin of the first input port and the 1 st pin of the first output port are both grounded, the 3 rd pin of the first input port and the 3 rd pin of the first output port are both connected with a node VCC _5, the 2 nd pin of the first input port is connected with a node HW _ TX1, the 2 nd pin of the first output port is connected with a node HW _ TX2, the 1 st pin of the second input port and the 1 st pin of the second output port are both grounded, the 4 th pin of the second input port and the 4 th pin of the second output port are both connected with a node VCC _5, the 2 nd pin of the second input port is connected with a node HW _ TX3, the 3 rd pin thereof is connected with a node HW _ TX2, the 2 nd pin of the second output port is connected with a node TX1, and the 3 rd pin thereof is connected with a node TX.

Further, the infrared receiving state display circuit comprises diodes D1-D2, diodes V1-V2 and diode V4, a node VCC _5 is connected with a node HW _ TX1 through a resistor R15 and a diode V1 which are connected in series, 5 is connected with a node LED1_ HW through a resistor R18 and a diode V2 which are connected in series, and is connected with a node LED2_ HW through a resistor R20 and a diode V4 which are connected in series, a node LED1_38K is grounded through a resistor R13 and a diode D2 which are connected in series, and a node LED2_38K is grounded through a resistor R17 and a diode D1 which are connected in series.

Further, infrared induction receiving circuit includes infrared induction transmitter, infrared induction receiver, electric capacity C9 and electric capacity C13, infrared induction transmitter's 1 st pin and node VCC _5 are connected, and through electric capacity C9 ground connection, its 2 nd pin direct ground connection, and its 3 rd pin and node LED1_ HW are connected, infrared induction receiver's 1 st pin and node VCC _5 are connected, and through electric capacity C13 ground connection, its 2 nd pin direct ground connection, and its 3 rd pin and node LED2_ HW are connected, infrared induction transmitter and infrared induction receiver all are located the garbage bin outside.

Furthermore, the ultrasonic ranging module comprises an ultrasonic ranging circuit and a capacity display circuit which are sequentially connected.

Further, the ultrasonic ranging circuit comprises a second microprocessor, an ultrasonic ranging sensor, a clock reset switch JP1 and resistors R29-R34, R44 and R46, wherein the ultrasonic ranging sensor is positioned at the top end of the inner side of the garbage can;

pins 1 to 10 of the second microprocessor are connected to a node LED2_ G, a node LED2_ DP, a node LED1_ a, a node LED1_ B, a node LED1_ C, a node LED1_ D, a node LED1_ E, a node LED1_ F, a node LED1_ G, and a node LED1_ DP, respectively and in sequence, a 12 th pin thereof is connected to a node VCC _5, a 14 th pin thereof is grounded, a 15 th pin thereof is connected to a node VCC _5 through a resistor R33 and is connected to a node RX2 through a resistor R32, a 16 th pin thereof is connected to a node VCC _5 through a resistor R34 and is connected to a node TX2 through a resistor R31, a 17 th pin thereof is connected to a node CSB _ RX through a resistor R30, an 18 th pin thereof is connected to a node CSB _ TX through a resistor R29, a 20 th pin thereof is connected to a second pin of a clock reset switch JP1, a node R46 is connected to a node 44, pins 23 to 28 are respectively and correspondingly connected with a node LED2_ A, a node LED2_ B, a node LED2_ C, a node LED2_ D, a node LED2_ E and a node LED2_ F, and a pin 1 of a clock reset switch JP1 is connected with a node VCC _ 5; the 1 st pin of the ultrasonic ranging sensor is connected to the node VCC _5, the 2 nd pin thereof is connected to the node CSB _ TX, the 3 rd pin thereof is connected to the node CSB _ RX, and the 4 th pin thereof is directly grounded.

Furthermore, the capacity display circuit comprises a first nixie tube, a second nixie tube and resistors R21-R28 and R35-R43, wherein the first nixie tube and the second nixie tube are positioned on the outer side of the garbage can main body;

the node LED1_ A, the node LED1_ B, the node LED1_ C, the node LED1_ D, the node LED1_ E, the node LED1_ F, the node LED1_ G and the node LED1_ DP are sequentially connected with the 7 th pin, the 6 th pin, the 4 th pin, the 2 nd pin, the 1 st pin, the 9 th pin, the 10 th pin and the 5 th pin of the corresponding first nixie tube through corresponding resistors R21-R28, and the 3 rd pin and the 8 th pin of the first nixie tube are connected with the node VCC _ LED;

the LED2_ A, the node LED2_ B, the node LED2_ C, the node LED2_ D, the node LED2_ E, the node LED2_ F, LED2_ G and the node LED2_ DP are sequentially connected with the 7 th pin, the 6 th pin, the 4 th pin, the 2 nd pin, the 1 st pin, the 9 th pin, the 10 th pin and the 5 th pin of the corresponding second digital tube through corresponding resistors R35-R43, and the 3 rd pin and the 8 th pin of the node LED are connected with the node VCC _ LED.

Further, the program programming module comprises a level conversion circuit, a first programming port and a second programming port, wherein the level conversion circuit comprises a level conversion chip and capacitors C20-21 and C24-25, a 1 st pin of the level conversion chip is connected with a 3 rd pin thereof through a capacitor C24, a 2 nd pin thereof is connected with a node VCC _5 through a capacitor C25, a 4 th pin thereof is connected with a 5 th pin thereof through a capacitor C20, a 6 th pin thereof is grounded through a capacitor C21, an 11 th pin thereof is connected with a node RX2, a 12 th pin thereof is connected with a node TX2, a 13 th pin thereof is connected with a node TXD, a 14 th pin thereof is connected with a node PCRXD, and a 15 th pin thereof is directly grounded;

the 3 rd pin of the first programming port and the 3 rd pin of the second programming port are both directly grounded, the 1 st pin of the first programming port is connected with a node RX1, the 2 nd pin thereof is connected with a node TX1, the 1 st pin of the second programming port is connected with a node PCRXD, the 2 nd pin thereof is connected with a node PCTXD, and the 2 nd pin thereof is connected with a node LEDCON.

Further, the power supply module comprises resistors R19, R45, diodes V3, D3, capacitors C1-C7, C10-C12, C14-C16, C18, C19, C22 and C23, a node VCC _5 is grounded through the capacitors C1-C7, C10-C12, C14-C16, C18, C19, C22 and C23 which are connected in parallel, a node VCC _5 is grounded through the resistor R19 and the diode V3 which are connected in series, a node LEDCON is connected with the node LED through the diode D3 and is connected with the node VCC _5 through the resistor R45;

the capacity automated inspection garbage bin still includes the phase inverter, the D utmost point of phase inverter is connected with node VCC _ LED, and its G utmost point is connected with node LEDCON, and its S utmost point is connected with node VCC _ 5.

The utility model has the advantages that:

the utility model discloses an infrared induction function that infrared induction module provided, ultrasonic ranging module provide the ultrasonic wave survey in the garbage bin residual capacity function and show, have improved the practicality, when infrared induction detects no user and is close, device outage dormancy has practiced thrift resource consumption to when infrared induction detects that there is the user to be close, independently move, carry out residual capacity function and show in the garbage bin.

Drawings

FIG. 1 is a block diagram of an internal structure of a trash can with infrared sensing function and automatic capacity detection function;

FIG. 2 is a schematic diagram of an infrared induction main circuit;

FIG. 3 is a schematic diagram of an infrared receiving state display circuit;

FIG. 4 is a schematic diagram of an infrared sensing receiving circuit;

FIG. 5 is a schematic diagram of an ultrasonic ranging circuit;

FIG. 6 is a schematic diagram of a capacity display circuit;

FIG. 7 is a schematic circuit diagram of a program programming module;

FIG. 8 is a schematic circuit diagram of a power module;

fig. 9 is a schematic diagram of an inverter circuit.

Detailed Description

The present invention will be further described with reference to the following embodiments. Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; for a better understanding of the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

The embodiment of the utility model provides an in, as shown in FIG. 1, a capacity automated inspection garbage bin with infrared induction function, including the garbage bin main part with be located the inside infrared induction module of garbage bin main part, ultrasonic ranging module, procedure burn and write module and power module, ultrasonic ranging module burns with infrared induction module and procedure respectively and writes module communication connection, and the procedure burns and writes module and infrared induction module communication connection, and power module burns with infrared induction module, ultrasonic ranging module and procedure respectively and writes module electric connection.

In this embodiment, infrared induction module is including all being located inside and the infrared induction main circuit, the infrared receiving state display circuit and the infrared induction receiving circuit of communication connection in proper order of garbage bin main part.

In this embodiment, as shown in fig. 2, the main ir sensing circuit includes a first microcontroller U1 of STC15W201S type, a first input port P1, a second input port P2, a first output port P3, a second output port P4, a total output port P5, and resistors R1-R12, a first microcontroller 1 pin is connected to a node LED2_38K, a first 16 pin is connected to a node LED1_38K, a second 6 pin is connected to a node VCC _5, a second 8 pin is grounded, a second 9 pin is connected to a node RX1 through a resistor R11 and to a node HW 1 through a resistor R11 and a resistor R12 connected in series, a third 10 pin is connected to a node TX1 through a resistor R9 and to a node TX 5 through a resistor R9 and a resistor R10 connected in series, a third 11 pin is connected to a node LED through a resistor R7 and a resistor VCC R7 and a resistor TX 8 connected in series, and a node TX _5 is connected to a node TX 5, and is connected with the node VCC _5 through the resistor R5 and the resistor R6 connected in series, the 13 th pin thereof is connected with the node LED2_ HW through the resistor R3, and is connected with the node VCC _5 through the resistor R3 and the resistor R4 connected in series, and the 14 th pin thereof is connected with the node LED1_ HW through the resistor R1, and is connected with the node VCC _5 through the resistor R1 and the resistor R2 connected in series;

the 1 st pin of the first input port and the 1 st pin of the first output port are both grounded, the 3 rd pin of the first input port and the 3 rd pin of the first output port are both connected with a node VCC _5, the 2 nd pin of the first input port is connected with a node HW _ TX1, the 2 nd pin of the first output port is connected with a node HW _ TX2, the 1 st pin of the second input port and the 1 st pin of the second output port are both grounded, the 4 th pin of the second input port and the 4 th pin of the second output port are both connected with a node VCC _5, the 2 nd pin of the second input port is connected with a node HW _ TX3, the 3 rd pin thereof is connected with a node HW _ TX2, the 2 nd pin of the second output port is connected with a node TX1, and the 3 rd pin thereof is connected with a node TX.

In this embodiment, as shown in fig. 3, the infrared receiving state display circuit includes diodes D1-D2, a normal red diode V1-V2, and a normal red diode V4 in TSAL6200 model, a node VCC _5 is connected to a node HW _ TX1 through a resistor R15 and a diode V1 connected in series, a node 5 is connected to a node LED1_ HW through a resistor R18 and a diode V2 connected in series, and is connected to a node LED2_ HW through a resistor R20 and a diode V4 connected in series, a node LED1_38K is grounded through a resistor R13 and a diode D2 connected in series, and a node LED2_38K is grounded through a resistor R17 and a diode D1 connected in series.

In this embodiment, as shown in fig. 4, the infrared sensing receiving circuit includes an infrared sensing transmitter I1, an infrared sensing receiver I2, a capacitor C9 and a capacitor C13 of the TSOP31238 model, a 1 st pin of the infrared sensing transmitter is connected to a node VCC _5 and is grounded through a capacitor C9, a 2 nd pin thereof is directly grounded, a 3 rd pin thereof is connected to a node LED1_ HW, a 1 st pin of the infrared sensing receiver is connected to a node VCC _5 and is grounded through a capacitor C13, a 2 nd pin thereof is directly grounded, a 3 rd pin thereof is connected to a node LED2_ HW, and the infrared sensing transmitter and the infrared sensing receiver are both located outside the trash can; the infrared induction transmitter I1 and the infrared induction receiver I2 are both positioned outside the garbage can.

In this embodiment, the ultrasonic ranging module includes an ultrasonic ranging circuit and a capacity display circuit that are connected in sequence.

In the embodiment, as shown in fig. 5, the ultrasonic ranging circuit comprises a second microprocessor U2 of STC15W404AS model, an ultrasonic ranging sensor I3 of HC-SR04 model, a clock reset switch JP1, and resistors R29-R34, R44 and R46, wherein the ultrasonic ranging sensor is positioned at the top end of the inner side of the garbage can;

pins 1 to 10 of the second microprocessor are connected to a node LED2_ G, a node LED2_ DP, a node LED1_ a, a node LED1_ B, a node LED1_ C, a node LED1_ D, a node LED1_ E, a node LED1_ F, a node LED1_ G, and a node LED1_ DP, respectively and in sequence, a 12 th pin thereof is connected to a node VCC _5, a 14 th pin thereof is grounded, a 15 th pin thereof is connected to a node VCC _5 through a resistor R33 and is connected to a node RX2 through a resistor R32, a 16 th pin thereof is connected to a node VCC _5 through a resistor R34 and is connected to a node TX2 through a resistor R31, a 17 th pin thereof is connected to a node CSB _ RX through a resistor R30, an 18 th pin thereof is connected to a node CSB _ TX through a resistor R29, a 20 th pin thereof is connected to a second pin of a clock reset switch JP1, a node R46 is connected to a node 44, pins 23 to 28 are respectively and correspondingly connected with a node LED2_ A, a node LED2_ B, a node LED2_ C, a node LED2_ D, a node LED2_ E and a node LED2_ F, and a pin 1 of a clock reset switch JP1 is connected with a node VCC _ 5; the 1 st pin of the ultrasonic ranging sensor is connected to the node VCC _5, the 2 nd pin thereof is connected to the node CSB _ TX, the 3 rd pin thereof is connected to the node CSB _ RX, and the 4 th pin thereof is directly grounded.

In this embodiment, as shown in fig. 6, the capacity display circuit includes a first nixie tube S1, a second nixie tube S2, and resistors R21-R28 and R35-R43; the first nixie tube and the second nixie tube are common-cathode nixie tubes, are LG3611AH in model and are positioned on the outer side of the garbage can main body;

the node LED1_ A, the node LED1_ B, the node LED1_ C, the node LED1_ D, the node LED1_ E, the node LED1_ F, the node LED1_ G and the node LED1_ DP are sequentially connected with the 7 th pin, the 6 th pin, the 4 th pin, the 2 nd pin, the 1 st pin, the 9 th pin, the 10 th pin and the 5 th pin of the corresponding first nixie tube through corresponding resistors R21-R28, and the 3 rd pin and the 8 th pin of the first nixie tube are connected with the node VCC _ LED;

the LED2_ A, the node LED2_ B, the node LED2_ C, the node LED2_ D, the node LED2_ E, the node LED2_ F, LED2_ G and the node LED2_ DP are sequentially connected with the 7 th pin, the 6 th pin, the 4 th pin, the 2 nd pin, the 1 st pin, the 9 th pin, the 10 th pin and the 5 th pin of the corresponding second digital tube through corresponding resistors R35-R43, and the 3 rd pin and the 8 th pin of the node LED are connected with the node VCC _ LED.

In this embodiment, as shown in fig. 7, the program programming module is configured to provide a programming function of a preset program, and includes a level shift circuit, a first programming port P6 and a second programming port P7, where the level shift circuit includes a MAX232 type level shift chip U3 and capacitors C20-21 and C24-25, a 1 st pin of the level shift chip is connected to a 3 rd pin thereof through a capacitor C24, a 2 nd pin thereof is connected to a node VCC _5 through a capacitor C25, a 4 th pin thereof is connected to a 5 th pin thereof through a capacitor C20, a 6 th pin thereof is grounded through a capacitor C21, a 11 th pin thereof is connected to a node RX2, a 12 th pin thereof is connected to a node TX2, a 13 th pin thereof is connected to a node PCTXD, a 14 th pin thereof is connected to a node PCRXD, and a 15 th pin thereof is directly grounded;

the 3 rd pin of the first programming port and the 3 rd pin of the second programming port are both directly grounded, the 1 st pin of the first programming port is connected with a node RX1, the 2 nd pin thereof is connected with a node TX1, the 1 st pin of the second programming port is connected with a node PCRXD, the 2 nd pin thereof is connected with a node PCTXD, and the 2 nd pin thereof is connected with a node LEDCON.

In this embodiment, as shown in fig. 8, the power module includes resistors R19, R45, a common red diode V3, a diode D3 of SS34 type, and capacitors C1-C7, C10-C12, C14-C16, C18, C19, C22, and C23, the node VCC _5 is grounded through capacitors C1-C7, C10-C12, C14-C16, C18, C19, C22, and C23 connected in parallel, the node VCC _5 is grounded through a resistor R19 and a diode V3 connected in series, the node LEDCON is connected to the node LED through a diode D3, and is connected to the node VCC _5 through a resistor R45;

as shown in fig. 9, the trash can with automatic capacity detection function further includes an inverter, wherein the inverter is an APM9435 type inverter, the D pole of the inverter is connected to the node VCC _ LED, the G pole of the inverter is connected to the node LEDCON, and the S pole of the inverter is connected to the node VCC _5, and the inverter inverts the phase of the input signal by 180 degrees.

In this embodiment, the infrared sensing receiving circuit uses an infrared sensing transmitter I1 for transmission and an infrared sensing receiver I2 for reception, when a user approach signal is detected, the signal is transmitted to a first microcontroller U1, the first microcontroller U1 controls a common red diode V1-V2 and a common red diode V4 of the infrared receiving state display circuit to flash, so as to facilitate observation of the working state of the device, the inverter inverts the phase of the input signal by 180 degrees, and then sends an instruction to a second microprocessor U2, the second microprocessor U2 controls an ultrasonic ranging sensor I3 to perform ranging, detect the remaining capacity in the trash can, and display the result to a first nixie tube S1 and a second nixie tube S2, and the power module provides a working voltage for a required device.

The utility model provides a simple function, the practicality that prior art exists hang down and the user can't learn the problem of surplus capacity in the garbage bin.

The above is only the embodiment of the present invention, and the embodiment is used for understanding the structure, function and effect of the present invention, and is not used for limiting the protection scope of the present invention. The utility model can be changed and changed in various ways, and any modification, equivalent replacement, improvement, etc. within the spirit and principle of the utility model should be included within the protection scope of the utility model.

Claims (10)

1. The utility model provides a capacity automated inspection garbage bin with infrared induction function, its characterized in that, burns and writes module and power module including the garbage bin main part and infrared induction module, ultrasonic ranging module, procedure that are located the garbage bin main part inside, ultrasonic ranging module burns and writes module communication connection with infrared induction module and procedure respectively, the procedure burns and writes module and infrared induction module communication connection, power module burns and writes module electric connection with infrared induction module, ultrasonic ranging module and procedure respectively.

2. The trash can with the infrared sensing function and the automatic capacity detection function according to claim 1, wherein the infrared sensing module comprises an infrared sensing main circuit, an infrared receiving state display circuit and an infrared sensing receiving circuit which are sequentially and communicatively connected and are all located inside a trash can body.

3. The automatic capacity detecting trash can with infrared sensing function of claim 2, wherein the infrared sensing main circuit comprises a first microcontroller, a first input port, a second input port, a first output port, a second output port, a total output port and resistors R1-R12, wherein the 1 st pin of the first microcontroller is connected with a node LED2_38K, the 16 th pin thereof is connected with a node LED1_38K, the 6 th pin thereof is connected with a node VCC _5, the 8 th pin thereof is grounded, the 9 th pin thereof is connected with a node RX1 through a resistor R11 and is connected with a node VCC _5 through a resistor R11 and a resistor R12 in series, the 10 th pin thereof is connected with a node TX1 through a resistor R9 and is connected with a node VCC _5 through a resistor R9 and a resistor R10 in series, the 11 th pin thereof is connected with a node LED through a resistor R7 and is connected with a node VCC _5 through a resistor R7 and a resistor R8 in series, its 12 th pin is connected with node HW _ TX through resistor R5 and with node VCC _5 through resistor R5 and resistor R6 in series, its 13 th pin is connected with node LED2_ HW through resistor R3 and with node VCC _5 through resistor R3 and resistor R4 in series, and its 14 th pin is connected with node LED1_ HW through resistor R1 and with node VCC _5 through resistor R1 and resistor R2 in series;

the 1 st pin of the first input port and the 1 st pin of the first output port are both grounded, the 3 rd pin of the first input port and the 3 rd pin of the first output port are both connected with a node VCC _5, the 2 nd pin of the first input port is connected with a node HW _ TX1, the 2 nd pin of the first output port is connected with a node HW _ TX2, the 1 st pin of the second input port and the 1 st pin of the second output port are both grounded, the 4 th pin of the second input port and the 4 th pin of the second output port are both connected with a node VCC _5, the 2 nd pin of the second input port is connected with a node HW _ TX3, the 3 rd pin thereof is connected with a node HW _ TX2, the 2 nd pin of the second output port is connected with a node HW _ TX1, and the 3 rd pin thereof is connected with a node HW _ TX.

4. The automatic capacity detecting trash can with the infrared sensing function as claimed in claim 2, wherein the infrared receiving state display circuit comprises diodes D1-D2, diodes V1-V2 and diode V4, the node VCC _5 is connected with the node HW _ TX1 through a resistor R15 and a diode V1 connected in series, the node 5 is connected with the node LED1_ HW through a resistor R18 and a diode V2 connected in series, and is connected with the node LED2_ HW through a resistor R20 and a diode V4 connected in series, the node LED1_38K is grounded through a resistor R13 and a diode D2 connected in series, and the node LED2_38K is grounded through a resistor R17 and a diode D1 connected in series.

5. The trash can with infrared sensing function and automatic capacity detection function as claimed in claim 2, wherein the infrared sensing receiving circuit comprises an infrared sensing transmitter, an infrared sensing receiver, a capacitor C9 and a capacitor C13, the 1 st pin of the infrared sensing transmitter is connected with a node VCC _5 and is grounded through a capacitor C9, the 2 nd pin thereof is directly grounded, the 3 rd pin thereof is connected with a node LED1_ HW, the 1 st pin of the infrared sensing receiver is connected with a node VCC _5 and is grounded through a capacitor C13, the 2 nd pin thereof is directly grounded, the 3 rd pin thereof is connected with a node LED2_ HW, and the infrared sensing transmitter and the infrared sensing receiver are both located outside the trash can.

6. The automatic capacity detecting trash can with the infrared sensing function as claimed in claim 1, wherein the ultrasonic ranging module comprises an ultrasonic ranging circuit and a capacity display circuit which are sequentially connected.

7. The automatic capacity detecting trash can with the infrared sensing function as claimed in claim 6, wherein the ultrasonic ranging circuit comprises a second microprocessor, an ultrasonic ranging sensor, a clock reset switch JP1 and resistors R29-R34, R44 and R46, wherein the ultrasonic ranging sensor is positioned at the top end of the inner side of the trash can;

the 1 st to 10 th pins of the second microprocessor are respectively and sequentially connected to a node LED2_ G, a node LED2_ DP, a node LED1_ a, a node LED1_ B, a node LED1_ C, a node LED1_ D, a node LED1_ E, a node LED1_ F, a node LED1_ G, and a node LED1_ DP, respectively, and are connected in sequence, the 12 th pin thereof is connected to a node VCC _5, the 14 th pin thereof is grounded, the 15 th pin thereof is connected to a node VCC _5 through a resistor R33 and is connected to a node RX2 through a resistor R32, the 16 th pin thereof is connected to a node VCC _5 through a resistor R34 and is connected to a node TX2 through a resistor R31, the 17 th pin thereof is connected to a node CSB _ RX through a resistor R30, the 18 th pin thereof is connected to a node CSB _ TX through a resistor R29, the 20 th pin thereof is connected to a second ground switch JP1, the resistor R46 and is connected to a node 44, the 23 st pin to the 28 th pin of the clock reset switch JP1 are respectively and correspondingly connected with a node LED2_ A, a node LED2_ B, a node LED2_ C, a node LED2_ D, a node LED2_ E and a node LED2_ F, and the 1 st pin of the clock reset switch JP1 is connected with a node VCC _ 5; the 1 st pin of the ultrasonic ranging sensor is connected with a node VCC _5, the 2 nd pin thereof is connected with a node CSB _ TX, the 3 rd pin thereof is connected with a node CSB _ RX, and the 4 th pin thereof is directly grounded.

8. The trash can with infrared sensing function and automatic capacity detection function of claim 6, wherein the capacity display circuit comprises a first nixie tube, a second nixie tube and resistors R21-R28 and R35-R43, the first nixie tube and the second nixie tube are both located outside the trash can body;

the node LED1_ A, the node LED1_ B, the node LED1_ C, the node LED1_ D, the node LED1_ E, the node LED1_ F, the node LED1_ G and the node LED1_ DP are sequentially connected with the 7 th pin, the 6 th pin, the 4 th pin, the 2 nd pin, the 1 st pin, the 9 th pin, the 10 th pin and the 5 th pin of the corresponding first nixie tube through corresponding resistors R21-R28, and the 3 rd pin and the 8 th pin of the first nixie tube are connected with the node VCC _ LED;

the LED2_ A, the node LED2_ B, the node LED2_ C, the node LED2_ D, the node LED2_ E, the node LED2_ F, LED2_ G and the node LED2_ DP are sequentially connected with the 7 th pin, the 6 th pin, the 4 th pin, the 2 nd pin, the 1 st pin, the 9 th pin, the 10 th pin and the 5 th pin of the corresponding second digital tube through corresponding resistors R35-R43, and the 3 rd pin and the 8 th pin of the node LED are connected with the node VCC _ LED.

9. The infrared sensing enabled automatic capacity detection trash can of claim 1, wherein the program programming module comprises a level shifting circuit, a first programming port and a second programming port, the level shifting circuit comprises a level shifting chip and capacitors C20-21 and C24-25, a 1 st pin of the level shifting chip is connected with a 3 rd pin thereof through a capacitor C24, a 2 nd pin thereof is connected with a node VCC _5 through a capacitor C25, a 4 th pin thereof is connected with a 5 th pin thereof through a capacitor C20, a 6 th pin thereof is grounded through a capacitor C21, an 11 th pin thereof is connected with a node RX2, a 12 th pin thereof is connected with a node TX2, a 13 th pin thereof is connected with a node txpcd, a 14 th pin thereof is connected with a node PCRXD, and a 15 th pin thereof is directly grounded;

the 3 rd pin of the first programming port and the 3 rd pin of the second programming port are both directly grounded, the 1 st pin of the first programming port is connected with a node RX1, the 2 nd pin thereof is connected with a node TX1, the 1 st pin of the second programming port is connected with a node PCRXD, the 2 nd pin thereof is connected with a node PCTXD, and the 2 nd pin thereof is connected with a node LEDCON.

10. The infrared-sensing-function-based automatic capacity detection trash can of claim 1, wherein the power module comprises resistors R19, R45, diodes V3, D3, capacitors C1-C7, C10-C12, C14-C16, C18, C19, C22 and C23, a node VCC _5 is grounded through the capacitors C1-C7, C10-C12, C14-C16, C18, C19, C22 and C23 which are connected in parallel, a node VCC _5 is grounded through the resistor R19 and the diode V3 which are connected in series, a node dcleon is connected with a node LED through the diode D3 and is connected with the node VCC _5 through the resistor R45;

the capacity automated inspection garbage bin still includes the phase inverter, the D utmost point of phase inverter is connected with node VCC _ LED, and its G utmost point is connected with node LEDCON, and its S utmost point is connected with node VCC _ 5.

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