CN210468099U

CN210468099U - PCB oscillator assembly capable of being automatically assembled and antenna device

Info

Publication number: CN210468099U
Application number: CN201921836054.6U
Authority: CN
Inventors: 陈礼涛; 宋建平; 王钦源; 岑宣良
Original assignee: Comba Telecom Technology Guangzhou Ltd
Current assignee: Comba Telecom Technology Guangzhou Ltd
Priority date: 2019-10-29
Filing date: 2019-10-29
Publication date: 2020-05-05
Anticipated expiration: 2029-10-29

Abstract

The utility model relates to a but PCB vibrator subassembly and antenna device of automatic equipment, PCB vibrator subassembly that can automatic equipment include merit and divide network board, PCB vibrator board and feed pin. The surface of the power distribution network board is provided with a first bonding pad. The PCB oscillator board is provided with a metal radiation layer on the surface, and the metal radiation layer is provided with a second bonding pad. The two ends of the feed needle are respectively connected with the first bonding pad and the second bonding pad in a welding mode, and one end of the feed needle is a large head end used for mechanical adsorption. Foretell but PCB oscillator subassembly of automatic assembly, owing to be used for connecting one of them end of the feed needle of PCB oscillator board and merit branch network board for big head end, the terminal surface size of big head end is greater than the perpendicular to axial direction's of the main part of feed needle cross sectional dimension, consequently the mechanical absorption of being convenient for (including not being limited to magnetism inhale and adsorb with the negative pressure), and then be favorable to realizing the automatic assembly between PCB oscillator board and the merit branch network board, greatly reduced manufacturing cost.

Description

PCB oscillator assembly capable of being automatically assembled and antenna device

Technical Field

The utility model relates to an antenna communication technical field especially relates to a PCB oscillator subassembly and antenna device that can automize the equipment.

Background

In a 5G Massive MIMO antenna, an antenna element assembly is one of the key components and also an important cost factor. In the 5G antenna, due to the fact that the distance between the arrays is reduced, the optimization difficulty of indexes such as the same-polarization isolation degree, the different-polarization isolation degree and the directional diagram cross polarization of the sub-arrays is greatly increased, and the oscillators adopting two-point or four-point feeding of the PCB oscillator pieces have excellent indexes in the aspects of the same-polarization isolation degree, the different-polarization isolation degree and the directional diagram cross polarization. The traditional feed probe is mostly of a cylindrical structure with two small ends and a large middle part, one end of the traditional feed probe is fixedly welded with the power distribution network board, the oscillator piece is required to be placed on the top end of the feed probe, manual welding can only be adopted usually, the automation degree is low, and the production cost is high.

Disclosure of Invention

Accordingly, there is a need to overcome the drawbacks of the prior art and to provide an automatically assembled PCB oscillator module and an antenna apparatus, which can achieve automatic assembly and reduce production cost.

The technical scheme is as follows: an automatically assemblable PCB vibrator assembly, comprising: the power distribution network board is provided with a first bonding pad on the surface; the PCB oscillator plate is characterized in that a metal radiation layer is arranged on the surface of the PCB oscillator plate, and a second bonding pad is arranged on the metal radiation layer; and the number of the feed pins is more than two, two ends of each feed pin are respectively connected with the first bonding pad and the second bonding pad in a welding mode, and one end of each feed pin is a large head end for mechanical adsorption.

Foretell but PCB oscillator subassembly of automatic assembly, owing to be used for connecting one of them end of the feed needle of PCB oscillator board and merit branch network board for big head end, the terminal surface size of big head end is greater than the perpendicular to axial direction's of the main part of feed needle cross sectional dimension, consequently the mechanical absorption of being convenient for (including not being limited to magnetism inhale and adsorb with the negative pressure), and then be favorable to realizing the automatic assembly between PCB oscillator board and the merit branch network board, greatly reduced manufacturing cost.

In one embodiment, the metal radiation layer is disposed on a surface of the PCB oscillator board away from the power distribution network board, a first through hole corresponding to the feed pin is disposed on the PCB oscillator board, an end of the feed pin penetrates through the first through hole and is then welded to the first pad, and a large end of the feed pin is welded to the second pad.

In one embodiment, a metal radiation layer electrically connected with the feed pin is also arranged on the surface of the PCB oscillator board facing the power distribution network board; or the first through hole extends from the middle part of the second bonding pad to the surface of the PCB oscillator board facing the power division network board.

In one embodiment, a second through hole corresponding to the feed pin is formed in the power distribution network board, an end of the feed pin penetrates through the second through hole and then is welded to the second pad, and a large end of the feed pin is abutted to a surface, away from the PCB oscillator board, of the power distribution network board.

In one embodiment, the other end of the feeding pin is a small end, a jack corresponding to the small end is arranged on the first pad or the second pad, and the small end is inserted into the jack.

In one embodiment, the number of the PCB oscillator boards is two or more, and the two or more PCB oscillator boards are arranged on the power distribution network board at intervals.

In one embodiment, the PCB oscillator board is connected to the power distribution network board through two or four feeding pins.

In one embodiment, the PCB vibrator board is an epoxy board or a high frequency board.

In one embodiment, the metal radiation layer is provided with a cross-shaped gap.

An antenna device comprises the PCB oscillator assembly capable of being automatically assembled.

The antenna device is characterized in that one end of the feed pin for connecting the PCB oscillator board and the power distribution network board is a big head end, and the end face size of the big head end is larger than the cross-sectional size of the main body of the feed pin in the axial direction perpendicular to the axial direction, so that mechanical absorption (including magnetic absorption and negative pressure absorption) is facilitated, automatic assembly between the PCB oscillator board and the power distribution network board is facilitated, and production cost is greatly reduced.

Drawings

Fig. 1 is a partially exploded view of an automatically assembled PCB vibrator assembly according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of an automatically assembled PCB vibrator assembly according to an embodiment of the present invention;

fig. 3 is a top view of an automatically assembled PCB vibrator assembly according to an embodiment of the present invention;

fig. 4 is a top view of an automatically assemblable PCB vibrator assembly according to another embodiment of the present invention;

fig. 5 is a schematic structural view of a feeding needle according to an embodiment of the present invention.

Reference numerals:

10. a power distribution network board; 11. a first pad; 20. a PCB vibrator board; 21. a metal radiation layer; 22. a second pad; 23. a first through hole; 24. a gap; 30. a feed pin; 31. a big head end; 32. a main body; 33. a small head end.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the description of the present invention, it is to be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly connected" to another element, there are no intervening elements present.

In one embodiment, referring to fig. 1, fig. 2 and fig. 5, an automatically assemblable PCB oscillator assembly includes a power distribution network board 10, a PCB oscillator board 20 and a feeding pin 30. The surface of the power distribution network board 10 is provided with a first pad 11. The PCB oscillator board 20 is provided with a metal radiation layer 21 on the surface, and the metal radiation layer 21 is provided with a second bonding pad 22. The number of the feeding pins 30 is more than two, two ends of each feeding pin 30 are respectively connected with the first bonding pad 11 and the second bonding pad 22 in a welding mode, and one end of each feeding pin 30 is a large head end 31 used for mechanical adsorption.

Above-mentioned but PCB oscillator subassembly of automatic assembly, because the one of them end of the feed pin 30 that is used for connecting PCB oscillator board 20 and power distribution network board 10 is big head end 31, the terminal surface size of big head end 31 is greater than the perpendicular to axial direction's of the main part 32 of feed pin 30 cross-sectional dimension, consequently be convenient for mechanical absorption (including not being limited to magnetism and negative pressure absorption), and then be favorable to realizing the automatic assembly between PCB oscillator board 20 and power distribution network board 10, greatly reduced manufacturing cost.

Further, referring to fig. 1, fig. 2 and fig. 5, the metal radiation layer 21 is disposed on a surface of the PCB oscillator board 20 away from the power distribution network board 10, and the PCB oscillator board 20 is provided with a first through hole 23 corresponding to the feeding pin 30. The end of the feeding pin 30 is soldered to the first pad 11 after passing through the first through hole 23. The large end 31 of the feed pin 30 is soldered to the second pad 22. So, in the assembling process, because the big head end 31 of feed needle 30 is inconsistent with second pad 22, realize tentatively fixing, be convenient for adopt welding set with big head end 31 and second pad 22 welded connection, be favorable to realizing automatic equipment.

Further, referring to fig. 1, fig. 2 and fig. 5, a metal radiation layer 21 electrically connected to the feeding pin 30 is also disposed on a surface of the PCB oscillator board 20 facing the power distribution network board 10.

It should be noted that, one of the two opposite surfaces of the PCB oscillator board 20 may be provided with the metal radiation layer 21, or both of the two opposite surfaces may be provided with the metal radiation layer 21, which is set according to the characteristics of the antenna circuit, and details thereof are not described herein.

Optionally, the first through hole 23 extends from the middle of the second pad 22 to the surface of the PCB vibrator board 20 facing the power dividing network board 10. In this manner, the large-head end 31 can be ensured to be more sufficiently contacted and solder-fixed with the second pad 22.

In another embodiment, the arrangement of the feeding pin 30 may be reversed compared to the above embodiment, that is, the power distribution network board 10 is provided with a second through hole corresponding to the feeding pin 30. The end of the feed pin 30 penetrates through the second through hole and then is welded to the second pad 22, and the large head end 31 of the feed pin 30 abuts against the surface of the power distribution network board 10, which is away from the PCB oscillator board 20.

Further, referring to fig. 5, the end surface of the large head end 31 is, for example, a plane. Thus, the large head end 31 having a flat end surface can facilitate mechanical suction.

Further, the other end of the feeding pin 30 is a small end 33, a socket corresponding to the small end 33 is provided on the first pad 11 or the second pad 22, and the small end 33 is inserted into the socket. So, after little head end 33 inserted the jack for feed pin 30, merit divide network board 10 and PCB oscillator board 20 three are tentatively fixed, are favorable to the three welding to link to each other. It will be appreciated that the end face dimension of the small end 33 is smaller than the cross-sectional dimension perpendicular to the axial direction of the main body 32 of the feed pin 30. In addition, the specific shape of the main body 32 of the feeding pin 30 is not limited, and may be a square cylinder, a triangular cylinder, a cylindrical body, or the like.

Further, the end surface of the other end of the feed pin 30 is a plane, so that the other end of the feed pin 30 can be easily welded and fixed.

In one embodiment, referring to fig. 1 to 4, the number of the PCB oscillator board 20 is two or more. The two or more PCB vibrator boards 20 are disposed on the power distribution network board 10 at intervals. Thus, more than two PCB oscillator boards 20 form more than two sub-arrays, and the sub-arrays form a 5G Massive MIMO antenna array according to a certain regular array. Optionally, there may be one PCB oscillator board 20, and one corresponding sub-array on the power division network board 10.

In one embodiment, the PCB oscillator board 20 is connected to the power distribution network board 10 through two or four feeding pins 30. Thus, two-point or four-point feeding can be utilized, and the radiation and circuit index performance is excellent. The method is applied to the 5 GMasseive MIMO antenna array, meets the indexes of good homopolarity isolation, heteropolarity isolation, directional diagram cross polarization and the like, and can realize automatic production and assembly.

In one embodiment, the PCB vibrator board 20 is an epoxy board or a high frequency board. Thus, a low cost epoxy board or a high performance high frequency board can be used to reduce losses.

Please refer to fig. 4 and 5, the specific shape of the metal radiation layer 21 is set according to the actual radiation requirement, and is not limited herein. In one embodiment, the metal radiation layer 21 is provided with a cross-shaped slit 24. Thus, on the one hand, the directional pattern can be improved: the polarization of the antenna is in the + -45 deg. direction and the cross-shaped slot 24 is in the horizontal and vertical direction. On the other hand, the cross-shaped slit 24 has an effect of reinforcing radiation: when the antenna unit works, the cross-shaped slot 24 also generates radiation, and radiation fields of the cross-shaped slot 24 are vector-superposed in the polarization direction of the antenna to form a + -45 polarization electromagnetic wave radiation directional diagram, so that a gain index is improved.

In one embodiment, an antenna assembly includes the PCB vibrator assembly of any of the above embodiments that can be assembled automatically.

In the antenna device, one end of the feed pin 30 for connecting the PCB oscillator board 20 and the power distribution network board 10 is the large head end 31, and the end face size of the large head end 31 is larger than the cross-sectional size of the main body 32 of the feed pin 30, which is perpendicular to the axial direction, so that mechanical absorption (including magnetic absorption and negative pressure absorption) is facilitated, and further, the automatic assembly between the PCB oscillator board 20 and the power distribution network board 10 is facilitated, and the production cost is greatly reduced.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. An automatically assemblable PCB vibrator assembly, comprising:

the power distribution network board is provided with a first bonding pad on the surface;

the PCB oscillator plate is characterized in that a metal radiation layer is arranged on the surface of the PCB oscillator plate, and a second bonding pad is arranged on the metal radiation layer; and

the feed needle, the feed needle is more than two, the both ends of feed needle respectively with first pad, second pad welding links to each other, one of them one end of feed needle is for being used for the big head end of mechanical absorption.

2. The PCB oscillator assembly capable of being automatically assembled according to claim 1, wherein the metal radiation layer is arranged on a surface of the PCB oscillator board, which is away from the power distribution network board, a first through hole corresponding to the feed pin is arranged on the PCB oscillator board, an end of the feed pin penetrates through the first through hole and then is welded with the first bonding pad, and a large end of the feed pin is welded with the second bonding pad.

3. The PCB oscillator assembly capable of being automatically assembled according to claim 2, wherein a metal radiation layer electrically connected with the feed pin is also arranged on the surface of the PCB oscillator plate facing the power distribution network plate; or the first through hole extends from the middle part of the second bonding pad to the surface of the PCB oscillator board facing the power division network board.

4. The PCB oscillator assembly capable of being automatically assembled according to claim 1, wherein a second through hole corresponding to the feed pin is formed in the power distribution network board, an end portion of the feed pin penetrates through the second through hole and then is welded to the second pad, and a large end of the feed pin is in contact with a surface, away from the PCB oscillator board, of the power distribution network board.

5. The PCB vibrator assembly capable of being automatically assembled according to claim 1, wherein the other end of the feeding pin is a small end, a jack corresponding to the small end is arranged on the first pad or the second pad, and the small end is inserted into the jack.

6. The PCB oscillator assembly capable of being automatically assembled according to claim 1, wherein the number of the PCB oscillator plates is two or more, and the two or more PCB oscillator plates are arranged on the power distribution network board at intervals.

7. The automatically assemblable PCB vibrator assembly of claim 1, wherein the PCB vibrator board is connected to the power distribution network board through two or four of the feeding pins.

8. The automatically assemblable PCB vibrator assembly of claim 1, wherein the PCB vibrator board is an epoxy board or a high frequency board.

9. The automatically assemblable PCB vibrator assembly of any one of claims 1 to 8, wherein the metal radiation layer is provided with a cross-shaped slit.

10. An antenna device comprising an automatically assemblable PCB vibrator assembly according to any one of claims 1 to 9.