CN210432291U

CN210432291U - Heat sink device

Info

Publication number: CN210432291U
Application number: CN201921171164.5U
Authority: CN
Inventors: 陈柏州; 刘阿生; 陈朝泉; 刘冠昕
Original assignee: Shenzhen Holdled Opto Co ltd
Current assignee: Shenzhen Holdled Opto Co ltd
Priority date: 2019-07-24
Filing date: 2019-07-24
Publication date: 2020-04-28
Anticipated expiration: 2029-07-24

Abstract

The utility model discloses a heat dissipation device, which comprises a substrate and a plurality of heat exchange fins. The substrate is provided with a first surface and a second surface, the heat exchange fins are arranged on the first surface of the substrate and protrude out of the first surface of the substrate, the heat exchange fins are arranged at intervals, a groove is formed between every two adjacent heat exchange fins and is recessed in the first surface of the substrate, and the grooves are recessed from the first surface of the substrate towards the second surface. Therefore, a larger heat exchange area can be obtained, and the fluid is closer to a heat source, so that the heat dissipation efficiency of the fluid is improved.

Description

Heat sink device

Technical Field

The utility model relates to a heat abstractor technical field, in particular to can be used for assisting radiating heat abstractor of electron heating element.

Background

In addition to miniaturization of the device, the amount of heat generated by the device is also greatly increased, and the amount of heat generated during operation is also large. The corresponding heat dissipation devices are arranged for various electronic heating elements so as to maintain the normal operation of the electronic heating elements at the allowable temperature.

For high power electronic heating elements, a water cooling head is generally used to assist heat dissipation, and the water cooling head includes a substrate and a plurality of heat exchange fins disposed on the substrate to increase heat exchange area. The heat exchange fins are usually fabricated by pre-forming a boss on a substrate, and milling a plurality of grooves on the boss by using a cutter, wherein the grooves are located outside the surface of the substrate, and the heat exchange fins are formed among the grooves. In addition, a plurality of grooves can be directly milled on the substrate by utilizing a cutter so as to form a plurality of heat exchange fins.

In addition, the water cooling head can also comprise a cover body which is covered on the base plate, so that the heat exchange fins are positioned in the cavity of the cover body, and fluid can be input into the cavity through a water inlet and output from a water outlet. The substrate can be in contact with the electronic heating element, and when fluid passes through the chamber, heat generated by the electronic heating element can be rapidly taken away through the fluid so as to assist the electronic heating element in heat dissipation.

However, the conventional heat dissipation device cannot obtain a large heat exchange area, and the fluid cannot be closer to the heat source, so that the heat dissipation efficiency is difficult to improve.

SUMMERY OF THE UTILITY MODEL

The main objective of the present invention is to provide a heat dissipation device, which aims to obtain a large heat exchange area and make the fluid closer to the heat source, so as to improve the heat dissipation efficiency.

In order to achieve the above object, the utility model provides a heat dissipation device, include:

the substrate is provided with a first surface and a second surface, and the first surface and the second surface are respectively positioned on two opposite surfaces of the substrate; and

the heat exchange fins are arranged on the first surface of the substrate and protrude out of the first surface of the substrate, the heat exchange fins are arranged at intervals, a groove is formed between every two adjacent heat exchange fins, the grooves are recessed in the first surface of the substrate, and the grooves are recessed from the first surface of the substrate towards the direction of the second surface.

The utility model discloses heat abstractor technical scheme, its a plurality of slots cave in the first surface of base plate, and a plurality of slots are sunken by the first surface of base plate towards the direction of second surface, make a plurality of the slot is comparatively close to the second surface and the heat source of base plate, and is a plurality of when the fluid passes through during the slot, the fluid can be more close the heat source, can provide the radiating efficiency of heat source preferred, and a plurality of the slot is sunken by the first surface of base plate towards the direction of second surface, also can make a plurality of heat exchange fins's the increase by a wide margin of heat exchange area to increase heat exchange rate, promote its radiating efficiency.

Drawings

Fig. 1 is a perspective view (i) of an embodiment of the heat dissipation device of the present invention.

Fig. 2 is a perspective view (ii) of an embodiment of the heat dissipation device of the present invention.

Fig. 3 is a cross-sectional view iii-iii of fig. 1.

FIG. 4 is a cross-sectional view of the lines IV-IV of FIG. 1.

Fig. 5 is an exploded perspective view of another embodiment of the heat dissipation device of the present invention.

Fig. 6 is a perspective view of another embodiment of the heat dissipation device of the present invention.

FIG. 7 is a cross-sectional view of VII-VII of FIG. 6.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indicators (such as … …, upper, lower, left, right, front, back, top, bottom, inner, outer, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial) are involved in the embodiments of the present invention, the directional indicators are only used to explain the relative position, motion, etc. of the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicators are changed accordingly.

In addition, if there is a description relating to "first" or "second", etc. in the embodiments of the present invention, the description of "first" or "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Example 1

Referring to fig. 1 to 4, the present invention provides a heat dissipation device, and more particularly, to a heat dissipation device applicable to a water cooling device or an air cooling device, wherein the heat dissipation device is made of a metal material with good thermal conductivity (such as aluminum or copper), and the heat dissipation device includes a substrate 1 and a plurality of heat exchange fins 2.

The substrate 1 is a plate body, and the shape thereof is not limited, and in the embodiment, the substrate 1 is a square plate body. The substrate 1 has a first surface 11 and a second surface 12, the first surface 11 and the second surface 12 are respectively located on two opposite sides of the substrate 1, and the first surface 11 and the second surface 12 may be a plane or a concave-convex surface, which is not limited. The second surface 12 can be used to contact a heat source (e.g., an electronic heating element) so that the high temperature of the heat source can be transmitted to the substrate 1 and the plurality of heat exchange fins 2. In this embodiment, the second surface 12 is provided with a protrusion 121 for contacting a heat source.

The plurality of heat exchange fins 2 are disposed on the first surface 11 of the substrate 1, and the plurality of heat exchange fins 2 protrude from the first surface 11 of the substrate 1. The heat exchange fins 2 can be fabricated by pre-forming a boss 3 on the first surface 11 of the substrate 1, and then milling a plurality of grooves 4 on the boss 3 by using a cutter, wherein the heat exchange fins 2 are formed among the grooves 4, and one side of the grooves 4, which is far away from the first surface 11 of the substrate 1, is open. A groove 4 is formed between every two adjacent heat exchange fins 2, the heat exchange fins 2 are separated by the grooves 4, so that the heat exchange fins 2 are arranged at intervals, and the opposite ends of the grooves 4 are open, so that fluid can flow along the extending direction of the grooves 4 to contact with the heat exchange fins 2 for heat exchange.

The grooves 4 are recessed (cut into) the first surface 11 of the substrate 1, and the grooves 4 are recessed from the first surface 11 of the substrate 1 toward the second surface 12, so that the grooves 4 are closer to the second surface 12 of the substrate 1 and a heat source (e.g., an electronic heating element), when a fluid (cooling water) passes through the grooves 4, a better heat dissipation efficiency of the heat source can be provided, and the grooves 4 are recessed from the first surface 11 of the substrate 1 toward the second surface 12, so that the heat exchange area of the heat exchange fins 2 can be increased.

In this embodiment, a plurality of groove bottom surfaces 13 are formed on one side of the substrate 1 close to the plurality of grooves 4, the plurality of groove bottom surfaces 13 are respectively adjacent to the plurality of grooves 4, the plurality of groove bottom surfaces 13 respectively have a straight line segment 131 and two

arc line segments

132 and 133, and the two

arc line segments

132 and 133 are respectively connected to two opposite ends of the straight line segment 131. The two

arc segments

132, 133 are used to guide the fluid into and out of the bottom of the trench 4, respectively.

In the present embodiment, the plurality of grooves 4 extend in the same direction, that is, the plurality of grooves 4 are parallel to each other, and the plurality of heat exchange fins 2 extend in the same direction, that is, the plurality of heat exchange fins 2 are parallel to each other. It should be noted that the extending direction of the plurality of grooves 4 is not limited, for example, in another embodiment, the plurality of grooves 4 may also be perpendicular to each other.

Example 2

Referring to fig. 5 to 7, the heat dissipating device of the present invention may further include a cover 5, the cover 5 has a cover plate 51, a cavity 52 is formed in the cover plate 51, the cavity 52 opens toward one side of the base plate, the cover plate 51 is connected to a water inlet 53 and a water outlet 54, the water inlet 53 and the water outlet 54 are connected to the cavity 52, and preferably, the water inlet 53 and the water outlet 54 are respectively close to two opposite sides of the cover plate 51. The cover 5 is placed on the substrate 1, and a sealing element (not shown) may be disposed between the substrate 1 and the cover 5 (especially at the matching position), so that the substrate 1 and the cover 5 can maintain good sealing performance, and fluid is not easy to leak out when flowing between the substrate 1 and the cover 5. One side of the heat exchange fins 2 away from the first surface 11 of the substrate 1 may abut against the cover plate 51 of the cover 5, so that one side of the grooves 4 away from the first surface 11 of the substrate 1 is closed. The substrate 1 and the cover 5 can form a water cooling head, which can assist the heat dissipation of the heat source (such as the electronic heating element) by water cooling.

The heat exchanging fins 2 are located in the cavity 52 of the cover 5, and a fluid (e.g. cooling water) can be input into the cavity 52 through the water inlet 53, so that the fluid can contact with the heat exchanging fins 2 for heat exchanging, and the heat exchanged fluid is output from the water outlet 54. The second surface 12 of the substrate 1 may be in contact with a heat source (e.g., an electronic heating element) that is capable of rapidly removing heat generated by the heat source as a fluid passes through the chamber 52 to assist in dissipating the heat from the heat source.

The heat dissipation device of the present invention can also be applied to an air cooling device, and the heat dissipation device includes a substrate 1 and a plurality of heat exchange fins 2, and is plural the groove 4 is recessed toward the direction of the second surface 12 from the first surface 11 of the substrate 1, so that the groove 4 is plural and is relatively close to the second surface 12 of the substrate 1 and a heat source (such as an electronic heating element), and fluid (air) is made to pass through the groove 4, thereby providing a better heat dissipation efficiency of the heat source.

The utility model has the advantages that:

the utility model discloses heat abstractor includes a base plate and a plurality of heat exchange fins, and is a plurality of heat exchange fins sets up on the first surface of base plate, and is a plurality of heat exchange fins protrusion is in the first surface of base plate, respectively forms a slot between every two adjacent heat exchange fins, and is a plurality of the slot caves in the first surface of base plate, and is a plurality of the slot is sunken by the first surface of base plate towards the direction of second surface, makes a plurality of the slot is comparatively close to the second surface and the heat source of base plate, and is a plurality of when the fluid passes through during the slot, the fluid can be closer to the heat source, can provide the radiating efficiency of heat source preferred, and is a plurality of the slot is sunken by the first surface of base plate towards the direction of second surface, also can make a plurality of heat exchange fins's increase by a wide margin to increase heat exchange rate, promote its radiating efficiency.

The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.

Claims

1. A heat dissipating device, comprising:

2. The heat dissipating device of claim 1, wherein: the substrate is provided with a plurality of grooves, a plurality of groove bottom surfaces are formed on one side, close to the plurality of grooves, of the substrate, the groove bottom surfaces are respectively adjacent to the plurality of grooves, each groove bottom surface is provided with a straight line segment and two arc line segments, and the two arc line segments are respectively connected to two opposite ends of the straight line segments.

3. The heat dissipating device of claim 1, wherein: the second surface is provided with a convex part which can be used for contacting with a heat source.

4. The heat dissipating device of claim 1, wherein: a boss is formed on the first surface of the substrate, and a plurality of grooves are milled on the boss.

5. The heat dissipating device of claim 1, wherein: the extending directions of the grooves are the same, and the grooves are parallel to each other.

6. The heat dissipating device of claim 1, wherein: the opposite ends of the plurality of grooves are open.

7. The heat dissipating device of claim 1, wherein: the cover body is provided with a cover plate, a cavity is formed in the cover plate, the cover plate is connected with a water inlet and a water outlet, the water inlet and the water outlet are communicated with the cavity, the cover body is covered on the base plate, the heat exchange fins are located in the cavity of the cover body, fluid can be input into the cavity through the water inlet, the fluid can be in contact with the heat exchange fins to exchange heat, and the fluid after heat exchange is output through the water outlet.

8. The heat dissipating device of claim 7, wherein: the water inlet and the water outlet are respectively close to two opposite sides of the cover plate.

9. The heat dissipating device of claim 7, wherein: one side of the heat exchange fins, which is far away from the first surface of the base plate, is abutted against the cover plate of the cover body, so that one side of the grooves, which is far away from the first surface of the base plate, is closed.

10. The heat dissipating device of claim 7, wherein: a sealing element is arranged between the substrate and the cover body.