CN210427714U - IGBT bonding point thrust testing arrangement - Google Patents
IGBT bonding point thrust testing arrangement Download PDFInfo
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- CN210427714U CN210427714U CN201921220207.4U CN201921220207U CN210427714U CN 210427714 U CN210427714 U CN 210427714U CN 201921220207 U CN201921220207 U CN 201921220207U CN 210427714 U CN210427714 U CN 210427714U
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/24—Investigating strength properties of solid materials by application of mechanical stress by applying steady shearing forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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Abstract
The utility model discloses a thrust test device for IGBT bonding points, wherein a vertical seat is connected to the upper end of a base, a first sliding groove is arranged at the upper end of the base, a second sliding groove is arranged at the front side of the vertical seat, the upper end of the first sliding groove is connected with a positioning mechanism, and the second sliding groove is connected with a test mechanism; the positioning mechanism comprises a side wall, a sliding rod and a base, a placing groove is formed in the middle of the side wall, limiting blocks are connected to two sides of the side wall, and limiting columns are connected to the front ends of the limiting blocks; one end of the sliding rod is provided with a strip hole, the limiting column is embedded into the strip hole of the sliding rod, the other end of the sliding rod is provided with a positioning hole, and the positioning hole covers the outer side of the placing groove; the base is connected to the lower end of the side wall, the bottom of the base is connected with a cross rod, and the cross rod is embedded into the first sliding groove; the rear side of the test sensor is embedded into and moves in the second sliding groove, and the connecting rod is connected between the test sensor and the test cutter. The problems of low precision of manual testing and high cost of automatic testing in the current IGBT bonding point thrust testing are solved.
Description
Technical Field
The utility model relates to a IGBT bonding point thrust test dress belongs to IGBT test technical field.
Background
The IGBT is an insulated gate bipolar transistor, which has the advantages of MOS (metal-oxide-semiconductor field effect transistor) easy to drive, simple to control, and high switching frequency, and also has the significant advantages of bjt (bipolar Junction transistor) triode with low on-state voltage, large on-state current, and low loss, and is the most representative platform device in a novel power electronic semiconductor device.
The IGBT core component is an IGBT chip, and when the IGBT is packaged, each chip and a DBC (ceramic copper clad laminate) are connected by using a bonding wire through ultrasonic bonding to form a complete circuit structure, so that the electrical property of the product is realized. In the bonding process, a bonding thrust test needs to be carried out on the DBC subjected to wire bonding, and whether the strength of a bonding point meets the process requirement (more than 800g) is detected so as to carry out process control and process capability calculation.
Conventional instruments for bond push tests are often used in two ways: first, manual tester: the bonding point is pushed away in a hand-push mode, although the operation cost is low, the bonding point cannot be accurately positioned, and the test precision is not high; second, full-automatic tester: the full-automatic tester has accurate positioning, high precision and high cost, and the market price of the tester which can be generally used for IGBT bonding testing is more than tens of thousands of yuan. At present, a technical scheme for testing the thrust of the IGBT bonding point with low cost and high precision is lacked.
SUMMERY OF THE UTILITY MODEL
The utility model discloses not enough to prior art exists provides an IGBT bonding point thrust test device, and it is low to overcome manual measuring accuracy among the present IGBT bonding point thrust test, the problem that automatic test is with high costs.
The utility model provides an above-mentioned technical problem's technical scheme as follows: a thrust testing device for an IGBT bonding point comprises a base and a vertical seat, wherein the vertical seat is connected to the upper end of the base, a first sliding groove is formed in the upper end of the base, a second sliding groove is formed in the front side of the vertical seat, a positioning mechanism is connected to the upper end of the first sliding groove, and a testing mechanism is connected to the second sliding groove;
the positioning mechanism comprises a side wall, a sliding rod and a base, a placing groove is formed in the middle of the side wall, limiting blocks are connected to two sides of the side wall, and limiting columns are connected to the front ends of the limiting blocks; one end of the sliding rod is provided with a strip hole, the limiting column is embedded into the strip hole of the sliding rod, the other end of the sliding rod is provided with a positioning hole, and the positioning hole covers the outer side of the placing groove; the base is connected to the lower end of the side wall, the bottom of the base is connected with a cross rod, and the cross rod is embedded into the first sliding groove;
the test mechanism comprises a test sensor, a connecting rod and a test cutter, the rear side of the test sensor is embedded into and moves in the second sliding groove, and the connecting rod is connected between the test sensor and the test cutter.
As a preferred scheme of the IGBT bonding point thrust testing device, the number of the slide bars is two, and the two slide bars are oppositely arranged on two sides of the placing groove; the positioning holes are arranged on one side of the sliding rod in a rectangular shape.
As a preferable scheme of the IGBT bonding point thrust testing device, the front end of the base is connected with an adjusting seat, and a spiral shaft is connected between the adjusting seat and the base.
As the preferable scheme of the IGBT bonding point thrust testing device, the side part of the connecting rod is provided with teeth, the connecting rod is connected with a driving gear through the teeth, and the driving gear is connected with a handle.
As a preferable scheme of the IGBT bonding point thrust testing device, the connecting rod drives the testing cutter to move up and down on the placing groove.
The traditional manual IGBT thrust tester has no DBC fixing device and cannot realize accurate positioning of a testing tool and a bonding point, and inaccurate positioning of the bonding point causes inaccurate test data. Although the full-automatic thrust tester can realize accurate positioning, the price is high, the technical scheme can realize accurate positioning of the testing tool and the bonding point by designing the positioning mechanism, and the full-automatic thrust tester has lower cost and high popularity. This technical scheme passes through screw axis control positioning mechanism fore-and-aft position, and the horizontal pole is mutually supported with first slip recess, and the position about control positioning mechanism realizes the accurate location of bonding point, and the connecting rod drives test sensor and reciprocates in second slip recess and carry out the thrust test action, the utility model discloses synthesize the advantage of manual test and full-automatic test, with low costs, easy operation, test data error are little, the precision is high.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structure, ratio, size and the like shown in the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention has no technical essential significance, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy and the achievable purpose of the present invention.
Fig. 1 is a schematic structural view of an IGBT bonding point thrust testing apparatus provided in an embodiment of the present invention;
fig. 2 is a schematic view of a testing mechanism of an IGBT bonding point thrust testing apparatus provided in an embodiment of the present invention;
fig. 3 is a schematic view of a positioning mechanism of an IGBT bonding point thrust testing apparatus provided in an embodiment of the present invention;
fig. 4 is a schematic view of a combined structure of a connecting rod, a driving gear and a handle of the IGBT bonding point thrust testing device provided in the embodiment of the present invention.
In the figure, 1, a base; 2. a vertical seat; 3. a first sliding groove; 4. a second sliding groove; 5. a positioning mechanism; 6. a testing mechanism; 7. a slide bar; 8. a base; 9. a placement groove; 10. a limiting block; 11. a limiting column; 12. a bar hole; 13. positioning holes; 14. a cross bar; 15. testing the sensor; 16. a connecting rod; 17. testing the cutter; 18. teeth; 19. a drive gear; 20. a handle; 21. an adjusting seat; 22. a screw shaft; 23. a side wall.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, 2, 3 and 4, an IGBT bonding point thrust test device is provided, which includes a base 1 and a vertical base 2, the vertical base 2 is connected to the upper end of the base 1, a first sliding groove 3 is arranged at the upper end of the base 1, a second sliding groove 4 is arranged at the front side of the vertical base 2, a positioning mechanism 5 is connected to the upper end of the first sliding groove 3, the positioning mechanism 5 can move left and right based on the first sliding groove 3, the second sliding groove 4 is connected to a test mechanism 6, and the test mechanism 6 can move up and down based on the second sliding groove 4.
Specifically, the positioning mechanism 5 comprises a side wall 23, a sliding rod 7 and a base 8, wherein a placing groove 9 is formed in the middle of the side wall 23, limiting blocks 10 are connected to two sides of the side wall 23, and limiting columns 11 are connected to the front ends of the limiting blocks 10; one end of the sliding rod 7 is provided with a strip hole 12, the limiting column 11 is embedded into the strip hole 12 of the sliding rod 7, the other end of the sliding rod 7 is provided with a positioning hole 13, and the positioning hole 13 covers the outer side of the placing groove 9; the base 8 is connected at the lower end of the side wall 23, the bottom of the base 8 is connected with a cross rod 14, and the cross rod 14 is embedded in the first sliding groove 3. The slide rod 7 is subjected to left-right position adjustment under the limiting of the limiting column 11 through the bar hole 12, so that the number of the positioning holes 13 covering the outer side of the placing groove 9 is changed, the exposure degree of the placing groove 9 is further changed, and the DBC with different sizes is adapted.
Specifically, the testing mechanism 6 includes a testing sensor 15, a connecting rod 16 and a testing tool 17, the rear side of the testing sensor 15 is embedded in and moves in the second sliding groove 4, and the connecting rod 16 is connected between the testing sensor 15 and the testing tool 17. The connecting rod 16 drives the test tool 17 to move up and down on the placing groove 9. The test sensor 15 itself belongs to the prior art, the lateral part of the connecting rod 16 is provided with teeth 18, the connecting rod 16 is connected with a driving gear 19 through the teeth 18, and the driving gear 19 is connected with a handle 20. The connecting rod 16 can be driven to move up and down by shaking the handle 20, and the connecting rod 16 drives the test sensor 15 and the test cutter 17 to move up and down.
In an embodiment of the IGBT bonding point thrust testing device, the number of the sliding rods 7 is two, and the two sliding rods 7 are oppositely arranged on two sides of the placing groove 9; the positioning holes 13 are arranged on one side of the slide bar 7 in a rectangular shape. The size of the placing groove 9 is controlled within a prescribed range (determined according to the size of the DBC) by sliding the slide bar 7 left and right, so that the DBC containing the bonding point is placed in the placing groove 9.
In one embodiment of the device for testing the thrust of the IGBT bonding point, the front end of the base 8 is connected with an adjusting seat 21, and a spiral shaft 22 is connected between the adjusting seat 21 and the base 8. The front and rear positions of the DBC can be controlled through the spiral shaft 22, the bonding point can be aligned and positioned with the testing cutter 17 through the positioning mechanism 5, the positioning hole 13 is designed in a hollow mode, and the position of the bonding point can be observed in real time.
Taking the DBC bonded by the 380mm aluminum wire as an example, the specific operation mode is as follows:
1) sliding the slide bar 7 left and right to control the size of the placing groove 9 within a specified range, so that the DBC containing the bonding point is placed in the placing groove 9;
2) the screw shaft 22 is rotated to adjust the front and rear positions of the DBC, and the cross bar 14 below the left and right sliding bases 8 adjusts the left and right positions of the DBC, so that the bonding point and the test tool 17 are accurately positioned;
3) and manually rotating the rocker to drive the test tool 17 to move downwards and cut the bonding point, wherein the data displayed in the test sensor 15 is the thrust numerical value of the bonding point.
4) And (4) completing the testing of the bonding point, and repeating the steps 1-3 to continue the thrust testing of other bonding points.
5) At least 5 sets of data (typically greater than 800g) are thus recorded repeatedly, allowing process control and process capability calculations to be performed.
The traditional manual IGBT thrust tester has no DBC fixing device and cannot realize accurate positioning of the testing tool 17 and the bonding point, and inaccurate positioning of the bonding point causes inaccurate testing data. Although the full-automatic thrust tester can realize accurate positioning, the price is high, the technical scheme can realize accurate positioning of the testing tool 17 and the bonding point by designing the positioning mechanism 5, and the full-automatic thrust tester has the advantages of low cost and high universality. This technical scheme passes through screw axis 22 control positioning mechanism 5 fore-and-aft position, and horizontal pole 14 mutually supports with first slip recess 3, and position about control positioning mechanism 5 realizes the accurate location of bonding point, and connecting rod 16 drives test sensor 15 and reciprocates in second slip recess 4 and carries out the thrust test action, the utility model discloses synthesize the advantage of manual test and full-automatic test, with low costs, easy operation, test data error are little, the precision is high.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. The device for testing the thrust of the IGBT bonding point comprises a base (1) and a vertical seat (2), wherein the vertical seat (2) is connected to the upper end of the base (1), and is characterized in that a first sliding groove (3) is formed in the upper end of the base (1), a second sliding groove (4) is formed in the front side of the vertical seat (2), a positioning mechanism (5) is connected to the upper end of the first sliding groove (3), and a testing mechanism (6) is connected to the second sliding groove (4);
the positioning mechanism (5) comprises a side wall (23), a sliding rod (7) and a base (8), a placing groove (9) is formed in the middle of the side wall (23), limiting blocks (10) are connected to two sides of the side wall (23), and limiting columns (11) are connected to the front ends of the limiting blocks (10); one end of the sliding rod (7) is provided with a strip hole (12), the limiting column (11) is embedded into the strip hole (12) of the sliding rod (7), the other end of the sliding rod (7) is provided with a positioning hole (13), and the positioning hole (13) covers the outer side of the placing groove (9); the base (8) is connected to the lower end of the side wall (23), a cross rod (14) is connected to the bottom of the base (8), and the cross rod (14) is embedded into the first sliding groove (3);
the testing mechanism (6) comprises a testing sensor (15), a connecting rod (16) and a testing cutter (17), the rear side of the testing sensor (15) is embedded into and moves in the second sliding groove (4), and the connecting rod (16) is connected between the testing sensor (15) and the testing cutter (17).
2. The IGBT bonding point thrust test device according to claim 1, wherein the number of the sliding rods (7) is two, and the two sliding rods (7) are oppositely arranged on two sides of the placing groove (9); the positioning holes (13) are arranged on one side of the sliding rod (7) in a rectangular shape.
3. The IGBT bonding point thrust test device according to claim 1, wherein a regulating seat (21) is connected to the front end of the base (8), and a screw shaft (22) is connected between the regulating seat (21) and the base (8).
4. The IGBT bonding point thrust test device according to claim 1, wherein teeth (18) are arranged on the side of the connecting rod (16), a driving gear (19) is connected to the connecting rod (16) through the teeth (18), and a handle (20) is connected to the driving gear (19).
5. The IGBT bonding point thrust test device according to claim 1, wherein the connecting rod (16) drives the test tool (17) to move up and down on the placing groove (9).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921220207.4U CN210427714U (en) | 2019-07-29 | 2019-07-29 | IGBT bonding point thrust testing arrangement |
| PCT/CN2019/119750 WO2021017325A1 (en) | 2019-07-29 | 2019-11-20 | Igbt bonding point pushing-force test apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921220207.4U CN210427714U (en) | 2019-07-29 | 2019-07-29 | IGBT bonding point thrust testing arrangement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210427714U true CN210427714U (en) | 2020-04-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921220207.4U Active CN210427714U (en) | 2019-07-29 | 2019-07-29 | IGBT bonding point thrust testing arrangement |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN210427714U (en) |
| WO (1) | WO2021017325A1 (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040103726A1 (en) * | 2002-12-02 | 2004-06-03 | Malcolm Cox | Bond test systems with offset shear tool |
| US8375804B2 (en) * | 2009-05-15 | 2013-02-19 | VISWELL Technology Co., Ltd. | Apparatus for testing bonding strength of electrical connections and frictionless calibration device for the same |
| CN201681015U (en) * | 2009-09-03 | 2010-12-22 | 杭州之江开关股份有限公司 | Device used for measuring welding strength of flexible connection |
| DE102010006130B4 (en) * | 2010-01-29 | 2014-11-06 | F&K Delvotec Semiconductor Gmbh | Method and arrangement for determining the quality of a wire bond connection |
| KR20150050068A (en) * | 2013-10-31 | 2015-05-08 | 삼성전기주식회사 | Bonding force test device |
| GB201620548D0 (en) * | 2016-12-02 | 2017-01-18 | Nordson Corp | Bond test apparatus and method |
| CN208672690U (en) * | 2018-08-29 | 2019-03-29 | 烟台台芯电子科技有限公司 | A kind of half-bridge DBC test fixture inside IGBT module |
| CN109932315B (en) * | 2019-04-17 | 2024-05-31 | 深圳市德瑞茵精密科技有限公司 | Testing device and testing method for detecting bonding strength of semiconductor device |
-
2019
- 2019-07-29 CN CN201921220207.4U patent/CN210427714U/en active Active
- 2019-11-20 WO PCT/CN2019/119750 patent/WO2021017325A1/en active Application Filing
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| WO2021017325A1 (en) | 2021-02-04 |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Yantai Yida Financial Leasing Co.,Ltd. Assignor: YANTAI TAIXIN ELECTRONICS TECHNOLOGY Co.,Ltd. Contract record no.: X2020980008906 Denomination of utility model: A thrust test device for IGBT bonding point Granted publication date: 20200428 License type: Exclusive License Record date: 20201208 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A thrust test device for IGBT bonding point Effective date of registration: 20201210 Granted publication date: 20200428 Pledgee: Yantai Yida Financial Leasing Co.,Ltd. Pledgor: YANTAI TAIXIN ELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2020980009067 |
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| EC01 | Cancellation of recordation of patent licensing contract | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Yantai Yida Financial Leasing Co.,Ltd. Assignor: YANTAI TAIXIN ELECTRONICS TECHNOLOGY Co.,Ltd. Contract record no.: X2020980008906 Date of cancellation: 20230915 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230915 Granted publication date: 20200428 Pledgee: Yantai Yida Financial Leasing Co.,Ltd. Pledgor: YANTAI TAIXIN ELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2020980009067 |