CN210446572U - Container with heat radiation structure - Google Patents
Container with heat radiation structure Download PDFInfo
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- CN210446572U CN210446572U CN201921476986.4U CN201921476986U CN210446572U CN 210446572 U CN210446572 U CN 210446572U CN 201921476986 U CN201921476986 U CN 201921476986U CN 210446572 U CN210446572 U CN 210446572U
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- semiconductor wafer
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- pressurizing
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Abstract
The utility model discloses a be provided with heat radiation structure's container, including the kettle body, base, semiconductor wafer, circuit board, the base is connected kettle body bottom, the semiconductor wafer with kettle body bottom is hugged closely, the circuit board with the semiconductor wafer is connected and is controlled semiconductor wafer work still includes fin, fan, wind-guiding groove, the fin with the semiconductor wafer is connected, the fan is located the fin below and with the circuit board is connected, the wind-guiding groove sets up on the base lateral wall. The utility model discloses a cooling heat dissipation wind channel that fin, fan, wind-guiding groove formed carries out effectual cooling to the semiconductor piece, has improved the work efficiency of semiconductor piece.
Description
Technical Field
The utility model relates to a container especially relates to a be provided with heat radiation structure's container.
Background
The existing container is generally used for containing liquid food such as water or soup, in order to satisfy the requirement of going out to drink, most containers all have the heat preservation function, because the user is to drinking the different hobbies of temperature, when drinking, if need reduce the temperature, the user need open the bowl cover, cool down to liquid in the container, if the container is in long-time open mode, can produce the pollution to the liquid in the container, therefore, for solving this problem, increase the temperature control part again on the container, carry out rapid heating up or cooling to the liquid in the container, in order to realize the accuse temperature to liquid in the container, the temperature control part in the container is in the use, can produce the heat, current container lacks heat radiation structure, lead to accuse temperature part work efficiency to reduce, need to make the improvement to this.
Disclosure of Invention
The utility model discloses to the lack heat radiation structure who exists among the prior art, lead to defects such as accuse temperature part work efficiency reduction, provide a new container that is provided with heat radiation structure.
In order to solve the technical problem, the utility model discloses a following technical scheme realizes:
a container with a heat dissipation structure comprises a kettle body, a base, a semiconductor wafer and a circuit board, wherein the base is connected to the bottom of the kettle body, the semiconductor wafer is tightly attached to the bottom of the kettle body, the circuit board is connected with the semiconductor wafer and controls the semiconductor wafer to work, the container further comprises a cooling fin, a fan and an air guide groove, the cooling fin is connected with the semiconductor wafer, the fan is located below the cooling fin and connected with the circuit board, and the air guide groove is formed in the side wall of the base.
The kettle body is used for splendid attire liquid, and the base is used for holding semiconductor wafer, circuit board, and the fin is connected in the semiconductor wafer below for absorb the heat of semiconductor wafer, the fan is located the fin below, is used for reducing the temperature of fin, forms the wind channel between fan, fin, the wind-guiding groove, and the heat on the fin is discharged through the wind-guiding groove to the fan, carries out effectual cooling to the semiconductor wafer, the utility model discloses a cooling radiating wind channel that fin, fan, wind-guiding groove formed carries out effectual cooling to the semiconductor wafer, has improved the work efficiency of semiconductor wafer.
Preferably, the container with the heat dissipation structure further includes a heat pipe, one end of the heat pipe is connected to the semiconductor wafer, the other end of the heat pipe is connected to the bottom plate of the base, and the heat pipe is filled with a superconducting liquid.
The heat conduction pipe is filled with superconducting liquid, and the semiconductor wafer is further cooled through the superconducting liquid, so that the temperature of the semiconductor wafer is further reduced, and the working efficiency of the semiconductor wafer is improved.
Preferably, in the container with the heat dissipation structure, the bottom plate of the base is made of metal, and the bottom plate of the base is provided with heat dissipation holes.
The bottom plate of base sets up to metal material and louvre, can accelerate to derive the inside heat of base to further improve the cooling efficiency to the semiconductor piece.
Preferably, in the container with the heat dissipation structure, the heat pipe passes through the heat dissipation fins.
The heat pipe passes the fin, can improve the stability of the installation of heat pipe, and heat pipe and fin can mutually support simultaneously, cool down the semiconductor piece jointly.
Preferably, in the above container with a heat dissipation structure, the semiconductor chip is externally covered with a copper foil, and the copper foil is connected to the semiconductor chip through a heat conductive silicone grease.
The copper foil is used for protecting the semiconductor wafer, meanwhile, the copper foil can lead out heat on the semiconductor wafer, and the heat-conducting silicone grease can also accelerate heat dissipation of the semiconductor wafer while connecting the semiconductor wafer and the copper foil.
Preferably, the container with the heat dissipation structure further comprises a sponge layer, and the sponge layer is arranged around the semiconductor wafer.
The sponge layer is used for protecting the semiconductor wafer, reducing the friction of the semiconductor wafer and prolonging the service life of the semiconductor wafer.
Preferably, the container with the heat dissipation structure comprises a pressing portion, a pressing plug, a pressing portion and a water storage portion, the pressing portion is movably connected with the pressing portion, the upper portion of the pressing plug is connected with the pressing portion and driven by the pressing portion, the lower portion of the pressing plug is located in the pressing portion and abuts against the inner wall of the pressing portion, the water storage portion is connected below the pressing portion, a vent hole is formed in the bottom of the pressing portion, and a water outlet pipe is arranged on the side wall of the water storage portion.
The pressing part is used for driving the pressurizing plug to move downwards, the pressurizing part is matched with the pressurizing plug, the pressure inside the pressurizing part is increased through the movement of the pressurizing plug along the inner wall of the pressurizing part, the vent hole is used for guiding the air pressure inside the pressurizing part into the water storage part, the pressure inside the water storage part is increased, and liquid is guided out from the water outlet pipe.
Preferably, in the container with the heat dissipation structure, a silicone pad is movably connected to the bottom of the pressurizing portion, and the silicone pad is opposite to the vent hole.
The silica gel pad is used for when water storage portion inside pressure increases, upwards removes and seals the air vent, prevents that the liquid in the water storage portion from passing through the air vent and getting into the pressurization portion, influences the use of other parts.
Preferably, in the container with the heat dissipation structure, an elastic member is disposed inside the pressure plug, and one end of the elastic member abuts against the pressing portion and the other end of the elastic member abuts against the pressing portion.
The elastic piece that the pressure plug inside set up for when the user relieves to press, for pressing the splenium and providing ascending elastic restoring force, promote the rebound that presses the splenium, improve the availability factor.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a cross-sectional view of the present invention;
FIG. 3 is an enlarged view of a portion A of FIG. 2;
FIG. 4 is a partial enlarged view of portion B of FIG. 2;
FIG. 5 is a schematic view of the structure inside the base of the present invention;
fig. 6 is an exploded view of the present invention.
Detailed Description
The invention will be described in further detail with reference to the accompanying drawings 1-6 and the detailed description, which are not intended to limit the invention:
example 1
As shown in fig. 1-6, a container with a heat dissipation structure comprises a pot body 1, a base 3, a semiconductor chip 4, a circuit board 8, a heat sink 7, a fan 6, and an air guiding groove 31, wherein the base 3 is connected to the bottom of the pot body 1, the semiconductor chip 4 is tightly attached to the bottom of the pot body 1, the circuit board 8 is connected to the semiconductor chip 4 and controls the semiconductor chip 4 to work, the heat sink 7 is connected to the semiconductor chip 4, the fan 6 is located below the heat sink 7 and connected to the circuit board 8, and the air guiding groove 31 is formed in a side wall of the base 3.
When the kettle is used, liquid is injected into the kettle body 1, the circuit board 8 is started, the semiconductor chip 4 is controlled by the circuit board 8 to carry out refrigeration or heating, the heat radiating fins 7 absorb the heat of the semiconductor chip 4, meanwhile, the fan 6 is started to form an air channel with the heat radiating fins 7 and the air guide grooves 31, the heat on the heat radiating fins 7 is taken away, and the cooling and heat radiating effects of the heat radiating fins 7 are improved.
Preferably, the semiconductor device further comprises a heat conduction pipe 5, one end of the heat conduction pipe 5 is connected with the semiconductor chip 4, the other end of the heat conduction pipe 5 is connected with the bottom plate of the base 3, and the heat conduction pipe 5 is filled with superconducting liquid.
Preferably, the bottom plate of the base 3 is made of metal, and the bottom plate of the base 3 is provided with heat dissipation holes 32.
Preferably, the heat conductive pipes 5 pass through the heat dissipation fins 7.
Preferably, the semiconductor chip 4 is externally covered with a copper foil 42, and the copper foil 42 is connected with the semiconductor chip 4 through a heat-conducting silicone grease.
Preferably, a sponge layer 41 is further included, and the sponge layer 41 is disposed around the semiconductor chip 4.
Preferably, the kettle body 1 comprises a pressing part 11, a pressing plug 13, a pressing part 12 and a water storage part 14, the pressing part 11 is movably connected with the pressing part 12, the upper part of the pressing plug 13 is connected with the pressing part 11 and driven by the pressing part 11, the lower part of the pressing plug 13 is positioned in the pressing part 12 and is abutted against the inner wall of the pressing part 12, the water storage part 14 is connected below the pressing part 12, the bottom of the pressing part 12 is provided with a vent hole 121, and the side wall of the water storage part 14 is provided with a water outlet pipe 2.
Preferably, a silicone pad 122 is movably connected to the bottom of the pressing portion 12, and the silicone pad 122 is opposite to the vent hole 121.
Preferably, an elastic member 131 is provided inside the pressing plug 13, and one end of the elastic member 131 abuts against the pressing portion 11 and the other end thereof abuts against the pressing portion 12.
Specifically, during the use, will store up 14 earlier and follow pressurization portion 12 and unscrew, add water in the storage portion 14 again, revolve storage portion 14 on pressurization portion 12 again, starting circuit board 8, control semiconductor wafer 4 refrigerates or heats, when taking, the user presses according to splenium 11, impresses gas storage portion 14 through air vent 121, and 14 internal pressure of storage portion increase, with liquid from 2 punishments of outlet pipe, realize the utility model discloses a drinking water function, when 14 internal pressure of storage portion increase, silica gel pad 122 rebound, plug up air vent 121, avoid the liquid in the storage portion 14 to get into pressurization portion 12, the influence is used.
In short, the above description is only a preferred embodiment of the present invention, and all the equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the present invention.
Claims (9)
1. The utility model provides a be provided with heat radiation structure's container, includes the kettle body (1), base (3), semiconductor wafer (4), circuit board (8), base (3) are connected the kettle body (1) bottom, semiconductor wafer (4) with the kettle body (1) bottom is hugged closely, circuit board (8) with semiconductor wafer (4) are connected and are controlled semiconductor wafer (4) work, its characterized in that: the semiconductor device is characterized by further comprising a radiating fin (7), a fan (6) and an air guide groove (31), wherein the radiating fin (7) is connected with the semiconductor chip (4), the fan (6) is located below the radiating fin (7) and connected with the circuit board (8), and the air guide groove (31) is formed in the side wall of the base (3).
2. A container provided with a heat dissipating structure according to claim 1, wherein: the semiconductor wafer heat conduction device is characterized by further comprising a heat conduction pipe (5), one end of the heat conduction pipe (5) is connected with the semiconductor wafer (4), the other end of the heat conduction pipe (5) is connected with the base plate of the base (3), and superconducting liquid is filled in the heat conduction pipe (5).
3. A container provided with a heat dissipating structure according to claim 2, wherein: the base plate of base (3) is the metal material, be provided with louvre (32) on the base plate of base (3).
4. A container provided with a heat dissipating structure according to claim 2, wherein: the heat conductive pipe (5) passes through the heat sink (7).
5. A container provided with a heat dissipating structure according to claim 1, wherein: the semiconductor wafer (4) is externally coated with a copper foil (42), and the copper foil (42) is connected with the semiconductor wafer (4) through heat-conducting silicone grease.
6. A container provided with a heat dissipating structure according to claim 1, wherein: and the semiconductor wafer packaging structure further comprises a sponge layer (41), wherein the sponge layer (41) is arranged around the semiconductor wafer (4).
7. A container provided with a heat dissipating structure according to claim 1, wherein: the kettle body (1) comprises a pressing portion (11), a pressurizing plug (13), a pressurizing portion (12) and a water storage portion (14), the pressing portion (11) is movably connected with the pressurizing portion (12), the upper portion of the pressurizing plug (13) is connected with the pressing portion (11) and driven by the pressing portion (11), the lower portion of the pressurizing plug (13) is located in the pressurizing portion (12) and is abutted to the inner wall of the pressurizing portion (12), the water storage portion (14) is connected below the pressurizing portion (12), a vent hole (121) is formed in the bottom of the pressurizing portion (12), and a water outlet pipe (2) is arranged on the side wall of the water storage portion (14).
8. A container provided with a heat dissipating structure according to claim 7, wherein: the bottom of the pressurization part (12) is movably connected with a silica gel pad (122), and the silica gel pad (122) is opposite to the vent hole (121).
9. A container provided with a heat dissipating structure according to claim 7, wherein: an elastic piece (131) is arranged inside the pressurizing plug (13), one end of the elastic piece (131) is abutted to the pressing portion (11) and the other end of the elastic piece is abutted to the pressurizing portion (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921476986.4U CN210446572U (en) | 2019-09-06 | 2019-09-06 | Container with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921476986.4U CN210446572U (en) | 2019-09-06 | 2019-09-06 | Container with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210446572U true CN210446572U (en) | 2020-05-05 |
Family
ID=70433443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921476986.4U Active CN210446572U (en) | 2019-09-06 | 2019-09-06 | Container with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210446572U (en) |
-
2019
- 2019-09-06 CN CN201921476986.4U patent/CN210446572U/en active Active
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