CN210379018U

CN210379018U - Quantum transmitting wave frequency packaging structure

Info

Publication number: CN210379018U
Application number: CN201921555356.6U
Authority: CN
Inventors: 王晓颖
Original assignee: Jiangsu Zhongkang Quantum Technology Co Ltd
Current assignee: Jiangsu Zhongkang Quantum Technology Co Ltd
Priority date: 2019-09-19
Filing date: 2019-09-19
Publication date: 2020-04-21
Anticipated expiration: 2029-09-19

Abstract

The utility model discloses a quantum emission wave frequency packaging structure in the technical field of quantum chip packaging, which comprises a positioning plate, a connecting plate and a cover plate, wherein the positioning plate and the connecting plate are provided with mounting through holes at corresponding positions around the surface, the middle part of the surface of the positioning plate is provided with a placing groove, a circuit board is placed at the bottom of the inner cavity of the placing groove, pins of a quantum chip are inserted into blind holes on spring thimbles, elastic clamping strips at two sides are inwards extruded and the cover plate is pressed, the elastic clamping strips are clamped with clamping grooves, then the distance between a pressing block and the quantum chip is observed through transparent toughened glass, the pressing block of an adhesive insulating rubber pad fixed on the inner surface is screwed in by an adjusting bolt to be attached to the surface of the quantum chip, the surface of the quantum chip is protected, and simultaneously the pins can be matched with the blind holes on the spring thimbles for fixing, the safety is improved, and the practicability is strong.

Description

Quantum transmitting wave frequency packaging structure

Technical Field

The utility model relates to a quantum chip packaging technology field specifically is a quantum emission wave frequency packaging structure.

Background

The quantum transmitting wave frequency belongs to a signal transmitted on a quantum chip, the quantum chip needs an extremely stable external environment when in working so as to avoid interference from the outside, and the naked chip is extremely easy to be influenced by clutter in the surrounding environment, so that the transmission of the signal on the chip is influenced, the performance of the chip is poor or even the chip can not work normally, and under the common condition, the naked quantum chip needs to be packaged firstly and then used, so that the environmental interference is prevented. For example, CN201721871596.8 discloses a quantum chip packaging device, including fixed chamber, alignment chamber, copper sheet, quantum chip and connecting portion, be provided with the recess in the fixed chamber, quantum chip is located the recess, is provided with the benchmark tie point on the quantum chip, and the copper sheet is located quantum chip upper surface and is located the recess, and the copper sheet is the annular, aligns the top that the chamber is located fixed chamber, and copper sheet and quantum chip are located fixed chamber and align between the chamber. The utility model discloses it is low to aim at the precision when can solving quantum chip encapsulation, unable real-time supervision, the quantum chip of correction and the problem of aiming at hole relative position in the packaging process, but among the packaging process, because make quantum chip fix through extrusion quantum chip to inevitable can cause the damage to quantum chip's surface, influence performance, so need to design an encapsulation structure who avoids direct large tracts of land extrusion fixed quantum chip urgently, based on this, the utility model discloses a quantum transmission wave frequency packaging structure to solve above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a quantum emission ripples is packaging structure frequently to what put forward in solving above-mentioned background art needs to design one kind and avoids direct large tracts of land extrusion fixed quantum chip's packaging structure's problem urgently.

In order to achieve the above object, the utility model provides a following technical scheme: a quantum emission wave frequency packaging structure comprises a positioning plate, a connecting plate and a cover plate, wherein mounting through holes are formed in the positioning plate and the corresponding positions on the periphery of the surface of the connecting plate, a placing groove is formed in the middle of the surface of the positioning plate, a circuit board is placed at the bottom of an inner cavity of the placing groove, a groove is formed in the middle of the surface of the connecting plate in a downward direction, the groove is matched and spliced with the placing groove, a plurality of spring thimbles with blind holes in the tops are vertically penetrated and fixed at rectangular uniform intervals at the bottom of the inner cavity of the groove, open grooves are formed in the middles of the left side and the right side of a bead of the groove, a clamping groove is formed below the open grooves, transparent toughened glass is fixedly;

the bottom of apron is equipped with the front end open-ended and holds the groove, the surperficial both sides central authorities of apron have adjusting bolt through ladder screw thread through-hole vertical fixation, the inner wall both sides central authorities that hold the groove are provided with the guide way, the inner chamber of guide way is provided with the briquetting of the sticky insulating rubber pad of internal surface fixation, adjusting bolt's bottom is passed through welded bearing with the top of briquetting and is rotated and be connected, and is two sets of the joint has quantum chip between the briquetting, the both sides central authorities of apron are through erecting the embedded elastic card strip that is fixed with and draw-in groove matching in the groove.

Furthermore, the mounting through holes on the positioning plate are threaded through holes, and the mounting through holes on the connecting plate are smooth through holes.

Furthermore, an insulating anti-skid pad is fixed at the bottom of the inner cavity of the placing groove through a screw.

Furthermore, a concave cavity is formed outwards on the lower portion of the inner wall of the placing groove.

Furthermore, communicated guide grooves are formed in the periphery of the bottom of the inner cavity of the groove and extend to the outer side of the connecting plate.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses utilize participating in of quantum chip and peg graft with the blind hole on the spring thimble, the elasticity card strip of inside extrusion both sides and press the apron, make elasticity card strip and draw-in groove joint, the distance between briquetting and the quantum chip is observed to transparent toughened glass of rethread, utilize adjusting bolt precession to make the briquetting and the laminating of quantum chip surface of the sticky insulating rubber pad of internal surface fixation, the quantum chip surface is protected, can utilize simultaneously participating in and fix with the epaxial blind hole matching grafting of spring thimble, the device simple to operate, avoided carrying on spacingly through direct extrusion chip surface, the security improves, therefore, the clothes hanger is strong in practicability.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a cross-sectional view taken at a-a in fig. 1.

In the drawings, the components represented by the respective reference numerals are listed below:

1-positioning plate, 2-connecting plate, 3-cover plate, 4-circuit board, 5-mounting through hole, 6-spring thimble, 7-open slot, 8-clamping slot, 9-transparent toughened glass, 100-placing slot, 200-groove, 300-holding slot, 301-adjusting bolt, 302-guide slot, 303-pressing block, 304-elastic clamping strip and 305-quantum chip.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Referring to fig. 1-2, the present invention provides a technical solution: a quantum emission wave frequency packaging structure comprises a positioning plate 1, a connecting plate 2 and a cover plate 3, wherein the positioning plate 1, the connecting plate 2 and the cover plate 3 can be overlapped and fixed, mounting through holes 5 are formed in corresponding positions on the periphery of the surfaces of the positioning plate 1 and the connecting plate 2, a placing groove 100 is formed in the middle of the surface of the positioning plate 1, a circuit board 4 is placed at the bottom of an inner cavity of the placing groove 100, a groove 200 is integrally and downwards formed in the middle of the surface of the connecting plate 2, the groove 200 is in matched insertion connection with the placing groove 100, a plurality of spring thimbles 6 with top parts provided with blind holes vertically penetrate through and are fixed at rectangular intervals at the bottom of the inner cavity of the groove 200, the number and distribution of the spring thimbles 6 are set according to quantum chips 305, chip fixing holes in the circuit board 4 are also set according to the types of the quantum, the cover plate 3 and the transparent toughened glass 9 are integrally matched and inserted with the groove 200;

the bottom of apron 3 is equipped with front end open-ended and holds groove 300, apron 3's surperficial both sides central authorities have adjusting bolt 301 through ladder screw thread through-hole vertical fixation, the inner wall both sides central authorities that hold groove 300 are provided with guide way 302, the inner chamber of guide way 302 is provided with the briquetting 303 of the sticky insulating rubber pad of internal surface fixation, adjusting bolt 301's bottom is passed through welded bearing and is rotated with the top of briquetting 303 and be connected, the joint has quantum chip 305 between two sets of briquetting 303, apron 3's both sides central authorities are fixed with the elasticity card strip 304 that matches with draw-in groove 8 through erecting the inslot, participate in of quantum chip 305 and peg graft with the blind hole on the spring thimble 6, the elasticity card strip 304 and the pressure apron 3 of inside extrusion both sides, make elasticity card strip 304 and draw-in groove 8 joint, the rethread transparent toughened glass 9 observes the distance between briquetting 303 and the quantum chip 305, utilize adjusting bolt 301 to screw in to make the briquetting 303 of the.

The mounting through holes 5 on the positioning plate 1 are threaded through holes, the mounting through holes 5 on the connecting plate 2 are smooth through holes, the positioning plate 1 and the connecting plate 2 can be fixed together by short bolts, and the positioning plate 1 and the connecting plate 2 can be fixed together by long bolts.

The bottom of the inner cavity of the placing groove 100 is fixed with an insulating anti-slip pad through a screw, so that the circuit board 4 is prevented from moving and the alignment contact between a welding spot of the circuit board and the bottom of the spring thimble 6 is prevented from being influenced.

The lower part of the inner wall of the placing groove 100 is provided with a concave cavity outwards, so that the threading is convenient to punch from outside to inside.

The bottom of the inner cavity of the groove 200 is provided with communicated guide grooves all around, and the guide grooves extend to the outer side of the connecting plate 2 to play a role in guiding flow and prevent short circuit.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. The utility model provides a quantum emission ripples packaging structure frequently, includes locating plate (1), connecting plate (2) and apron (3), its characterized in that: the corresponding positions on the periphery of the surfaces of the positioning plate (1) and the connecting plate (2) are provided with mounting through holes (5), a placing groove (100) is arranged in the middle of the surface of the positioning plate (1), a circuit board (4) is placed at the bottom of an inner cavity of the placing groove (100), a groove (200) is integrally and downwards arranged in the middle of the surface of the connecting plate (2), the groove (200) is matched and inserted with the placing groove (100), a plurality of spring thimbles (6) with blind holes at the top are vertically penetrated and fixed at the bottom of the inner cavity of the groove (200) in a rectangular shape at even intervals, open grooves (7) are respectively arranged in the middle parts of the left side and the right side of the edge opening of the groove (200), a clamping groove (8) is arranged below the open groove (7), the front surface of the cover plate (3) is fixedly connected with transparent toughened glass (9), the cover plate (3) and the transparent toughened glass (9) are integrally matched and inserted with the groove (200);

the bottom of apron (3) is equipped with front end open-ended and holds groove (300), the surperficial both sides central authorities of apron (3) have adjusting bolt (301) through ladder screw thread through-hole vertical fixation, the inner wall both sides central authorities of holding groove (300) are provided with guide way (302), the inner chamber of guide way (302) is provided with briquetting (303) of the sticky insulating cushion of internal surface mounting, the bottom of adjusting bolt (301) is passed through welded bearing with the top of briquetting (303) and is rotated and be connected, and is two sets of the joint has quantum chip (305) between briquetting (303), the both sides central authorities of apron (3) are fixed with elasticity card strip (304) that match with draw-in groove (8) through erecting the inslot embedding.

2. The structure of claim 1, wherein: the mounting through holes (5) on the positioning plate (1) are threaded through holes, and the mounting through holes (5) on the connecting plate (2) are smooth through holes.

3. The structure of claim 1, wherein: and the bottom of the inner cavity of the placing groove (100) is fixed with an insulating anti-skid pad through a screw.

4. The structure of claim 1, wherein: the lower part of the inner wall of the placing groove (100) is provided with a concave cavity outwards.

5. The structure of claim 1, wherein: communicated guide grooves are formed in the periphery of the bottom of the inner cavity of the groove (200) and extend to the outer side of the connecting plate (2).