CN210381199U - Intelligent digital terminal of 5G passive optical network - Google Patents
Intelligent digital terminal of 5G passive optical network Download PDFInfo
- Publication number
- CN210381199U CN210381199U CN201921785868.1U CN201921785868U CN210381199U CN 210381199 U CN210381199 U CN 210381199U CN 201921785868 U CN201921785868 U CN 201921785868U CN 210381199 U CN210381199 U CN 210381199U
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- shell
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- digital terminal
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- 230000003287 optical effect Effects 0.000 title claims abstract description 33
- 230000017525 heat dissipation Effects 0.000 claims abstract description 49
- 238000005057 refrigeration Methods 0.000 claims abstract description 42
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- 238000009434 installation Methods 0.000 claims abstract description 22
- 238000004321 preservation Methods 0.000 claims abstract description 20
- 238000005192 partition Methods 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 8
- 238000013016 damping Methods 0.000 claims description 7
- 230000035939 shock Effects 0.000 claims description 5
- 239000000428 dust Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
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Abstract
A5G passive optical network intelligent digital terminal comprises a shell, an air supply device and a guide block; an installation bin, a heat dissipation bin and a refrigeration bin which are used for installing all parts of the intelligent digital terminal are arranged in the shell; the mounting bin is respectively communicated with the heat dissipation bin and the refrigeration bin; a second through hole communicated with each other is arranged between the heat dissipation bin and the refrigeration bin; the air inlet hole of the refrigeration bin is connected with the air inlet end of the air supply device; the heat dissipation cabin is provided with heat dissipation holes on the shell; the small end face thread of the T-shaped conduction block is screwed into the opening at one end of the heat preservation cylinder; the large end face threads of the conducting block are screwed into the second through holes; a heat dissipation block is arranged in an opening at the other end of the heat preservation cylinder; the cold and hot ends of the semiconductor refrigerating sheet in the heat-insulating cylinder are respectively pressed tightly on the conducting block and the radiating block; the controller in the installation bin is in signal connection with the temperature sensor in the installation bin, and the controller is respectively in control connection with the air supply device and the plurality of semiconductor refrigerating sheets. The utility model provides an intelligent digital terminal's radiating effect is good.
Description
Technical Field
The utility model relates to a terminal equipment technical field especially relates to a 5G passive optical network intelligence digital terminal.
Background
A passive optical network (GPON), which is an Optical Distribution Network (ODN) between an OLT and an ONU, has no active electronic device, is a pure medium network, avoids electromagnetic interference and lightning influence of external devices, reduces the failure rate of lines and external devices, improves the reliability of the system, and saves maintenance cost at the same time, and mainly includes an OLT (optical line terminal), an optical network terminal ONU, and an optical splitter (optical distribution network), and currently the passive optical network is mainly an IP-based GGPON that supports the highest asymmetric transmission rate of 2.488Gbit/s and 1.244Gbit/s in the uplink, the maximum physical distance is 20km, and the optical splitting ratio is between 16 and 128; when the passive optical network intelligent terminal operates, if heat energy generated inside the passive optical network intelligent terminal cannot be effectively dissipated, the service performance of the passive optical network intelligent terminal can be influenced, and the passive optical network intelligent terminal can be damaged in serious cases; in addition, the passive optical network intelligent terminal has a large volume and is time-consuming and labor-consuming to move by manpower; therefore, the application provides a 5G passive optical network intelligent digital terminal.
SUMMERY OF THE UTILITY MODEL
Objects of the invention
For solving the technical problem who exists among the background art, the utility model provides a 5G passive optical network intelligence digital terminal, the utility model provides an intelligence digital terminal's radiating effect is good, stable good and convenient the removal.
(II) technical scheme
The utility model provides a 5G passive optical network intelligent digital terminal, which comprises a shell, a base, a plurality of universal wheels, an air supply device, a controller, a temperature sensor, a heat dissipation block, a heat preservation cylinder, a conduction block and a semiconductor refrigeration piece;
the universal wheels are uniformly arranged on the lower end surface of the base; the shell is arranged at the upper end of the base; a first clapboard is arranged in the shell; the first partition board is used for dividing the interior of the shell into an installation bin and a placement bin for installing all components of the intelligent digital terminal; a second partition plate is arranged in the placing bin to divide the interior of the placing bin into a heat dissipation bin and a refrigeration bin; a plurality of second through holes for communicating the heat dissipation bin with the refrigeration bin are uniformly formed in the second partition plate; the first partition plate is provided with a plurality of first through holes for communicating the installation bin with the refrigeration bin and a plurality of third through holes for communicating the installation bin with the heat dissipation bin;
the shell of the refrigeration bin is provided with an air inlet hole; the air supply device is arranged on the shell, and the air inlet end of the air supply device is connected with the air inlet hole; the heat dissipation cabin is provided with heat dissipation holes on the shell; a dust screen is arranged in the heat dissipation holes;
the cross section area of the conducting block is T-shaped; the small end surfaces of the plurality of the conduction blocks are screwed into the openings at one end of the plurality of the heat preservation cylinders one by one, and the large end surfaces of the plurality of the conduction blocks are screwed into the second through holes one by one; the plurality of radiating blocks are screwed into the openings at the other ends of the plurality of heat-insulating cylinders one by one; the semiconductor refrigeration pieces are respectively positioned in the heat preservation cylinder one by one, the cold ends of the semiconductor refrigeration pieces respectively press the conduction blocks one by one, and the hot ends of the semiconductor refrigeration pieces respectively press the heat dissipation blocks one by one; second heat insulation glue for separating the hot end and the cold end of the semiconductor refrigeration piece is filled in the space between the semiconductor refrigeration piece and the heat preservation cylinder; a first heat insulation glue is filled in the space between the heat preservation cylinder and the second through hole;
the controller and the temperature sensor are both arranged in the mounting bin; the controller is in signal connection with the temperature sensor and is respectively in control connection with the air supply device and the plurality of semiconductor refrigerating pieces; wherein, the installation bin is provided with a sealing door on the shell.
Preferably, the cross section area of the radiating block is T-shaped, and the diameter of the lower end face of the radiating block is the same as the inner diameter of the heat preservation cylinder.
Preferably, a plurality of heat radiating fins are included; the plurality of radiating fins are respectively arranged at one end of the plurality of radiating blocks, which is far away from the heat-insulating cylinder.
Preferably, a plurality of placing plates are included; a plurality of boards of placing set up in the installation storehouse side by side.
Preferably, a conductive plate; the conduction board is located the refrigeration storehouse and sets up on the second baffle, and the conduction board compresses tightly a plurality of conduction blocks towards the terminal surface of a plurality of conduction blocks.
Preferably, a shock absorbing assembly is included; wherein, a hollow bin is arranged inside the base; the upper end surface of the base of the hollow bin is provided with an opening; a sealing gasket is arranged on the end surface of the opening;
the lower end of the shell extends into the hollow bin from the opening and is connected with the damping component; the damping component is arranged in the hollow bin; the gasket compresses the outer end face of the housing.
Preferably, the shock absorption assembly comprises a spring, an elastic ball, a baffle plate, a guide rod, an elastic sleeve and a support plate;
the supporting plate is connected with the shell, the area of the supporting plate is larger than that of the lower end face of the shell, and fourth through holes are uniformly formed in the supporting plate;
the guide rods respectively penetrate through the fourth through holes in a one-to-one matching mode, the guide rods are connected with the supporting plate in a sliding mode, and two ends of each guide rod are connected with the base; the springs are respectively sleeved on the outer sides of the guide rods one by one, and two ends of the springs are respectively connected with the lower end of the supporting plate and the inner wall of the hollow bin; the elastic sleeves are respectively sleeved on the outer sides of the guide rods one by one, and two ends of the elastic sleeves are respectively abutted to the upper end face of the supporting plate and the inner wall of the hollow bin;
the baffles are uniformly arranged on the bottom surface of the hollow bin and surround the bottom surface of the hollow bin to form a space for placing a plurality of elastic balls.
The above technical scheme of the utility model has following profitable technological effect:
in the utility model, each part of the intelligent digital terminal is arranged in the installation bin, and then the universal wheel is arranged to move the shell, when the intelligent digital terminal operates, each electric part is electrified to operate to generate heat energy, and the temperature sensor detects the temperature in the installation bin; when the temperature in the installation bin reaches a first set value detected by the temperature sensor, the temperature sensor sends the signal to the controller; the controller controls the air supply device to be electrified and operated, and the air supply device conveys outside air to the refrigerating bin; air enters the mounting bin from the first through hole and flows into the heat dissipation bin from the third through hole so as to take away high temperature in the mounting bin and dissipate heat of electric parts in the mounting bin; hot air is discharged from the heat dissipation holes; when the temperature in the mounting bin continuously rises and reaches a second set value set by the temperature sensor, the temperature sensor sends the signal to the controller; the controller controls the plurality of semiconductor refrigerating pieces to be electrified and operated; the cold ends of the plurality of semiconductor refrigerating pieces refrigerate the conducting block, air entering the refrigerating bin is contacted with the conducting block to form low-temperature air, and the low-temperature air enters the mounting bin to rapidly cool the interior of the mounting bin; in addition, the air flowing out of the mounting bin contacts a heat dissipation block connected with the hot end of the semiconductor refrigerating sheet so as to accelerate the heat dissipation of the hot end of the semiconductor refrigerating sheet; through the process, the heat dissipation effect of the intelligent digital terminal is good, and the intelligent digital terminal is convenient to move.
Drawings
Fig. 1 is the utility model provides a 5G passive optical network intelligent digital terminal's schematic structure.
Fig. 2 is the utility model provides a 5G passive optical network intelligent digital terminal's spatial structure sketch map.
Fig. 3 is a schematic structural diagram of a local amplification at a position in a 5G passive optical network intelligent digital terminal provided by the present invention.
Fig. 4 is a rear view of the 5G passive optical network intelligent digital terminal provided by the present invention.
Fig. 5 is a cross-sectional view of the housing in the 5G passive optical network intelligent digital terminal provided by the present invention.
Reference numerals: 1. a housing; 2. a dust screen; 3. heat dissipation holes; 4. a base; 5. a universal wheel; 6. a sealing door; 7. a first separator; 8. installing a bin; 9. a first through hole; 10. a second separator; 11. a heat dissipation bin; 12. a second through hole; 13. an air supply device; 14. a refrigeration bin; 15. a controller; 16. placing the plate; 17. a temperature sensor; 18. an air inlet hole; 19. a third through hole; 20. a conductive plate; 21. a heat sink; 22. a heat dissipating block; 23. a heat-preserving cylinder; 24. a first heat-insulating glue; 25. a conductive block; 26. a semiconductor refrigeration sheet; 27. a second heat-insulating glue; 28. a spring; 29. an elastic ball; 30. a baffle plate; 31. a guide bar; 32. an elastic sleeve; 33. and a support plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1-5, the utility model provides a 5G passive optical network intelligent digital terminal, including shell 1, base 4, a plurality of universal wheels 5, air supply arrangement 13, controller 15, temperature sensor 17, radiating block 22, a heat preservation section of thick bamboo 23, conducting block 25 and semiconductor refrigeration piece 26;
the universal wheels 5 are uniformly arranged on the lower end surface of the base 4; wherein, the universal wheel 5 is a universal wheel with a brake;
the shell 1 is arranged at the upper end of the base 4; a first clapboard 7 is arranged in the shell 1; the first partition plate 7 is used for dividing the interior of the shell 1 into an installation bin 8 and a placement bin, wherein the installation bin 8 and the placement bin are used for installing all parts of the intelligent digital terminal; the first partition plate 7 is provided with a plurality of first through holes 9 for communicating the mounting bin 8 with the refrigerating bin 14 and a plurality of third through holes 19 for communicating the mounting bin 8 with the heat dissipation bin 11;
a second partition plate 10 is arranged in the placing bin to divide the interior of the placing bin into a heat dissipation bin 11 and a refrigeration bin 14; a plurality of second through holes 12 for communicating the heat dissipation bin 11 with the refrigeration bin 14 are uniformly formed in the second partition plate 10; wherein, the second separator 10 is L-shaped; the height value of the second clapboard 10 is smaller than that of the placing bin;
the refrigeration bin 14 is provided with an air inlet hole 18 on the shell 1; the air supply device 13 is arranged on the shell 1, and the air inlet end of the air supply device 13 is connected with an air inlet hole 18; wherein, a dustproof filter screen is arranged in the air inlet hole 18;
the heat dissipation chamber 11 is provided with heat dissipation holes 3 on the shell 1; a dust screen 2 is arranged in the heat dissipation holes 3;
the cross-sectional area of the conductive block 25 is T-shaped; the small end surfaces of the plurality of the conduction blocks 25 are screwed into the openings at one end of the plurality of the heat preservation cylinders 23 one by one, and the large end surfaces of the plurality of the conduction blocks 25 are screwed into the plurality of the second through holes 12 one by one; the conduction block 25 has excellent heat conduction and cold conduction performances, and has low temperature through being contacted with the cold end of the semiconductor refrigeration piece 26, so as to refrigerate the refrigeration bin 14;
the plurality of radiating blocks 22 are screwed into the openings at the other ends of the plurality of heat-insulating cylinders 23 one by one; the semiconductor refrigeration pieces 26 are respectively positioned in the heat preservation cylinder 23 one by one, the cold ends of the semiconductor refrigeration pieces 26 respectively press the conduction blocks 25 one by one, and the hot ends of the semiconductor refrigeration pieces 26 respectively press the heat dissipation blocks 22 one by one; a second heat insulation glue 27 for separating the hot end and the cold end of the semiconductor refrigeration sheet 26 is filled in the space between the semiconductor refrigeration sheet 26 and the heat preservation cylinder 23 to form a second heat insulation layer; a space between the heat preservation cylinder 23 and the second through hole 12 is filled with first heat insulation glue 24 to form a first heat insulation layer;
the controller 15 and the temperature sensor 17 are both arranged in the mounting bin 8; the controller 15 is in signal connection with the temperature sensor 17, and the controller 15 is respectively in control connection with the air supply device 13 and the plurality of semiconductor refrigerating pieces 26; wherein, the mounting bin 8 is provided with a sealing door 6 on the shell 1; wherein, the sealing door 6 is provided with a handle and a lockset; the lock is a common structure in the existing market and is not described in detail.
In the utility model, each part of the intelligent digital terminal is arranged in the installation bin 8, the shell 1 is moved through the universal wheels 5, when the intelligent digital terminal operates, each electric part is electrified to operate to generate heat energy, and the temperature sensor 17 detects the temperature in the installation bin 8; when the temperature in the installation bin 8 reaches a first set value detected by the temperature sensor 17, the temperature sensor 17 sends the signal to the controller 15; the controller 15 controls the air supply device 13 to be powered on and operated, and the air supply device 13 conveys outside air to the refrigerating bin 14; air enters the mounting bin 8 from the first through hole 9 and flows into the heat dissipation bin 11 from the third through hole 19 so as to take away high temperature in the mounting bin 8 and dissipate heat of electric parts in the mounting bin 8; hot air is discharged from the heat dissipation holes 3; when the temperature in the installation bin 8 continuously rises and reaches a second set value set by the temperature sensor 17, the temperature sensor 17 sends the signal to the controller 15; the controller 15 controls the plurality of semiconductor chilling plates 26 to be powered on; the cold ends of the semiconductor refrigerating sheets 26 refrigerate the conducting block 25, air entering the refrigerating bin 14 contacts with the conducting block 25 to form low-temperature air, and the low-temperature air enters the mounting bin 8 to rapidly cool the interior of the mounting bin 8; in addition, the air flowing out of the mounting bin 8 contacts the heat dissipation block 22 connected with the hot end of the semiconductor refrigeration piece 26 to accelerate the heat dissipation of the hot end of the semiconductor refrigeration piece 26; through the process, the heat dissipation effect of the intelligent digital terminal is good, and the intelligent digital terminal is convenient to move.
In an alternative embodiment, the cross-sectional area of the heat dissipation block 22 is T-shaped, and the diameter of the lower end surface of the heat dissipation block 22 is the same as the inner diameter of the heat preservation cylinder 23; the heat slug 22 is T-shaped to increase the contact area between the heat slug 22 and the outside to improve the heat dissipation performance.
In an alternative embodiment, a plurality of fins 21 are included; the plurality of radiating fins 21 are respectively arranged at one ends of the plurality of radiating blocks 22 far away from the heat-insulating cylinder 23; the heat dissipation block 22 is provided with heat dissipation fins 21 to improve heat dissipation performance.
In an alternative embodiment, a plurality of resting plates 16 are included; a plurality of placing plates 16 are arranged in the mounting bin 8 side by side; and the intelligent digital terminal components are installed through the arranged placing plate 16.
In an alternative embodiment, a conductive plate 20 is included; the conduction plate 20 is positioned in the refrigeration bin 14 and arranged on the second partition plate 10, and the conduction plate 20 presses the plurality of conduction blocks 25 towards the end faces of the plurality of conduction blocks 25; a conduction plate 20 is provided to uniformly cool the air entering the cooling compartment 14.
In an alternative embodiment, a shock absorbing assembly is included; wherein, a hollow bin is arranged inside the base 4; the hollow bin is provided with an opening on the upper end surface of the base 4; a sealing gasket is arranged on the end surface of the opening;
the lower end of the shell 1 extends into the hollow bin from the opening and is connected with a damping component; the damping component is arranged in the hollow bin; the gasket is pressed against the outer end face of the housing 1.
In an alternative embodiment, the shock absorbing assembly includes a spring 28, an elastic ball 29, a baffle 30, a guide rod 31, an elastic sleeve 32, and a support plate 33;
the supporting plate 33 is connected with the shell 1, the area of the supporting plate 33 is larger than that of the lower end face of the shell 1, and fourth through holes are uniformly formed in the supporting plate 33;
the guide rods 31 respectively penetrate through the fourth through holes in a one-to-one matching mode, the guide rods 31 are connected with the supporting plate 33 in a sliding mode, and two ends of each guide rod 31 are connected with the base 4; the springs 28 are respectively sleeved outside the guide rods 31 one by one, and two ends of the springs 28 are respectively connected with the lower end of the support plate 33 and the inner wall of the hollow bin; the elastic sleeves 32 are respectively sleeved on the outer sides of the guide rods 31 one by one, and two ends of the elastic sleeves 32 are respectively abutted to the upper end face of the support plate 33 and the inner wall of the hollow bin;
the baffles 30 are uniformly arranged on the bottom surface of the hollow bin and enclose a space for placing the elastic balls 29 with the bottom surface of the hollow bin; when the shell 1 moves, the damping assembly arranged can damp and buffer the electric equipment in the shell 1, so that the electric element is prevented from being damaged by vibration, and the service life of the electric element is prolonged.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (7)
1. A5G passive optical network intelligent digital terminal is characterized by comprising a shell (1), a base (4), a plurality of universal wheels (5), an air supply device (13), a controller (15), a temperature sensor (17), a heat dissipation block (22), a heat preservation cylinder (23), a conduction block (25) and a semiconductor refrigeration piece (26);
the universal wheels (5) are uniformly arranged on the lower end surface of the base (4); the shell (1) is arranged at the upper end of the base (4); a first clapboard (7) is arranged in the shell (1); the first partition plate (7) is used for dividing the interior of the shell (1) into an installation bin (8) and a placement bin, wherein the installation bin is used for installing all parts of the intelligent digital terminal; a second partition plate (10) is arranged in the placing bin to divide the interior of the placing bin into a heat dissipation bin (11) and a refrigeration bin (14); a plurality of second through holes (12) for communicating the heat dissipation bin (11) with the refrigeration bin (14) are uniformly formed in the second partition plate (10); wherein, a plurality of first through holes (9) for communicating the installation bin (8) with the refrigeration bin (14) and a plurality of third through holes (19) for communicating the installation bin (8) with the heat dissipation bin (11) are arranged on the first clapboard (7);
the refrigeration bin (14) is provided with an air inlet hole (18) on the shell (1); the air supply device (13) is arranged on the shell (1), and the air inlet end of the air supply device (13) is connected with the air inlet hole (18); the heat dissipation chamber (11) is provided with heat dissipation holes (3) on the shell (1); a dust screen (2) is arranged in the heat dissipation hole (3);
the cross section area of the conducting block (25) is T-shaped; the small end surfaces of the plurality of the conduction blocks (25) are screwed into the openings at one end of the plurality of the heat preservation cylinders (23) one by one, and the large end surfaces of the plurality of the conduction blocks (25) are screwed into the plurality of the second through holes (12) one by one; the plurality of radiating blocks (22) are screwed into the openings at the other ends of the plurality of heat-insulating cylinders (23) one by one; the semiconductor refrigeration pieces (26) are respectively positioned in the heat preservation cylinder (23) one by one, the cold ends of the semiconductor refrigeration pieces (26) respectively press the conduction blocks (25) one by one, and the hot ends of the semiconductor refrigeration pieces (26) respectively press the heat dissipation blocks (22) one by one; a second heat insulation glue (27) used for separating the hot end and the cold end of the semiconductor refrigeration sheet (26) is filled in the space between the semiconductor refrigeration sheet (26) and the heat preservation cylinder (23); a first heat insulation glue (24) is filled in the space between the heat preservation cylinder (23) and the second through hole (12);
the controller (15) and the temperature sensor (17) are both arranged in the mounting bin (8); the controller (15) is in signal connection with the temperature sensor (17), and the controller (15) is respectively in control connection with the air supply device (13) and the plurality of semiconductor refrigerating pieces (26); wherein, the installation bin (8) is provided with a sealing door (6) on the shell (1).
2. The intelligent digital terminal of a 5G passive optical network according to claim 1, wherein the cross-sectional area of the heat dissipation block (22) is T-shaped, and the diameter of the lower end surface of the heat dissipation block (22) is the same as the inner diameter of the heat preservation cylinder (23).
3. A 5G passive optical network intelligent digital terminal according to claim 1, characterized by comprising a plurality of heat sinks (21); the plurality of radiating fins (21) are respectively arranged at one end of the plurality of radiating blocks (22) far away from the heat-insulating cylinder (23).
4. A 5G passive optical network intelligent digital terminal according to claim 1, characterized by comprising a plurality of placing boards (16); a plurality of placing plates (16) are arranged in the mounting bin (8) side by side.
5. A 5G passive optical network intelligent digital terminal according to claim 1, characterized by comprising a conductive plate (20); the conduction plate (20) is located in the refrigeration bin (14) and arranged on the second partition plate (10), and the conduction plate (20) presses the plurality of conduction blocks (25) towards the end faces of the plurality of conduction blocks (25).
6. A 5G passive optical network intelligent digital terminal according to claim 1, comprising a shock absorbing component; wherein, a hollow bin is arranged inside the base (4); the hollow bin is provided with an opening on the upper end surface of the base (4); a sealing gasket is arranged on the end surface of the opening;
the lower end of the shell (1) extends into the hollow bin from the opening and is connected with a damping component; the damping component is arranged in the hollow bin; the sealing gasket presses the outer end face of the shell (1).
7. A5G passive optical network intelligent digital terminal according to claim 6, wherein the shock-absorbing assembly comprises a spring (28), an elastic ball (29), a baffle plate (30), a guide rod (31), an elastic sleeve (32) and a support plate (33);
the support plate (33) is connected with the shell (1), the area of the support plate (33) is larger than that of the lower end face of the shell (1), and fourth through holes are uniformly formed in the support plate (33);
the guide rods (31) respectively penetrate through the fourth through holes in a one-to-one matching mode, the guide rods (31) are connected with the supporting plate (33) in a sliding mode, and two ends of the guide rods (31) are connected with the base (4); the springs (28) are respectively sleeved outside the guide rods (31) one by one, and two ends of the springs (28) are respectively connected with the lower end of the support plate (33) and the inner wall of the hollow bin; the elastic sleeves (32) are respectively sleeved on the outer sides of the guide rods (31) one by one, and two ends of the elastic sleeves (32) are respectively abutted to the upper end face of the support plate (33) and the inner wall of the hollow bin;
the baffles (30) are uniformly arranged on the bottom surface of the hollow bin and enclose a space for placing the elastic balls (29) with the bottom surface of the hollow bin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921785868.1U CN210381199U (en) | 2019-10-23 | 2019-10-23 | Intelligent digital terminal of 5G passive optical network |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921785868.1U CN210381199U (en) | 2019-10-23 | 2019-10-23 | Intelligent digital terminal of 5G passive optical network |
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| Publication Number | Publication Date |
|---|---|
| CN210381199U true CN210381199U (en) | 2020-04-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921785868.1U Expired - Fee Related CN210381199U (en) | 2019-10-23 | 2019-10-23 | Intelligent digital terminal of 5G passive optical network |
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| CN (1) | CN210381199U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111487885A (en) * | 2020-04-27 | 2020-08-04 | 电子科技大学中山学院 | Monitoring device for smart home and using method thereof |
-
2019
- 2019-10-23 CN CN201921785868.1U patent/CN210381199U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111487885A (en) * | 2020-04-27 | 2020-08-04 | 电子科技大学中山学院 | Monitoring device for smart home and using method thereof |
| CN111487885B (en) * | 2020-04-27 | 2023-04-28 | 广州宝露智能科技有限公司 | Monitoring device for smart home and application method thereof |
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Granted publication date: 20200421 |