CN210403706U - SMD packaging structure of base is filled up in area - Google Patents
SMD packaging structure of base is filled up in area Download PDFInfo
- Publication number
- CN210403706U CN210403706U CN201921783339.8U CN201921783339U CN210403706U CN 210403706 U CN210403706 U CN 210403706U CN 201921783339 U CN201921783339 U CN 201921783339U CN 210403706 U CN210403706 U CN 210403706U
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- shaped radiating
- shaped
- radiating fin
- pad
- radiating fins
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Abstract
The utility model discloses a patch type packaging structure with a pad base, which comprises a bottom pad, wherein the top surface of the bottom pad is provided with a plurality of slots arranged at intervals, a first U-shaped radiating fin is inserted in each slot, the opening of the first U-shaped radiating fin is vertically arranged upwards, and the bottom of the first U-shaped radiating fin is higher than the depth of the slot, so that the first U-shaped radiating fin is exposed outside the bottom pad; the second U-shaped radiating fins are respectively positioned between the first U-shaped radiating fins, two ends of the bottom of each first U-shaped radiating fin are connected to the strip-shaped plates, and the strip-shaped plates are respectively positioned on two sides of the bottom pad; the sealing shell covers the second U-shaped radiating fins and the first U-shaped radiating fins, and the bottom pad and the sealing shell are fastened through screws; and a wind shield is connected to the middle position of the top in the sealed shell and is perpendicular to the top surface of the second U-shaped radiating fin. The utility model discloses simple structure, simple to operate can scatter the heat on electronic equipment surface rapidly.
Description
Technical Field
The utility model relates to an packaging structure technical field especially relates to a SMD packaging structure of base is filled up in area.
Background
Electronic device will produce the heat at the in-process that uses, the heat is great to electronic device's influence, so at the in-process that uses, need carry out the heat dissipation to important electronic device and handle, otherwise will influence the result of use, traditional electronic device when the installation, need leave the louvre on the shell, so that reach radiating purpose, but this kind of mode radiating effect is poor, the inside heat of casing can not in time be discharged, can lead to thermal gathering, for this reason, we propose a SMD packaging structure who takes pad base.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a patch type packaging structure with a pad base.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a surface mount type packaging structure with a base pad comprises a base pad, wherein the top surface of the base pad is provided with a plurality of slots which are arranged at intervals, a first U-shaped radiating fin is inserted in each slot, the opening of the first U-shaped radiating fin is vertically arranged upwards, the height of the bottom of the first U-shaped radiating fin is higher than the depth of each slot, and the first U-shaped radiating fin is exposed outside the base pad;
the heat-radiating structure also comprises a plurality of second U-shaped heat-radiating fins and a sealing shell, wherein the second U-shaped heat-radiating fins are respectively positioned between the first U-shaped heat-radiating fins, two ends of the bottom of each first U-shaped heat-radiating fin are connected to strip-shaped plates, and the strip-shaped plates are respectively positioned on two sides of the bottom pad;
the sealing shell covers the second U-shaped radiating fins and the first U-shaped radiating fins, and the bottom pad and the sealing shell are fastened through screws;
a wind shield is connected to the middle position of the top in the sealed shell, the wind shield is perpendicular to the top surface of the second U-shaped radiating fin, a bayonet corresponding to the second U-shaped radiating fin is arranged on the ground of the wind shield, and the wind shield is clamped to the top of the second U-shaped radiating fin through the bayonet;
the deep bead is with the inside two the same cavitys of cutting apart of seal housing, all sets up the air intake that is the line range at the seal housing top at two cavity opposite tops, and the top of air intake all is equipped with the motor installation shell, installs the rotating motor in the motor installation shell, installs the fan in the pivot of rotating motor, and the bottom of motor installation shell links to each other with seal housing through a plurality of supporting legss.
Preferably, the strip-shaped plate is connected with the side surface of the bottom mat through a plurality of locking screws.
Preferably, the bayonet depth is consistent with the width of the second U-shaped radiating fin, so that the wind deflector is flush with the bottom of the second U-shaped radiating fin.
The utility model provides a SMD packaging structure of area pad base, when using, two rows of fan are one to be aired exhaust, and another air inlet gets into letting wind of shell and directly blows on electronic equipment's surface, circulates electronic equipment's bottom along the clearance between the U type fin again, circulates to air outlet department from its bottom again, and the air current that blows in is just in 7 inside rotatory a week of seal shell, can all take away electronic equipment surface's heat. The utility model discloses simple structure, simple to operate can scatter the heat on electronic equipment surface rapidly.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is the utility model provides a SMD packaging structure's of tape backing base structural sketch.
Fig. 2 is a cross-sectional view of a chip package structure with a pad base according to the present invention.
Fig. 3 is the utility model provides a SMD packaging structure's of tape backing base inner structure sketch map one.
Fig. 4 is the utility model provides a SMD packaging structure's of tape backing base inner structure schematic diagram two.
Labeled as: the air-cooling type air-conditioning unit comprises a bottom pad (1), first U-shaped radiating fins (2), slots (3), locking screws (4), strip-shaped plates (5), second U-shaped radiating fins (6), a sealing shell (7), an air inlet (8), supporting legs (9), a motor mounting shell (10), a wind shield (11), bayonets (12) and a rotating motor (13).
Detailed Description
To make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the following examples and drawings, and the exemplary embodiments and descriptions thereof of the present invention are only used for explaining the present invention, and are not intended as limitations of the present invention.
The structural features of the present invention will now be described in detail with reference to the accompanying drawings.
Referring to fig. 1-4, a patch type package structure with a pad base comprises a base pad 1, wherein the top surface of the base pad 1 is provided with a plurality of slots 3 arranged at intervals, a first U-shaped heat sink 2 is inserted into each slot 3, the opening of the first U-shaped heat sink 2 is vertically arranged upwards, the height of the bottom of the first U-shaped heat sink 2 is higher than the depth of the slot 3, and the first U-shaped heat sink 2 is exposed outside the base pad 1; the electronic equipment is arranged inside the first U-shaped radiating fin 2, and a radiating gap exists between the electronic equipment and the base pad 1 under the support of the first U-shaped radiating fin 2;
the utility model also comprises a plurality of second U-shaped radiating fins 6 and a sealing shell 7, wherein the second U-shaped radiating fins 6 are respectively positioned between the first U-shaped radiating fins 2, both ends of the bottom of the first U-shaped radiating fins 2 are connected with the strip-shaped plates 5, and the strip-shaped plates 5 are respectively positioned at both sides of the bottom pad 1; when electronic equipment is arranged in the first U-shaped radiating fin 2, the second U-shaped radiating fin 6 is clamped on the electronic equipment, and the electronic equipment is clamped and fixed by the second U-shaped radiating fin 6 and the first U-shaped radiating fin 2;
the sealing shell 7 covers the second U-shaped radiating fin 6 and the first U-shaped radiating fin 2, and the base gasket 1 and the sealing shell 7 are fastened through screws; gaps among the second U-shaped radiating fins 6 and gaps among the first U-shaped radiating fins 2 are used for heat dissipation and ventilation;
a wind shield 11 is connected to the middle position of the top in the sealed shell 7, the wind shield 11 is perpendicular to the top surface of the second U-shaped radiating fin 6, a bayonet 12 corresponding to the second U-shaped radiating fin 6 is arranged on the ground of the wind shield 11, and the wind shield 11 is clamped on the top of the second U-shaped radiating fin 6 through the bayonet 12;
the deep bead 11 is inside to be cut apart into two the same cavitys with seal housing 7, all offers the air intake 8 that is the line range at the seal housing 7 top of two cavity opposite tops, and the top of air intake 8 all is equipped with motor installation shell 10, installs rotation motor 13 in the motor installation shell 10, installs the fan in rotation motor 13's the pivot, and the bottom of motor installation shell 10 links to each other with seal housing 7 through a plurality of supporting legss 9.
Specifically, the utility model discloses when using, two rows of rotation motor 13 rotation opposite direction lets one row of rotation motor 13 drive the fan air inlet, another row's rotation motor 13 drives the fan and airs exhaust, when the fan is to the inside air intake of seal shell 7, wind directly blows on electronic equipment's surface, again along the bottom of clearance circulation to electronic equipment between the U type fin, from its bottom circulation to air outlet department again, the air current of blowing in is just in 7 inside rotatory a week of seal shell, can all take away the heat on electronic equipment surface.
Further, as shown in fig. 2, the strip-shaped plate 5 is connected to the side surface of the base pad 1 through a plurality of locking screws 4, so that the second U-shaped heat sink 6 and the first U-shaped heat sink 2 are fixed to each other.
Furthermore, the depth of the bayonet 12 is consistent with the width of the second U-shaped radiating fin 6, so that the wind shield 11 is flush with the bottom of the second U-shaped radiating fin 6, and the sealing effect of the wind shield 11 is better.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (3)
1. A patch type packaging structure with a pad base comprises a bottom pad (1) and is characterized in that a plurality of slots (3) which are arranged at intervals are formed in the top surface of the bottom pad (1), a first U-shaped radiating fin (2) is inserted into each slot (3), an opening of each first U-shaped radiating fin (2) is vertically and upwards arranged, the height of the bottom of each first U-shaped radiating fin (2) is higher than the depth of each slot (3), and the first U-shaped radiating fins (2) are exposed out of the bottom pad (1);
the heat-insulating bottom cushion is characterized by further comprising a plurality of second U-shaped radiating fins (6) and a sealing shell (7), wherein the second U-shaped radiating fins (6) are respectively positioned between the first U-shaped radiating fins (2), two ends of the bottom of each first U-shaped radiating fin (2) are connected to strip-shaped plates (5), and the strip-shaped plates (5) are respectively positioned on two sides of the bottom cushion (1);
the sealing shell (7) covers the second U-shaped radiating fins (6) and the first U-shaped radiating fins (2), and the base gasket (1) and the sealing shell (7) are fastened through screws;
a wind shield (11) is connected to the middle position of the top in the sealed shell (7), the wind shield (11) is perpendicular to the top surface of the second U-shaped radiating fin (6), a bayonet (12) corresponding to the second U-shaped radiating fin (6) is arranged on the ground of the wind shield (11), and the wind shield (11) is clamped on the top of the second U-shaped radiating fin (6) through the bayonet (12);
wind shield (11) are with seal housing (7) inside cutting apart into two the same cavitys, air intake (8) that are the line range are all seted up at seal housing (7) top at two cavity opposite tops, the top of air intake (8) all is equipped with motor installation shell (10), installation rotation motor (13) in motor installation shell (10), install the fan in the pivot of rotation motor (13), the bottom of motor installation shell (10) is passed through a plurality of supporting legss (9) and is linked to each other with seal housing (7).
2. The patch type package structure with a pad base according to claim 1, wherein the strip-shaped plate (5) is connected with the side surface of the base pad (1) through a plurality of locking screws (4).
3. The SMD package structure with pad base according to claim 1, wherein said bayonet (12) has a depth corresponding to the width of said second U-shaped heat sink (6), so that said wind deflector (11) is flush with the bottom of said second U-shaped heat sink (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921783339.8U CN210403706U (en) | 2019-10-23 | 2019-10-23 | SMD packaging structure of base is filled up in area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921783339.8U CN210403706U (en) | 2019-10-23 | 2019-10-23 | SMD packaging structure of base is filled up in area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210403706U true CN210403706U (en) | 2020-04-24 |
Family
ID=70343027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921783339.8U Active CN210403706U (en) | 2019-10-23 | 2019-10-23 | SMD packaging structure of base is filled up in area |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210403706U (en) |
-
2019
- 2019-10-23 CN CN201921783339.8U patent/CN210403706U/en active Active
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