CN210491315U - Novel PCB rigid-flex board - Google Patents

Novel PCB rigid-flex board Download PDF

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Publication number
CN210491315U
CN210491315U CN201920564773.0U CN201920564773U CN210491315U CN 210491315 U CN210491315 U CN 210491315U CN 201920564773 U CN201920564773 U CN 201920564773U CN 210491315 U CN210491315 U CN 210491315U
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CN
China
Prior art keywords
circuit board
rigid
flexible
flexible circuit
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201920564773.0U
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Chinese (zh)
Inventor
张世利
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Xinfeng Jinxin Noanteno High Tech Co Ltd
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Xinfeng Jinxin Noanteno High Tech Co Ltd
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Priority to CN201920564773.0U priority Critical patent/CN210491315U/en
Application granted granted Critical
Publication of CN210491315U publication Critical patent/CN210491315U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The utility model discloses a novel PCB soft and hard combined board, which comprises a flexible circuit board, wherein rigid circuit boards are respectively arranged at two ends of the flexible circuit board, each rigid circuit board comprises a plurality of rigid base plates, and the end part of the flexible circuit board is clamped between any two adjacent rigid base plates; the utility model discloses set up to the chamfer in the inboard of rigid circuit board and flexible circuit board department of meeting, avoid the department of meeting of first flexible basic unit and the edge angle direct contact of rigid circuit board, eliminated the stress point, prevent that first flexible basic unit from splitting at the stress point because of buckling, the inside stiffening sheet that buckles that sets up of flexible circuit board that rigid circuit board and flexible circuit board are connected for strengthen the intensity and the pliability of changeover portion, and buckle through metallization hole electric connection between stiffening sheet and the flexible circuit board, make the utility model discloses a circuit board even can guarantee its good electric conductive property under the bending state.

Description

Novel PCB rigid-flex board
Technical Field
The utility model relates to a PCB combines board technical field, concretely relates to novel PCB soft or hard to combine board.
Background
The rigid-flex board is also called a rigid-flex board, and the rigid-flex board can be arranged in a three-dimensional manner, so that the reliability of a product is improved, and high-density connection between boards is realized, and the market demand of the rigid-flex board is rapidly increased, continuously developed and expanded in recent years. The rigid-flex board generally includes a rigid region and a flexible region, and the rigid region is generally formed by two rigid circuit boards and a flexible layer sandwiched between the two rigid circuit boards. The flexible region is formed by extending the flexible layer outwards. The flexible layer at the joint of the rigid area and the flexible area bears larger stress because of being extruded by the two rigid circuit boards, and when the flexible layer is bent greatly, the soft copper conductive circuit inside the flexible area is easily damaged, so that the communication of the bent area is poor, and the communication quality of the rigid-flexible combined board is influenced.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to solve the technical problem of providing a novel PCB soft and hard combination board.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides a novel PCB rigid-flex board, including flexible circuit board, flexible circuit board both ends are equipped with rigid circuit board respectively, each rigid circuit board includes multilayer rigid base plate, flexible circuit board's tip centre gripping is in arbitrary adjacent two rigid base plates between, flexible circuit board includes the first flexible base plate that is located top and bottom, and the multilayer second flexible base plate of centre gripping between two first flexible base plates; the inner sides of the joints of the rigid circuit board and the flexible circuit board are provided with chamfers; one surface, close to the rigid substrate, of each first flexible substrate is further provided with two bending reinforcing pieces, the two bending reinforcing pieces are respectively arranged at two ends of the flexible circuit board, each bending reinforcing piece comprises two parallel first reinforcing strips and two parallel second reinforcing strips perpendicular to the first reinforcing strips, the two first reinforcing strips and the two second reinforcing strips are connected with each other to form a rectangular structure, one half of each bending reinforcing piece is located in the rigid circuit board, and the other half of each bending reinforcing piece is located outside the rigid circuit board; the length direction of the first reinforcing strips is perpendicular to the length direction of the flexible circuit board, and at least two metalized holes penetrating through the flexible circuit board are formed in the positions of the first reinforcing strips.
The utility model discloses in the preferred technical scheme, there are two high density flexible circuit boards, two along length direction concatenation in the flexible circuit board high density flexible circuit board centre gripping is in two between the first flexible substrate.
The utility model discloses in the preferred technical scheme, two high density flexible circuit board is located respectively both ends set up in the flexible circuit board, a part of high density flexible circuit board is located in the rigid circuit board, another part of high density flexible circuit board is located outside the rigid circuit board.
The utility model discloses in the preferred technical scheme, be equipped with the carbon powder layer on the pore wall in metallization hole, the copper layer of plating on the carbon powder layer.
In the preferred technical solution of the present invention, each of the rigid circuit boards has at least one metallized hole formed thereon, and the metallized hole penetrates through the flexible circuit board.
The utility model has the advantages that:
the utility model provides a novel PCB rigid-flex board, including flexible circuit board and the rigid circuit board that connects in flexible circuit board both ends, because flexible circuit board texture is soft, when the rigid-flex board is buckled, the flexible circuit board copper of rigid circuit board and flexible circuit board hookup location appears the consume, leads to the communication bad; the utility model discloses set up to the chamfer in the inboard of rigid circuit board and flexible circuit board department of meeting, avoid the department of meeting of first flexible basic unit and the edge angle direct contact of rigid circuit board, eliminated the stress point, prevent that first flexible basic unit from splitting at the stress point because of buckling, the inside stiffening sheet that buckles that sets up of flexible circuit board that rigid circuit board and flexible circuit board are connected for strengthen the intensity and the pliability of changeover portion, and buckle through metallization hole electric connection between stiffening sheet and the flexible circuit board, make the utility model discloses a circuit board even can guarantee its good electric conductive property under the bending state.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of the bending reinforcing sheet of the present invention.
In the figure: 1. a flexible circuit board; 11. a first flexible substrate; 12. a second flexible substrate; 13. chamfering; 2. a rigid circuit board; 21. a rigid substrate; 3. bending the reinforcing sheet; 31. a first reinforcing strip; 32. a second reinforcing strip; 33. metallizing the hole; 4. high density flexible circuit board.
Detailed Description
The technical solution in the embodiments of the present invention will be described in detail and removed from the accompanying drawings in the embodiments of the present invention, wherein the drawings are only for illustrative purposes, and only schematic drawings are shown, not physical drawings, and the patent is not to be construed as limited thereto; for a better understanding of the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
The embodiments described herein are only some embodiments, not all embodiments, of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Detailed description of the examples:
as shown in fig. 1 to fig. 2, in an embodiment, a novel PCB rigid-flex board is provided, which includes a flexible circuit board 1, rigid circuit boards 2 are respectively disposed at two ends of the flexible circuit board 1, each rigid circuit board 2 includes a plurality of layers of rigid substrates 21, an end of the flexible circuit board 1 is clamped between any two adjacent rigid substrates 21, the flexible circuit board 1 includes first flexible substrates 11 located at the top and the bottom, and a plurality of layers of second flexible substrates 12 clamped between the two first flexible substrates 11; the inner sides of the joint of the rigid circuit board 2 and the flexible circuit board 1 are provided with chamfers 13; one surface of each first flexible substrate 11, which is close to the rigid substrate 21, is further provided with two bent reinforcing pieces 3, the two bent reinforcing pieces 3 are respectively located at two ends of the flexible circuit board 1, each bent reinforcing piece 3 comprises two parallel first reinforcing strips 31 and two parallel second reinforcing strips 32 perpendicular to the first reinforcing strips 31, the two first reinforcing strips 31 and the two second reinforcing strips 32 are connected with each other to form a rectangular structure, and one half of each bent reinforcing piece 3 is located in the rigid circuit board 2, and the other half of each bent reinforcing piece 3 is located outside the rigid circuit board 2; the length direction of the first reinforcing strip 31 is perpendicular to the length direction of the flexible circuit board 1, and at least two metalized holes 33 penetrating through the flexible circuit board 1 are formed in the positions of the first reinforcing strips 31.
The utility model provides a novel PCB rigid-flex board, including flexible circuit board 1 and the rigid circuit board 2 of connecting in flexible circuit board 1 both ends, because flexible circuit board 1 texture is soft, when the rigid-flex board is buckled, the flexible circuit board 1 copper of rigid circuit board 2 and flexible circuit board 1 hookup location appears the consume, leads to the communication badly; the utility model discloses set up to chamfer 13 in the inboard of rigid circuit board 2 and flexible circuit board 1 department of meeting, avoid the department of meeting of first flexible base plate 11 and rigid circuit board 2 edge angle direct contact, eliminated the stress point, prevent that first flexible base plate 11 from breaking at the stress point because of buckling, rigid circuit board 2 sets up the reinforcement piece 3 of buckling with flexible circuit board 1 inside of the flexible circuit board that flexible circuit board 1 is connected for strengthen the intensity and the pliability of changeover portion, and buckle through metallization hole electricity 33 hookup between reinforcement piece 3 and the flexible circuit board 1, make the utility model discloses a circuit board even can guarantee its good electric conductive property under the bending state.
In this embodiment, two high-density flexible circuit boards 4 are spliced in the flexible circuit board 1 along the length direction, and the two high-density flexible circuit boards 4 are clamped between the two first flexible substrates 11; the two high-density flexible circuit boards 1 are respectively arranged at two ends in the flexible circuit board 1, one part of the high-density flexible circuit board 1 is positioned in the rigid circuit board 2, and the other part of the high-density flexible circuit board 1 is positioned outside the rigid circuit board 2; the utility model discloses set up high density flexible circuit board inside flexible circuit board, high density flexible circuit board mainly adopts interconnect and flexible circuit board inside to splice and realize electric connection, it is to be noted that, high density flexible circuit board is under fixed thickness, the number of piles sum of its flexible base plate is greater than flexible circuit board, that is to say, the circuit layer intensive degree of high density flexible circuit board is greater than flexible circuit board's circuit layer intensive degree, thereby make high density flexible circuit board's electric conductive property more superior than flexible circuit board's electric conductive property, the controllability of electric conductivity has been improved, can constitute the circuit that has good impedance, promote the promotion of yield; through the high-density flexible circuit board with more reliable conductive performance at the joint, when the rigid-flex printed circuit board is bent, the degree of loss generated at the joint of the rigid-flex printed circuit board is reduced to the maximum extent when the rigid-flex printed circuit board is bent.
In this embodiment, a carbon powder layer is disposed on the wall of the metallized hole 33, and a copper layer is electroplated on the carbon powder layer; will the utility model discloses a circuit board soaks in copper sulfate solution, puts the negative electrode simultaneously and switches on, and the circular telegram back because all is the electron around the negative electrode, consequently combines with the copper positive ion in the copper sulfate, becomes the metal copper layer and attaches to on the pore wall of through-hole, further strengthen high density flexible circuit board's electric conductive property when carbon powder layer and copper layer can protect the metal through-hole.
In this embodiment, at least one metallized hole 33 is formed on each rigid circuit board 2, and the metallized hole 33 penetrates through the flexible circuit board 1.
While the present invention has been described with reference to preferred embodiments, those skilled in the art will appreciate that various changes, modifications, substitutions and alterations can be made to the features and embodiments without departing from the principles and spirit of the invention, and still fall within the scope of the invention. The present invention is not to be limited by the specific embodiments disclosed herein, and other embodiments that fall within the scope of the claims of the present application are intended to be within the scope of the present invention.

Claims (5)

1. Novel PCB soft or hard combines board, its characterized in that: the flexible printed circuit board comprises a flexible printed circuit board (1), wherein rigid printed circuit boards (2) are respectively arranged at two ends of the flexible printed circuit board (1), each rigid printed circuit board (2) comprises a plurality of layers of rigid substrates (21), the end part of the flexible printed circuit board (1) is clamped between any two adjacent rigid substrates (21), and the flexible printed circuit board (1) comprises first flexible substrates (11) positioned at the top and the bottom and a plurality of layers of second flexible substrates (12) clamped between the two first flexible substrates (11);
the inner sides of the joints of the rigid circuit board (2) and the flexible circuit board (1) are provided with chamfers (13);
one surface, close to the rigid substrate (21), of each first flexible substrate (11) is further provided with two bent reinforcing pieces (3), the two bent reinforcing pieces (3) are respectively arranged at two ends of the flexible circuit board (1), each bent reinforcing piece (3) comprises two parallel first reinforcing strips (31) and two parallel second reinforcing strips (32) perpendicular to the first reinforcing strips (31), the two first reinforcing strips (31) and the two second reinforcing strips (32) are mutually connected to form a rectangular structure, one half of each bent reinforcing piece (3) is positioned in the rigid circuit board (2), and the other half of each bent reinforcing piece is positioned outside the rigid circuit board (2); the length direction of the first reinforcing strips (31) is perpendicular to the length direction of the flexible circuit board (1), and at least two metalized holes (33) penetrating through the flexible circuit board (1) are formed in the positions of the first reinforcing strips (31).
2. The novel PCB rigid-flex board of claim 1, wherein: two high-density flexible circuit boards (4) are spliced in the flexible circuit board (1) along the length direction, and the two high-density flexible circuit boards (4) are clamped between the two first flexible substrates (11).
3. The novel PCB rigid-flex board of claim 2, wherein: the two high-density flexible circuit boards (4) are respectively arranged at two ends in the flexible circuit board (1), one part of the high-density flexible circuit board (4) is positioned in the rigid circuit board (2), and the other part of the high-density flexible circuit board (4) is positioned outside the rigid circuit board (2).
4. The novel PCB rigid-flex board of claim 1, wherein: and a carbon powder layer is arranged on the wall of the metallized hole (33), and a copper plating layer is plated on the carbon powder layer.
5. The novel PCB rigid-flex board of claim 1, wherein: at least one metallized hole (33) is formed in each rigid circuit board (2), and the metallized hole (33) penetrates through the flexible circuit board (1).
CN201920564773.0U 2019-04-23 2019-04-23 Novel PCB rigid-flex board Expired - Fee Related CN210491315U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920564773.0U CN210491315U (en) 2019-04-23 2019-04-23 Novel PCB rigid-flex board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920564773.0U CN210491315U (en) 2019-04-23 2019-04-23 Novel PCB rigid-flex board

Publications (1)

Publication Number Publication Date
CN210491315U true CN210491315U (en) 2020-05-08

Family

ID=70507990

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920564773.0U Expired - Fee Related CN210491315U (en) 2019-04-23 2019-04-23 Novel PCB rigid-flex board

Country Status (1)

Country Link
CN (1) CN210491315U (en)

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Granted publication date: 20200508