CN210491017U - Stamp hole welding disc surface mounting type image visual processing module - Google Patents
Stamp hole welding disc surface mounting type image visual processing module Download PDFInfo
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- CN210491017U CN210491017U CN201921846480.8U CN201921846480U CN210491017U CN 210491017 U CN210491017 U CN 210491017U CN 201921846480 U CN201921846480 U CN 201921846480U CN 210491017 U CN210491017 U CN 210491017U
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Abstract
The utility model provides a stamp hole welding dish surface pastes dress type image vision processing module. Stamp hole welding dish surface subsides dress type image vision processing module includes: a PCB substrate; an ISP image processing chip mounted on the PCB substrate; a resistance-capacitance sensing part mounted on the PCB substrate; the power supply chip is arranged on the PCB substrate; a clock crystal mounted on the PCB substrate; a firmware memory mounted on the PCB substrate. The utility model provides a stamp hole welding dish surface subsides dress type image vision processing module has with low costs, the hardware integrated level is high, compatible high, the software integrated level is high, and the module is more intelligent, can reduce the advantage that the customer used the threshold.
Description
Technical Field
The utility model relates to an image processing technology field especially relates to a stamp hole welding dish surface subsides dress type image vision processing module.
Background
Along with the development of the current artificial intelligence AI, AIOT and 5G technologies, the application scene of image vision is more and more popularized, the industry market puts forward high integration requirements on the dimensionality of hardware and software of image processing, an integration module is convenient for terminal customers to rapidly develop, the integration module is convenient for embedding and a product terminal, the consistency and the stability of the image quality are convenient to improve, the development of image multiple requirements is convenient, and the protection of intellectual property rights is convenient.
From the aspect of product hardware design dimension, based on the common phenomenon of the current industry, the hardware design of a terminal product usually designs an image processing unit hardware circuit and complex hardware circuits of other units on a common large PCB substrate, the designed packaging form brings about a series of problems that the compatibility of an ISP hardware unit for image processing and other unit hardware is poor, the hardware circuit design is complex, the post-maintenance is not easy, the product visual demand is changed, and the whole version change is needed, and the like. For example: in the initial stage of product design, the AISP image processing chip is evaluated to meet the visual requirements of products, and the selection of an ISP chip can be changed due to high cost or effect deviation and other factors in the later development process, so that the problem of the hardware single board version change of the whole product is solved. Therefore, the hardware design problem that the ISP unit and other units share the PCB substrate design and are inconvenient for the later revision needs to be solved.
From the demand dimension of products, the demands of medical treatment, education, agriculture, scientific research and security protection to image vision are gradually increased in various industries, and the demands are more diversified. For example, different customers have demands for development of different Image Sensor sensors, there are AR0237, AR0230, and so on. The customer group may desirably select a desired Image Sensor by an external arrangement resistor. For another example, some customer groups have limited capability for image vision development, and even have no technical accumulation in the field, but urgently need a vision processing module capable of realizing front-end visual image capture, image processing, image coding and image output. The customer base may desire to select a video stream with desired characteristics through an external configuration resistor. The modules in the market of the industry at present are basically in customized demands, the problems cannot be well solved, and the market has great limitation.
Therefore, it is necessary to provide a visual image processing module for stamp hole pad surface mounting to solve the above-mentioned problems.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem provide a stamp hole welding dish surface subsides dress type image vision processing module with low costs, hardware integrated level is high, compatible high, software integrated level is high, and the module is more intelligent, can reduce the customer and use the threshold.
In order to solve the technical problem, the utility model provides a stamp hole welding dish surface mounting type image vision processing module, include:
a PCB substrate;
an ISP image processing chip mounted on the PCB substrate;
a resistance-capacitance sensing part mounted on the PCB substrate;
the power supply chip is arranged on the PCB substrate;
a clock crystal mounted on the PCB substrate;
a firmware memory mounted on the PCB substrate.
Preferably, the stamp hole pad surface-mounted image vision processing module further comprises a lens component, and the lens component is arranged on the PCB substrate.
Preferably, the stamp hole pad surface-mounted image vision processing module further comprises a camera connector, and the camera connector is arranged on the PCB substrate.
Preferably, the ISP Image processing chip includes a Camera SoC, Video, Image Controllers chip with Image signal and media service.
Preferably, a shielding case is fixedly mounted on the top of the PCB substrate.
Preferably, a plurality of half-hole pins are arranged on four sides of the PCB substrate; the PCB design adopts a substrate side half-hole welding disc, and a copper welding disc is exposed at the bottom of the substrate.
Preferably, the capacitance-resistance sensing component, the power chip, the clock crystal and the firmware memory are all electrically connected with the ISP image processing chip.
Preferably, a lens component is mounted on the top of the PCB substrate.
Preferably, the stamp hole welding disc surface mounting type image vision processing module is used for completing image acquisition, image optimization, image coding and image output;
stamp hole welding dish surface subsides dress type image vision processing module be used for receiving the image data of image Sensor input, its interface includes: MIPI, LVDS, Hispi, DVP interface;
the encoding format includes: h264 coding format, H265 coding format, MJPEG coding format and JPEG picture format;
the output interface includes: MIPI, ethernet interface, USB interface.
Compared with the prior art, the utility model provides a stamp hole welding dish surface subsides dress type image vision processing module has following beneficial effect:
① the method for surface mounting of stamp hole pad without board-to-board connector and fixed copper post can realize stable connection between ISP image visual module and functional bottom board, reduce high-speed signal transmission loss, improve signal quality and stability, and the bottom board of module substrate has hot pad through hole and copper foil with window to conduct heat to the bottom board quickly and fully, thereby realizing heat optimization without heat sink design and reducing heat design cost
② the integration level of hardware is high, the peripheral minimum system and the power system of the ISP image signal vision processing chip are designed on a substrate as small as possible, compared with the high integration level of hardware design, the occupation ratio of a bottom board PCB can be reduced, the embedding into a client terminal is convenient, and the diversification of product application is realized;
③ standardized design, high compatibility, good portability, defining the module for image signal visual processing as a universal device, the terminal design engineer only needs to select the module meeting the requirement according to the performance specification of the module, embedding the module similar to a chip into a project single board, and no longer needs complicated separate device design or consideration of complex interface, realizing the first universal module design as 17mmX17mm, and designing the electrical interface required by the terminal customer in the image signal visual processing industry, and designing the interface in standardized, later stage new module using the same interface design, realizing the module pin compatibility, improving the module compatibility.
④ software integration level is high, the module is more intelligent, it adopts modular design, it combines in many Image Sensor drive configurations, at the same time, it combines in ISP optimization parameter matching with lens, combines in Image algorithm such as automatic gain, etc. firmware supports conventional Image output format such as 1080P, 720P,30/60FPS, etc. and supports output of H.264, H.265, MJPEG, JPEG coding format, and USB and Ethernet.
Drawings
FIG. 1 is a top cross-sectional view of a first embodiment of a stamp hole pad surface mount image vision processing module according to the present invention;
FIG. 2 is a top view of a first embodiment of a stamp hole pad surface mount image vision processing module according to the present invention;
FIG. 3 is a schematic block diagram of a first embodiment of a stamp hole pad surface mount image vision processing module according to the present invention;
FIG. 4 is a flowchart of the intelligent configuration software of the first embodiment of the stamp hole pad surface mount image vision processing module according to the present invention;
FIG. 5 is a top cross-sectional view of a second embodiment of a stamp hole pad surface mount image vision processing module according to the present invention;
FIG. 6 is a top view of a second embodiment of a stamp hole pad surface mount image vision processing module according to the present invention;
FIG. 7 is a bottom view of a PCB substrate in a third embodiment of a stamp hole pad surface mount type image vision processing module according to the present invention;
FIG. 8 is a bottom view of a PCB substrate in a fourth embodiment of a stamp hole pad surface mount image vision processing module according to the present invention;
FIG. 9 is a top view of a fifth embodiment of a stamp hole pad surface mount image vision processing module according to the present invention;
FIG. 10 is a schematic block diagram of a fifth embodiment of a stamp hole pad surface mount image vision processing module according to the present invention;
FIG. 11 is a top cross-sectional view of a sixth embodiment of a stamp hole pad surface mount image vision processing module according to the present invention;
fig. 12 is a side view of a stamp hole pad surface mount image vision processing module according to a sixth embodiment of the present invention.
Reference numbers in the figures: 1. PCB base plate, 2, I SP image processing chip, 3, resistance-capacitance sensing part, 4, power chip, 5, clock crystal, 6, firmware memory, 7, shield cover, 8, half-hole pin, 9, camera connector, 10, dodge the hole, 11, base plate bottom exposed copper big pad, 12, base plate bottom exposed copper small pad, 13, lens part.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and embodiments.
First embodiment
Referring to fig. 1 to fig. 4, in a first embodiment of the present invention:
stamp hole welding dish surface subsides dress type image vision processing module includes:
a PCB substrate 1;
an ISP image processing chip 2, wherein the ISP image processing chip 2 is installed on the top of the PCB substrate 1;
the capacitance and resistance sensing component 3 is mounted on the top of the PCB substrate 1;
the power supply chip 4 is mounted on the top of the PCB substrate 1;
the clock crystal 5, the said clock crystal 5 is installed on the top of the said PCB base plate 1;
a firmware memory 6, the firmware memory 6 being mounted on top of the PCB substrate 1.
The I SP Image processing chip 2 comprises a chip with Image signals and media services, such as Camera SoC, Video and Image Controllers.
And a shielding cover 7 is fixedly arranged at the top of the PCB substrate 1.
A plurality of half-hole pins 8 are arranged on four sides of the PCB substrate 1; the PCB design adopts a substrate side half-hole welding disc.
The capacitance-resistance sensing component 3, the power chip 4, the clock crystal 5 and the firmware memory 6 are all electrically connected with the I SP image processing chip 2.
The size of the PCB substrate 1 is 17 × 17 mm.
The stamp hole welding disc surface mounting type image vision processing module is used for completing image acquisition, image optimization, image coding and image output;
stamp hole welding dish surface subsides dress type image vision processing module be used for receiving the image data of image Sensor input, its interface includes: MIPI, LVDS, Hispi, DVP interface;
the encoding format includes: h264 coding format, H265 coding format, MJPEG coding format and JPEG picture format;
the output interface includes: MIPI, ethernet interface, USB interface.
In this embodiment:
the first step is as follows: the ISP Image processing chip 2 includes chips with Image signals and media services such as Camera SoC, Video, Image Controllers, etc., the whole module has rich external interfaces, including MIPI, LVDS, hipspi, DVP, etc., and external lens component communication interfaces, also including USB, Ethernet, PCIE, etc., and backend component multimedia communication interfaces, and also includes I2C, UART, etc., and backend component control communication interfaces.
The second step is that: and by adopting a modular design, various ImageSensor drive configurations are combined, ISP (internet service provider) optimization parameters matched with the lens are combined, and image algorithms such as automatic gain and the like are combined. The firmware supports conventional image output formats such as 1080P, 720P,30/60FPS and the like, supports output of H.264, H.265, MJPEG and JPEG coding formats, and supports USB and Ethernet output. The configuration modes are all configured by selecting a configuration resistor and an ADC interface from the outside, a terminal client can complete required configuration according to a module design guide, the module is provided with an SDIO interface and can be connected with a TF card to realize local video storage, and the module can be configured with ImageSensor input interface types such as MIPI, LVDS and HISPI; configurable video stream formats, such as 1080P, 720P, frame rate 30FPS, 60 FPS; configurable coding formats, such as h.264, h.265, MJPEG, JPEG; the configurable image output interface, such as USB, Ethernet, etc., the above configuration modes can be configured by selecting the configuration resistor and ADC interface externally, or can be configured by the back end module through communication interface; the PCB substrate 1 is composed of conventional PCB substrate plates such as FR-4, a stamp hole half-hole pad surface mounting process is realized by arranging half-hole pins 8 on the periphery of the PVB substrate 1, the ISP image processing chip 2, the capacitance resistance sensing component 3, the power supply chip 4, the clock crystal 5 and the firmware memory 6 are covered by the shielding case 7, the EMC grade of the module is improved, and whether the shielding case 7 is needed or not can be selected according to the EMC grade.
Compared with the prior art, the utility model provides a stamp hole welding dish surface subsides dress type image vision processing module has following beneficial effect:
1) low cost, thermally optimized packaging, board-to-board soldering technology is in widespread use when a single module board is mounted on the surface of another PCB during PCB assembly. The stamp hole pad surface mounting mode does not need board-to-board connectors and fixed copper columns, the ISP image vision module can be stably connected with the functional bottom board at low cost, the high-speed signal transmission loss is reduced, the signal quality is improved, and the stability is improved; the module substrate base plate is provided with a thermal welding pad through hole and a windowing copper foil, so that the heat of the module can be quickly and fully conducted to the base plate, the thermal optimization of the design without radiating fins is realized, and the thermal design cost is reduced
2) The integration level of hardware is high, a peripheral minimum system and a power supply system of the ISP image signal visual processing chip are designed on a substrate which is as small as possible, and compared with the integration level of hardware design, the integration level of the hardware is high, the occupation ratio of a bottom plate PCB can be reduced, the insertion of a client terminal is facilitated, and the diversification of product application is realized;
3) the standardized design, the compatibility is high, the portability is good, define the module that the vision of the image signal is processed as a general device, the terminal design engineer only needs to according to the performance specification of the module, choose the module that meets the demand, imbed it in with project veneer like a chip, and no longer need loaded down with trivial details separation device design or consider complicated interface, realized that the first general module design is 17mmX17mm, and the design possesses the required electric interface of terminal customer in the vision of the image signal processing trade, and with the standardized design of interface, the later stage new module follows the same interface design, can realize that the module pin is compatible each other, improve the module compatibility. In the design process of the terminal client, the module can be replaced quickly to verify development, and the portability is good.
4) The software integration level is high, the module is more intelligent, various Image Sensor drive configurations are combined by adopting a modular design, ISP optimization parameters matched with the lens are combined, and Image algorithms such as automatic gain are combined. The firmware supports conventional image output formats such as 1080P, 720P,30/60FPS and the like, supports output of H.264, H.265, MJPEG and JPEG coding formats, and supports USB and Ethernet output. The above configuration modes can be configured by the external selection configuration resistor and the ADC interface, and can also be configured by the back-end component through the communication interface. The terminal customer can complete the required configuration according to the module design guide, thereby greatly meeting the customer requirements and reducing the customer use threshold.
Second embodiment:
referring to fig. 5-6, the present embodiment is different from the first embodiment in that a camera connector 9 is installed on the PCB substrate 1, the camera connector 9 is located in the shielding cover 7, an avoiding hole 11 is formed in the shielding cover 7, the avoiding hole 11 is adapted to the camera connector 9, and the camera connector 9 is used for connecting an external lens component.
The third embodiment:
referring to fig. 7, the only difference between this embodiment and the first embodiment is that the PCB design of the PCB substrate 1 adopts a large pad 11 with copper exposed on the bottom of the substrate.
The fourth embodiment:
referring to fig. 8, the only difference between the present embodiment and the first embodiment is that the PCB design of the PCB substrate 1 adopts the substrate bottom exposed copper small pad 12.
Fifth embodiment:
referring to fig. 9-10, the present embodiment is different from the first embodiment in that a lens component 13 is mounted on the PCB substrate 1, the lens component 13 is located in the shield cover 7, an avoiding hole 11 is formed in the shield cover 7, the avoiding hole 11 is adapted to the lens component 13, and the originally external lens component 13 is directly incorporated into the module, so that the module has an image collecting function, and meets some customer customization requirements.
Sixth embodiment:
referring to fig. 11 to 12, the difference between the present embodiment and the first embodiment is that the capacitance-resistance sensing component 3 and the power chip 4 are both located at the bottom of the PCB substrate 1, and are packaged in an up-down manner.
The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a stamp hole welding dish surface subsides dress type image vision processing module which characterized in that includes:
a PCB substrate;
an ISP image processing chip mounted on the PCB substrate;
a resistance-capacitance sensing part mounted on the PCB substrate;
the power supply chip is arranged on the PCB substrate;
a clock crystal mounted on the PCB substrate;
a firmware memory mounted on the PCB substrate.
2. The stamp hole pad surface mount image vision processing module of claim 1, further comprising a lens component disposed on the PCB substrate.
3. The visual processing module of a stamp hole pad surface mount image of claim 1, further comprising a camera connector disposed on the PCB substrate.
4. The stamp hole pad surface mount Image vision processing module of claim 1, wherein the ISP Image processing chip comprises a Camera SoC, Video, Image Controllers chip with Image signal and media services.
5. The stamp hole pad surface mount image vision processing module of claim 1, wherein a shielding cage is fixedly mounted on a top of the PCB substrate.
6. The stamp hole pad surface mount image vision processing module of claim 1, wherein a plurality of half-hole pins are disposed on a side of the PCB substrate; the PCB adopts a substrate side half-hole pad process.
7. The stamp hole pad surface mount image vision processing module of claim 1, wherein the bottom of the PCB substrate is provided with exposed metal pads, and the PCB employs a substrate bottom exposed copper pad technology.
8. The stamp hole pad surface mount image vision processing module of claim 1, in which the capacitive sensing component, power chip, clock crystal and firmware memory are electrically connected to the ISP image processing chip.
9. The stamp hole pad surface mount image vision processing module of claim 1, in which a lens component is mounted on top of the PCB substrate.
10. The visual processing module for stamp hole pad surface mount images of claim 1, wherein the visual processing module for stamp hole pad surface mount images is configured to perform image acquisition, image optimization, image coding, and image output;
stamp hole welding dish surface subsides dress type image vision processing module be used for receiving the image data of image Sensor input, its interface includes: MIPI, LVDS, Hispi, DVP interface;
the encoding format includes: h264 coding format, H265 coding format, MJPEG coding format and JPEG picture format;
the output interface includes: MIPI, ethernet interface, USB interface.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921846480.8U CN210491017U (en) | 2019-10-30 | 2019-10-30 | Stamp hole welding disc surface mounting type image visual processing module |
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| CN201921846480.8U CN210491017U (en) | 2019-10-30 | 2019-10-30 | Stamp hole welding disc surface mounting type image visual processing module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110661959A (en) * | 2019-10-30 | 2020-01-07 | 深圳市猫头鹰微视科技有限公司 | Stamp hole welding disc surface mounting type image visual processing module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110661959A (en) * | 2019-10-30 | 2020-01-07 | 深圳市猫头鹰微视科技有限公司 | Stamp hole welding disc surface mounting type image visual processing module |
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Effective date of registration: 20220729 Address after: 518000 room 2101-2103, Jinjia science and technology building, No. 19, Keji Zhonger Road, Maling community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen HENGLING Technology Co.,Ltd. Address before: 518000 308, unit 3, Huali building, 54 Baoshi South Road, Luoshe community, Shiyan street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Shenzhen owl micro vision technology Co.,Ltd. |
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