CN210429761U

CN210429761U - Novel semiconductor bending machine

Info

Publication number: CN210429761U
Application number: CN201921800266.9U
Authority: CN
Inventors: 陈磊
Original assignee: Nantong Guoshang Precision Machinery Co Ltd
Current assignee: Nantong Guoshang Precision Machinery Co Ltd
Priority date: 2019-10-24
Filing date: 2019-10-24
Publication date: 2020-04-28
Anticipated expiration: 2029-10-24

Abstract

The utility model discloses a novel semiconductor bender relates to semiconductor bending technical field. The utility model discloses a workstation, first quick-witted case is installed to the one end at workstation top, and the second machine case is installed to the opposite side on workstation top, and the internally mounted of second machine case has the hydraulic press, and one side threaded connection of hydraulic press has the goods pushing rod, and the rotation motor is all installed near the both ends of hydraulic press in the inside of second machine case, and the carousel is all installed near the both sides of goods pushing rod to the one end of second machine case, and the one end of two carousels is installed and is beaten the knee. The utility model discloses a processing of different angles can be accomplished according to the production needs to work piece to a series of designs, makes the product appearance abundant diversified, and can be automatic carry the semiconductor component that will bend to the department of bending and bend, also can release the semiconductor component after bending to alleviateed operation workman's labour output greatly, and then improved the work efficiency who bends to the semiconductor.

Description

Novel semiconductor bending machine

Technical Field

The utility model relates to a semiconductor technical field that bends, more specifically say, relate to a novel semiconductor bender.

Background

The semiconductor refers to the material that electric conductive property is between conductor and insulator under the normal atmospheric temperature, the semiconductor bending processing has wide application in fields such as consumer electronics, communication system, medical instrument, just adopt the device of semiconductor preparation like the diode, no matter from science and technology or economic development's perspective, the importance of semiconductor bending processing is very huge, most electronic product today, core unit in computer, mobile phone or digital recorder all has very close relation with the semiconductor, current semiconductor bending machine ubiquitous bending process is single, the work piece can't be automatic feeding, and do not set up the automatic mechanism that sends out of finished product after bending, the utility model discloses a new solution is proposed to above problem.

SUMMERY OF THE UTILITY MODEL

The invention aims to provide a novel semiconductor bending machine to solve the technical problems mentioned in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme: a novel semiconductor bending machine comprises a workbench, wherein a first case is installed at one end of the top of the workbench, a second case is installed at the other side of the top of the workbench, a hydraulic machine is installed in the second case through screws, a pushing rod is in threaded connection with one side of the hydraulic machine, rotating motors are installed in the second case and located on two sides of the hydraulic machine, turntables are installed at two ends of one side of the second case and located on two sides of the pushing rod, bending rods are installed on the other sides of the two turntables, a first switch is installed at the top of the second case, hexagonal screws are installed at two sides of the top of the second case close to the first switch, a conveying wheel is installed at one side of the first case, a conveying belt is connected to the outer side of the conveying wheel in a transmission manner, seven supporting rods are fixed at one side of the top of the workbench close to the first case, wherein three the bracing piece plug-in connection has the propulsion screw rod, four in addition the bracing piece just is located the both sides welded connection who impels the screw rod has the slide bar, two the outside plug-in connection of slide bar has the feed table.

Preferably, the rotating motor is connected with the second chassis through a hexagon screw.

In any of the above embodiments, preferably, S7-200PLC is installed inside the second enclosure.

In any of the above schemes, preferably, a groove is formed in the middle of one end of the feeding table, an internal thread through hole is formed in the groove, and the feeding table is in threaded connection with the propelling screw.

In any of the above schemes, preferably, through holes are formed in both ends of the feeding table and on both sides of the threaded hole, the inner diameter of each through hole is the same as the outer diameter of the corresponding sliding rod, and the feeding table is in clearance fit with the sliding rods.

In any of the above schemes, preferably, a through hole is formed in the middle of one end of the second chassis, and the pushing rod is connected with the hydraulic press in a welding mode through a through hole.

Compared with the prior art, the utility model has the advantages of:

(1) the utility model discloses lay the semiconductor work piece on the slide bar earlier, stimulate the second switch circular telegram, under the drive of motor, the transfer gear passes through conveyer and drives the screw rod rotation of propelling, under the rotation of propelling screw rod, the feed table passes through the screw thread and passes power, move to one side of second machine case along the slide bar, accomplish the installation of treating processing of work piece, after the installation is accomplished, stimulate first switch circular telegram, two rotation motor antiport after the circular telegram, thereby drive two carousel antiport, the work piece is accomplished the processing under the rotation of the pole of bending, traditional semiconductor bending machine adopts mould punching press to accomplish bending mostly, can only accomplish the fixed camber of ninety degrees, and this device can accomplish the processing work of the finished product work piece of different angles as required, make the product appearance richen diversified;

(2) the utility model discloses after accomplishing the processing, owing to inside S7-PLC that is equipped with, under the effect of this controller, the hydraulic press begins work and promotes to push away the goods pole and do the back and forth movement, through the effect that pushes away the goods pole, accomplishes the work of finished product ejection of compact, has saved the manpower greatly, has improved the work efficiency of bending to the semiconductor.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a top view of the overall structure of the present invention;

fig. 3 is a schematic diagram of an internal structure of the second case of the present invention.

The reference numbers in the figures illustrate:

1. a work table; 2. a first chassis; 3. a second chassis; 4. a hex screw; 5. a turntable; 6. a first switch; 7. a pushing rod; 8. a support bar; 9. a slide bar; 10. a screw is advanced; 11. a transfer wheel; 12. a conveyor belt; 13. a feeding table; 14. bending the rod; 15. a hydraulic press; 16. rotating the motor; 17. a second switch.

Detailed Description

The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention based on the embodiments of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are used in a broad sense, and for example, "connected," may be fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediate medium, or connected between two elements.

The specific embodiment is as follows:

referring to fig. 1-3, a novel semiconductor bending machine comprises a workbench 1, a first machine box 2 is installed at one end of the top of the workbench 1, a second machine box 3 is installed at the other side of the top end of the workbench 1, a hydraulic machine 15 is installed inside the second machine box 3 through screws, a pushing rod 7 is connected to one side of the hydraulic machine 15 through threads, rotating motors 16 are installed inside the second machine box 3 and located at two sides of the hydraulic machine 15, turntables 5 are installed at two ends of one side of the second machine box 3 and located at two sides of the pushing rod 7, bending rods 14 are installed at the other sides of the two turntables 5, a first switch 6 is installed at the top of the second machine box 3, hexagonal screws 4 are installed at two sides of the top of the second machine box 3 close to the first switch 6, a conveying wheel 11 is installed at one side of the first machine box 2, a conveying belt 12 is connected to the outer side of the conveying wheel 11 in a transmission manner, seven supporting rods 8 are fixed at one side, wherein three bracing pieces 8 are in plug-in connection with a propelling screw 10, the two sides of the other four bracing pieces 8 which are positioned on the propelling screw 10 are in welded connection with slide bars 9, the outer sides of the two slide bars 9 are in plug-in connection with a feeding table 13, the middle part of one end of the second case 3 is provided with a through hole, and the pushing rod 7 is in welded connection with a hydraulic press 15 through a through hole.

In the present embodiment, in order to fix the rotating motor 16 to the second housing 3, the rotating motor 16 is connected to the second housing 3 by the hexagon screws 4.

In this embodiment, the second housing 3 is internally installed with S7-200PLC for efficient operation of the process steps.

In this embodiment, in order to effectively perform the mechanical feeding work, a groove is formed in the middle of one end of the feeding table 13, an internal threaded through hole is formed inside the groove, and the feeding table 13 is connected with the propelling screw 10 through a thread.

In this embodiment, in order to facilitate the reciprocating motion of the feeding table 13 on the sliding rod 9, through holes are formed in both ends of the feeding table 13 and on both sides of the threaded hole, the inner diameter of each through hole is the same as the outer diameter of the sliding rod 9, and the feeding table 13 is in clearance fit with the sliding rod 9.

In this embodiment, in order to complete the discharging operation of the finished product, a through hole is formed in the middle of one end of the second case 3, and the pushing rod 7 is connected with the hydraulic press 15 by welding through the through hole.

The working principle is as follows:

when in use, the utility model firstly lays the semiconductor workpiece on the slide bar 9, the second switch 17 is pulled to be electrified, the transmission wheel 11 drives the pushing screw 10 to rotate through the transmission belt 12 under the driving of the motor, the feeding platform 13 transmits force through the screw thread to move to one side of the second case 3 along the slide bar 9 under the rotation of the pushing screw 10, the to-be-processed installation of the workpiece is completed, after the installation is completed, the first switch 6 is pulled to be electrified, the two rotating motors 16 reversely rotate after the electrification so as to drive the two turntables 5 to reversely rotate, the workpiece completes the processing under the rotation of the bending rod 14, most of the traditional semiconductor bending machines adopt the die stamping to complete the bending, only the fixed bending degree of ninety degrees can be completed, the device can complete the processing work of the finished product workpieces with different angles according to the needs, the appearance of the product is diversified, the utility model discloses after the processing is completed, because the S7-200PLC is arranged in the device, under the action of the controller, the hydraulic press 15 starts to work to push the pushing rod 7 to move back and forth, and the finished product is discharged under the action of the pushing rod 7, so that the labor is greatly saved, and the working efficiency of bending the semiconductor is improved.

The above description is only the preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by replacing or changing the technical solution and the improvement concept of the present invention with equivalents and modifications within the technical scope of the present invention.

Claims

1. A novel semiconductor bending machine comprises a workbench (1) and is characterized in that a first case (2) is installed at one end of the top of the workbench (1), a second case (3) is installed at the other side of the top of the workbench (1), a hydraulic machine (15) is installed inside the second case (3) through screws, a goods pushing rod (7) is connected to one side of the hydraulic machine (15) through threads, rotating motors (16) are installed inside the second case (3) and on two sides of the hydraulic machine (15), turntables (5) are installed at two ends of one side of the second case (3) and on two sides of the goods pushing rod (7), bending rods (14) are installed on the other sides of the turntables (5), a first switch (6) is installed at the top of the second case (3), and hexagonal screws (4) are installed on two sides of the top of the second case (3) close to the first switch (6), conveying wheel (11) are installed to one side of first quick-witted case (2), the outside transmission of conveying wheel (11) is connected with conveyer (12), one side that the top of workstation (1) is close to first quick-witted case (2) is fixed with seven bracing pieces (8), wherein three bracing piece (8) plug-in connection has propulsion screw rod (10), four in addition bracing piece (8) and the both sides welded connection who is located propulsion screw rod (10) have slide bar (9), two the outside plug-in connection of slide bar (9) has feed table (13).

2. The novel semiconductor bender according to claim 1, characterized in that: the rotating motor (16) is connected with the second case (3) through a hexagon screw (4).

3. The novel semiconductor bender according to claim 1, characterized in that: and S7-200PLC is installed in the second case (3).

4. The novel semiconductor bender according to claim 1, characterized in that: the middle position of one end of the feeding table (13) is provided with a groove, an internal thread through hole is formed in the groove, and the feeding table (13) is connected with the pushing screw rod (10) through threads.

5. The novel semiconductor bender according to claim 1, characterized in that: the two ends of the feeding table (13) are provided with through holes in the two sides of the threaded holes, the inner diameter of each through hole is the same as the outer diameter of the corresponding sliding rod (9), and the feeding table (13) is in clearance fit with the sliding rods (9).

6. The novel semiconductor bender according to claim 1, characterized in that: a through hole is formed in the middle of one end of the second case (3), and the goods pushing rod (7) is connected with the hydraulic machine (15) in a welding mode through the through hole.