CN210415715U - Adhesive floor or wall board - Google Patents
Adhesive floor or wall board Download PDFInfo
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- CN210415715U CN210415715U CN201920664680.5U CN201920664680U CN210415715U CN 210415715 U CN210415715 U CN 210415715U CN 201920664680 U CN201920664680 U CN 201920664680U CN 210415715 U CN210415715 U CN 210415715U
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Abstract
The utility model discloses an adhesive type floor or wallboard, its structure includes floor or wallboard main part layer, still including pasting the buffer layer at floor or wallboard main part layer back, its characterized in that: and a plurality of holes are formed in the buffer layer. The utility model discloses the buffer layer has been posted at the floor or the wallboard back of thin layer to it has a plurality of holes to open on the buffer layer, and when pasting, glue can increase the area of contact of glue and buffer layer through hole and floor or wallboard direct contact, the existence in hole simultaneously, makes the utility model discloses an adhesive type floor or wallboard are pasted with the backplate more firmly.
Description
Technical Field
The utility model relates to a floor or wallboard, especially an adhesive type floor or wallboard.
Background
Thinner floor or wall board with thickness of 0.5-5mm is widely applied to places such as market, office place and the like due to low cost. Flooring or wall panels of this thickness cannot be snapped on the sides and are therefore usually applied by gluing. Such a floor would have the problem of poor silencing and the wall panels would have the problem of poor sound insulation. The solution is that a layer of soft buffer material such as cork, foaming EVA or IXPE is directly adhered behind the floor or the wallboard to form a buffer layer. When the floor is installed, the buffer layer is adhered to the bottom plate through glue, and the floor or the wall plate is adhered to the buffer layer, so that the floor is not firmly adhered and is easily stripped from the bottom plate.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an adhesive floor or wallboard can make floor or wallboard and bottom plate paste more firmly.
The utility model adopts the technical proposal that: the utility model provides an adhesive type floor or wallboard, its structure includes floor or wallboard main part layer, still includes the buffer layer of pasting at floor or wallboard main part layer back, be equipped with a plurality of holes on the buffer layer.
Preferably, the holes are round holes, elliptical holes, square holes or irregular holes, and the holes occupy 25 to 75 percent of the area of the buffer layer. The holes can be made into patterns, trademarks and characters so as to improve the identification degree of the adhesive floor or wallboard.
Preferably, the material used for the buffer layer is foamed PVC, cork, foamed EVA or IXPE (cross-linked polyethylene foam).
Preferably, still include not dry glue film and oiled paper layer, the non-setting adhesive layer pastes the back at the buffer layer, the oiled paper layer pastes the back at not dry glue film, not dry glue film and oiled paper layer correspond the position at the hole of buffer layer and are equipped with the hole equally.
Preferably, the thickness of the floor or wall board main body layer is 0.5-5mm, and the thickness of the buffer layer is 0.5-5 mm.
Preferably, the material of the floor or wall board main body layer is wood board, bamboo board, high-density PVC composite material, glass magnesium board, high-density fiberboard, medium-density fiberboard, aluminum alloy material, cement board, aluminum plastic board, textile, paper board or HPL fireproof board (thermosetting resin impregnated paper high-pressure laminated board).
The utility model discloses the buffer layer has been pasted at the floor or the wallboard back of thin layer to be equipped with a plurality of holes on the buffer layer, when pasting, glue can clearing hole and floor or wallboard direct contact, and the area of contact of glue and buffer layer can be increased in the existence in hole simultaneously, makes the utility model discloses an adhesive type floor or wallboard are pasted with the backplate more firmly. The buffer layer can play balanced, buffering and the effect of silence to the floor, can play balanced, buffering and syllable-dividing effect to the wallboard.
Set up adhesive tape layer and oiled paper layer at the buffer layer back, be equipped with the hole in the hole of buffer layer corresponds the position equally, and adhesive tape layer can be fixed on the backplate with adhesive formula floor or wallboard when glue is not dry thoroughly yet, prevents the displacement. Especially when as the wallboard, when glue is not solidified, if do not have the not dry glue film fixed position in advance, extremely easy landing, the utility model discloses with the earlier fixed wallboard of non-setting adhesive, treat the back and downthehole glue solidification back, really play sticky effect again.
Drawings
The present invention will be further described with reference to the accompanying drawings and examples.
Fig. 1 is a cross-sectional view of the adhesive floor or wall panel of example 1.
Fig. 2 is a schematic view of the back structure of the adhesive floor or wall panel of example 1.
Fig. 3 is a schematic view of the back structure of the adhesive floor or wall panel of example 2.
Fig. 4 is a schematic view of the back structure of the adhesive floor or wall panel of example 3.
FIG. 5 is a cross-sectional view of the adhesive floor or wall panel of example 5.
Detailed Description
Example 1
As shown in fig. 1 and 2, the adhesive floor or wall board structurally comprises a floor or wall board main body layer 1 and a buffer layer 2 adhered to the back of the floor or wall board main body layer, wherein a plurality of holes 3 are formed in the buffer layer, so that the back of the floor or wall board main body layer 1 is communicated with the outside, the thickness of the floor or wall board main body layer is 0.5mm, the thickness of the buffer layer is 0.5mm, the diameter of each hole is 1mm, the holes are round holes, the area of the buffer layer is 50%, and the buffer layer is made of foamed PVC. The floor or wall board main body layer is made of cement boards.
During preparation, after the foamed PVC is adhered to the back surface of the floor or wallboard main body layer, a buffer layer formed by the foamed PVC is punched, the depth of the hole is controlled, and the floor or wallboard main body layer is prevented from being damaged; or holes can be punched in the foamed PVC in advance and then the foamed PVC is adhered to the back of the floor or wallboard main body layer. The pore structure may also be formed on the cushioning layer formed of foamed PVC by etching or any other means.
When the floor or wall paving machine is used, a bottom plate of the ground or wall is cleaned, glue is applied, then the glued floor or wallboard is paved, pressure is slightly applied to the floor or wallboard, the glue enters the holes, and paving work is finished after solidification.
Example 2
As shown in fig. 3, the adhesive floor or wall board structurally comprises a floor or wall board main body layer 1 and a buffer layer 2 adhered to the back of the floor or wall board main body layer, wherein a plurality of holes 3 are formed in the buffer layer, the thickness of the floor or wall board main body layer is 2mm, the thickness of the buffer layer is 1mm, the holes are strip-shaped holes, the occupied area is 35%, and the buffer layer is made of cork wood. The floor or wallboard main body layer is made of aluminum alloy materials.
When the floor or wall board is prepared, the cork can be adhered to the back surface of the floor or wall board main body layer firstly, and then the cork is cut to form strip-shaped holes, so that the floor or wall board main body layer is prevented from being damaged when the cork is cut; or the cork can be cut into strips in advance and then adhered to the back of the floor or wallboard main body layer, and certain gaps are reserved among the strips of cork, and the gaps form strip-shaped holes on the buffer layer. The pore structure may also be formed on the cushioning layer formed of foamed PVC by etching or any other means.
Example 3
As shown in fig. 4, the adhesive floor or wall board structurally comprises a floor or wall board main body layer 1 and a buffer layer 2 adhered to the back of the floor or wall board main body layer, wherein a plurality of holes 3 are formed in the buffer layer, the thickness of the floor or wall board main body layer is 5mm, the thickness of the buffer layer is 3mm, the holes are irregular, the occupied area of the holes is 25%, and the buffer layer is made of foamed EVA. The floor or wall board main body layer is made of medium-density fiberboard.
Example 4
This glued formula floor or wallboard, its structure includes floor or wallboard main part layer 1, still includes the buffer layer 2 of pasting at floor or wallboard main part layer back, be equipped with a plurality of holes 3 on the buffer layer, the thickness of floor or wallboard main part layer is 3mm, and the thickness of buffer layer is 5mm, the hole is the elliptical aperture, and hole area is 40%, and the used material of buffer layer is IXPE. The material of the floor or wall board main body layer is high-density fiberboard.
Example 5
As shown in fig. 5, the adhesive floor or wall board structurally comprises a floor or wall board main body layer 1, a buffer layer 2 adhered to the back of the floor or wall board main body layer, a plurality of holes 3 arranged on the buffer layer, an adhesive sticker layer 4 and an oil paper layer 5, wherein the adhesive sticker layer is adhered to the back of the buffer layer, the oil paper layer is adhered to the back of the adhesive sticker layer, and the adhesive sticker layer and the oil paper layer are also provided with holes at corresponding positions of the holes of the buffer layer. The thickness of floor or wallboard main body layer is 5mm, and the thickness of buffer layer is 4mm, the hole is the round hole, and hole area is 45%, and the used material of buffer layer is the cork. The floor or wallboard main body layer is made of a glass magnesium board.
When the adhesive is used, the bottom plate of the ground or the wall surface is cleaned, glue is applied, the oiled paper layer of the adhesive floor or wallboard is removed, then the adhesive floor or wallboard is paved, pressure is slightly applied to the floor or wallboard to enable the glue to enter the holes, when the glue is not cured, the non-setting adhesive layer can be fixed in advance to prevent the floor or wallboard from moving or falling off, and paving work is finished after the glue is cured.
Example 6
The adhesive type floor or wallboard structurally comprises a floor or wallboard main body layer, a buffer layer adhered to the back of the floor or wallboard main body layer, a plurality of holes arranged on the buffer layer, a self-adhesive layer and an oil paper layer, wherein the self-adhesive layer is adhered to the back of the buffer layer, the oil paper layer is adhered to the back of the self-adhesive layer, and the hole corresponding positions of the self-adhesive layer and the oil paper layer on the buffer layer are also provided with holes. The thickness of floor or wallboard main part layer is 0.5mm, and the thickness of buffer layer is 3mm, the hole is square hole, and hole area is 50%, and the used material of buffer layer is foaming EVA. The floor or wallboard main body layer is made of high-density PVC composite material.
Example 7
The adhesive type floor or wallboard structurally comprises a floor or wallboard main body layer, a buffer layer adhered to the back of the floor or wallboard main body layer, a plurality of holes arranged on the buffer layer, a self-adhesive layer and an oil paper layer, wherein the self-adhesive layer is adhered to the back of the buffer layer, the oil paper layer is adhered to the back of the self-adhesive layer, and the hole corresponding positions of the self-adhesive layer and the oil paper layer on the buffer layer are also provided with holes. The thickness of floor or wallboard main body layer is 2.5mm, and the thickness of buffer layer is 0.5mm, the hole is the round hole, and hole area is 60%, and the used material of buffer layer is IXPE. The main body layer of the floor or the wallboard is made of bamboo boards.
Example 8
The adhesive type floor or wallboard structurally comprises a floor or wallboard main body layer, a buffer layer adhered to the back of the floor or wallboard main body layer, a plurality of holes arranged on the buffer layer, a self-adhesive layer and an oil paper layer, wherein the self-adhesive layer is adhered to the back of the buffer layer, the oil paper layer is adhered to the back of the self-adhesive layer, and the hole corresponding positions of the self-adhesive layer and the oil paper layer on the buffer layer are also provided with holes. The thickness of floor or wallboard main body layer is 4mm, and the thickness of buffer layer is 2mm, the hole is the slot, and hole area is 75%, and the used material of buffer layer is foaming PVC. The floor or wall board main body layer is made of wood boards.
Example 9
This example is substantially the same as example 8 except that the material used for the floor or wall panel body layer is aluminum-plastic panel.
Example 10
This example is substantially the same as example 8 except that the floor or wall panel body layer is a textile material.
Example 11
This example is substantially the same as example 8 except that the material used for the floor or wall panel body layer is paperboard.
Example 12
This example is substantially identical to example 8 except that the material used for the floor or wall panel body layer is HPL fire rated board.
The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be equivalent replacement modes, and all are included in the scope of the present invention.
In the description of the present invention, it should be understood that the terms indicating the orientation or the positional relationship are based on the orientation or the positional relationship shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the structure indicated must have a specific orientation, be configured in a specific orientation, and thus cannot be construed as limiting the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the present disclosure, unless otherwise expressly stated or limited, the first feature may comprise both the first and second features directly contacting each other, and also may comprise the first and second features not being directly contacting each other but being in contact with each other by means of further features between them. Also, the first feature being above, on or above the second feature includes the first feature being directly above and obliquely above the second feature, or merely means that the first feature is at a higher level than the second feature. A first feature that underlies, and underlies a second feature includes a first feature that is directly under and obliquely under a second feature, or simply means that the first feature is at a lesser level than the second feature.
Claims (10)
1. The utility model provides an adhesive type floor or wallboard, its structure includes floor or wallboard main body layer, still includes the buffer layer of pasting at floor or wallboard main body layer back, its characterized in that: and a plurality of holes are formed in the buffer layer.
2. The adhesive floor or wall panel according to claim 1, wherein: the holes are round holes, elliptical holes, square holes or irregular holes, and the area of the holes in the buffer layer is 25-75%.
3. A glued floor or wall panel according to claim 1 or 2, characterized in that: the buffer layer is made of foaming PVC, cork, foaming EVA or IXPE.
4. A glued floor or wall panel according to claim 1 or 2, characterized in that: still include not dry glue film and oiled paper layer, the non-setting adhesive layer pastes the back at the buffer layer, the back at not dry glue film is pasted to the oiled paper layer, not dry glue film and oiled paper layer correspond the position at the hole of buffer layer and are equipped with the hole equally.
5. The adhesive floor or wall panel according to claim 3, wherein: still include not dry glue film and oiled paper layer, the non-setting adhesive layer pastes the back at the buffer layer, the back at not dry glue film is pasted to the oiled paper layer, not dry glue film and oiled paper layer correspond the position at the hole of buffer layer and are equipped with the hole equally.
6. A glued floor or wall panel according to claim 1 or 2, characterized in that: the thickness of the floor or wallboard main body layer is 0.5-5mm, and the thickness of the buffer layer is 0.5-5 mm.
7. The glued floor or wall panel according to claim 4, wherein: the thickness of the floor or wallboard main body layer is 0.5-5mm, and the thickness of the buffer layer is 0.5-5 mm.
8. The glued floor or wall panel according to claim 5, wherein: the thickness of the floor or wallboard main body layer is 0.5-5mm, and the thickness of the buffer layer is 0.5-5 mm.
9. A glued floor or wall panel according to claim 1 or 2, characterized in that: the floor or the wallboard main body layer is made of wood boards, bamboo boards, high-density PVC composite materials, glass magnesium boards, high-density fiber boards, medium-density fiber boards, aluminum alloy materials, cement boards, aluminum plastic boards, textiles, paperboards or HPL fireproof boards.
10. The glued floor or wall panel according to claim 4, wherein: the floor or the wallboard main body layer is made of wood boards, bamboo boards, high-density PVC composite materials, glass magnesium boards, high-density fiber boards, medium-density fiber boards, aluminum alloy materials, cement boards, aluminum plastic boards, textiles, paperboards or HPL fireproof boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920664680.5U CN210415715U (en) | 2019-05-10 | 2019-05-10 | Adhesive floor or wall board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920664680.5U CN210415715U (en) | 2019-05-10 | 2019-05-10 | Adhesive floor or wall board |
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| Publication Number | Publication Date |
|---|---|
| CN210415715U true CN210415715U (en) | 2020-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920664680.5U Active CN210415715U (en) | 2019-05-10 | 2019-05-10 | Adhesive floor or wall board |
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| CN (1) | CN210415715U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112746707A (en) * | 2020-12-25 | 2021-05-04 | 江苏昇昌家居新材料股份有限公司 | Scratch-resistant sound-insulation leather wallboard |
-
2019
- 2019-05-10 CN CN201920664680.5U patent/CN210415715U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112746707A (en) * | 2020-12-25 | 2021-05-04 | 江苏昇昌家居新材料股份有限公司 | Scratch-resistant sound-insulation leather wallboard |
| CN112746707B (en) * | 2020-12-25 | 2021-10-01 | 江苏昇昌家居新材料股份有限公司 | Scratch-resistant sound-insulation leather wallboard |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230105 Address after: 211300 No. 17, Jingshan East Road, Gaochun Development Zone, Nanjing, Jiangsu Patentee after: JIANGSU YUANMEI BAMBOO & WOOD INDUSTRY Co.,Ltd. Address before: 211316 No.17 Jingshan East Road, Gaochun Development Zone, Nanjing City, Jiangsu Province Patentee before: Chen Zhu |
|
| TR01 | Transfer of patent right |