SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an engine unit is with closed circulative cooling system to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a closed circulative cooling system for engine block, includes cooler bin, connecting pipe, water pump, cooling tube, semiconductor refrigeration piece and engine block, the cooler bin bottom is connected through the end of intaking of connecting pipe and water pump, the play water end of water pump is connected with the cooling tube, the contact of the refrigeration end of cooling tube and semiconductor refrigeration piece, the outside of engine block is equipped with the cooling bath with cooling tube matched with, the cooling tube is along the cooling bath winding in the outside of engine block, the one end that the semiconductor refrigeration piece was kept away from to the cooling tube is connected with the cooler bin.
Preferably, the refrigeration end of semiconductor refrigeration piece is equipped with the mounting panel, and the mounting panel is made by high heat conduction material, the mounting panel is connected with the semiconductor refrigeration piece through heat conduction glue, the one end that the semiconductor refrigeration piece was kept away from to the mounting panel is equipped with the recess with cooling tube matched with, the cooling tube embedding is in the recess.
Preferably, the heating end of semiconductor refrigeration piece is fixed with radiating fin through heat-conducting glue, the mounting bracket is installed at radiating fin's top, the top of mounting bracket is fixed with the heat dissipation fan, and is equipped with under the mounting bracket is located the heat dissipation fan with heat dissipation fan matched with through-hole.
Preferably, the one end side of mounting bracket is fixed with the fixed plate, be fixed with the shower nozzle on the fixed plate, and the shower nozzle just to radiating fin, the shower nozzle passes through pipeline and radiator intercommunication.
Preferably, the pipeline between shower nozzle and the connecting pipe installs the solenoid valve, the cooling tube is located and installs temperature sensor between semiconductor refrigeration piece and the engine block, and temperature sensor and solenoid valve all with car control system electric connection.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses add coolant liquid or other radiating liquid of being convenient for in the cooler bin is inside, then take out the solution through the water pump in the cooler bin, cool down the solution in the cooler bin under the effect of semiconductor refrigeration piece to the cooler bin becomes the s type, is convenient for increase and the area of semiconductor refrigeration piece contact, thereby can increase the speed of heat transfer, and when in-service use, the cooler bin can adopt the metal material, thereby is convenient for heat conduction.
2. The utility model discloses a mounting panel can restrict the cooling tube to can increase the area of contact between mounting panel and the cooling tube, and then can be convenient for cool down the inside solution of cooling tube, thereby be convenient for subsequent cooling.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1, the utility model provides a technical solution: a closed circulating cooling system for an engine unit comprises a cooling box 1, a connecting pipe 2, a water pump 3, a cooling pipe 4, a semiconductor refrigerating sheet 5 and the engine unit 6, wherein the bottom of the cooling box 1 is connected with a water inlet end of the water pump 3 through the connecting pipe 2, a water outlet end of the water pump 3 is connected with the cooling pipe 4, the cooling pipe 4 is in contact with a refrigerating end of the semiconductor refrigerating sheet 5, a cooling groove matched with the cooling pipe 4 is formed in the outer side of the engine unit 6, the cooling pipe 4 is wound on the outer side of the engine unit 6 along the cooling groove, one end, far away from the semiconductor refrigerating sheet 5, of the cooling pipe 4 is connected with the cooling box 1, when the closed circulating cooling system is used, cooling liquid or other liquid convenient for heat dissipation is added into the cooling box 1, then the solution is pumped into the cooling pipe 4 through the water pump 3, and the solution in the cooling pipe 4 is cooled under the action of the, and cooling tube 4 becomes the s type, is convenient for increase with the area of semiconductor refrigeration piece 5 contact to can increase the speed of heat transfer, when in actual use, cooling tube 4 can adopt the metal material, thereby is convenient for heat conduction.
As shown in fig. 2, the refrigeration end of semiconductor refrigeration piece 5 is equipped with mounting panel 7, and mounting panel 7 is made by high heat-conducting material, mounting panel 7 is connected with semiconductor refrigeration piece 5 through heat-conducting glue, the one end that semiconductor refrigeration piece 5 was kept away from to mounting panel 7 is equipped with the recess with cooling tube 4 matched with, cooling tube 4 imbeds in the recess, can restrict cooling tube 4 through mounting panel 7 to can increase the area of contact between mounting panel 7 and the cooling tube 4, and then can be convenient for cool down the inside solution of cooling tube 4, thereby be convenient for subsequent cooling.
Semiconductor refrigeration piece 5's the end of heating is fixed with radiating fin 8 through heat-conducting glue, mounting bracket 9 is installed at radiating fin 8's top, mounting bracket 9's top is fixed with heat dissipation fan 10, and is located radiating fan 10 and is equipped with under, and the through-hole is convenient for the gas circulation with heat dissipation fan 10 matched with through-hole, makes things convenient for heat dissipation fan 10 to dispel the heat to radiating fin 8.
The one end side of mounting bracket 9 is fixed with fixed plate 11, be fixed with shower nozzle 12 on the fixed plate 11, and shower nozzle 12 just to radiating fin 8, shower nozzle 12 passes through pipeline and radiator intercommunication, can be convenient for spray water to radiating fin 8 through shower nozzle 12, and the evaporation of water can increase the radiating effect to increase the refrigeration effect of semiconductor refrigeration piece 5.
Pipeline between shower nozzle 12 and the connecting pipe 2 installs solenoid valve 13, cooling tube 4 is located and installs temperature sensor 14 between semiconductor refrigeration piece 5 and the engine unit 6, and temperature sensor 14 and solenoid valve 13 all with car control system electric connection, can detect the liquid temperature after the refrigeration of semiconductor refrigeration piece 5 through temperature sensor 14, if the weather is overheated when leading to the refrigeration effect unsatisfactory, the temperature that temperature sensor detected 14 can increase, thereby control system control solenoid valve 13 through the car is opened, dispel the heat to radiating fin 8, thereby can reach better radiating effect.
The working principle is as follows: when the cooling box is used, cooling liquid or other liquid convenient for heat dissipation is added into the cooling box 1, then the solution is pumped into the cooling pipe 4 through the water pump 3, the solution in the cooling pipe 4 is cooled under the action of the semiconductor refrigerating sheet 5, the cooling pipe 4 is in an S shape, the contact area with the semiconductor refrigerating sheet 5 is convenient to increase, so that the heat transfer rate can be increased, in practical use, the cooling pipe 4 can be made of metal materials, so that heat conduction is convenient, the cooling pipe 4 can be limited through the mounting plate 7, the contact area between the mounting plate 7 and the cooling pipe 4 can be increased, further, the solution in the cooling pipe 4 can be conveniently cooled, so that subsequent cooling is convenient, water can be conveniently sprayed to the radiating fins 8 through the spray head 12, the heat dissipation effect can be increased through the evaporation of water, and the refrigerating effect of the semiconductor refrigerating sheet 5 is increased, can detect the liquid temperature after the refrigeration of semiconductor refrigeration piece 5 through temperature sensor 14, if the weather is overheated to lead to when refrigeration effect is unsatisfactory, temperature sensor detects 14 temperatures and can increase to control system control solenoid valve 13 through the car is opened, dispels the heat to radiating fin 8, thereby can reach better radiating effect.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.