CN210470127U - Heat sink device - Google Patents
Heat sink device Download PDFInfo
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- CN210470127U CN210470127U CN201921241602.0U CN201921241602U CN210470127U CN 210470127 U CN210470127 U CN 210470127U CN 201921241602 U CN201921241602 U CN 201921241602U CN 210470127 U CN210470127 U CN 210470127U
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- heat dissipation
- heat dissipating
- heat
- substrate
- cavity
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Abstract
The utility model relates to a heat-radiating equipment field provides a heat abstractor. The device comprises a heat dissipation substrate, wherein the upper surface of the heat dissipation substrate is used for mounting a circuit board, and a bin body which protrudes outwards is integrally formed on the lower surface of the heat dissipation substrate; the bin body is internally provided with a cavity for accommodating a heating element, and the side wall of the bin body is provided with a mounting hole communicated with the cavity. The utility model discloses simple structure, the installation of being convenient for, through the lower surface integrated into one piece storehouse body at the heat dissipation base plate, can not only eliminate the thermal contact resistance between the storehouse body and the heat dissipation base plate, improve the radiating efficiency of the components and parts that generate heat, but also can avoid the storehouse body to occupy the space of heat dissipation base plate upper surface, that is to say, the components and parts and circuit board that generate heat during the installation can be installed respectively in the storehouse body and the upper surface of heat dissipation base plate lower surface, and then just can show the area that reduces the heat dissipation base plate, make the structure.
Description
Technical Field
The utility model relates to a heat-radiating equipment field especially relates to a heat abstractor.
Background
In order to ensure heat dissipation, a heat sink is generally disposed in the electrical equipment. Currently, some heat dissipation devices are mounted on the upper surface of a heat dissipation substrate together with some heat generating components such as inductors and circuit boards. In order to mount the heat generating component, the upper surface of the conventional heat dissipating substrate is usually fixed with an empty case for accommodating the heat generating component by bolts. When the heat-conducting insulating glue is installed, the heating element is placed in the hollow shell, and then the heat-conducting insulating glue is filled in the hollow shell. Because thermal contact resistance exists between the hollow shell and the radiating substrate, the radiating effect of the heating component is poor. In addition, because the hollow shell and the circuit board are both arranged on the upper surface of the heat dissipation substrate, the area of the heat dissipation substrate is larger.
SUMMERY OF THE UTILITY MODEL
The present invention aims at least solving one of the technical problems existing in the prior art or the related art.
The utility model aims at providing a simple structure is compact, be convenient for installation, radiating effect good heat abstractor.
In order to achieve the purpose, the utility model provides a heat dissipation device, which comprises a heat dissipation substrate, wherein the upper surface of the heat dissipation substrate is used for installing a circuit board, and a bin body which is outwards protruded is integrally formed on the lower surface of the heat dissipation substrate; the bin body is internally provided with a cavity for accommodating a heating element, and the side wall of the bin body is provided with a mounting hole communicated with the cavity.
The radiating base plate is of a U-shaped structure, the edges of the left side and the right side of the U-shaped structure are respectively turned outwards to form flanges, and the flanges are provided with mounting holes.
Wherein the mounting port faces the front end or the rear end of the heat dissipation substrate.
The bin body extends from one end of the heat dissipation substrate to the other end of the heat dissipation substrate.
The cavity penetrates through two ends of the bin body so as to form the mounting opening at one end of the bin body and form an opening at the other end of the bin body; the opening upper cover is provided with a sealing plate.
Wherein, the shrouding with the storehouse body can be dismantled and be connected.
Wherein, the heat dissipation base plate and the storehouse body are integrally extruded and formed.
Wherein, the heat dissipation base plate and the storehouse body integrated into one piece casting shaping.
And the heat dissipation substrate is provided with a lead hole communicated with the cavity.
The lower surface of the heat dissipation substrate and the outer wall of the bin body are both provided with a plurality of heat dissipation teeth.
The utility model discloses simple structure, the installation of being convenient for, through the lower surface integrated into one piece storehouse body at the heat dissipation base plate, can not only eliminate the thermal contact resistance between the storehouse body and the heat dissipation base plate, improve the radiating efficiency of the components and parts that generate heat, but also can avoid the storehouse body to occupy the space of heat dissipation base plate upper surface, that is to say, the components and parts and circuit board that generate heat during the installation can be installed respectively in the storehouse body and the upper surface of heat dissipation base plate lower surface, and then just can show the area that reduces the heat dissipation base plate, make the structure.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic front view of a heat dissipation device in an embodiment of the present invention;
fig. 2 is a schematic top view of a heat dissipation device in an embodiment of the present invention;
fig. 3 is a schematic bottom view of a heat dissipation device in an embodiment of the present invention;
fig. 4 is a cross-sectional view at a-a of fig. 1.
Reference numerals:
1.1, a heat dissipation substrate; 1.1.1, flanging; 1.1.2, lead holes; 1.2, a bin body;
1.2.1, a cavity; 1.2.2, a mounting port; 1.3, closing a plate; 1.4, radiating teeth;
2. a circuit board; 3. a heat generating element; 3.1, leading wires; 4. and a power tube.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly described below with reference to the accompanying drawings of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the utility model, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the utility model.
In the description of the present invention, unless otherwise specified, the terms "upper", "lower", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
It is to be understood that, unless otherwise expressly stated or limited, the term "coupled" is used in a generic sense as defined herein, e.g., fixedly attached or removably attached or integrally attached; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the utility model can be understood in specific cases to those of ordinary skill in the art.
With reference to fig. 1 to 4, the present embodiment provides a heat dissipation apparatus, which includes a heat dissipation substrate 1.1, an upper surface of the heat dissipation substrate 1.1 for mounting a circuit board 2, and a lower surface integrally formed with an outwardly protruding bin 1.2; the bin body 1.2 is internally provided with a cavity 1.2.1 for accommodating the heating element 3, and the side wall of the bin body 1.2 is provided with a mounting port 1.2.2 communicated with the cavity 1.2.1. The heat dissipation substrate 1.1 and the bin body 1.2 may be made of, but not limited to, aluminum alloy.
When in use: the heating element 3 can be firstly arranged in the cavity 1.2.1 from the mounting port 1.2.2, and the lead 3.1 of the heating element 3 extends out of the bin body 1.2; then, filling heat-conducting insulating glue into the cavity 1.2.1 through the mounting port 1.2.2 until the heat-conducting insulating glue fills up the gap between the heating element 3 and the cavity 1.2.1; and finally, fixing the circuit board 2 on the upper surface of the heat dissipation substrate 1.1 through the power tube 4. Wherein, a heat-conducting insulating pad can be arranged between the power tube 4 and the heat-radiating substrate 1.1. In the present embodiment, the heating component 3 may be, but is not limited to, an inductor.
It is thus clear that the device simple structure, the installation of being convenient for, through the lower surface integrated into one piece storehouse body 1.2 at heat dissipation base plate 1.1, can not only eliminate the thermal contact resistance between the storehouse body 1.2 and the heat dissipation base plate 1.1, improve the radiating efficiency of components and parts 3 that generate heat, but also can avoid the storehouse body 1.2 to occupy the space of heat dissipation base plate 1.1 upper surface, that is to say, components and parts 3 and circuit board 2 that generate heat can install respectively in the storehouse body 1.2 and the upper surface of heat dissipation base plate 1.1 lower surface during the installation, and then just can show the area that reduces heat dissipation base plate 1.1, make the structure of whole device.
Further, in order to facilitate the installation of the heat dissipation substrate 1.1, the heat dissipation substrate 1.1 is preferably in a U-shaped structure, that is, the longitudinal section of the heat dissipation substrate 1.1 is formed in a U shape, the edges of the left side and the right side of the U-shaped structure are respectively turned outwards to form flanges 1.1.1, and the flanges 1.1.1 are provided with installation holes. It should be noted that the outward direction is referred to the center of the heat dissipation substrate 1.1, and the direction away from the center of the heat dissipation substrate 1.1 is outward, whereas the direction approaching the center of the heat dissipation substrate 1.1 is inward.
In order to avoid the left or right side wall of the U-shaped structure interfering with the mounting of the heat generating component 3, the mounting opening 1.2.2 is preferably directed toward the front or rear end of the heat dissipating substrate 1.1.
Preferably, the cartridge body 1.2 extends from one end of the heat dissipation substrate 1.1 to the other end of the heat dissipation substrate 1.1. For example, when the transverse cross-sectional shape of the heat dissipation substrate 1.1 is rectangular, the bin 1.2 extends along the length direction of the heat dissipation substrate 1.1, and the length of the bin 1.2 is the same as the length of the heat dissipation substrate 1.1. The advantage of this arrangement is that the space of the cavity 1.2.1 in the silo body 1.2 can be increased, and the manufacture is convenient. Of course, the shape of the heat dissipation substrate 1.1 is not limited to a rectangle, and may be, for example, a circle, a polygon, or a special shape. Likewise, the longitudinal cross-sectional shape of the cartridge body 1.2 can be, but is not limited to, circular, oval, rectangular or polygonal.
Preferably, the cavity 1.2.1 penetrates through two ends of the bin body 1.2, so that a mounting opening 1.2.2 is formed at one end of the bin body 1.2, and an opening is formed at the other end; the opening upper cover is provided with a closing plate 1.3. When the heating component 3 is mounted: the closing plate 1.3 can be fixed on the opening to close the opening; then, the heating element 3 is arranged in the cavity 1.2.1 from the mounting port 1.2.2; finally, the heat-conducting insulating glue is filled into the cavity 1.2.1 from the mounting opening 1.2.2. Wherein, shrouding 1.3 and storehouse body 1.2 can dismantle and be connected. For example, the closing plate 1.3 is screwed to the cartridge body 1.2. When the bin body 1.2 in the above form is adopted, the heat dissipation substrate 1.1 and the bin body 1.2 are preferably integrally extruded and molded.
Of course, the heat dissipation substrate 1.1 and the bin body 1.2 may also be integrally cast. When the heat dissipation substrate 1.1 and the storehouse body 1.2 integrated casting shaping, cavity 1.2.1 can only run through the one end of the storehouse body 1.2, that is to say, the one end of cavity 1.2.1 is the enclosed segment, and the other end runs through the storehouse body 1.2 and forms installing port 1.2.2. Therefore, when the heating component 3 is installed, the sealing plate 1.3 does not need to be arranged, and the heating component 3 is directly installed in the installation opening 1.2.2 and then is injected with heat conduction insulating glue.
Preferably, the heat dissipation substrate 1.1 is provided with a lead hole 1.1.2 communicated with the cavity 1.2.1. Among them, the lead hole 1.1.2 is preferably provided at the edge of the heat dissipation substrate 1.1. The advantages of such an arrangement are: on one hand, the application range of the device can be expanded: after the heating element 3 is arranged in the cavity 1.2.1, the lead 3.1 of the heating element 3 can directly pass through the lead hole 1.1.2 to be connected with the circuit board 2, so the device is suitable for the heating element 3 with a shorter lead 3.1; on the other hand, the lead 3.1 of the heating component 3 can be prevented from being worn by the edge of the heat dissipation substrate 1.1 because the lead 3.1 winds onto the circuit board 2 from the edge of the heat dissipation substrate 1.1.
Preferably, the lower surface of the heat dissipation substrate 1.1 and the outer wall of the bin body 1.2 are both provided with a plurality of heat dissipation teeth 1.4 to improve the heat dissipation effect of the whole device.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A heat dissipation device is characterized by comprising a heat dissipation substrate, wherein the upper surface of the heat dissipation substrate is used for mounting a circuit board, and a bin body which protrudes outwards is integrally formed on the lower surface of the heat dissipation substrate; the bin body is internally provided with a cavity for accommodating a heating element, and the side wall of the bin body is provided with a mounting hole communicated with the cavity.
2. The heat dissipating device of claim 1, wherein the heat dissipating substrate has a U-shaped structure, and the left and right edges of the U-shaped structure are respectively folded outward to form flanges, and the flanges are provided with mounting holes.
3. The heat dissipating device of claim 2, wherein the mounting opening is directed toward a front end or a rear end of the heat dissipating substrate.
4. The heat dissipating device of claim 1, wherein the cartridge body extends from one end of the heat dissipating substrate to the other end of the heat dissipating substrate.
5. The heat dissipation device of claim 1, wherein the cavity extends through both ends of the cartridge body to form the mounting opening at one end of the cartridge body and an opening at the other end; the opening upper cover is provided with a sealing plate.
6. The heat dissipating device of claim 5, wherein said sealing plate is removably attached to said cartridge body.
7. The heat dissipating device of claim 5, wherein the heat dissipating substrate is integrally extruded with the cartridge body.
8. The heat dissipating device of claim 1, wherein the heat dissipating substrate is integrally cast with the cartridge body.
9. The heat dissipating device of claim 1, wherein the heat dissipating substrate defines a plurality of lead holes in communication with the cavity.
10. The heat dissipating device of any one of claims 1 to 9, wherein the lower surface of the heat dissipating substrate and the outer wall of the cartridge body are each provided with a plurality of heat dissipating teeth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921241602.0U CN210470127U (en) | 2019-07-31 | 2019-07-31 | Heat sink device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921241602.0U CN210470127U (en) | 2019-07-31 | 2019-07-31 | Heat sink device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210470127U true CN210470127U (en) | 2020-05-05 |
Family
ID=70449359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921241602.0U Active CN210470127U (en) | 2019-07-31 | 2019-07-31 | Heat sink device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210470127U (en) |
-
2019
- 2019-07-31 CN CN201921241602.0U patent/CN210470127U/en active Active
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