TWI774334B - Antenna structure and manufacturing, assembly and use method thereof, and movable device - Google Patents

Abstract

An antenna structure and a manufacturing, an assembly and a use method thereof and a movable device are provided. The manufacturing method of the antenna structure includes obtaining antenna simulation information by an antenna simulation software; fixing a chip antenna and a metal component on a circuit substrate to obtain an antenna structure; and testing the antenna structure to obtain antenna electricity information and antenna pattern information of the antenna structure. A distance between the metal component and the chip antenna is equal to or less than λ/2, a full length of the metal component is equal to or greater than λ/8, and a height of the metal component relative to the circuit substrate is equal to or greater than λ/16. Therefore, a vertical polarization gain generated by the antenna structure using the metal component is greater than a vertical polarization gain generated by the antenna structure without using the metal component, on an aspect (or a position) of a vertical polarization pattern generated by the antenna structure.

Description

Antenna structure and method of making, assembling and using the same, and movable device

The present invention relates to an antenna structure, in particular to an antenna structure for improving vertical polarization gain, its fabrication, assembly and use methods, and a movable device using the antenna structure.

In the prior art, the antenna structure using a chip antenna can only provide a horizontal polarization pattern that meets the requirements (can provide better horizontal polarization gain), but cannot provide a vertical polarization pattern that meets the requirements alone (cannot provide a better horizontal polarization pattern. vertical polarization gain), so the existing antenna structures using chip antennas still have room for improvement.

The technical problem to be solved by the present invention is to provide an antenna structure for improving the vertical polarization gain, a method for manufacturing, assembling and using thereof, and a movable device in view of the deficiencies of the prior art.

In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a method for fabricating an antenna structure, which includes: evaluating both a virtual chip antenna and a virtual metal element in a virtual circuit through an antenna simulation software An optimized position on the substrate and an optimized size of the virtual metal element are evaluated to obtain an antenna simulation information; according to the antenna simulation information, a chip antenna and a metal element are fixed on a circuit substrate to obtain a day and testing the antenna structure to obtain an antenna electrical information and an antenna pattern information of the antenna structure. Wherein, when the wavelength of the operating frequency of the antenna structure used for transmitting wireless signals is λ, the distance between the metal element and the chip antenna cannot be greater than λ/2, the full length of the metal element cannot be less than λ/8, and the metal element is relatively close to the circuit. The height of the substrate cannot be less than λ/16. Among them, at the same azimuth of a vertical polarization pattern generated by the antenna structure, a vertical polarization gain generated by an antenna structure using metal elements is greater than a vertical polarization gain generated by an antenna structure without metal elements. .

In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide an antenna structure for improving the vertical polarization gain, and the antenna structure is manufactured by the manufacturing method of the antenna structure.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide an assembly method of an antenna structure, which includes: providing a circuit substrate, a chip antenna and a metal element; and fixing the chip antenna and the metal element on the circuit substrate to form an antenna structure. Wherein, when the wavelength of the operating frequency of the antenna structure used for transmitting wireless signals is λ, the distance between the metal element and the chip antenna cannot be greater than λ/2, the full length of the metal element cannot be less than λ/8, and the metal element is relatively close to the circuit. The height of the substrate cannot be less than λ/16. Among them, at the same azimuth of a vertical polarization pattern generated by the antenna structure, a vertical polarization gain generated by an antenna structure using metal elements is greater than a vertical polarization gain generated by an antenna structure without metal elements. .

In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide an antenna structure for increasing the vertical polarization gain, and the antenna structure is fabricated by an assembly method of the antenna structure.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a method for using an antenna structure, which includes: providing an antenna structure, the antenna structure includes a circuit substrate, a chip antenna disposed on the circuit substrate, and A metal element arranged on the circuit substrate; and through the mutual cooperation between the metal element and the chip antenna, the antenna structure generates a vertical polarization field pattern. Wherein, when the wavelength of the operating frequency of the antenna structure used for transmitting wireless signals is λ, the distance between the metal element and the chip antenna cannot be greater than λ/2, the full length of the metal element cannot be less than λ/8, and the metal element is relatively close to the circuit. The height of the substrate cannot be less than λ/16. Wherein, at the same azimuth of the vertical polarization pattern generated by the antenna structure, a vertical polarization gain generated by an antenna structure using metal elements is greater than a vertical polarization gain generated by an antenna structure without metal elements.

In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide an antenna structure for improving the vertical polarization gain, and the antenna structure is applied to the using method of the antenna structure.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a movable device. The movable device uses an antenna structure, and the antenna structure includes a circuit substrate, a chip antenna disposed on the circuit substrate, and a chip antenna disposed on the circuit substrate. A metal element on a circuit substrate. Wherein, when the wavelength of the operating frequency of the antenna structure used for transmitting wireless signals is λ, the distance between the metal element and the chip antenna cannot be greater than λ/2, the full length of the metal element cannot be less than λ/8, and the metal element is relatively close to the circuit. The height of the substrate cannot be less than λ/16. Among them, at the same azimuth of a vertical polarization pattern generated by the antenna structure, a vertical polarization gain generated by an antenna structure using metal elements is greater than a vertical polarization gain generated by an antenna structure without metal elements. .

One of the beneficial effects of the present invention is that the present invention provides an antenna structure for improving vertical polarization gain, a method for manufacturing, assembling and using the same, and a movable device, which can be achieved through "the antenna structure includes a circuit substrate, a set of A chip antenna on the circuit substrate and a metal element arranged on the circuit substrate" and "The distance between the metal element and the chip antenna cannot be greater than λ/2, the full length of the metal element cannot be less than λ/8, and the metal element is relatively The technical solution that the height of the circuit board cannot be less than λ/16”, so that at the same orientation of a vertical polarization field generated by the antenna structure, a vertical polarization gain generated by the antenna structure using metal elements will Greater than a vertical polarization gain produced by an antenna structure without metal elements.

To further understand the features and technical content of the present invention, please refer to the following detailed descriptions and drawings related to the present invention, however, the drawings provided are only for reference and description, not for limiting the present invention.

The following are specific specific examples to illustrate the embodiments of the present disclosure related to the "antenna structure for increasing vertical polarization gain, its manufacturing, assembling and using methods, and a movable device". Those skilled in the art can learn from this specification. The disclosure provides an understanding of the advantages and effects of the present invention. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustration, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[First Embodiment]

Referring to FIG. 1 and FIG. 5 to FIG. 16 , a first embodiment of the present invention provides a method for fabricating an antenna structure, which includes: first, as shown in FIG. 1 and FIG. 5 to FIG. 7 , using an antenna simulation software to evaluate An optimized position of both a dummy chip antenna and a dummy metal element on a dummy circuit substrate and an optimum size of the dummy metal element are evaluated to obtain an antenna simulation information (step S100 ), and then according to the antenna simulation information, a chip antenna 2 and a metal element 3 are fixed on a circuit substrate 1 to obtain an antenna structure S (step S102 ); To obtain an antenna electrical information (as shown in FIGS. 8 to 10 ) and an antenna pattern information (as shown in FIGS. 11 to 16 ) of the antenna structure S (step S104 ). In addition, the first embodiment of the present invention further provides an antenna structure S fabricated by a fabrication method of an antenna structure, so as to improve the vertical polarization gain of the antenna structure S. FIG.

Referring to FIG. 2 and FIGS. 5 to 16 , a first embodiment of the present invention provides an antenna structure assembling method, which includes: first, as shown in FIG. 2 , providing a circuit substrate 1 , a chip antenna 2 and a metal element 3 (step S200 ); then, as shown in FIGS. 2 and 5 to 7 , the chip antenna 2 and the metal element 3 are fixed on the circuit substrate 1 to form an antenna structure S (step S202 ). In addition, the first embodiment of the present invention further provides an antenna structure S fabricated by an assembly method of the antenna structure, so as to improve the vertical polarization gain of the antenna structure S. FIG.

Referring to FIG. 3 and FIG. 5 to FIG. 16 , the first embodiment of the present invention provides a method for using an antenna structure, which includes: first, in conjunction with FIG. 3 and FIG. 5 to FIG. 7 , an antenna structure S is provided, an antenna The structure S includes a circuit substrate 1, a chip antenna 2 disposed on the circuit substrate 1, and a metal element 3 disposed on the circuit substrate 1 (step S300); then, as shown in FIG. 3 and FIGS. 11 to 16, Through the cooperation between the metal element 3 and the chip antenna 2 , the antenna structure S generates a vertical polarization pattern (step S302 ). In addition, the first embodiment of the present invention further provides an antenna structure S for improving the vertical polarization gain, and the antenna structure S is applied to the using method of the antenna structure.

Referring to FIG. 4 and FIG. 5 to FIG. 16 , a first embodiment of the present invention provides a movable device M. The movable device M uses an antenna structure S, and the antenna structure S includes a circuit substrate 1 , a chip antenna 2 disposed on the circuit substrate 1 , and a metal element 3 disposed on the circuit substrate 1 . For example, the movable device M may be any kind of vehicle, such as a vehicle, a ship, or an airplane.

It is worth noting that, as shown in FIG. 6 , when the wavelength of the operating frequency of the antenna structure S used for transmitting wireless signals is λ, the distance D between the metal element 3 and the chip antenna 2 (from one end of the chip antenna 2 to An interval distance between one end of the metal element 3) cannot be greater than λ/2 (or less than λ/2), and the full length L of the metal element 3 (extending from one end of the metal element 3 to the other end of the metal element 3) An extension distance) cannot be less than λ/8 (or greater than λ/8), and the height H of the metal element 3 relative to the circuit substrate 1 (a vertical distance from the bottom end of the metal element 3 to the top of the metal element 3) It cannot be less than λ/16 (or more than λ/16). 11 to 16, on the same azimuth of a vertically polarized field generated by the antenna structure S (for example, on the same straight line or on the same straight line extending direction), "there are those using the metal element 3". A vertical polarization gain (as outlined by the solid lines in Figures 11 to 16 ) produced by the antenna structure S" will be greater than a vertical polarization gain produced by the "antenna structure S without metal element 3" (such as 11 to 16, the outlines represented by the dashed lines).

For example, in step S100, the antenna simulation software may be CST, HFSS, Sonnet, XFDTD or FEKO, etc. In addition, the optimized positions of both the virtual chip antenna and the virtual metal element on the virtual circuit substrate may at least include: a "chip antenna position information" of the virtual chip antenna on the virtual circuit substrate (for example, placing the virtual chip antenna on the virtual circuit substrate) Any position on the circuit substrate)” and a “metal element position information (for example, placing the dummy metal element at a position adjacent to the dummy chip antenna)” on the dummy metal element on the virtual circuit substrate. In addition, the optimized size of the dummy metal element may at least include: a "shape information of the dummy metal element (for example, using a columnar metal element (or only a columnar metal element), a plate-like metal element (or only a plate-like metal element) ) or a metal element of any shape)”, a “distance information of the virtual metal element relative to the virtual chip antenna (for example, the distance D between the metal element 3 and the chip antenna 2 can be approximately between λ/4 and λ/2, or less than λ/4)”, a “full-length information of the dummy metal element (for example, the full length L of the metal element 3 can be approximately between λ/8 to 2λ, or greater than 2λ)”, and the relative length of the dummy metal element. A "height information (for example, the height H of the metal element 3 relative to the circuit substrate 1 may be approximately between λ/16 to 1λ, or greater than 2λ)" on the virtual circuit substrate. That is, the antenna simulation information obtained by the antenna simulation software includes at least the chip antenna position information of the virtual chip antenna, the metal element position information of the virtual metal element, and the shape information, distance information, full length information and height information of the virtual metal element. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

For example, in step S102, according to the antenna simulation information, the chip antenna 2 can be fixed on a predetermined position on the circuit substrate 1 by soldering, so that the two terminal electrodes of the chip antenna 2 can be fixed by two solders respectively. On the two conductive pads of the circuit substrate 1 , the chip antenna 2 is electrically connected to the circuit substrate 1 . In addition, in step S102, according to the antenna simulation information, the metal element 3 can be fixed on another predetermined position of the circuit substrate 1 by welding, locking or clamping, so that the metal element 3 can pass through solder, screws or fasteners. And it is fixed on at least one conductive pad of the circuit substrate 1 , and the metal element 3 is electrically connected to the circuit substrate 1 . It is worth noting that the metal element 3 can be disposed on one of the upper surface 101 and the lower surface 102 of the circuit substrate 1 and electrically connected to the circuit substrate 1 , and the chip antenna 2 is disposed on the upper surface of the circuit substrate 1 . 101 and separated from the metal element 3 from each other. In addition, the included angle of the metal element 3 relative to the circuit substrate is approximately any number between 85 degrees and 95 degrees. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

For example, as shown in FIG. 5 and FIG. 6 , the chip antenna 2 is placed at a laterally centered position on the upper surface 101 of the circuit substrate 1 (chip antenna position information), and the metal element 3 is placed on the circuit substrate 1 On the upper surface 101 of the chip antenna 2 and a predetermined position adjacent to the chip antenna 2 (metal element position information). In addition, as shown in FIG. 5 and FIG. 6 , the metal element 3 is a vertical columnar metal element (shape information), so the included angle of the metal element 3 with respect to the circuit substrate is exactly 90 degrees. In addition, as shown in FIG. 7 , the distance D of the metal element 3 from the chip antenna 2 can be set to λ/4 (distance information), the full length L of the metal element 3 can be set to λ/8 (full length information), and the metal element 3 The height H with respect to the circuit board 1 can be set to λ/8 (height information). In this way, in step S104 , with reference to FIGS. 8 to 16 , after the antenna structure S fabricated according to the antenna simulation information is actually tested, an antenna electrical information of the antenna structure S can be obtained (as shown in FIGS. 8 to 16 ). 10) and an antenna pattern information (as shown in Figures 11 to 16). It is worth noting that no matter whether the metal element 3 is a columnar metal element, a plate-like metal element or a metal element of any shape, the diameter of the columnar metal element (or the width and thickness of the plate-like metal element) does not matter. Too much will affect the vertical polarization pattern of the antenna structure S.

Further, as shown in FIG. 8 , FIG. 8 shows the “antenna structure S with the metal element 3” and the “antenna structure S without the metal element 3” provided by the first embodiment of the present invention in different ways. A graph of the Voltage Standing Wave Ratio (VSWR) obtained at the frequency. For example, when the first embodiment of the present invention tests the antenna structure S using the metal element 3, at the operating frequencies of 6239.6 MHz, 6489.6 MHz and 6739.6 MHz, voltages of 1.3, 1.2 and 1.4 can be measured respectively standing wave ratio. When the antenna structure S without the metal element 3 is tested in the first embodiment of the present invention, at the operating frequencies of 6239.6 MHz, 6489.6 MHz and 6739.6 MHz, voltage standing wave ratios of 1.3, 1.2 and 1.3 can be measured respectively. That is to say, in the first embodiment of the present invention, regardless of whether the antenna structure S uses the metal element 3, a voltage standing wave ratio below 2 can be obtained at the operating frequencies of 6239.6 MHz, 6489.6 MHz and 6739.6 MHz.

Further, as shown in FIG. 9 , FIG. 9 is the “antenna structure S with the metal element 3” and the “antenna structure S without the metal element 3” provided by the first embodiment of the present invention in different ways. Graph of the radiation efficiency obtained at frequency. For example, when the first embodiment of the present invention tests the antenna structure S using the metal element 3, at the operating frequencies of 6239.6 MHz, 6489.6 MHz and 6739.6 MHz, 81%, 81% and 79% can be measured respectively. % radiation efficiency. When the first embodiment of the present invention is tested on the antenna structure S without the metal element 3, the radiation efficiencies of 82%, 82% and 82% can be measured at the operating frequencies of 6239.6 MHz, 6489.6 MHz and 6739.6 MHz respectively. . That is to say, in the first embodiment of the present invention, regardless of whether the antenna structure S uses the metal element 3, the radiation efficiency greater than 75% can be obtained at the operating frequencies of 6239.6 MHz, 6489.6 MHz and 6739.6 MHz.

Further, as shown in FIG. 10 , FIG. 10 is the “antenna structure S with the metal element 3” and the “antenna structure S without the use of the metal element 3” provided by the first embodiment of the present invention. Graph of the resulting peak gain at frequency. For example, when the first embodiment of the present invention tests the antenna structure S using the metal element 3, at the operating frequencies of 6239.6 MHz, 6489.6 MHz and 6739.6 MHz, 1.8 dBi, 1.9 dBi and 2.1 dBi can be measured respectively. Peak gain in dBi. When the first embodiment of the present invention tests the antenna structure S without using the metal element 3, at the operating frequencies of 6239.6 MHz, 6489.6 MHz and 6739.6 MHz, the peak gains of 3.2 dBi, 3.2 dBi and 3 dBi can be measured respectively. . That is, in the first embodiment of the present invention, regardless of whether the antenna structure S uses the metal element 3, the peak gain greater than 1.5 dBi can be obtained at the operating frequencies of 6239.6 MHz, 6489.6 MHz and 6739.6 MHz.

11 and FIG. 12 , FIG. 11 shows both the "antenna structure S with metal element 3" and the "antenna structure S without metal element 3" according to the first embodiment of the present invention Schematic diagrams of vertical polarization patterns in the Y-Z plane respectively operating at 6239.6 MHz, and FIG. 12 is the “antenna structure S with metal element 3” and “antenna without metal element 3” provided by the first embodiment of the present invention Schematic diagram of the vertical polarization pattern in the X-Y plane for both structures S" operating at 6239.6 MHz, respectively. For example, as shown in Figure 11, when the antenna structure S operates at 6239.6 MHz, metal elements are used on the same azimuth (for example, the same straight extension line) of the vertical polarization pattern generated by the Y-Z plane of the antenna structure S A vertical polarization gain P1 generated by the antenna structure S of 3 is greater than a vertical polarization gain P2 generated by the antenna structure S without using the metal element 3 by at least 10 dB or more. As shown in Figure 12, when the antenna structure S operates at 6239.6 MHz, there is an antenna structure using metal element 3 at the same azimuth (for example, on the same straight extension line) of the vertical polarization pattern generated by the X-Y plane of the antenna structure S A vertical polarization gain P1 produced by S is greater than a vertical polarization gain P2 produced by the antenna structure S without using the metal element 3 by at least 10 dB or more.

13 and FIG. 14 , FIG. 13 shows both the “antenna structure S with metal element 3” and the “antenna structure S without metal element 3” according to the first embodiment of the present invention Schematic diagrams of vertical polarization patterns in the Y-Z plane respectively operating at 6489.6 MHz, and FIG. 14 is the “antenna structure S with metal element 3” and “antenna without metal element 3” provided by the first embodiment of the present invention Schematic diagram of the vertical polarization pattern in the X-Y plane for both structures S" operating at 6489.6 MHz, respectively. For example, as shown in Fig. 13, when the antenna structure S operates at 6489.6 MHz, metal elements are used on the same azimuth of the vertical polarization pattern generated by the Y-Z plane of the antenna structure S (for example, on the same straight extension line). A vertical polarization gain P1 generated by the antenna structure S of 3 is greater than a vertical polarization gain P2 generated by the antenna structure S without using the metal element 3 by at least 10 dB or more. As shown in Figure 14, when the antenna structure S operates at 6489.6 MHz, there is an antenna structure using metal element 3 at the same azimuth (for example, on the same straight extension line) of the vertical polarization pattern generated by the X-Y plane of the antenna structure S A vertical polarization gain P1 produced by S is greater than a vertical polarization gain P2 produced by the antenna structure S without using the metal element 3 by at least 10 dB or more.

15 and FIG. 16 , FIG. 15 shows both the "antenna structure S with metal element 3" and the "antenna structure S without metal element 3" according to the first embodiment of the present invention Schematic diagrams of vertical polarization patterns in the Y-Z plane when operating at 6739.6 MHz, respectively, and FIG. 16 is the “antenna structure S with metal element 3” and “antenna without metal element 3” provided by the first embodiment of the present invention Schematic diagram of the vertical polarization pattern in the X-Y plane for both structures S" operating at 6739.6 MHz, respectively. For example, as shown in Fig. 15, when the antenna structure S operates at 6739.6 MHz, some metal elements are used on the same azimuth of the vertical polarization pattern generated by the Y-Z plane of the antenna structure S (for example, on the same straight extension line). A vertical polarization gain P1 generated by the antenna structure S of 3 is greater than a vertical polarization gain P2 generated by the antenna structure S without using the metal element 3 by at least 10 dB or more. As shown in Figure 16, when the antenna structure S operates at 6739.6 MHz, there is an antenna structure using metal element 3 at the same azimuth (for example, on the same straight extension line) of the vertical polarization pattern generated by the X-Y plane of the antenna structure S. A vertical polarization gain P1 produced by S is greater than a vertical polarization gain P2 produced by the antenna structure S without using the metal element 3 by at least 10 dB or more.

[Second Embodiment]

Referring to FIG. 17 , a second embodiment of the present invention provides an antenna structure S for increasing vertical polarization gain, which includes: a circuit substrate 1 , a chip antenna 2 disposed on the circuit substrate 1 , and a chip antenna 2 disposed on the circuit substrate 1 on a metal element 3. It can be seen from the comparison between FIG. 17 and FIG. 7 that the biggest difference between the second embodiment of the present invention and the first embodiment is that in the second embodiment, the metal element 3 is disposed on the lower surface 102 of the circuit substrate 1 and is electrically connected on the circuit board 1. That is, the chip antenna 2 and the metal element 3 may be respectively disposed on two opposite surfaces (the upper surface 101 and the lower surface 102 ) of the circuit substrate 1 .

Furthermore, when the wavelength of the operating frequency of the antenna structure S used for transmitting wireless signals is λ, the distance D between the metal element 3 and the chip antenna 2 cannot be greater than λ/2, and the overall length L of the metal element 3 cannot be less than λ. /8, and the height H of the metal element 3 relative to the circuit substrate 1 cannot be less than λ/16. Therefore, at the same azimuth of a vertical polarization pattern generated by the antenna structure S, a vertical polarization gain generated by the "antenna structure S with the metal element 3" is greater than that of the "antenna without the metal element 3" A vertical polarization gain produced by structure S".

It should be noted that the antenna structure S provided by the second embodiment of the present invention may further include another metal element (the metal element 3 shown in FIG. 7 ) disposed on an upper surface 101 of the circuit substrate 1 . That is, the second embodiment of the present invention may provide two metal elements 3, and the two metal elements 3 may be disposed on the upper surface 101 and the lower surface 102 of the circuit substrate 1, respectively.

[Third Embodiment]

Referring to FIG. 18 , a third embodiment of the present invention provides an antenna structure S for enhancing vertical polarization gain, which includes: a circuit substrate 1 , a chip antenna 2 disposed on the circuit substrate 1 , and a chip antenna 2 disposed on the circuit substrate 1 on a metal element 3. As can be seen from the comparison between FIG. 18 and FIG. 7 , the biggest difference between the third embodiment of the present invention and the first embodiment is that in the third embodiment, the metal element 3 has a fixing portion 31 fixed on the circuit substrate 1 and a connection There is an extension portion 32 extending upward from the fixing portion 31 , and the fixing portion 31 of the metal element 3 can be fixed on the circuit substrate 1 by welding, locking or clamping.

Furthermore, when the wavelength of the operating frequency of the antenna structure S used for transmitting wireless signals is λ, the distance D between the metal element 3 and the chip antenna 2 cannot be greater than λ/2, and the full length of the metal element 3 (not shown in the figure) It cannot be less than λ/8, and the height H of the metal element 3 with respect to the circuit substrate 1 cannot be less than λ/16. Therefore, at the same azimuth of a vertical polarization pattern generated by the antenna structure S, a vertical polarization gain generated by the "antenna structure S with the metal element 3" is greater than that of the "antenna without the metal element 3" A vertical polarization gain produced by structure S".

[Fourth Embodiment]

Referring to FIG. 19 , a fourth embodiment of the present invention provides an antenna structure S for increasing vertical polarization gain, which includes: a circuit substrate 1 , a chip antenna 2 disposed on the circuit substrate 1 , and a chip antenna 2 disposed on the circuit substrate 1 on a metal element 3. It can be seen from the comparison between FIG. 19 and FIG. 7 that the biggest difference between the fourth embodiment of the present invention and the first embodiment is that in the fourth embodiment, the metal element 3 has a first vertical section 321 and a first horizontal section 322 . The first vertical section 321 is perpendicular to the circuit substrate 1 , and the first horizontal section 322 extends horizontally from the first vertical section 321 toward a direction away from the chip antenna 2 .

Furthermore, when the wavelength of the operating frequency of the antenna structure S used for transmitting wireless signals is λ, the distance D between the metal element 3 and the chip antenna 2 cannot be greater than λ/2, and the full length of the metal element 3 (not shown in the figure) It cannot be less than λ/8, and the height H of the metal element 3 with respect to the circuit substrate 1 cannot be less than λ/16. Therefore, at the same azimuth of a vertical polarization pattern generated by the antenna structure S, a vertical polarization gain generated by the "antenna structure S with the metal element 3" is greater than that of the "antenna without the metal element 3" A vertical polarization gain produced by structure S".

[Fifth Embodiment]

Referring to FIG. 20 , a fifth embodiment of the present invention provides an antenna structure S for enhancing vertical polarization gain, which includes: a circuit substrate 1 , a chip antenna 2 disposed on the circuit substrate 1 , and a chip antenna 2 disposed on the circuit substrate 1 on a metal element 3. As can be seen from the comparison between FIG. 20 and FIG. 7 , the biggest difference between the fifth embodiment of the present invention and the first embodiment is that in the fifth embodiment, the metal element 3 has a first vertical section 321 and a first horizontal section 322 , a second vertical section 323 , a second horizontal section 324 and a third vertical section 325 . The first vertical section 321 is perpendicular to the circuit substrate 1 , the first horizontal section 322 extends horizontally from the first vertical section 321 toward the direction away from the chip antenna 2 , and the second vertical section 323 extends upward from the first horizontal section 322 and is perpendicular to the first vertical section 322 . The horizontal section 322 , the second horizontal section 324 extend horizontally from the second vertical section 323 toward the direction close to the chip antenna 2 , and the third vertical section 325 extends upward from the second horizontal section 324 and is perpendicular to the second horizontal section 324 .

Furthermore, when the wavelength of the operating frequency of the antenna structure S used for transmitting wireless signals is λ, the distance D between the metal element 3 and the chip antenna 2 cannot be greater than λ/2, and the full length of the metal element 3 (not shown in the figure) It cannot be less than λ/8, and the height H of the metal element 3 with respect to the circuit substrate 1 cannot be less than λ/16. Therefore, at the same azimuth of a vertical polarization pattern generated by the antenna structure S, a vertical polarization gain generated by the "antenna structure S with the metal element 3" is greater than that of the "antenna without the metal element 3" A vertical polarization gain produced by structure S".

It is worth noting that the antenna structure S provided by the fifth embodiment of the present invention can omit the third vertical section 325 or omit both the second horizontal section 324 and the third vertical section 325 at the same time, so as to form another method for raising the vertical pole Antenna structure S with optimized gain.

[Advantageous effects of the embodiment]

One of the beneficial effects of the present invention is that the present invention provides an antenna structure S for increasing vertical polarization gain, a method for making, assembling and using the same, and a movable device M, which can be achieved by "the antenna structure S includes a circuit The substrate 1, a chip antenna 2 arranged on the circuit substrate 1, and a metal element 3" and "the distance D between the metal element 3 and the chip antenna 2 cannot be greater than λ/2, and the full length of the metal element 3 L cannot be less than λ/8, and the height H of the metal element 3 relative to the circuit substrate 1 cannot be less than λ/16", so that the antenna structure S produces a vertical polarization pattern on the same azimuth. , a vertical polarization gain generated by the antenna structure S using the metal element 3 is greater than a vertical polarization gain generated by the antenna structure S without the metal element 3 .

The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

M: removable device

S: Antenna structure

1: circuit board

101: Upper surface

102: Lower surface

2: chip antenna

3: Metal components

31: Fixed part

32: Extensions

321: First vertical segment

322: First horizontal segment

323: Second vertical segment

324: Second horizontal segment

325: Third vertical segment

D: distance

L: full length

H: height

P1, P2: vertical polarization gain

FIG. 1 is a flowchart of a method for fabricating an antenna structure according to a first embodiment of the present invention.

FIG. 2 is a flowchart of a method for assembling an antenna structure according to a first embodiment of the present invention.

FIG. 3 is a flowchart of a method for using the antenna structure according to the first embodiment of the present invention.

FIG. 4 is a functional block diagram of the portable device according to the first embodiment of the present invention.

FIG. 5 is a schematic perspective view of an antenna structure according to the first embodiment of the present invention.

FIG. 6 is a partial top plan view of the antenna structure according to the first embodiment of the present invention.

FIG. 7 is a schematic side view of the antenna structure according to the first embodiment of the present invention.

FIG. 8 is a graph of voltage standing wave ratios obtained at different frequencies for the antenna structure provided with the metal element and the antenna structure without the metal element according to the first embodiment of the present invention.

FIG. 9 is a graph showing the radiation efficiencies obtained at different frequencies for the antenna structure provided with the metal element and the antenna structure without the metal element according to the first embodiment of the present invention.

FIG. 10 is a graph showing the peak gain obtained at different frequencies for the antenna structure provided with the metal element and the antenna structure without the metal element according to the first embodiment of the present invention.

11 is a schematic diagram of vertical polarization patterns in the Y-Z plane when both the antenna structure using metal elements and the antenna structure without using metal elements according to the first embodiment of the present invention operate at 6239.6 MHz respectively.

12 is a schematic diagram of vertical polarization patterns in the X-Y plane when the antenna structure using metal elements and the antenna structure not using metal elements are respectively operated at 6239.6 MHz according to the first embodiment of the present invention.

13 is a schematic diagram of vertical polarization patterns in the Y-Z plane when both the antenna structure using metal elements and the antenna structure without metal elements according to the first embodiment of the present invention operate at 6489.6 MHz respectively.

14 is a schematic diagram of vertical polarization patterns in the X-Y plane when the antenna structure using metal elements and the antenna structure not using metal elements according to the first embodiment of the present invention operate at 6489.6 MHz respectively.

FIG. 15 is a schematic diagram of vertical polarization patterns in the Y-Z plane when operating at 6739.6 MHz, respectively, of the antenna structure with metal elements and the antenna structure without metal elements according to the first embodiment of the present invention.

16 is a schematic diagram of vertical polarization patterns in the X-Y plane when the antenna structure using metal elements and the antenna structure not using metal elements according to the first embodiment of the present invention operate at 6739.6 MHz respectively.

FIG. 17 is a schematic side view of an antenna structure according to a second embodiment of the present invention.

FIG. 18 is a schematic side view of an antenna structure according to a third embodiment of the present invention.

FIG. 19 is a schematic side view of an antenna structure according to a fourth embodiment of the present invention.

FIG. 20 is a schematic side view of an antenna structure according to a fifth embodiment of the present invention.

Claims (15)

A method for fabricating an antenna structure, comprising: evaluating an optimal position of a virtual chip antenna and a virtual metal element on a virtual circuit substrate and evaluating an optimum position of the virtual metal element through an antenna simulation software optimizing the size to obtain an antenna simulation information; fixing a chip antenna and a metal element on a circuit substrate according to the antenna simulation information to obtain an antenna structure; and testing the antenna structure to obtain the An antenna electrical information and an antenna pattern information of the antenna structure; wherein, when the wavelength of the operating frequency of the antenna structure used for transmitting wireless signals is λ, the distance between the metal element and the chip antenna cannot be greater than λ/2, the full length of the metal element cannot be less than λ/8, and the height of the metal element relative to the circuit substrate cannot be less than λ/16; wherein the chip antenna and the metal element are separated from each other , at the same azimuth of a vertical polarization pattern generated by the antenna structure, a vertical polarization gain generated by the antenna structure using the metal element is greater than that of the antenna without the metal element A vertically polarized gain produced by the structure. The method for fabricating an antenna structure according to claim 1, wherein the optimized positions of the dummy chip antenna and the dummy metal element on the dummy circuit substrate include the position where the dummy chip antenna is located. position information of a chip antenna on the dummy circuit substrate and position information of a metal element of the dummy metal element on the dummy circuit substrate; wherein the optimized size of the dummy metal element includes the dummy metal element a shape information of the metal element, a distance information of the dummy metal element relative to the dummy chip antenna, a full-length information of the dummy metal element, and a height information of the dummy metal element relative to the dummy circuit substrate ; wherein, the antenna simulation information includes the chip antenna position information of the virtual chip antenna, the metal element position information of the virtual metal element, the shape information and the distance information of the virtual metal element , the full-length information and the height information; wherein, the metal element is disposed on one of an upper surface and a lower surface of the circuit substrate and is electrically connected to the circuit substrate, and the chip The antenna is arranged on the upper surface of the circuit substrate; wherein, the metal element is plate-shaped or column-shaped, and the included angle of the metal element relative to the circuit substrate is between 85 degrees and 95 degrees; Wherein, the metal element has a fixing portion fixed on the circuit substrate and an extension portion connected to the fixing portion and extending upward, and the fixing portion of the metal element is welded, locked or clamped. fixed on the circuit substrate; wherein, the distance between the metal element and the chip antenna is between λ/4 and λ/2, and the full length of the metal element is between λ/8 and 2λ , and the height of the metal element relative to the circuit substrate is between λ/16 and 1λ. An antenna structure for improving vertical polarization gain, the antenna structure is made by the manufacturing method of the antenna structure according to claim 1; wherein, a vertical polarization field pattern generated by the antenna structure At the same azimuth, a vertical polarization gain produced by the antenna structure using the metal element is greater than a vertical polarization gain produced by the antenna structure without the metal element; Wherein, the metal element is arranged on one of the upper surface and the lower surface of the circuit substrate and is electrically connected to the circuit substrate, and the chip antenna is arranged on the upper surface of the circuit substrate surface; wherein, the metal element is plate-shaped or columnar, and the included angle of the metal element relative to the circuit substrate is between 85 degrees and 95 degrees; a fixing part on the circuit board and an extension part connected to the fixing part and extending upward, and the fixing part of the metal element is fixed on the circuit board by welding, locking or clamping; wherein , the distance between the metal element and the chip antenna is between λ/4 and λ/2, the full length of the metal element is between λ/8 and 2λ, and the metal element is relative to the circuit. The height of the substrate is between λ/16 and 1λ; wherein, at the operating frequencies of 6239.6MHz, 6489.6MHz and 6739.6MHz, the antenna structure measures voltage standing wave ratios of 1.3, 1.2 and 1.4 respectively; wherein, the The radiation efficiencies of 81%, 81%, and 79% were measured for the antenna structure at the operating frequencies of 6239.6MHz, 6489.6MHz, and 6739.6MHz, respectively; wherein, the antenna structure was at the operating frequencies of 6239.6MHz, 6489.6MHz, and 6739.6MHz. , the peak gains of 1.8dBi, 1.9dBi, and 2.1dBi were measured, respectively. A method for assembling an antenna structure, comprising: providing a circuit substrate, a chip antenna and a metal element; and fixing the chip antenna and the metal element on the circuit substrate to form an antenna structure; wherein, When the antenna structure is used to transmit wireless signals, the operating frequency When the wavelength is λ, the distance between the metal element and the chip antenna cannot be greater than λ/2, the full length of the metal element cannot be less than λ/8, and the height of the metal element relative to the circuit substrate cannot be less than λ/2. At λ/16; wherein, the chip antenna and the metal element are separated from each other, and at the same azimuth of a vertically polarized field pattern generated by the antenna structure, there is the antenna structure using the metal element. A vertical polarization gain is produced that is greater than a vertical polarization gain produced by the antenna structure without the metal element. The method for assembling an antenna structure according to claim 4, wherein the antenna structure obtains an optimization of both a virtual chip antenna and a virtual metal element on a virtual circuit substrate through evaluation of an antenna simulation software The position and an optimized size of the dummy metal element; wherein, the optimized position of both the dummy chip antenna and the dummy metal element on the virtual circuit substrate includes the dummy chip antenna at position information of a chip antenna on the dummy circuit substrate and position information of a metal element of the dummy metal element on the dummy circuit substrate; wherein the optimized size of the dummy metal element includes the dummy metal element a shape information of the metal element, a distance information of the dummy metal element relative to the dummy chip antenna, a full-length information of the dummy metal element, and a height information of the dummy metal element relative to the dummy circuit substrate ; wherein, the antenna simulation information includes the chip antenna position information of the virtual chip antenna, the metal element position information of the virtual metal element, the shape information and the distance information of the virtual metal element , the full-length information and the height information; Wherein, the metal element is arranged on one of the upper surface and the lower surface of the circuit substrate and is electrically connected to the circuit substrate, and the chip antenna is arranged on the upper surface of the circuit substrate surface; wherein, the metal element is plate-shaped or columnar, and the included angle of the metal element relative to the circuit substrate is between 85 degrees and 95 degrees; a fixing part on the circuit board and an extension part connected to the fixing part and extending upward, and the fixing part of the metal element is fixed on the circuit board by welding, locking or clamping; wherein , the distance between the metal element and the chip antenna is between λ/4 and λ/2, the full length of the metal element is between λ/8 and 2λ, and the metal element is relative to the circuit. The height of the substrate is between λ/16 and 1λ. An antenna structure for improving vertical polarization gain, the antenna structure is manufactured by the assembling method of the antenna structure according to claim 4; wherein, the metal element is arranged on an upper surface of the circuit substrate one of the lower surface and the lower surface is electrically connected to the circuit substrate, and the chip antenna is arranged on the upper surface of the circuit substrate; wherein, the metal element is plate-shaped or column-shaped, and the included angle of the metal element relative to the circuit substrate is between 85 degrees and 95 degrees; wherein, the metal element has a fixing portion fixed on the circuit substrate and is connected to the fixing portion and faces upwards. an extension part that extends, and the fixing part of the metal element is fixed on the circuit substrate by welding, locking or clamping; wherein, the distance between the metal element and the chip antenna is between λ/ between 4 and λ/2, the full length of the metal element is between λ/8 and 2λ, and the height of the metal element relative to the circuit substrate is between λ/16 and 1λ; Wherein, the antenna structure measured voltage standing wave ratios of 1.3, 1.2 and 1.4 at the operating frequencies of 6239.6MHz, 6489.6MHz and 6739.6MHz, respectively; wherein, the antenna structure was at 6239.6MHz, 6489.6MHz and 6739.6MHz. At the operating frequency, the radiation efficiencies of 81%, 81% and 79% were measured, respectively; wherein, the antenna structure measured 1.8dBi, 1.9dBi and 2.1dBi at the operating frequencies of 6239.6MHz, 6489.6MHz and 6739.6MHz, respectively peak gain. A method of using an antenna structure, comprising: providing an antenna structure, the antenna structure comprising a circuit substrate, a chip antenna arranged on the circuit substrate, and a metal element arranged on the circuit substrate; and The metal element and the chip antenna cooperate with each other, so that the antenna structure generates a vertical polarization field; wherein, when the wavelength of the working frequency of the antenna structure used for transmitting wireless signals is λ, the The distance between the metal element and the chip antenna cannot be greater than λ/2, the full length of the metal element cannot be less than λ/8, and the height of the metal element relative to the circuit substrate cannot be less than λ/16; wherein , the chip antenna and the metal element are separated from each other, and on the same azimuth of the vertical polarization field pattern generated by the antenna structure, there is a vertical pole generated by the antenna structure using the metal element The polarization gain is greater than a vertical polarization gain produced by the antenna structure without the use of the metal element. A method of using the antenna structure as claimed in claim 7, Wherein, the antenna structure is evaluated by an antenna simulation software to obtain an optimized position of both a virtual chip antenna and a virtual metal element on a virtual circuit substrate and an optimized size of the virtual metal element ; wherein, the optimized positions of the virtual chip antenna and the virtual metal element on the virtual circuit substrate include a chip antenna position information of the virtual chip antenna on the virtual circuit substrate and a metal element position information of the dummy metal element on the dummy circuit substrate; wherein, the optimal size of the dummy metal element includes a shape information of the dummy metal element, the relative size of the dummy metal element A distance information of the virtual chip antenna, a full-length information of the virtual metal element, and a height information of the virtual metal element relative to the virtual circuit substrate; wherein, the antenna simulation information includes the virtual chip The chip antenna position information of the antenna, the metal element position information of the dummy metal element, and the shape information, the distance information, the full length information and the height information of the dummy metal element; wherein, The metal element is arranged on one of an upper surface and a lower surface of the circuit substrate and is electrically connected to the circuit substrate, and the chip antenna is arranged on the upper surface of the circuit substrate ; Wherein, the metal element is plate-shaped or columnar, and the included angle of the metal element with respect to the circuit substrate is between 85 degrees and 95 degrees; wherein, the metal element is fixed on the circuit substrate a fixing part on the metal element and an extension part connected to the fixing part and extending upward, and the fixing part of the metal element is fixed on the circuit substrate by welding, locking or clamping; wherein, the The distance between the metal element and the chip antenna is between λ/4 and λ/2 In between, the full length of the metal element is between λ/8 and 2λ, and the height of the metal element relative to the circuit substrate is between λ/16 and 1λ. An antenna structure for improving vertical polarization gain, the antenna structure is applied to the using method of the antenna structure according to claim 7; wherein, the metal element is arranged on an upper surface and a lower surface of the circuit substrate one of the two surfaces is electrically connected to the circuit substrate, and the chip antenna is arranged on the upper surface of the circuit substrate; wherein, the metal element is plate-shaped or column-shaped, and the The included angle of the metal element relative to the circuit substrate is between 85 degrees and 95 degrees; wherein, the metal element has a fixing portion fixed on the circuit substrate and a fixing portion connected to the fixing portion and extending upward. an extension part, and the fixing part of the metal element is fixed on the circuit substrate by welding, locking or clamping; wherein, the distance between the metal element and the chip antenna cannot be greater than λ/2, The full length of the metal element cannot be less than λ/8, and the height of the metal element relative to the circuit substrate cannot be less than λ/16; wherein, the antenna structure operates at 6239.6MHz, 6489.6MHz and 6739.6MHz At the operating frequencies of 6239.6MHz, 6489.6MHz and 6739.6MHz, the antenna structure measured 81%, 81% and 79% of the radiation respectively. Efficiency; wherein, at the operating frequencies of 6239.6MHz, 6489.6MHz and 6739.6MHz, the antenna structure measured peak gains of 1.8dBi, 1.9dBi and 2.1dBi, respectively. A movable device, the movable device uses an antenna structure, the antenna structure includes a circuit substrate, a chip antenna arranged on the circuit substrate, and a metal element arranged on the circuit substrate; wherein, When the wavelength of the operating frequency of the antenna structure used for transmitting wireless signals is λ, the distance between the metal element and the chip antenna cannot be greater than λ/2, and the overall length of the metal element cannot be less than λ/8, And the height of the metal element relative to the circuit substrate cannot be less than λ/16; wherein, the chip antenna and the metal element are separated from each other, in the same vertical polarization field pattern generated by the antenna structure. In azimuth, a vertical polarization gain produced by the antenna structure using the metal element is greater than a vertical polarization gain produced by the antenna structure without the metal element. The movable device of claim 10, wherein the metal element is disposed on one of an upper surface and a lower surface of the circuit substrate and is electrically connected to the circuit substrate, and the chip The antenna is arranged on the upper surface of the circuit substrate; wherein, the metal element is plate-shaped or column-shaped, and the included angle of the metal element relative to the circuit substrate is between 85 degrees and 95 degrees; Wherein, the metal element has a fixing portion fixed on the circuit substrate and an extension portion connected to the fixing portion and extending upward, and the fixing portion of the metal element is welded, locked or clamped. fixed on the circuit substrate; wherein, the distance between the metal element and the chip antenna is between λ/4 and λ/2, and the full length of the metal element is between λ/8 and 2λ , and the height of the metal element relative to the circuit substrate is between λ/16 and 1λ. The movable device of claim 10, wherein the metal element has a first vertical section and a first horizontal section, the first vertical section is perpendicular to the circuit substrate, and the first horizontal section Extends horizontally from the first vertical segment in a direction away from the chip antenna. The movable device of claim 10, wherein the metal element has a first vertical section, a first horizontal section and a second vertical section, the first vertical section is perpendicular to the circuit substrate, so The first horizontal section extends horizontally from the first vertical section in a direction away from the chip antenna, and the second vertical section extends upward from the first horizontal section and is perpendicular to the first horizontal section. The mobile device of claim 10, wherein the metal element has a first vertical section, a first horizontal section, a second vertical section, and a second horizontal section, the first vertical section being perpendicular to In the circuit substrate, the first horizontal section extends horizontally from the first vertical section in a direction away from the chip antenna, and the second vertical section extends upward from the first horizontal section and is perpendicular to the first horizontal section. a horizontal section, and the second horizontal section extends horizontally from the second vertical section toward a direction close to the chip antenna. The mobile device of claim 10, wherein the metal element has a first vertical section, a first horizontal section, a second vertical section, a second horizontal section, and a third vertical section, the The first vertical section is perpendicular to the circuit substrate, the first horizontal section extends horizontally from the first vertical section in a direction away from the chip antenna, and the second vertical section extends upward from the first horizontal section and perpendicular to the first horizontal section, the second horizontal section extends horizontally from the second vertical section toward the direction close to the chip antenna, and the third vertical section extends upward from the second horizontal section and perpendicular to the second horizontal segment.

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