CN210497391U - Cleaning device for electroplated circuit board - Google Patents

Abstract

The utility model discloses an electroplating circuit board belt cleaning device, include: n cleaning assemblies, conveying assemblies and filtering assemblies; the adjacent nth cleaning assembly and the (n + 1) th cleaning assembly are connected through a first circulation communication assembly, and the first circulation communication assembly comprises: the first check valve, the first extraction pump and the first circulating communicating pipe enable circulating water solution inside the (n + 1) th cleaning assembly to be extracted into the (n) th cleaning assembly for spraying, so that the circulating water solution can be recycled, and water resources are saved; the conveying assembly is connected with the cleaning assembly; the filter assembly is respectively connected with the first cleaning assembly and the Nth cleaning assembly, so that circulating water solution in the first cleaning assembly is conveyed to the Nth cleaning assembly after being filtered, an electroplating circuit board is sprayed, water resources are saved, the production cost is reduced, and the discharge of sewage is reduced.

Description

Cleaning device for electroplated circuit board

Technical Field

The utility model relates to a circuit board production facility technical field, concretely relates to electroplating circuit board belt cleaning device.

Background

When a circuit board is processed, the circuit board is usually required to be electroplated, and the electroplated circuit board needs to be cleaned if electroplating solution remains on the surface of the circuit board after electroplating. At present, the existing cleaning assemblies are mostly independent water inlet and independent water drainage, or pure water is continuously added in the water washing process, so that waste of a large amount of water resources, production cost improvement and a large amount of sewage discharge are caused, and the natural environment is deteriorated.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, an object of the utility model is to provide an electroplating circuit board belt cleaning device can carry out cyclic utilization to the circulating water solution after the electroplating circuit board washs, and the utilization of the water resource that has reduced manufacturing cost, reduces the emission of sewage.

The utility model provides a technical scheme that its problem adopted is:

the utility model provides a 1 electroplating circuit board belt cleaning device, include: the electroplating device comprises N cleaning assemblies arranged in sequence, a conveying assembly used for conveying an electroplated circuit board to the N cleaning assemblies arranged in sequence, and a filtering assembly used for filtering a circulating water solution in the first cleaning assembly; the adjacent nth cleaning assembly and the (n + 1) th cleaning assembly are connected through a first circulation communication assembly, and the first circulation communication assembly comprises: the cleaning device comprises a first check valve, a first extraction pump and a first circulating communicating pipe for communicating a circulating water solution in the (n + 1) th cleaning assembly with a spray water solution in the nth cleaning assembly, wherein the first circulating communicating pipe is respectively connected with the first extraction pump and the first check valve; the conveying assembly is connected with the cleaning assembly; the filter assembly is respectively connected with the first cleaning assembly and the Nth cleaning assembly; wherein N is a positive integer greater than 1, N is a positive integer not less than 1, and N is greater than N.

Further, the transfer assembly includes: the device comprises a frame body, a first motor, a transmission shaft, a chain, a first chain wheel, a plurality of second chain wheels and a plurality of rollers; the frame body is respectively connected with the first motor and the cleaning assembly, the frame body is connected with the roller in a sliding mode, the outer surface of the second chain wheel is connected with the chain in a meshed mode, and the inner surface of the second chain wheel is fixedly connected with the roller; one end of the transmission shaft is connected with the first motor, the other end of the transmission shaft is fixedly connected with the inner surface of the first chain wheel, and the outer surface of the first chain wheel is meshed with the chain.

Further, the filter assembly includes: the device comprises a base, a filter cartridge, a dosing groove and an exhaust assembly for exhausting the filter cartridge; a second motor and a pump are arranged in the base; the filter cartridge is connected with the dosing groove through the exhaust assembly; the pump is provided with an inlet and an outlet, the pump is connected with the second motor, the inlet of the pump is connected with the dosing groove, and the outlet of the pump is connected with the filter cartridge; the base is respectively connected with the filter cartridge and the dosing groove.

Further, the filter cartridge includes: the device comprises a shell, a first filtering layer for filtering impurities and a second filtering layer for adsorbing the impurities; the shell is respectively connected with the first filter layer and the second filter layer in a sealing way; the first filtering layer divides the interior of the filter cylinder into a liquid inlet area and a filtering area, and the second filtering layer divides the filtering area into a first filtering area and a second filtering area; the export of pumping with the feed liquor is regional to be connected, the second filter area is with nth wash the subassembly and be connected.

Further, the exhaust assembly includes: an exhaust pipe, a pressure gauge and an exhaust valve; the pressure gauge is connected with the filter cartridge, the exhaust valve is connected with the exhaust pipe, and the exhaust pipe is respectively connected with the filter cartridge and the dosing groove.

Further, a liquid level meter is connected to the side wall of the medicine feeding groove.

Further, the cleaning assembly includes: the device comprises a plurality of first spray pipes, a plurality of second spray pipes, a first cleaning box for fixing the first spray pipes and preventing spray water solution from splashing, and a second cleaning box for fixing the second spray pipes and storing circulating water solution; the first spraying pipe is provided with a plurality of first spraying components for spraying the upper surface of the electroplated circuit board; the second spraying pipe is provided with a plurality of second spraying components for spraying the lower surface of the electroplated circuit board; the first cleaning box is respectively connected with the conveying assembly, the first spraying pipe and the first circulating communicating pipe, and the second cleaning box is respectively connected with the conveying assembly, the second spraying pipe and the first circulating communicating pipe.

Further, the lower end of the second cleaning box is provided with a communication hole.

Further, still include the second circulation intercommunication subassembly, the second circulation intercommunication subassembly includes: the second circulating communicating pipe, the second extraction pump and the second one-way valve; the filtering component is connected with the first cleaning component through the second circulating communicating pipe, and the second circulating communicating pipe is respectively connected with the second extraction pump and the second one-way valve.

Further, still include the third circulation intercommunication subassembly, the third circulation intercommunication subassembly includes: a third circulating communicating pipe, a third extraction pump and a third one-way valve; the filter assembly is connected with the Nth cleaning assembly through the third circulating communicating pipe, and the third circulating communicating pipe is respectively connected with the third extraction pump and the third one-way valve.

The embodiment of the utility model provides an in the technical scheme who provides, following beneficial effect has at least: the conveying assembly conveys the electroplated circuit board to the N cleaning assemblies which are arranged in sequence, and the N cleaning assemblies clean the electroplated circuit board in sequence, so that the residual quantity of electroplating solution on the surface of the electroplated circuit board is gradually reduced; the adjacent nth cleaning assembly and the (n + 1) th cleaning assembly are connected through a first circulation communication assembly, and the first circulation communication assembly comprises: the first circulating communicating pipe, the first check valve and the first extraction pump enable circulating water solution inside the (n + 1) th cleaning assembly to be extracted into the (n) th cleaning assembly and spray the electroplating circuit board, namely the circulating water solution inside the (n + 1) th cleaning assembly is spraying water solution inside the (n + 1) th cleaning assembly, so that the circulating water solution can be recycled, and water resources are saved; the filter assembly is used for filtering the circulating water solution inside the first cleaning assembly, and the filter assembly is respectively connected with the first cleaning assembly and the Nth cleaning assembly, so that the circulating water solution inside the first cleaning assembly is conveyed to the Nth cleaning assembly after being filtered, the electroplating circuit board is sprayed, water resources are saved, the production cost is reduced, and the discharge of sewage is reduced.

Drawings

The invention is further described with reference to the following figures and examples.

FIG. 1 is a front view of an embodiment of the cleaning device for an electroplated circuit board of the present invention;

FIG. 2 is a rear view of an embodiment of the cleaning device for the electroplated circuit board of the present invention;

FIG. 3 is a cross-sectional view of one embodiment of the electroplated circuit board cleaning apparatus of the present invention;

FIG. 4 is a front cross-sectional view of one embodiment of a transfer assembly of the electroplated circuit board cleaning apparatus of the present invention;

FIG. 5 is a side cross-sectional view of one embodiment of a transfer assembly of the electroplated circuit board cleaning apparatus of the present invention;

FIG. 6 is a cross-sectional view of one embodiment of a filter assembly of the electroplated circuit board cleaning apparatus of the present invention;

fig. 7 is a schematic view of an embodiment of a first motor of the cleaning device for the electroplated circuit board of the present invention.

Detailed Description

Most of the existing cleaning assemblies are independently used for water inlet and independent water drainage, or pure water is continuously added in the water washing process, so that a large amount of water resource is wasted, the production cost is increased, and a large amount of sewage is discharged, thereby causing the deterioration of the natural environment.

Based on this, the utility model provides an electroplating circuit board belt cleaning device can carry out cyclic utilization to the solution after the electroplating circuit board washs, and the utilization of the water resource that has reduced manufacturing cost, reduces the emission of sewage.

The embodiments of the present invention will be further explained with reference to the drawings.

Referring to fig. 1 and 2, an embodiment of the present invention provides an electroplated circuit board cleaning apparatus, including: the cleaning device comprises N cleaning assemblies 100 arranged in sequence, a conveying assembly 200 used for conveying the electroplated circuit boards to the N cleaning assemblies 100 arranged in sequence, and a filtering assembly 300 used for filtering a circulating water solution in the first cleaning assembly 100; the adjacent nth cleaning assembly 100 and the (n + 1) th cleaning assembly 100 are connected through a first circulation communication assembly 400, and the first circulation communication assembly 400 includes: a first check valve 410, a first extraction pump 420, and a first circulation connection pipe 430 for connecting the circulating water solution inside the (n + 1) th cleaning assembly 100 with the shower water solution inside the nth cleaning assembly 100, wherein the first circulation connection pipe 430 is respectively connected with the first extraction pump 420 and the first check valve 410; the transfer assembly 200 is connected with the cleaning assembly 100; the filter assembly 300 is respectively connected with the first cleaning assembly 100 and the Nth cleaning assembly 100; wherein N is a positive integer greater than 1, N is a positive integer not less than 1, and N is greater than N.

In this embodiment, the number of the cleaning assemblies 100 is N, and the N cleaning assemblies 100 may be arranged with their respective arrangement numbers, such as No. 1, No. 2, No. 3, etc., according to the arrangement order; moreover, the solution sprayed by the cleaning assembly 100 on the electroplated circuit board is a spraying aqueous solution, and the solution generated after the electroplated circuit board is cleaned by the spraying aqueous solution is a circulating aqueous solution, that is, the circulating aqueous solution is a solution obtained by mixing the spraying aqueous solution and the electroplating solution on the surface of the electroplated circuit board. Wherein the spray water solution can be selected from pure water; n is a positive integer larger than 1, N is a positive integer not smaller than 1, N is larger than N, and the number of N can be specifically selected according to the concentration or the residual quantity of electroplating solution on the surface of the electroplating circuit board.

The conveying assembly 200 conveys the electroplated circuit board to the N cleaning assemblies 100 which are arranged in sequence, so that the N cleaning assemblies 100 clean the electroplated circuit board in sequence, and the residual quantity of the electroplating solution on the surface of the electroplated circuit board is gradually reduced along with the increase of the arrangement serial number of the cleaning assemblies 100. The adjacent nth cleaning assembly 100 and the (n + 1) th cleaning assembly 100 are connected by a first circulation communication assembly 400, and the first circulation communication assembly 400 includes: the first circulation connection pipe 430, the first check valve 410 and the first extraction pump 420, the first check valve 410 limits the extraction direction of the first extraction pump 420, so that the first extraction pump 420 can only extract the circulating aqueous solution inside the (n + 1) th cleaning assembly 100 to the (n + 1) th cleaning assembly 100, but cannot extract the circulating aqueous solution inside the (n + 1) th cleaning assembly 100 to the (n + 1) th cleaning assembly 100. Under the effect of first check valve 410 and first extraction pump 420, first circulation communicating pipe 430 communicates the inside circulating water solution of the (n + 1) th cleaning assembly 100 with the inside spray water solution of the nth cleaning assembly 100, make the inside circulating water solution of the (n + 1) th cleaning assembly 100 be extracted as the inside spray water solution of the nth cleaning assembly 100, because the plating solution residual quantity in the circulating water solution of the (n + 1) th cleaning assembly 100 is less than the plating solution residual quantity in the circulating water solution of the nth cleaning assembly 100, so the plating solution on the surface of the electroplating circuit board can be effectively cleaned by the spray water solution, make the circulating water solution can be recycled simultaneously, and water resources are saved.

The filtering assembly 300 can effectively filter the circulating water solution inside the first cleaning assembly 100, that is, filter impurities in the circulating water solution, and decompose and purify the electroplating solution in the circulating water solution, so that the concentration of impurity ions in the filtered circulating water solution is reduced to the minimum; and the filtering component 300 is respectively connected with the first cleaning component 100 and the Nth cleaning component 100, so that the circulating water solution in the first cleaning component 100 is filtered and then is conveyed to the Nth cleaning component 100, and the filtered circulating water solution is preferably used as the spraying water solution of the Nth cleaning component 100 due to the lower concentration of impurity ions in the filtered circulating water solution, so that the electroplating circuit board can be effectively cleaned, and the residual quantity of the electroplating solution on the surface of the electroplating circuit board is reduced to the minimum. The arrangement of the filter assembly 300 and the first circulation communicating pipe 430 enables the circulating aqueous solution to be effectively recycled, thereby greatly saving water resources, reducing production cost and reducing sewage discharge. The adjacent cleaning assemblies 100 may be arranged closely or at intervals.

Secondly, the circulating water solution filtered by the filtering component 300 can also be input into the nth cleaning component 100 as the circulating water solution of the nth cleaning component 100, and then is pumped into the (N-1) th cleaning component 100 by the first circulating communicating pipe 430 to be used as the spray water solution, so that the nth cleaning component 100 needs additional spray water solution to clean the electroplated circuit board, and then the spray water solution of the N cleaning components 100 can select pure water.

Further, referring to fig. 4, 5 and 7, another embodiment of the present invention also provides an electroplated circuit board cleaning apparatus, wherein the conveying assembly 200 includes: a frame body 210, a first motor 220, a transmission shaft 230, a chain 240, a first chain wheel 250, a plurality of second chain wheels 260 and a plurality of rollers 270; the frame body 210 is connected to the first motor 220 and the washing assembly 100, respectively, the frame body 210 is slidably connected to the drum 270, an outer surface of the second chain wheel 260 is engaged with the chain 240, and an inner surface of the second chain wheel 260 is fixedly connected to the drum 270; one end of the transmission shaft 230 is connected to the first motor 220, the other end of the transmission shaft 230 is fixedly connected to the inner surface of the first chain wheel 250, and the outer surface of the first chain wheel 250 is engaged with the chain 240.

In this embodiment, one end of the transmission shaft 230 is connected to the first motor 220, the other end of the transmission shaft 230 is fixedly connected to the inner surface of the first chain wheel 250, and when the transmission shaft 230 is driven by the first motor 220 to rotate, the transmission shaft 230 drives the first chain wheel 250 to rotate; the outer surface of the first chain wheel 250 is meshed with the chain 240, so that the chain 240 is driven by the first chain wheel 250 to run; because of the surface and the meshing of second sprocket 260 are connected, the internal surface and the cylinder 270 fixed connection of second sprocket 260 for chain 240 drives second sprocket 260 and rotates, and second sprocket 260 drives cylinder 270 and rotates, and first motor 220 can indirectly drive cylinder 270 and rotate promptly, makes a plurality of cylinders 270 can be on support body 210 toward same direction conveying electroplating circuit board, simple structure, convenient operation. Meanwhile, the frame body 210 is slidably coupled to the drum 270 such that the drum 270 rotates along the central axis of the drum 270 inside the frame body 210, effectively transferring the plated circuit boards.

Further, referring to fig. 6, another embodiment of the present invention further provides an electroplated circuit board cleaning apparatus, wherein the filter assembly 300 includes: a base 310, a filter cartridge 320, a dosing slot 330 and an exhaust assembly 340 for exhausting the filter cartridge 320; a second motor 350 and a pump 360 are arranged inside the base 310; the filter cartridge 320 is connected with the dosing tank 330 through the exhaust assembly 340; the pump 360 is provided with an inlet and an outlet, the pump 360 is connected with the second motor 350, the inlet of the pump 360 is connected with the dosing groove 330, and the outlet of the pump 360 is connected with the filter cartridge 320; the base 310 is connected to the filter cartridge 320 and the dosing groove 330, respectively.

In this embodiment, the base 310 is used to fix the filter cartridge 320 and the dosing groove 330; the dosing tank 330 is used for storing the circulating aqueous solution, so that a user can conveniently extract the circulating aqueous solution to detect the concentration of the electroplating solution in the circulating aqueous solution, and the number of the cleaning assemblies 100 can be set more conveniently and accurately; the second motor 350 drives the pump 360 to operate, so that the circulating aqueous solution in the dosing tank 330 is pumped into the filter cylinder 320, and the circulating aqueous solution is conveniently filtered. The exhaust assembly 340 can extract air or other gases in the filter assembly 300, so as to prevent substances in the filter assembly 300 from reacting with the air to generate impurities, and the extracted gases can increase the capacity of the circulating aqueous solution in the filter assembly 300 and promote the filtering of the circulating aqueous solution; when the gas in the filtering assembly 300 is completely discharged, the circulating water solution flows into the dosing tank 330 along with the exhaust assembly 340, and then is continuously pumped into the filtering tank by the pump 360, so that the circulating water solution can be effectively utilized by the connection of the exhaust assembly 340 and the dosing tank 330, the production cost is reduced, and the discharge of sewage is reduced.

Further, referring to fig. 6, another embodiment of the present invention also provides an electroplated circuit board cleaning apparatus, wherein the filter cartridge 320 includes: a housing 321, a first filter layer 322 for filtering impurities, and a second filter layer 323 for adsorbing impurities; the shell 321 is hermetically connected with the first filter layer 322 and the second filter layer 323; the first filtering layer 322 divides the inside of the filter cartridge 320 into a liquid inlet area 3221 and a filtering area 3222, and the second filtering layer 323 divides the filtering area 3222 into a first filtering area 3231 and a second filtering area 3232; the outlet of the pump 360 is connected to the liquid inlet region 3221, and the second filter region 3232 is connected to the nth cleaning assembly 100.

In this embodiment, the outlet of the pump 360 is connected to the liquid inlet area 3221, that is, the liquid inlet area 3221 is used for storing the circulating water solution, the first filtering area 3231 is used for storing the first filtering solution after the circulating water solution is filtered by the first filtering layer 322, the second filtering area 3232 is used for storing the second filtering solution after the first filtering solution is filtered by the second filtering layer 323, and the second filtering solution is used for spraying the electroplated circuit board by the nth cleaning assembly 100. The first filter layer 322 is used for filtering large particle substances or suspended matters such as impurities, wherein the first filter layer 322 can be set as a filter screen; the second filtering layer 323 is used for adsorbing impurities, i.e., separating and purifying impurities from the electroplating solution, so that the concentration of impurity ions in the second filtering solution is low, wherein the second filtering layer 323 can be set as activated carbon, an ultrafiltration membrane, or the like. After the circulating water solution is treated by the first filtering layer 322 and the second filtering layer 323, the concentration of impurity ions contained in the solution is low, so that the filtered circulating water solution can effectively clean the electroplating circuit board in the Nth cleaning assembly 100, and the residual quantity of the electroplating solution on the surface of the electroplating circuit board is reduced to the minimum.

Further, another embodiment of the present invention provides an apparatus for cleaning an electroplated circuit board, wherein the exhaust assembly 340 comprises: an exhaust pipe 341, a pressure gauge 342, and an exhaust valve 343; the pressure gauge 342 is connected to the filter cartridge 320, the exhaust valve 343 is connected to the exhaust pipe 341, and the exhaust pipe 341 is connected to the filter cartridge 320 and the dosing tank 330, respectively.

In this embodiment, the exhaust tube 341 is used to evacuate excess gas from the filter cartridge 320; the pressure gauge 342 is used for detecting the pressure inside the filter cartridge 320, and preventing the circulating water solution from reacting in the filter cartridge 320 to generate a large amount of gas, so that the filter cartridge 320 is broken due to excessive pressure; the exhaust valve 343 is used to exhaust the gas inside the filter cartridge 320 and to close the filter cartridge 320, preventing external air from entering the filter cartridge 320, causing the generation of impurities, and the introduction of the gas reduces the capacity of the circulating aqueous solution, slowing down the filtration rate of the circulating aqueous solution.

Further, another embodiment of the present invention further provides a cleaning device for an electroplated circuit board, wherein a liquid level gauge 331 is connected to a side wall of the chemical feeding groove 330.

In this embodiment, the liquid level meter 331 is configured to detect a liquid level of the circulating aqueous solution in the dosing tank 330, so as to adjust a rate of the circulating aqueous solution entering the dosing tank 330 according to a variation rate of the liquid level height, and avoid resource waste and sewage generation caused by overflow of the circulating aqueous solution from the dosing tank 330 due to an excessively high liquid level.

Further, referring to fig. 3, another embodiment of the present invention further provides an electroplated circuit board cleaning apparatus, wherein the cleaning assembly 100 includes: a plurality of first showers 110, a plurality of second showers 120, a first cleaning tank 130 for fixing the first showers 110 and preventing a spray water solution from splashing, and a second cleaning tank 140 for fixing the second showers 120 and storing a circulating water solution; the first spray pipe 110 is provided with a plurality of first spray components 111 for spraying the upper surface of the electroplated circuit board; the second spraying pipe 120 is provided with a plurality of second spraying components 121 for spraying the lower surface of the electroplated circuit board; the first cleaning tank 130 is connected to the transfer assembly 200, the first shower 110 and the first circulation connection pipe 430, respectively, and the second cleaning tank 140 is connected to the transfer assembly 200, the second shower 120 and the first circulation connection pipe 430, respectively.

In this embodiment, the spraying aqueous solution flows in from the first spraying pipe 110 and the second spraying pipe 120, and flows out from the first spraying assembly 111 and the second spraying assembly 121, so that the upper surface and the lower surface of the electroplated circuit board can be cleaned in all directions, and the cleaning efficiency is high. Wherein, the first spray assembly 111 and the second spray assembly 121 can be selected from spray heads.

The first cleaning box 130 is used for fixing the first spray pipe 110 and preventing the spray water solution from splashing, preferably, the first cleaning box 130 can be a rectangular frame body with a hollow lower bottom surface, the first spray pipe 110 is arranged on the inner side surface of the first cleaning box 130, the bottom height of the side surface of the first cleaning box 130 is consistent with the top height of the conveying assembly 200, the coverage range of the first cleaning box 130 is enlarged, the spray water solution is effectively prevented from splashing, and the waste of resources is reduced; in addition, in the spraying process of the first spray unit 111 and the second spray unit 121, the spray solution may be mixed with the plating solutions on the upper surface and the lower surface of the plated circuit board along with the contact of the spray solution with the plated circuit board, and the mixed solution flows into the second cleaning tank 140, but since the spray solution has an impact force when spraying, some of the mixed solution may splash, and thus the first cleaning tank 130 also has an effect of preventing the mixed solution from splashing at the same time, thereby preventing the environmental pollution.

The second cleaning tank 140 is used for fixing the second spray pipe 120 and storing the circulating aqueous solution, preferably, the first cleaning tank 130 may be a rectangular frame body with a hollow upper bottom surface, and the second spray pipe 120 is arranged on the inner side surface of the second cleaning tank 140; after the first spraying assembly 111 and the second spraying assembly 121 are sprayed, the spraying aqueous solution and the electroplating solution are mixed and flow to the second cleaning tank 140, and the second cleaning tank 140 stores the mixed solution, wherein the mixed solution is a circulating aqueous solution. Wherein, the top height of the side of the second cleaning tank 140 can be set to be consistent with the bottom height of the transfer assembly 200, which can better prevent the splashing of the liquid.

Further, another embodiment of the present invention also provides a cleaning device for an electroplated circuit board, wherein the lower end of the second cleaning box 140 is provided with a communication hole 141.

In the present embodiment, the lower end of the second wash tank 140 is provided with a communication hole 141, and the first circulation communication pipe 430 communicates the n +1 th second wash tank 140 with the nth first wash tank 130 and the nth second wash tank 140 through the communication hole 141 of the n +1 th second wash tank 140, respectively, for the nth first wash tank 130, the nth second wash tank 140, and the n +1 th second wash tank 140 that are adjacent; and the first circulation connection pipe 430 connects the first shower pipe 110 in the nth first cleaning tank 130 and the second shower pipe 120 in the nth second cleaning tank 140, so that the circulating aqueous solution in the (n + 1) th second cleaning tank 140 is smoothly pumped into the nth first cleaning tank 130 and the nth second cleaning tank 140 to spray the upper and lower surfaces of the electroplated circuit board. Therefore, the communication hole 141 is simply provided, the length of the first circulation communication pipe 430 is effectively shortened, and the production cost is reduced.

Further, referring to fig. 2, another embodiment of the present invention further provides an electroplated circuit board cleaning apparatus, wherein the apparatus further comprises a second circulation communication assembly 500, and the second circulation communication assembly 500 comprises: a second circulation connection pipe 510, a second suction pump 520, and a second check valve 530; the filter assembly 300 is connected to the first cleaning assembly 100 through the second circulation connection pipe 510, and the second circulation connection pipe 510 is connected to the second suction pump 520 and the second check valve 530, respectively.

In this embodiment, the second check valve 530 limits the pumping direction of the second pumping pump 520, such that the second pumping pump 520 can only pump the circulating aqueous solution from a single direction, i.e., the second pumping pump 520 can only pump the circulating aqueous solution inside the first cleaning assembly 100, such that the circulating aqueous solution flows from the first cleaning assembly 100 to the filtering assembly 300; under the action of the second circulation connection pipe 510, the second suction pump 520 and the second check valve 530, the circulating water solution inside the first cleaning module 100 smoothly flows into the filter module 300, and the filtering of the filter module 300 is facilitated.

Further, another embodiment of the present invention further provides an electroplated circuit board cleaning device, wherein the device further comprises a third circulation connection assembly 600, and the third circulation connection assembly 600 includes: a third circulation connection pipe 610, a third suction pump 620 and a third check valve 630; the filter assembly 300 is connected to the nth cleaning assembly 100 through a third circulation connection pipe 610, and the third circulation connection pipe 610 is connected to a third suction pump 620 and a third check valve 630, respectively.

In this embodiment, referring to fig. 2, the third check valve 630 limits the pumping direction of the third pumping pump 620, so that the third pumping pump 620 can only pump the circulating water solution filtered by the filtering assembly 300 from a single direction, and the filtered circulating water solution flows into the nth cleaning assembly 100 from the filtering assembly 300 for spraying; under the action of the third circulation connection pipe 610, the third extraction pump 620 and the third one-way valve 630, the circulating water solution filtered by the filter assembly 300 smoothly flows into the nth cleaning assembly 100, and the nth cleaning assembly 100 is promoted to spray.

In addition, referring to fig. 1 to 7, another embodiment of the present invention further provides an electroplated circuit board cleaning apparatus, including: the cleaning device comprises a frame body 210, a first motor 220, a transmission shaft 230, a chain 240, a first chain wheel 250, a plurality of second chain wheels 260, a plurality of rollers 270, a base 310, a shell 321, a first filter layer 322, a second filter layer 323, a dosing tank 330, an exhaust pipe 341, a pressure gauge 342, an exhaust valve 343, a plurality of first spray pipes 110, a plurality of second spray pipes 120, a first cleaning tank 130, a second cleaning tank 140, a plurality of first spray assemblies 111, a plurality of second spray assemblies 121, a first one-way valve 410, a first extraction pump 420, a first circulation communicating pipe 430, a second circulation communicating pipe 510, a second extraction pump 520, a second one-way valve 530, a third circulation communicating pipe 610, a third extraction pump 620 and a third one-way valve 630. A communication hole 141 is provided at the lower end of the second washing tank 140; the side wall of the dosing groove 330 is connected with a liquid level meter 331; a second motor 350 and a pump 360 are arranged inside the base 310; the pump 360 is provided with an inlet and an outlet; the first filtering layer 322 divides the inside of the filter cartridge 320 into a liquid inlet area 3221 and a filtering area 3222, and the second filtering layer 323 divides the filtering area 3222 into a first filtering area 3231 and a second filtering area 3232.

The frame body 210 is connected to the first motor 220, the first cleaning tank 130 and the second cleaning tank 140, respectively, the frame body 210 is slidably connected to the drum 270, the outer surface of the second chain wheel 260 is engaged with the chain 240, and the inner surface of the second chain wheel 260 is fixedly connected to the drum 270; one end of the transmission shaft 230 is connected with the first motor 220, the other end of the transmission shaft 230 is fixedly connected with the inner surface of the first chain wheel 250, and the outer surface of the first chain wheel 250 is engaged with the chain 240; the pressure gauge 342 is connected with the filter cylinder 320, the exhaust valve 343 is connected with the exhaust pipe 341, and the exhaust pipe 341 is respectively connected with the housing 321 and the dosing tank 330; the first cleaning tank 130 is connected to the first shower pipe 110 and the first circulation connection pipe 430, respectively, and the second cleaning tank 140 is connected to the second shower pipe 120 and the first circulation connection pipe 430, respectively; the adjacent first washing tank 130 and the second washing tank 140 are connected by the first circulation connection pipe 430, and the first circulation connection pipe 430 is connected to the first suction pump 420 and the first check valve 410, respectively; the chemical feeding tank 330 is connected to the first second cleaning tank 140 through the second circulation connection pipe 510, and the second circulation connection pipe 510 is connected to the second suction pump 520 and the second check valve 530, respectively; the second filtering region 3232 is connected to the nth first cleaning tank 130 through the third circulation connection pipe 610, and the third circulation connection pipe 610 is connected to the third suction pump 620 and the third check valve 630, respectively; the outlet of the pump 360 is connected to the liquid inlet region 3221; the shell 321 is hermetically connected with the first filter layer 322 and the second filter layer 323; the pump 360 is connected with the second motor 350, and the inlet of the pump 360 is connected with the dosing slot 330; the base 310 is connected to the housing 321 and the dosing slot 330. Wherein N is a positive integer greater than 1, N is a positive integer not less than 1, and N is greater than N.

In this embodiment, the drum 270 transfers the electroplated circuit board to the N first cleaning tanks 130 and the second cleaning tank 140 arranged in sequence, and the N first cleaning tanks 130 and the second cleaning tank 140 clean the electroplated circuit board in sequence, so that the residual amount of the plating solution on the surface of the electroplated circuit board is gradually reduced; the adjacent nth first cleaning tank 130, the nth second cleaning tank 140 and the (n + 1) th first cleaning tank 130 are connected through a first circulation communicating pipe 430, under the action of the first one-way valve 410 and the first extraction pump 420, the circulating water solution inside the (n + 1) th first cleaning tank 130 is extracted into the nth first cleaning tank 130 and the nth second cleaning tank 140, and the upper surface and the lower surface of the electroplated circuit board are sprayed, namely, the circulating water solution inside the (n + 1) th first cleaning tank 130 is the spraying water solution inside the nth first cleaning tank 130 and the nth second cleaning tank 140, so that the circulating water solution can be recycled, and water resources are saved. The first and second filtering layers 322 and 323 filter the circulating aqueous solution inside the first and second washing tanks 140; and add the medicine groove 330 and be connected with first second washing case 140, the entry of pump 360 with add the medicine groove 330 and connect, the export of pump 360 with the regional 3221 of feed liquor is connected, and second filter area 3232 is connected with the first washing case 130 of Nth for in first washing subassembly 100 inside circulating water solution filters the back and is carried the washing subassembly 100 of Nth, spray electroplating circuit board, practiced thrift the water resource, reduced manufacturing cost, reduce the emission of sewage.

While the preferred embodiments of the present invention have been described, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are intended to be included within the scope of the present invention defined by the appended claims.

Claims (10)

1. An electroplated circuit board cleaning device, comprising: the electroplating device comprises N cleaning assemblies arranged in sequence, a conveying assembly used for conveying an electroplated circuit board to the N cleaning assemblies arranged in sequence, and a filtering assembly used for filtering a circulating water solution in the first cleaning assembly; the adjacent nth cleaning assembly and the (n + 1) th cleaning assembly are connected through a first circulation communication assembly, and the first circulation communication assembly comprises: the cleaning device comprises a first check valve, a first extraction pump and a first circulating communicating pipe for communicating a circulating water solution in the (n + 1) th cleaning assembly with a spray water solution in the nth cleaning assembly, wherein the first circulating communicating pipe is respectively connected with the first extraction pump and the first check valve; the conveying assembly is connected with the cleaning assembly; the filter assembly is respectively connected with the first cleaning assembly and the Nth cleaning assembly; wherein N is a positive integer greater than 1, N is a positive integer not less than 1, and N is greater than N.

2. The cleaning device for the electroplated circuit board as claimed in claim 1, characterized in that: the transfer assembly includes: the device comprises a frame body, a first motor, a transmission shaft, a chain, a first chain wheel, a plurality of second chain wheels and a plurality of rollers; the frame body is respectively connected with the first motor and the cleaning assembly, the frame body is connected with the roller in a sliding mode, the outer surface of the second chain wheel is connected with the chain in a meshed mode, and the inner surface of the second chain wheel is fixedly connected with the roller; one end of the transmission shaft is connected with the first motor, the other end of the transmission shaft is fixedly connected with the inner surface of the first chain wheel, and the outer surface of the first chain wheel is meshed with the chain.

3. The cleaning device for the electroplated circuit board as claimed in claim 1, characterized in that: the filter assembly includes: the device comprises a base, a filter cartridge, a dosing groove and an exhaust assembly for exhausting the filter cartridge; a second motor and a pump are arranged in the base; the filter cartridge is connected with the dosing groove through the exhaust assembly; the pump is provided with an inlet and an outlet, the pump is connected with the second motor, the inlet of the pump is connected with the dosing groove, and the outlet of the pump is connected with the filter cartridge; the base is respectively connected with the filter cartridge and the dosing groove.

4. The cleaning device for the electroplated circuit board as claimed in claim 3, characterized in that: the filter cartridge includes: the device comprises a shell, a first filtering layer for filtering impurities and a second filtering layer for adsorbing the impurities; the shell is respectively connected with the first filter layer and the second filter layer in a sealing way; the first filtering layer divides the interior of the filter cylinder into a liquid inlet area and a filtering area, and the second filtering layer divides the filtering area into a first filtering area and a second filtering area; the export of pumping with the feed liquor is regional to be connected, the second filter area is with nth wash the subassembly and be connected.

5. The cleaning device for the electroplated circuit board as claimed in claim 3, characterized in that: the exhaust assembly includes: an exhaust pipe, a pressure gauge and an exhaust valve; the pressure gauge is connected with the filter cartridge, the exhaust valve is connected with the exhaust pipe, and the exhaust pipe is respectively connected with the filter cartridge and the dosing groove.

6. The cleaning device for the electroplated circuit board as claimed in claim 3, characterized in that: and the side wall of the dosing groove is connected with a liquid level meter.

7. The cleaning device for the electroplated circuit board as claimed in claim 1, characterized in that: the cleaning assembly comprises: the device comprises a plurality of first spray pipes, a plurality of second spray pipes, a first cleaning box for fixing the first spray pipes and preventing spray water solution from splashing, and a second cleaning box for fixing the second spray pipes and storing circulating water solution; the first spraying pipe is provided with a plurality of first spraying components for spraying the upper surface of the electroplated circuit board; the second spraying pipe is provided with a plurality of second spraying components for spraying the lower surface of the electroplated circuit board; the first cleaning box is respectively connected with the conveying assembly, the first spraying pipe and the first circulating communicating pipe, and the second cleaning box is respectively connected with the conveying assembly, the second spraying pipe and the first circulating communicating pipe.

8. The cleaning device for the electroplated circuit board as claimed in claim 7, characterized in that: the lower end of the second cleaning box is provided with a communication hole.

9. The cleaning device for the electroplated circuit board as claimed in claim 1, characterized in that: still include the second circulation intercommunication subassembly, the second circulation intercommunication subassembly includes: the second circulating communicating pipe, the second extraction pump and the second one-way valve; the filtering component is connected with the first cleaning component through the second circulating communicating pipe, and the second circulating communicating pipe is respectively connected with the second extraction pump and the second one-way valve.

10. The cleaning device for the electroplated circuit board as claimed in claim 1, characterized in that: still include the third circulation intercommunication subassembly, the third circulation intercommunication subassembly includes: a third circulating communicating pipe, a third extraction pump and a third one-way valve; the filter assembly is connected with the Nth cleaning assembly through the third circulating communicating pipe, and the third circulating communicating pipe is respectively connected with the third extraction pump and the third one-way valve.

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