CN210381784U - Circuit board assembly and electronic equipment - Google Patents

Abstract

The application provides a circuit board assembly and an electronic device. The circuit board assembly comprises a shielding cover, a circuit board and a conductive connecting piece, a first closed space is formed between the shielding cover and the circuit board, the shielding cover comprises a non-metal cover body and a first shielding layer, the first shielding layer covers the surface, close to the circuit board, of the non-metal cover body, and the conductive connecting piece is used for fixing the shielding cover on the circuit board and electrically connecting the first shielding layer with a ground pole on the circuit board. Because the shielding cover comprises the non-metal cover body and the first shielding layer, the quality of the shielding cover is reduced. Because the electromagnetic wave signal outside the shielding cover is conducted to the ground pole of the circuit board through the first shielding layer, the electromagnetic wave signal cannot penetrate into the first closed space; electromagnetic wave signals generated by the electronic device in the first closed space are conducted to the ground pole of the circuit board through the first shielding layer and cannot penetrate out of the shielding cover, so that the shielding effect of the shielding cover on the electromagnetic wave signals is improved.

Description

Circuit board assembly and electronic equipment

Technical Field

The application relates to the technical field of mobile communication devices, in particular to a circuit board assembly and electronic equipment.

Background

With the continuous development of the intellectualization of the electronic device, the functions of the electronic device are more and more. Meanwhile, signals generated by different electronic devices in the electronic device interfere with each other, thereby affecting the performance of the electronic device. Therefore, the metal shield can is used to prevent interference between electronic devices and prevent external electromagnetic wave signals from interfering with the electronic devices inside the metal shield can. However, the mass of the existing metal shielding case is often large, which is not favorable for reducing the mass of the electronic device.

SUMMERY OF THE UTILITY MODEL

The application provides a circuit board assembly, because the shield cover includes the non-metal cover body and first shielding layer, under the condition of equal volume, compare by the condition that the great metal of density constitutes with the shield cover, reduced the quality of shield cover.

The circuit board assembly comprises a shielding cover, a circuit board and a conductive connecting piece. A first closed space is formed between the shielding cover and the circuit board. The shielding case comprises a non-metal cover body and a first shielding layer. The first shielding layer covers the surface, close to the circuit board, of the non-metal cover body. The conductive connecting piece is used for fixing the shield on the circuit board and electrically connecting the first shielding layer with a ground pole on the circuit board.

Because the shielding cover comprises the non-metal cover body and the first shielding layer, under the condition of the same volume, compared with the condition that the shielding cover is made of metal with higher density, the mass of the shielding cover is reduced. Because a first closed space is formed between the shielding case and the circuit board, electronic devices contained in the first closed space can be protected. Because the first shielding layer covers the surface of the non-metal cover body close to the circuit board, and the conductive connecting piece electrically connects the first shielding layer with the ground pole on the circuit board, the electromagnetic wave signal outside the shielding cover is conducted to the ground pole of the circuit board through the first shielding layer and cannot penetrate into the first closed space, so that the interference of the electromagnetic wave signal outside the shielding cover on the electronic device in the first closed space is avoided; correspondingly, the electromagnetic wave signal that electron device in the first airtight space produced conducts through first shielding layer to the ground of circuit board is extremely, and can't see through the shield cover outside, has avoided the electromagnetic wave that electron device in the first airtight space produced when the operation causes the interference to the electron device outside the shield cover to electromagnetic wave signal's shielding effect has been improved. The conductive connecting piece has the function of bonding and fixing, so that the shielding cover is installed and fixed on the surface of the circuit board, and the shielding cover is easier to install on the circuit board. Further, the conductive connecting piece has the function of conducting electromagnetic waves, so that the electromagnetic waves on the first shielding layer can be conducted to the circuit.

The application provides an electronic equipment, electronic equipment include the center with circuit board assembly, the center is used for supporting circuit board assembly. The mass of the protective cover is smaller, so that the mass of the electronic device is reduced. Because the protective cover can shield electromagnetic wave signals and play the guard action to the inside electron device of protective cover, avoided increasing owing to add the protective cover in addition on the basis of shield cover the thickness of circuit board subassembly.

Drawings

Fig. 1 is a schematic perspective view of a circuit board assembly according to a first embodiment of the present disclosure.

Fig. 2 is an exploded schematic view of a three-dimensional structure of a circuit board assembly provided by the present application.

Fig. 3 is an enlarged partial cross-sectional view taken along line I-I of fig. 1.

Fig. 4 is an enlarged schematic view of fig. 3 at II.

Fig. 5 is a schematic perspective view of a circuit board assembly according to a second embodiment of the present application.

Fig. 6 is a schematic perspective view of a non-metal cover in a circuit board assembly according to a second embodiment of the present disclosure.

Fig. 7 is a schematic cross-sectional view taken along line III-III of fig. 5.

Fig. 8 is an enlarged schematic view of fig. 7 at IV.

Fig. 9 is a schematic perspective view of a circuit board assembly according to a third embodiment of the present application.

Fig. 10 is a schematic structural diagram of a circuit board in a circuit board assembly according to a third embodiment of the present application.

Fig. 11 is an enlarged partial cross-sectional view taken along line V-V in fig. 9.

Fig. 12 is a schematic structural diagram of a circuit board assembly according to a fourth embodiment of the present application.

Fig. 13 is a schematic structural diagram of a circuit board in a circuit board assembly according to a fourth embodiment of the present application.

Fig. 14 is a schematic perspective view of a circuit board assembly according to a fifth embodiment of the present application.

Fig. 15 is a schematic perspective view of a circuit board assembly according to a sixth embodiment of the present application.

Fig. 16 is an enlarged schematic view of a partial section taken along line VI-VI of fig. 15.

Fig. 17 is a schematic structural diagram of a circuit board assembly according to a seventh embodiment of the present application.

Fig. 18 is an enlarged schematic view of fig. 17 taken along line VII-VII in partial cross-section.

Fig. 19 is a schematic structural diagram of an electronic device provided in the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all embodiments. All other embodiments that can be derived by a person skilled in the art from the embodiments given herein without making any creative effort shall fall within the protection scope of the present application.

Referring to fig. 1 to 4, fig. 1 is a schematic perspective view of a circuit board assembly according to a first embodiment of the present disclosure; fig. 2 is an exploded schematic view of a three-dimensional structure of a circuit board assembly provided herein; FIG. 3 is an enlarged partial cross-sectional view taken along line I-I of FIG. 1; fig. 4 is an enlarged schematic view of fig. 3 at II. The circuit board assembly 10 includes a shield case 11, a circuit board 12, and a conductive connector 13. A first enclosed space 14 is formed between the shield case 11 and the circuit board 12. The shielding can 11 includes a non-metal can body 111 and a first shielding layer 112. The first shielding layer 112 covers the surface of the non-metal cover 111 close to the circuit board 12. The conductive connecting member 13 is used to fix the shielding can 11 on the circuit board 12 and electrically connect the first shielding layer 112 with the ground on the circuit board 12.

In the circuit board assembly 10 according to the first embodiment of the present application, since the shielding case 11 includes the non-metal cover 111 and the first shielding layer 112, the mass of the shielding case 11 is reduced compared to a case where the shielding case 11 is made of a metal having a relatively large density under the condition of the same volume. Since the first sealed space 14 is formed between the shield case 11 and the circuit board 12, the electronic component 20 housed inside the first sealed space 14 can be protected. Since the first shielding layer 112 covers the surface of the non-metallic cover 111 close to the circuit board 12, and the conductive connecting part 13 electrically connects the first shielding layer 112 with the ground pole on the circuit board 12, the electromagnetic wave signal outside the shielding cover 11 is conducted to the ground pole of the circuit board 12 through the first shielding layer 112 and cannot penetrate into the first enclosed space 14, so that the electromagnetic wave signal outside the shielding cover 11 is prevented from interfering with the electronic device 20 in the first enclosed space 14; accordingly, the electromagnetic wave signal generated by the electronic device 20 in the first enclosed space 14 is conducted to the ground of the circuit board 12 through the first shielding layer 112, and cannot be transmitted out of the shielding case 11, so that the electromagnetic wave generated by the electronic device 20 in the first enclosed space 14 during operation is prevented from interfering with the electronic device 20 outside the shielding case 11, and the shielding effect of the shielding case 11 on the electromagnetic wave signal is improved. Since the conductive connecting member 13 has the function of adhesive fixation, the shielding case 11 is fixed on the surface of the circuit board 12, so that the shielding case 11 is easier to mount on the circuit board 12. Further, since the conductive connecting member 13 has an electromagnetic wave conducting function, the electromagnetic wave on the first shielding layer 112 can be conducted to the circuit board 12.

It is understood that the shielding can 11 includes a non-metallic cover 111 and a first shielding layer 112. The non-metallic cage body 111 may be made of less dense materials such as, but not limited to, plastic, rubber, etc. The first shielding layer 112 may be composed of, but not limited to, a material having magnetic permeability. Wherein the material having magnetic permeability is selected based on a frequency of an electromagnetic wave generated by the electronic device 20 housed in the first closed space 14. For example, when the frequency of the electromagnetic wave emitted by the electronic device 20 housed in the first enclosed space 14 is less than or equal to 100kHz, the material of the first shielding layer 112 may be composed of, but not limited to, iron, silicon steel sheet, permalloy, and other high-permeability materials. kHz is kilohertz and hz is the unit of frequency in the international system of units, representing the number of repetitions of periodic variations per second. The high-permeability material refers to a magnetic material with the permeability of more than or equal to 100H/m. H/m, Henry/m, International Unit System of permeability. Wherein the magnetic permeability of air is 0H/m. When the frequency of the electromagnetic wave emitted from the electronic device 20 housed in the first enclosed space 14 is greater than 100kHz and equal to or less than 300kHz, the material of the first shielding layer 112 may be, but is not limited to, a good conductor material with low resistivity, such as copper, aluminum, or silver-plated copper. Wherein the copper comprises a metal material containing copper elements such as cupronickel, nickel cupronickel and the like. The good conductor material refers to a material which is extremely easy to conduct electricity under the normal temperature condition. The circuit board 12 may be, but is not limited to, a Printed Circuit Board (PCB), a ceramic circuit board, an ultra-thin circuit board, and the like. The conductive connecting member 13 may be, but not limited to, a material having functions of adhering, fixing and conducting an electrical signal, and specifically, the conductive connecting member 13 is a conductive adhesive.

The shielding principle of the shield case 11 will be explained below. When the electronic device 20 accommodated in the first enclosed space 14 emits the first electromagnetic wave, the first electromagnetic wave is conducted to the first shielding layer 112 through the air in the first enclosed space 14, because the first shielding layer 112 is made of a material with magnetic permeability, and the first shielding layer 112 is electrically connected to the ground electrode on the circuit board 12, all the first electromagnetic wave is absorbed by the first shielding layer 112 and then conducted to the electrode on the circuit board 12, and the first electromagnetic wave cannot penetrate out of the first shielding layer 112, so that the electronic device 20 outside the shielding case 11 is not affected. Similarly, when the second electromagnetic wave outside the shielding case 11 is radiated toward the shielding case 11, the second electromagnetic wave is conducted to the non-metallic cover 111 through the air, and then conducted from the non-metallic cover 111 to the first shielding layer 112, and all the second electromagnetic wave is absorbed by the first shielding layer 112 and then conducted to the electrode of the circuit board 12, so that the operation of the electronic device 20 accommodated in the first enclosed space 14 cannot be disturbed.

Further, the non-metallic cover 111 includes a bottom plate 1111 and a fixing portion 1112 connected to each other, the fixing portion 1112 is disposed around a periphery of the bottom plate 1111, and the first enclosed space 14 is formed between the bottom plate 1111 and the fixing portion 1112 and the circuit board 12. The fixing portion 1112 is arranged around the periphery of the bottom plate 1111 and supports the bottom plate 1111. When the bottom plate 1111 is pressed by an external force, the fixing portion 1112 can support the bottom plate 1111, thereby preventing the bottom plate 1111 from being deformed due to no support and the electronic device 20 of the first sealed space 14 from being damaged due to the deformation of the bottom plate 1111. A first enclosed space 14 is formed between the bottom plate 1111 and the fixing portion 1112 and the circuit board 12, so that the bottom plate 1111 and the fixing portion 1112 and the circuit board 12 can protect the electronic device 20 in the first enclosed space 14 and can shield electromagnetic wave signals.

Further, the fixing portion 1112 includes a bottom surface 11121 facing the circuit board 12 and a first inner surface 11122 connected to the bottom surface 11121, the bottom plate 1111 includes a second inner surface 1111a connected to the first inner surface 11122, and the first shielding layer 112 covers the second inner surface 1111a, the first inner surface 11122, and at least a portion of the bottom surface 11121. Since the first shielding layer 112 covers at least a portion of the bottom surface 11121 after covering the second inner surface 1111a and the first inner surface 11122, the area of the first shielding layer 112 covering the non-metallic cover 111 is increased, so that the first shielding layer 112 is more firmly attached to the non-metallic cover 111, and the shielding effect of the shielding cover 11 on electromagnetic wave signals is improved.

Further, the second inner surface 1111a and the first inner surface 11122 smoothly transition, and a projection of the smoothly transitioning portions of the second inner surface 1111a and the first inner surface 11122 along a direction perpendicular to the circuit board 12 do not coincide. Due to the fact that the second inner surface 1111a and the first inner surface 11122 are in smooth transition, and the second inner surface 1111a and the first inner surface 11122 are not in smooth transition along a projection perpendicular to the direction of the circuit board 12, the area of the first shielding layer 112 covering the non-metallic cover 111 is further increased, so that the first shielding layer 112 is more firmly attached to the non-metallic cover 111, and the shielding effect of the shielding cover 11 on electromagnetic wave signals is improved.

Referring to fig. 5 to 8, fig. 5 is a schematic perspective view of a circuit board assembly according to a second embodiment of the present application; fig. 6 is a schematic perspective view of a non-metal cover in a circuit board assembly according to a second embodiment of the present disclosure; FIG. 7 is a schematic cross-sectional view taken along line III-III of FIG. 5; fig. 8 is an enlarged schematic view of fig. 7 at IV. The circuit board assembly 10 provided in this embodiment is substantially the same as the circuit board assembly 10 provided in the first embodiment of the present application, except that in this embodiment, the bottom surface 11121 is provided with a groove 11121a, and the conductive connecting member 13 is at least partially filled in the groove 11121 a. Since the bottom surface 11121 is provided with the groove 11121a, the conductive connecting piece 13 is at least partially filled in the groove 11121a, and the groove 11121a defines the position of the part of the conductive connecting piece 13 filled in the groove 11121a, the conductive connecting piece 13 cannot be deviated, so that the installation accuracy of the conductive connecting piece 13 is improved. Further, the contact area between the conductive connecting piece 13 and the bottom surface 11121 is increased, the effect of the conductive connecting piece 13 on conducting electromagnetic waves to the non-metallic cover 111 is enhanced, and the bonding effect of the conductive connecting piece 13 is also enhanced.

Referring to fig. 9 to 11, fig. 9 is a schematic perspective view of a circuit board assembly according to a third embodiment of the present application; fig. 10 is a schematic structural diagram of a circuit board in a circuit board assembly according to a third embodiment of the present application; fig. 11 is an enlarged partial cross-sectional view taken along line V-V in fig. 9. The circuit board assembly 10 according to this embodiment may be combined with any one of the first to second embodiments described above, and in this embodiment, the circuit board 12 includes a conductive layer 121, an intermediate layer 122, and an insulating layer 123, which are sequentially stacked. The conductive layer 121 constitutes a ground pole of the circuit board 12. The insulating layer 123 includes a hollow 1231, and the hollow 1231 is used to partially expose the intermediate layer 122. A through hole 1221 is formed in the exposed intermediate layer 122, and the through hole 1221 is used for exposing the conductive layer 121. The through hole 1221 is provided with a conductive material 124 therein, and the conductive connecting member 13 is electrically connected to the conductive layer 121 through the conductive material 124.

Because the insulating layer 123 includes the hollow portion 1231, the hollow portion 1231 exposes the middle layer 122, the exposed middle layer 122 is provided with the through hole 1221 for exposing the conductive layer 121, and the conductive material 124 is disposed in the through hole 1221, so that the conductive connecting member 13 can be connected to the conductive layer 121 through the conductive material 124 on the through hole 1221, and the electromagnetic wave signal absorbed by the first shielding layer 112 is effectively transmitted to the conductive layer 121 through the conductive connecting member 13, thereby preventing the electromagnetic wave signal outside the shielding case 11 from interfering with the electronic device 20 inside the first enclosed space 14, and preventing the electromagnetic wave generated by the electronic device 20 inside the first enclosed space 14 during operation from interfering with the electronic device 20 outside the shielding case 11.

It is understood that the conductive layer 121 may be composed of, but not limited to, a good conductor material of copper, silver, etc., and the conductive layer 121 constitutes an electrode of the circuit board 12; the intermediate layer 122 may be, but is not limited to, a good conductor material such as copper, silver, etc., and the intermediate layer 122 is used for conducting the electrical signal of the electronic device 20 in the first enclosed space 14. The insulating layer 123 may be, but is not limited to, a material having a solder resist effect such as an acrylic oligomer, and the insulating layer 123 serves to protect the intermediate layer 122 and the conductive layer 121.

Further, referring to fig. 11 again, the projection of the conductive connecting element 13 along the direction perpendicular to the circuit board 12 falls into the hollow 1231. Because the projection of the conductive connecting piece 13 in the direction perpendicular to the circuit board 12 falls into the hollow portion 1231, the portion of the conductive connecting piece 13 close to the circuit board 12 can be completely accommodated in the hollow portion 1231, so that the conductive connecting piece 13 can be electrically connected with the conductive material 124 in the through hole 1221.

Referring to fig. 12 to 13, fig. 12 is a schematic structural diagram of a circuit board assembly according to a fourth embodiment of the present application; fig. 13 is a schematic structural diagram of a circuit board in a circuit board assembly according to a fourth embodiment of the present application. The circuit board assembly 10 provided in this embodiment is substantially the same as the circuit board assembly 10 provided in the first embodiment of the present disclosure, except that in this embodiment, the hollowed-out portion 1231 includes a plurality of connected sub hollowed-out portions 12311, each of the sub hollowed-out portions 12311 includes a first portion 12311a, a second portion 12311b, and an intermediate portion 12311c connected to the first portion 12311a and the second portion 12311b, the first portion 12311a and the second portion 12311b are used to be connected to other hollowed-out portions 12311, a density of the through holes 1221 exposed from the intermediate portion 12311c is greater than a density of the through holes 1221 exposed from the first portion 12311a, and a density of the through holes 1221 exposed from the intermediate portion 12311c is greater than a density of the through holes 1221 exposed from the second portion 12311 b. Since the density of the through holes 1221 exposed from the middle portion 12311c is greater than the density of the through holes 1221 exposed from the first portion 12311a, the contact area between the conductive connection member 13 and the conductive material 124 of the through holes 1221 on the middle portion 12311c is greater than the contact area between the conductive connection member 13 and the conductive material 124 of the through holes 1221 on the first portion 12311a, so that the efficiency of the electromagnetic wave signal conducted by the conductive connection member 13 through the through holes 1221 on the middle portion 12311c is greater than the efficiency of the electromagnetic wave signal conducted by the conductive connection member 13 through the through holes 1221 on the first portion 12311 a; accordingly, since the density of the through holes 1221 exposed from the middle portion 12311c is greater than the density of the through holes 1221 exposed from the second portion 12311b, the contact area between the conductive connection member 13 and the conductive material 124 of the through holes 1221 on the middle portion 12311c is greater than the contact area between the conductive connection member 13 and the conductive material 124 of the through holes 1221 on the second portion 12311b, so that the efficiency of the electromagnetic wave signal conducted by the conductive connection member 13 through the through holes 1221 on the middle portion 12311c is greater than the efficiency of the electromagnetic wave signal conducted by the conductive connection member 13 through the through holes 1221 on the second portion 12311 b. It is understood that, among the electronic devices 20 in the first enclosed space 14, the density of the electronic devices 20 near the intermediate portion 12311c is greater than the density of the electronic devices 20 near the first portion 12311 a; the density of the electronic devices 20 near the middle portion 12311c is greater than the density of the electronic devices 20 near the second portion 12311 b.

Further, the conductive connecting member 13 is elastically compressible. Since the conductive connector 13 is elastically compressible, the contact area between the conductive connector 13 and the circuit board 12 can be increased, so that the conductive connector 13 and the circuit board 12 are more tightly adhered; and when the circuit board assembly 10 is acted by the outside, the conductive connecting piece 13 can buffer the action of the outside.

Referring to fig. 14, fig. 14 is a schematic structural diagram of a circuit board assembly according to a fifth embodiment of the present disclosure. The circuit board assembly 10 provided in this embodiment may be combined with any one of the first to fourth embodiments described above, and in this embodiment, the circuit board assembly 10 further includes a protective cover 15 and a fixing member 16. The safety cover 15 includes at least one shield cover 11 and with the installation department 151 that shield cover 11 links to each other, the installation department 151 interval sets up the periphery of shield cover 11, mounting part 16 passes installation department 151, with will installation department 151 is fixed on the circuit board 12. Since the fixing member 16 penetrates through the mounting portion 151 to fix the mounting portion 151 on the circuit board 12, the conductive connecting member 13 is more closely attached to the circuit board 12, so as to enhance the electromagnetic wave shielding effect of the shielding case 11; further, the protective cover 15 can be attached to the electronic device 20 inside the protective cover 15 and to the electronic device 20 inside the protective cover 15. Since the mass of the shield case 11 is small, the mass of the shield case 11 is reduced compared to the case where the shield cases 11 are each composed of a metal having a large density, and the mass of the shield case 15 is reduced in the same volume.

Referring to fig. 15 to 16, fig. 15 is a schematic structural diagram of a circuit board assembly according to a sixth embodiment of the present application; fig. 16 is an enlarged schematic view of a partial section taken along line VI-VI of fig. 15. The circuit board assembly 10 provided by this embodiment may be combined with any one of the first to fifth embodiments described above, in this embodiment, the circuit board assembly 10 further includes an antenna 18, the antenna 18 is disposed between the shield case 11 and the mounting portion 151, the antenna 18 is configured to transceive electromagnetic wave signals within a preset direction range, the shield case 11 is at least partially located within the preset direction range, a portion of the first shield layer 112 located within the preset direction range includes a first sub-shield layer 112a and a second sub-shield layer 112b, a distance from the first sub-shield layer 112a to the antenna 18 is smaller than a distance from the second sub-shield layer 112b to the antenna 18, and a thickness d1 of the first sub-shield layer 112a is greater than a thickness d2 of the second sub-shield layer 112 b. Since the distance from the first sub-shielding layer 112a to the antenna 18 is smaller than the distance from the second sub-shielding layer 112b to the antenna 18, the thickness of the first sub-shielding layer 112a is greater than the thickness of the second sub-shielding layer 112b, so that the shielding effect of the first sub-shielding layer 112a is improved, and the influence of the antenna 18 on the electronic device 20 in the first enclosed space 14 is reduced.

Referring to fig. 17 to 18, fig. 17 is a schematic structural diagram of a circuit board assembly according to a seventh embodiment of the present application; fig. 18 is an enlarged schematic view of fig. 17 taken along line VII-VII in partial cross-section. The circuit board assembly 10 provided in this embodiment may be combined with any one of the first to sixth embodiments described above, in this embodiment, a second airtight space 17 is formed between the protective cover 15 and the circuit board 12, and the protective cover 15 further includes a second shielding layer 152, and the second shielding layer 152 covers a surface of the protective cover 15 away from the circuit board 12. Since the second sealed space 17 is formed between the protective cover 15 and the circuit board 12, the electronic components 20 in the second sealed space 17 can be protected. And the protection cover 15 further comprises a second shielding layer 152, so that the second shielding layer 152 covers the surface of the protection cover 15 far away from the circuit board 12, and thus the protection cover 15 can simultaneously play a role in shielding electromagnetic wave signals, thereby further enhancing the effect of shielding the electromagnetic wave signals of the circuit board assembly 10. It can be understood that the first enclosed space 14 is accommodated in the second enclosed space 17, so that electromagnetic wave signals outside the circuit board assembly 10 cannot interfere with the electronic device 20 in the first enclosed space 14, and electromagnetic wave signals generated by the electronic device 20 in the first enclosed space 17 cannot pass through the protective cover 15. It is to be understood that referring again to fig. 18, that the second shielding layer 152 covers the surface of the protective cover 15 away from the circuit board 12 means that the second shielding layer 152 covers the associated first outer surface 153 and second outer surface 154 of the protective cover.

Please refer to fig. 19, fig. 19 is a schematic structural diagram of an electronic device according to the present application. The electronic device 1 comprises a middle frame 30 and the circuit board assembly 10, wherein the middle frame 30 is used for supporting the circuit board assembly 10. The mass of the protective cover 15 is reduced, so that the mass of the electronic device 1 is reduced. Since the protective cover 15 can shield electromagnetic wave signals and protect the electronic device 20 inside the protective cover 15, the thickness increase of the circuit board assembly 10 due to the additional addition of the protective cover 15 on the basis of the shielding cover 11 is avoided.

While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (12)

1. The utility model provides a circuit board assembly, its characterized in that, circuit board assembly includes shield cover, circuit board and electrically conductive connecting piece, the shield cover with form first airtight space between the circuit board, the shield cover includes the non-metallic cover body and first shielding layer, first shielding layer covers the non-metallic cover body is close to the surface of circuit board, electrically conductive connecting piece is used for fixing the shield cover on the circuit board and will first shielding layer with the earth's pole electricity on the circuit board is connected.

2. The circuit board assembly of claim 1, wherein the non-metallic cage body comprises a bottom plate and a fixing portion connected to each other, the fixing portion is disposed around a periphery of the bottom plate, and the first enclosed space is formed between the bottom plate and the fixing portion and the circuit board.

3. The circuit board assembly of claim 2, wherein the fixing portion includes a bottom surface facing the circuit board and a first inner surface connected to the bottom surface, the bottom plate includes a second inner surface connected to the first inner surface, and the first shielding layer covers the second inner surface, the first inner surface, and at least a portion of the bottom surface.

4. A circuit board assembly according to claim 3, wherein the bottom surface is provided with a recess, the conductive connector at least partially filling the recess.

5. The circuit board assembly according to claim 1, wherein the circuit board includes a conductive layer, an intermediate layer, and an insulating layer, which are sequentially stacked, the conductive layer forms a ground of the circuit board, the insulating layer includes a hollow portion, the hollow portion is used to expose a part of the intermediate layer, a through hole is formed in the exposed intermediate layer, the through hole is used to expose the conductive layer, a conductive material is disposed in the through hole, and the conductive connecting member is electrically connected to the conductive layer through the conductive material.

6. The circuit board assembly of claim 5, wherein the conductive connector falls into the hollowed-out portion along a projection in a direction perpendicular to the circuit board.

7. The circuit board assembly of claim 6, wherein the hollowed-out portion comprises a plurality of connected sub hollowed-out portions, each sub hollowed-out portion comprises a first portion, a second portion and a middle portion, the first portion and the second portion are arranged oppositely, the middle portion is connected to the first portion and the second portion, the first portion and the second portion are used for being connected to other sub hollowed-out portions, the density of through holes exposed from the middle portion is greater than that of through holes exposed from the first portion, and the density of through holes exposed from the middle portion is greater than that of through holes exposed from the second portion.

8. The circuit board assembly of claim 1, wherein the conductive connector is resiliently compressible.

9. The circuit board assembly of any one of claims 1-8, further comprising a protective cover and a securing member, wherein the protective cover includes at least one of the shields and a mounting portion coupled to the shields, the mounting portion being spaced apart around a perimeter of the shields, and wherein the securing member passes through the mounting portion to secure the mounting portion to the circuit board.

10. The circuit board assembly of claim 9, further comprising an antenna disposed between the shielding cover and the mounting portion, wherein the antenna is configured to receive and transmit electromagnetic wave signals within a predetermined range of directions, at least a portion of the shielding cover is located within the predetermined range of directions, a portion of the first shielding layer located within the predetermined range of directions includes a first sub-shielding layer and a second sub-shielding layer, a distance from the first sub-shielding layer to the antenna is smaller than a distance from the second sub-shielding layer to the antenna, and a thickness of the first sub-shielding layer is greater than a thickness of the second sub-shielding layer.

11. The circuit board assembly of claim 9, wherein a second enclosed space is formed between the protective cover and the circuit board, and the protective cover further comprises a second shielding layer covering a surface of the protective cover remote from the circuit board.

12. An electronic device, characterized in that the electronic device comprises a middle frame for supporting the circuit board assembly and the circuit board assembly of claims 10-11.

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