CN110661959A - Stamp hole welding disc surface mounting type image visual processing module - Google Patents
Stamp hole welding disc surface mounting type image visual processing module Download PDFInfo
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- CN110661959A CN110661959A CN201911045975.5A CN201911045975A CN110661959A CN 110661959 A CN110661959 A CN 110661959A CN 201911045975 A CN201911045975 A CN 201911045975A CN 110661959 A CN110661959 A CN 110661959A
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- 238000012545 processing Methods 0.000 title claims abstract description 67
- 238000003466 welding Methods 0.000 title claims abstract description 20
- 230000000007 visual effect Effects 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 239000013078 crystal Substances 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000005457 optimization Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 230000010354 integration Effects 0.000 abstract description 15
- 238000013461 design Methods 0.000 description 37
- 238000011161 development Methods 0.000 description 7
- 238000004891 communication Methods 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000012938 design process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/80—Camera processing pipelines; Components thereof
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- Electromagnetism (AREA)
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Studio Devices (AREA)
Abstract
The invention provides a visual image processing module for a stamp hole welding disc surface mounting type. Stamp hole welding dish surface subsides dress type image vision processing module includes: a PCB substrate; an ISP image processing chip mounted on the PCB substrate; a resistance-capacitance sensing part mounted on the PCB substrate; the power supply chip is arranged on the PCB substrate; a clock crystal mounted on the PCB substrate; a firmware memory mounted on the PCB substrate. The stamp hole pad surface mounting type image vision processing module provided by the invention has the advantages of low cost, high hardware integration level, high compatibility, high software integration level, more intelligentization of the module and capability of reducing the use threshold of a customer.
Description
Technical Field
The invention relates to the technical field of image processing, in particular to a stamp hole welding disc surface mounting type image visual processing module.
Background
Along with the development of the current artificial intelligence AI, AIOT and 5G technologies, the application scene of image vision is more and more popularized, the industry market puts forward high integration requirements on the dimensionality of hardware and software of image processing, an integration module is convenient for terminal customers to rapidly develop, the integration module is convenient for embedding and a product terminal, the consistency and the stability of the image quality are convenient to improve, the development of image multiple requirements is convenient, and the protection of intellectual property rights is convenient.
From the aspect of product hardware design dimension, based on the common phenomenon of the current industry, the hardware design of a terminal product usually designs an image processing unit hardware circuit and complex hardware circuits of other units on a common large PCB substrate, the designed packaging form brings about a series of problems that the compatibility of an ISP hardware unit for image processing and other unit hardware is poor, the hardware circuit design is complex, the post-maintenance is not easy, the product visual demand is changed, and the whole version change is needed, and the like. For example: in the initial stage of product design, the AISP image processing chip is evaluated to meet the visual requirements of products, and the selection of an ISP chip can be changed due to high cost or effect deviation and other factors in the later development process, so that the problem of the hardware single board version change of the whole product is solved. Therefore, the hardware design problem that the ISP unit and other units share the PCB substrate design and are inconvenient for the later revision needs to be solved.
From the demand dimension of products, the demands of medical treatment, education, agriculture, scientific research and security protection to image vision are gradually increased in various industries, and the demands are more diversified. For example, different customers have demands for development of different Image Sensor sensors, there are AR0237, AR0230, and so on. The customer group may desirably select a desired Image Sensor by an external arrangement resistor. For another example, some customer groups have limited capability for image vision development, and even have no technical accumulation in the field, but urgently need a vision processing module capable of realizing front-end visual image capture, image processing, image coding and image output. The customer base may desire to select a video stream with desired characteristics through an external configuration resistor. The modules in the market of the industry at present are basically in customized demands, the problems cannot be well solved, and the market has great limitation.
Therefore, it is necessary to provide a visual image processing module for stamp hole pad surface mounting to solve the above-mentioned problems.
Disclosure of Invention
The invention solves the technical problem of providing the stamp hole pad surface mounting type image vision processing module which has low cost, high hardware integration level, high compatibility, high software integration level and more intelligent module and can reduce the threshold of customers.
In order to solve the above technical problem, the present invention provides a visual processing module for a stamp hole pad surface mounted image, comprising:
a PCB substrate;
an ISP image processing chip mounted on the PCB substrate;
a resistance-capacitance sensing part mounted on the PCB substrate;
the power supply chip is arranged on the PCB substrate;
a clock crystal mounted on the PCB substrate;
a firmware memory mounted on the PCB substrate.
Preferably, the stamp hole pad surface-mounted image vision processing module further comprises a lens component, and the lens component is arranged on the PCB substrate.
Preferably, the stamp hole pad surface-mounted image vision processing module further comprises a camera connector, and the camera connector is arranged on the PCB substrate.
Preferably, the ISP Image processing chip includes a Camera SoC, Video, Image Controllers chip with Image signal and media service.
Preferably, a shielding case is fixedly mounted on the top of the PCB substrate.
Preferably, a plurality of half-hole pins are arranged on four sides of the PCB substrate; the PCB design adopts a substrate side half-hole welding disc, and a copper welding disc is exposed at the bottom of the substrate.
Preferably, the capacitance-resistance sensing component, the power chip, the clock crystal and the firmware memory are all electrically connected with the ISP image processing chip.
Preferably, a lens component is mounted on the top of the PCB substrate.
Preferably, the stamp hole welding disc surface mounting type image vision processing module is used for completing image acquisition, image optimization, image coding and image output;
stamp hole welding dish surface subsides dress type image vision processing module be used for receiving the image data of image Sensor input, its interface includes: MIPI, LVDS, Hispi, DVP interface;
the encoding format includes: h264 coding format, H265 coding format, MJPEG coding format and JPEG picture format;
the output interface includes: MIPI, ethernet interface, USB interface.
Compared with the prior art, the stamp hole welding disc surface mounting type image visual processing module provided by the invention has the following beneficial effects:
firstly, the cost is low, the packaging is optimized thermally, and when a single module board is installed on the surface of another PCB in the PCB assembling process, the board-to-board welding technology is widely applied to the industry. The stamp hole pad surface mounting mode does not need board-to-board connectors and fixed copper columns, the ISP image vision module can be stably connected with the functional bottom board at low cost, the high-speed signal transmission loss is reduced, the signal quality is improved, and the stability is improved; the module substrate base plate is provided with a thermal welding pad through hole and a windowing copper foil, so that the heat of the module can be quickly and fully conducted to the base plate, the thermal optimization of the design without radiating fins is realized, and the thermal design cost is reduced
Secondly, the integration level of hardware is high, a peripheral minimum system and a power system of the ISP image signal visual processing chip are designed on a substrate which is as small as possible, and compared with the hardware design integration level, the integration level of the PCB of the bottom plate can be reduced, the embedding of a client terminal is facilitated, and the diversification of product application is realized;
standardized design, the compatibility is high, portability is good, define the module that image signal vision was handled as a general device, terminal design engineer only needs according to the performance specification of module, select the module that satisfies the demand, in embedding it with a chip similar to with the project veneer, and no longer need loaded down with trivial details separator design or consider complicated interface, it is 17mmX17mm to have realized first general module design, and the design possesses the required electrical interface of terminal customer in the image signal vision processing trade, and with the standardized design of interface, later stage new module follows the same interface design, can realize that the module pin is compatible each other, improve the module compatibility. In the design process of the terminal client, the module can be replaced quickly to verify development, and the portability is good.
And fourthly, the software integration level is high, the module is more intelligent, various Image Sensor drive configurations are combined by adopting a modular design, ISP optimization parameters matched with the lens are combined, and Image algorithms such as automatic gain are combined. The firmware supports conventional image output formats such as 1080P, 720P,30/60FPS and the like, supports output of H.264, H.265, MJPEG and JPEG coding formats, and supports USB and Ethernet output. The above configuration modes can be configured by the external selection configuration resistor and the ADC interface, and can also be configured by the back-end component through the communication interface. The terminal customer can complete the required configuration according to the module design guide, thereby greatly meeting the customer requirements and reducing the customer use threshold.
Drawings
FIG. 1 is a top cross-sectional view of a first embodiment of a stamp hole pad surface mount image vision processing module according to the present invention;
FIG. 2 is a top view of a first embodiment of a stamp hole pad surface mount image vision processing module in accordance with the present invention;
FIG. 3 is a schematic block diagram of a first embodiment of a stamp hole pad surface mount image vision processing module according to the present invention;
FIG. 4 is a flowchart of the intelligent configuration software of the stamp hole pad surface mount image vision processing module according to the first embodiment of the present invention;
FIG. 5 is a top cross-sectional view of a second embodiment of a stamp hole pad surface mount image vision processing module in accordance with the present invention;
FIG. 6 is a top view of a second embodiment of a stamp hole pad surface mount image vision processing module in accordance with the present invention;
FIG. 7 is a bottom view of a PCB substrate in a third embodiment of a stamp hole pad surface mount image vision processing module in accordance with the present invention;
FIG. 8 is a bottom view of a PCB substrate in a fourth embodiment of a stamp hole pad surface mount image vision processing module in accordance with the present invention;
FIG. 9 is a top view of a fifth embodiment of a stamp hole pad surface mount image vision processing module in accordance with the present invention;
FIG. 10 is a schematic block diagram of a fifth embodiment of a stamp hole pad surface mount image vision processing module in accordance with the present invention;
FIG. 11 is a top cross-sectional view of a sixth embodiment of a stamp hole pad surface mount image vision processing module in accordance with the present invention;
FIG. 12 is a side view of a sixth embodiment of a stamp hole pad surface mount image vision processing module in accordance with the present invention.
Reference numbers in the figures: 1. PCB base plate, 2, ISP image processing chip, 3, resistance-capacitance sensing part, 4, power chip, 5, clock crystal, 6, firmware memory, 7, shield cover, 8, half-hole pin, 9, camera connector, 10, dodge hole, 11, base plate bottom exposed copper big pad, 12, base plate bottom exposed copper small pad, 13, lens part.
Detailed Description
The invention is further described with reference to the following figures and embodiments.
First embodiment
Referring to fig. 1-4, in a first embodiment of the present invention:
stamp hole welding dish surface subsides dress type image vision processing module includes:
a PCB substrate 1;
an ISP image processing chip 2, wherein the ISP image processing chip 2 is installed on the top of the PCB substrate 1;
the capacitance and resistance sensing component 3 is mounted on the top of the PCB substrate 1;
the power supply chip 4 is mounted on the top of the PCB substrate 1;
the clock crystal 5, the said clock crystal 5 is installed on the top of the said PCB base plate 1;
a firmware memory 6, the firmware memory 6 being mounted on top of the PCB substrate 1.
The ISP Image processing chip 2 includes a Camera SoC, Video, Image Controllers chip with Image signal and media service.
And a shielding cover 7 is fixedly arranged at the top of the PCB substrate 1.
A plurality of half-hole pins 8 are arranged on four sides of the PCB substrate 1; the PCB design adopts a substrate side half-hole welding disc.
The capacitance-resistance sensing part 3, the power chip 4, the clock crystal 5 and the firmware memory 6 are all electrically connected with the ISP image processing chip 2.
The size of the PCB substrate 1 is 17 × 17 mm.
The stamp hole welding disc surface mounting type image vision processing module is used for completing image acquisition, image optimization, image coding and image output;
stamp hole welding dish surface subsides dress type image vision processing module be used for receiving the image data of image Sensor input, its interface includes: MIPI, LVDS, Hispi, DVP interface;
the encoding format includes: h264 coding format, H265 coding format, MJPEG coding format and JPEG picture format;
the output interface includes: MIPI, ethernet interface, USB interface.
In this embodiment:
the first step is as follows: the ISP Image processing chip 2 includes chips with Image signals and media services such as Camera SoC, Video, Image Controllers, etc., the whole module has rich external interfaces, including MIPI, LVDS, hipspi, DVP, etc., and external lens component communication interfaces, also including USB, Ethernet, PCIE, etc., and backend component multimedia communication interfaces, and also includes I2C, UART, etc., and backend component control communication interfaces.
The second step is that: and by adopting a modular design, various ImageSensor drive configurations are combined, ISP (internet service provider) optimization parameters matched with the lens are combined, and image algorithms such as automatic gain and the like are combined. The firmware supports conventional image output formats such as 1080P, 720P,30/60FPS and the like, supports output of H.264, H.265, MJPEG and JPEG coding formats, and supports USB and Ethernet output. The configuration modes are all configured by selecting a configuration resistor and an ADC interface from the outside, a terminal client can complete required configuration according to a module design guide, the module is provided with an SDIO interface and can be connected with a TF card to realize local video storage, and the module can be configured with ImageSensor input interface types such as MIPI, LVDS and HISPI; configurable video stream formats, such as 1080P, 720P, frame rate 30FPS, 60 FPS; configurable coding formats, such as h.264, h.265, MJPEG, JPEG; the configurable image output interface, such as USB, Ethernet, etc., the above configuration modes can be configured by selecting the configuration resistor and ADC interface externally, or can be configured by the back end module through communication interface; the PCB substrate 1 is composed of conventional PCB substrate plates such as FR-4, a stamp hole half-hole pad surface mounting process is realized by arranging half-hole pins 8 on the periphery of the PVB substrate 1, the ISP image processing chip 2, the capacitance resistance sensing component 3, the power supply chip 4, the clock crystal 5 and the firmware memory 6 are covered by the shielding case 7, the EMC grade of the module is improved, and whether the shielding case 7 is needed or not can be selected according to the EMC grade.
Compared with the prior art, the stamp hole welding disc surface mounting type image visual processing module provided by the invention has the following beneficial effects:
1) low cost, thermally optimized packaging, board-to-board soldering technology is in widespread use when a single module board is mounted on the surface of another PCB during PCB assembly. The stamp hole pad surface mounting mode does not need board-to-board connectors and fixed copper columns, the ISP image vision module can be stably connected with the functional bottom board at low cost, the high-speed signal transmission loss is reduced, the signal quality is improved, and the stability is improved; the module substrate base plate is provided with a thermal welding pad through hole and a windowing copper foil, so that the heat of the module can be quickly and fully conducted to the base plate, the thermal optimization of the design without radiating fins is realized, and the thermal design cost is reduced
2) The integration level of hardware is high, a peripheral minimum system and a power supply system of the ISP image signal visual processing chip are designed on a substrate which is as small as possible, and compared with the integration level of hardware design, the integration level of the hardware is high, the occupation ratio of a bottom plate PCB can be reduced, the insertion of a client terminal is facilitated, and the diversification of product application is realized;
3) the standardized design, the compatibility is high, the portability is good, define the module that the vision of the image signal is processed as a general device, the terminal design engineer only needs to according to the performance specification of the module, choose the module that meets the demand, imbed it in with project veneer like a chip, and no longer need loaded down with trivial details separation device design or consider complicated interface, realized that the first general module design is 17mmX17mm, and the design possesses the required electric interface of terminal customer in the vision of the image signal processing trade, and with the standardized design of interface, the later stage new module follows the same interface design, can realize that the module pin is compatible each other, improve the module compatibility. In the design process of the terminal client, the module can be replaced quickly to verify development, and the portability is good.
4) The software integration level is high, the module is more intelligent, various Image Sensor drive configurations are combined by adopting a modular design, ISP optimization parameters matched with the lens are combined, and Image algorithms such as automatic gain are combined. The firmware supports conventional image output formats such as 1080P, 720P,30/60FPS and the like, supports output of H.264, H.265, MJPEG and JPEG coding formats, and supports USB and Ethernet output. The above configuration modes can be configured by the external selection configuration resistor and the ADC interface, and can also be configured by the back-end component through the communication interface. The terminal customer can complete the required configuration according to the module design guide, thereby greatly meeting the customer requirements and reducing the customer use threshold.
Second embodiment:
referring to fig. 5-6, the present embodiment is different from the first embodiment in that a camera connector 9 is installed on the PCB substrate 1, the camera connector 9 is located in the shielding cover 7, an avoiding hole 11 is formed in the shielding cover 7, the avoiding hole 11 is adapted to the camera connector 9, and the camera connector 9 is used for connecting an external lens component.
The third embodiment:
referring to fig. 7, the only difference between this embodiment and the first embodiment is that the PCB design of the PCB substrate 1 adopts a large pad 11 with copper exposed on the bottom of the substrate.
The fourth embodiment:
referring to fig. 8, the only difference between the present embodiment and the first embodiment is that the PCB design of the PCB substrate 1 adopts the substrate bottom exposed copper small pad 12.
Fifth embodiment:
referring to fig. 9-10, the present embodiment is different from the first embodiment in that a lens component 13 is mounted on the PCB substrate 1, the lens component 13 is located in the shield cover 7, an avoiding hole 11 is formed in the shield cover 7, the avoiding hole 11 is adapted to the lens component 13, and the originally external lens component 13 is directly incorporated into the module, so that the module has an image collecting function, and meets some customer customization requirements.
Sixth embodiment:
referring to fig. 11 to 12, the difference between the present embodiment and the first embodiment is that the capacitance-resistance sensing component 3 and the power chip 4 are both located at the bottom of the PCB substrate 1, and are packaged in an up-down manner.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The utility model provides a stamp hole welding dish surface subsides dress type image vision processing module which characterized in that includes:
a PCB substrate;
an ISP image processing chip mounted on the PCB substrate;
a resistance-capacitance sensing part mounted on the PCB substrate;
the power supply chip is arranged on the PCB substrate;
a clock crystal mounted on the PCB substrate;
a firmware memory mounted on the PCB substrate.
2. The stamp hole pad surface mount image vision processing module of claim 1, further comprising a lens component disposed on the PCB substrate.
3. The visual processing module of a stamp hole pad surface mount image of claim 1, further comprising a camera connector disposed on the PCB substrate.
4. The stamp hole pad surface mount Image vision processing module of claim 1, wherein the ISP Image processing chip comprises a Camera SoC, Video, Image Controllers chip with Image signal and media services.
5. The stamp hole pad surface mount image vision processing module of claim 1, wherein a shielding cage is fixedly mounted on a top of the PCB substrate.
6. The stamp hole pad surface mount image vision processing module of claim 1, wherein a plurality of half-hole pins are disposed on a side of the PCB substrate; the PCB adopts a substrate side half-hole pad process.
7. The stamp hole pad surface mount image vision processing module of claim 1, wherein the bottom of the PCB substrate is provided with exposed metal pads, and the PCB employs a substrate bottom exposed copper pad technology.
8. The stamp hole pad surface mount image vision processing module of claim 1, in which the capacitive sensing component, power chip, clock crystal and firmware memory are electrically connected to the ISP image processing chip.
9. The stamp hole pad surface mount image vision processing module of claim 5, in which a lens component is mounted on top of the PCB substrate.
10. The visual processing module for stamp hole pad surface mount images of claim 1, wherein the visual processing module for stamp hole pad surface mount images is configured to perform image acquisition, image optimization, image coding, and image output;
stamp hole welding dish surface subsides dress type image vision processing module be used for receiving the image data of image Sensor input, its interface includes: MIPI, LVDS, Hispi, DVP interface;
the encoding format includes: h264 coding format, H265 coding format, MJPEG coding format and JPEG picture format;
the output interface includes: MIPI, ethernet interface, USB interface.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911045975.5A CN110661959A (en) | 2019-10-30 | 2019-10-30 | Stamp hole welding disc surface mounting type image visual processing module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911045975.5A CN110661959A (en) | 2019-10-30 | 2019-10-30 | Stamp hole welding disc surface mounting type image visual processing module |
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| CN210491017U (en) * | 2019-10-30 | 2020-05-08 | 深圳市猫头鹰微视科技有限公司 | Stamp hole welding disc surface mounting type image visual processing module |
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2019
- 2019-10-30 CN CN201911045975.5A patent/CN110661959A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1889162A (en) * | 2005-07-02 | 2007-01-03 | 群康科技(深圳)有限公司 | Liquid crystal display device tough body renewal system and method |
| CN203352944U (en) * | 2013-05-30 | 2013-12-18 | 航天科工深圳（集团）有限公司 | PCB with stamp holes |
| CN204945694U (en) * | 2015-06-26 | 2016-01-06 | 北京神州龙芯集成电路设计有限公司 | A kind of core board based on Godson GSC3280 SOC (system on a chip) |
| CN105610458A (en) * | 2015-12-21 | 2016-05-25 | 深圳市科陆电子科技股份有限公司 | Handheld terminal core plate based on MTK6580 platform and handheld terminal |
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