CN210375002U - Contact image sensor device and crack change monitoring device with same - Google Patents
Contact image sensor device and crack change monitoring device with same Download PDFInfo
- Publication number
- CN210375002U CN210375002U CN201921162110.2U CN201921162110U CN210375002U CN 210375002 U CN210375002 U CN 210375002U CN 201921162110 U CN201921162110 U CN 201921162110U CN 210375002 U CN210375002 U CN 210375002U
- Authority
- CN
- China
- Prior art keywords
- image sensor
- sensor device
- crack
- photoelectric conversion
- contact image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The utility model provides a contact image sensor device and have its crack change monitoring devices. The contact image sensor device includes: a frame body; the light sources are positioned in the frame and used for irradiating the wall surface and cracks at the position to be detected; the optical lenses are positioned in the frame body, and the left side and the right side of each optical lens are provided with at least one light source; a plurality of photoelectric conversion chips provided in one-to-one correspondence with the plurality of optical lenses, each photoelectric conversion chip being configured to convert an optical signal emitted from a corresponding optical lens into an electrical signal; wherein at least two optical lenses of the plurality of optical lenses are different in height position in the frame body, so that distances between focal points of the at least two optical lenses and the first surface of the frame body are different. The technical scheme of the utility model the problem of the width change of the different degree of depth position of unable real-time detection crack among the prior art has been solved.
Description
Technical Field
The utility model relates to a crack changes monitoring devices field particularly, relates to a contact image sensor device and has its crack change monitoring devices.
Background
The concrete is used as a material for various concrete buildings such as buildings, iron bridges, tunnels and the like, and is increasingly widely applied. However, as the service life of concrete increases, cracks are generated, and rainwater penetrates into the cracks to deteriorate the wall, resulting in a reduction in the strength of the building. For this reason, the building must be maintained, and the state of the crack must be constantly grasped when the maintenance is performed.
At present, when a crack on concrete is inspected, an operator needs to directly measure the width of the crack by using a graduated scale on site or take a picture of the crack by using a digital camera on site, and then brings a measurement result back to a management center for analysis and then determines whether corresponding maintenance is needed.
The current detection means is to detect the state of the surface of the wall crack when the wall crack is shot, the depth of the crack cannot be detected, and whether the building reaches the state needing maintenance or not needs to be periodically measured on site, so that the implementation is very troublesome, and the burden of workers and the measurement cost are increased. In addition, cracks of different depths of concrete are the key india for determining whether to perform maintenance, and the width of the cracks of different depths can be changed differently along with the change of time, so that the real-time detection of the cracks of different depths is very important.
That is, there is no tool in the prior art to detect in real time the change in width of the fracture at different depths.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a contact image sensor device and a crack change monitoring device having the same to solve the problem of the width change of the different depth positions of the crack which cannot be detected in real time in the prior art.
In order to achieve the above object, according to an aspect of the present invention, there is provided a contact image sensor device including: a frame body; the light sources are positioned in the frame and used for irradiating the wall surface and cracks at the position to be detected; the optical lenses are positioned in the frame body, and the left side and the right side of each optical lens are provided with at least one light source; a plurality of photoelectric conversion chips provided in one-to-one correspondence with the plurality of optical lenses, each photoelectric conversion chip being configured to convert an optical signal emitted from a corresponding optical lens into an electrical signal; wherein at least two optical lenses of the plurality of optical lenses are different in height position in the frame body, so that distances between focal points of the at least two optical lenses and the first surface of the frame body are different.
Further, the contact image sensor device further includes a transparent plate connected with the frame body and forming an accommodation chamber, wherein distances between focal points of at least two of the plurality of optical lenses and an upper surface of the transparent plate are different.
Furthermore, the contact image sensor device also comprises a circuit board positioned in the frame body, and a plurality of photoelectric conversion chips are arranged on the circuit board; or, the contact image sensor device further comprises a plurality of circuit boards located in the frame, and the plurality of circuit boards and the plurality of photoelectric conversion chips are arranged in a one-to-one correspondence manner.
Further, the light source is an LED light source, which emits visible and/or invisible light.
According to the utility model discloses an on the other hand provides a crack change monitoring devices, and crack change monitoring devices includes: the box body is provided with a detection surface, and the detection surface is attached to a position to be detected; the contact type image sensor device is positioned in the box body; the crack change monitoring part is connected with the contact type image sensor device and obtains width data of different depth positions of the crack at the position to be detected according to the signal detected by the contact type image sensor device; the output device is connected with the crack change monitoring part and outputs the crack change monitoring part in at least one mode of displaying, storing, recording and alarming; the contact image sensor device is the contact image sensor device.
Further, the output device includes a wireless control section that receives and transmits width data of different depth positions of the crack.
Further, the wireless control unit includes: a wireless network; the wireless control body receives width data of different depth positions of the crack; the antenna is connected with the wireless control body and sends width data of different depth positions of the crack outwards through the wireless network.
Furthermore, the contact image sensor device also comprises a control switch, wherein the control switch is connected with the plurality of photoelectric conversion chips to control the on-off of the photoelectric conversion chips; or, the contact image sensor device further includes a plurality of control switches, and the plurality of control switches and the plurality of photoelectric conversion chips are arranged in one-to-one correspondence.
Further, the contact image sensor device includes three optical lenses, and distances between focal points of the three optical lenses and the first surface of the transparent plate provided on the frame are different.
Furthermore, crack change monitoring devices still includes the power supply portion that is located the box, and contact image sensor device and crack change monitoring portion all are connected with power supply portion.
Use the technical scheme of the utility model, after being applied to crack change monitoring devices with above-mentioned contact image sensor device, shine through using the light source to wait to detect the position, and wait to detect the position through a plurality of optical lens and carry out image acquisition, because the focus of two at least optical lens is different with the distance between the first surface of framework (two at least optical lens have different optical focus characteristics promptly), correspondingly can obtain the width change of fissured different degree of depth positions, owing to set up a plurality of optical lens, thereby can carry out real-time detection to the width change of fissured different degree of depth positions.
Drawings
The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 shows a schematic structural view of an embodiment of a crack change monitoring device according to the present invention;
FIG. 2 shows a schematic view of a contact image sensor device of the crack change monitoring device of FIG. 1;
FIG. 3 is a schematic diagram showing focal positions of three optical lenses of the contact image sensor device of FIG. 2;
FIG. 4 shows a schematic structural view of a concrete crack to be detected in an initial state (wherein three different depth positions of the crack are shown);
FIG. 5 shows a schematic view of the installation of the fracture change monitoring device of FIG. 1 to the fracture of FIG. 4;
FIG. 6 is a timing diagram of a plurality of photoelectric conversion chips when the crack change monitoring apparatus of FIG. 1 is used to scan the concrete crack in the initial state of FIG. 4;
FIG. 7 shows a schematic view of the concrete crack of FIG. 4 after being altered;
FIG. 8 is a timing chart showing an operation explanation obtained by detecting the crack in FIG. 7; and
fig. 9 shows another schematic view of a contact image sensor device of the crack change monitoring device of fig. 1.
Wherein the figures include the following reference numerals:
10. a contact image sensor device; 11. a frame body; 12. a light source; 13. a photoelectric conversion chip; 14. a circuit board; 15. a transparent plate; 17. an optical lens; 18. a control switch; 20. a crack change monitoring section; 30. an output device; 31. a wireless control unit; 40. a power supply unit; 50. and (4) a box body.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
It is noted that, unless otherwise indicated, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
In the present application, where the contrary is not intended, the use of directional words such as "upper, lower, top and bottom" is generally with respect to the orientation shown in the drawings, or with respect to the component itself in the vertical, perpendicular or gravitational direction; likewise, for ease of understanding and description, "inner and outer" refer to the inner and outer relative to the profile of the components themselves, but the above directional words are not intended to limit the invention.
In order to solve the problem that is difficult to the different degree of depth positions of real-time detection fracture among the prior art, the utility model discloses a reach the embodiment of the utility model provides a contact image sensor device and have its crack change monitoring devices.
Specifically, as shown in fig. 2, the contact image sensor device 10 of the present embodiment includes a frame 11, a plurality of light sources 12, a plurality of optical lenses 17, and a plurality of photoelectric conversion chips 13. The light sources 12 are positioned in the frame body 11, and the light sources 12 are used for irradiating the wall surface and cracks at the position to be detected; the plurality of optical lenses 17 are positioned in the frame body 11, and the left side and the right side of the plurality of optical lenses 17 are provided with at least one light source 12; the plurality of photoelectric conversion chips 13 are arranged in one-to-one correspondence with the plurality of optical lenses 17, and each photoelectric conversion chip 13 is configured to convert an optical signal emitted from the corresponding optical lens 17 into an electrical signal; wherein the distances between the focal points of at least two optical lenses 17 of the plurality of optical lenses 17 and the first surface of the frame 11 are different.
After the contact image sensor device 10 is applied to a crack change monitoring device, a position to be detected is irradiated by using the light source 12, and the position to be detected is subjected to image acquisition through the plurality of optical lenses 17, because distances between focuses of the at least two optical lenses 17 and the first surface of the frame 11 are different (namely, the at least two optical lenses 17 have different optical focus characteristics), width changes of the crack from different depth positions of the first surface of the frame 11 can be obtained, and because the plurality of optical lenses 17 are arranged, the width changes of the crack from different depth positions can be detected in real time.
As shown in fig. 2, in the embodiment of the present invention, the contact image sensor device 10 further includes a transparent plate 15, the transparent plate 15 is connected to the frame 11 and forms a receiving cavity, wherein distances between focuses of at least two optical lenses 17 of the plurality of optical lenses 17 and an upper surface of the transparent plate 15 are different.
In the above arrangement, when the distances between the focal points of the plurality of optical lenses 17 and the upper surface of the transparent plate 15 are different, information of different positions from the upper surface of the transparent plate 15 can be read by the different photoelectric conversion chips 13, so that, after an image of a crack is acquired by the above-described contact image sensor device 10, the width change of different depth positions of the crack can be detected in real time.
As shown in fig. 2, in the embodiment of the present invention, the contact image sensor device 10 further includes a circuit board 14 located in the frame 11, and the plurality of photoelectric conversion chips 13 are disposed on the circuit board 14.
In the above arrangement, by providing one circuit board 14, the start and stop of the plurality of photoelectric conversion chips 13 on the same circuit board 14 can be controlled by the control switch 18, so as to control the operation of different optical lenses 17.
Specifically, as shown in fig. 2, the number of the optical lenses 17 is three, and the three optical lenses include a first optical lens 171, a second optical lens 172, and a third optical lens 173; the number of the photoelectric conversion chips 13 is also three, and the three photoelectric conversion chips include a first photoelectric conversion chip 131, a second photoelectric conversion chip 132, and a third photoelectric conversion chip 133. A wiring board 14 is disposed below the three optical lenses 17 (i.e., the first optical lens 171, the second optical lens 172, and the third optical lens 173), and three photoelectric conversion chips 13 (i.e., the first photoelectric conversion chip 131, the second photoelectric conversion chip 132, and the third photoelectric conversion chip 133) are disposed on a side of the wiring board 14 facing the three optical lenses 17 (i.e., the first optical lens 171, the second optical lens 172, and the third optical lens 173). The top surface of each photoelectric conversion chip 13 is provided with a photosensitive window, and a circuit is arranged inside the photoelectric conversion chip 13, and the photoelectric conversion chip 13 has a function of converting an optical signal into an electrical signal. Among them, the three optical lenses 17 (i.e., the first optical lens 171, the second optical lens 172, and the third optical lens 173) are located at different height positions in the frame 11, and due to different optical focal point characteristics of the three optical lenses 17 (i.e., the first optical lens 171, the second optical lens 172, and the third optical lens 173), the three photoelectric conversion chips 13 (i.e., the first photoelectric conversion chip 131, the second photoelectric conversion chip 132, and the third photoelectric conversion chip 133) are used to scan crack states at different depths.
Of course, in a different alternative embodiment, as shown in fig. 9, the contact image sensor device 10 further includes a plurality of circuit boards 14 located in the frame 11, and the plurality of circuit boards 14 are arranged in one-to-one correspondence with the plurality of photoelectric conversion chips 13.
In the above arrangement, by providing a plurality of circuit boards 14, the start and stop of the photoelectric conversion chips 13 on different circuit boards 14 can be controlled by the control switch 18, so as to control different optical lenses 17 to operate.
Specifically, as shown in fig. 9, the number of the optical lenses 17 is three. The three optical lenses 17 include a first optical lens 171, a second optical lens 172, and a third optical lens 173; the number of the photoelectric conversion chips 13 is also three, and the three photoelectric conversion chips include a first photoelectric conversion chip 131, a second photoelectric conversion chip 132, and a third photoelectric conversion chip 133; the number of the circuit boards 14 is also three, and specifically includes a first circuit board 141, a second circuit board 142, and a third circuit board 143. Specifically, the first optical lens 171 and the first photoelectric conversion chip 131 are disposed correspondingly, the second optical lens 172 and the second photoelectric conversion chip 132 are disposed correspondingly, and the third optical lens 173 and the third photoelectric conversion chip 133 are disposed correspondingly, wherein the first photoelectric conversion chip 131 is disposed on the first circuit board 141, the second photoelectric conversion chip 132 is disposed on the second circuit board 142, and the third photoelectric conversion chip 133 is disposed on the third circuit board 143, and the first circuit board 141, the second circuit board 142, and the third circuit board 143 are different in height position within the housing 11. The top surface of each photoelectric conversion chip 13 is provided with a photosensitive window, a circuit is arranged inside the photoelectric conversion chip 13, and the photoelectric conversion chip 13 has a function of converting an optical signal into an electrical signal. The first circuit board 141, the second circuit board 142, and the third circuit board 143 are located at different height positions in the frame 11, and due to different optical focal characteristics of the first optical lens 171, the second optical lens 172, and the third optical lens 173, the first photoelectric conversion chip 131, the second photoelectric conversion chip 132, and the third photoelectric conversion chip 133 achieve scanning of crack states at different depths.
Preferably, the optical lens 17 is a cylindrical lens, and due to the symmetrical focal distance characteristics, the first optical lens 171, the second optical lens 172 and the third optical lens 173 on the other side can be scanned by arranging different circuit boards (the first circuit board 141, the second circuit board 142 and the third circuit board 143) at different positions.
The principle and steps of detecting different depth positions of a crack by using the crack change monitoring device of the present embodiment will be described below with reference to fig. 3 to 5.
As shown in fig. 3, the three optical lenses 17 (i.e., the first optical lens 171, the second optical lens 172, and the third optical lens 173) of the present embodiment have different optical focal characteristics, and the focal positions of the three optical lenses 17 (i.e., the first optical lens 171, the second optical lens 172, and the third optical lens 173) are L1, L2, and L3 positions from the upper surface of the transparent plate 15, respectively. That is, the three photoelectric conversion chips 13 (i.e., the first photoelectric conversion chip 131, the second photoelectric conversion chip 132, and the third photoelectric conversion chip 133) can clearly read information of positions L1, L2, and L3 from the upper surface of the transparent plate 15 through the three optical lenses 17 (i.e., the first optical lens 171, the second optical lens 172, and the third optical lens 173).
Fig. 4 is a schematic structural diagram of a concrete crack in an initial state. For example, the depth direction of the concrete crack to be read is divided into three depth positions a, b and c, and the width of the crack corresponding to a, b and c is a1, b1 and c 1.
Fig. 5 is a schematic view illustrating the installation position of the full depth-of-field crack change monitoring device in the crack according to the present embodiment. Fig. 5 is only to illustrate the installation positions of the three optical lenses corresponding to different depths of the crack when the crack change monitoring device for detecting cracks at full depth of field scans the state of the crack, and does not show the installation method of the crack change monitoring device for detecting cracks at full depth of field in actual use. After the full-depth crack change monitoring device is installed in the present embodiment, the focal positions L1, L2, and L3 of the three optical lenses 17 (i.e., the first optical lens 171, the second optical lens 172, and the third optical lens 173) away from the upper surface of the transparent plate 15 coincide with the three crack depth positions a, b, and c of the concrete to be read, and the focal position L1 coincides with the position a, the focal position L2 coincides with the position b, and the focal position L3 coincides with the position c.
Fig. 6 and 8 are timing diagrams illustrating operations of the contact image sensor device 10, and include a clock signal 704 and a line period signal 705. Specifically, fig. 6 is a timing chart corresponding to the three photoelectric conversion chips 13 (i.e., the first photoelectric conversion chip 131, the second photoelectric conversion chip 132, and the third photoelectric conversion chip 133) when the crack change monitoring apparatus of the present embodiment scans the crack in the initial state of fig. 4. The three photoelectric conversion chips 13 (i.e., the first photoelectric conversion chip 131, the second photoelectric conversion chip 132, and the third photoelectric conversion chip 133) have a common clock signal 704 and a common line cycle signal 705.
Among them, 701, 702, and 703 are output signals corresponding to the three photoelectric conversion chips 13 (i.e., the first photoelectric conversion chip 131, the second photoelectric conversion chip 132, and the third photoelectric conversion chip 133). Since the three optical lenses 17 (i.e., the first optical lens 171, the second optical lens 172, and the third optical lens 173) correspond to the three crack depth positions a, b, and c of the concrete, respectively, the three photoelectric conversion chips 13 (i.e., the first photoelectric conversion chip 131, the second photoelectric conversion chip 132, and the third photoelectric conversion chip 133) scan the crack widths a1, b1, and c1 corresponding to the three crack depth positions a, b, and c, respectively. At this time, the slit widths a1, B1, C1 corresponding one-to-one to the three depth positions a, B, C, the number of clocks of the clock 704 corresponding to the three slit widths a1, B1, and C1 is a1 (corresponding to a 1), B1 (corresponding to B1), and C1 (corresponding to C1). Assuming that the working frequency and the working resolution corresponding to the three photoelectric conversion chips are fixed, the crack width data corresponding to 1 clock of the three photoelectric conversion chips is d. The crack widths corresponding to the three depth positions a, B, C of the initial state crack of fig. 4 are a1 × d, B1 × d, and C1 × d in this order. In this example, as shown in fig. 6, in the initial state, no crack is present at the depth position c, and the crack width is 0.
Fig. 7 shows a schematic structural view of the concrete crack of fig. 4 after being changed. If the depth direction of the concrete crack to be read is still three depth positions a, b and c, the crack width after the change of the crack at the three positions a, b and c is a2, b2 and c 2.
Fig. 8 shows an operation explanatory timing chart obtained by detecting the crack in fig. 7. As shown in fig. 8, it is a timing chart corresponding to the three photoelectric conversion chips 13 (i.e. the first photoelectric conversion chip 131, the second photoelectric conversion chip 132, and the third photoelectric conversion chip 133) when the scanning state of the full-depth scanning monitoring apparatus for detecting cracks changes in the present embodiment. The three photoelectric conversion chips 13 (i.e., the first photoelectric conversion chip 131, the second photoelectric conversion chip 132, and the third photoelectric conversion chip 133) have a common clock signal 704 and a common line cycle signal 705. 701. 702, 703 are output signals corresponding to the three photoelectric conversion chips 131, 132, 133. Since the three optical lenses 17 (i.e., the first optical lens 171, the second optical lens 172, and the third optical lens 173) correspond to the three crack depth positions a, b, and c of the concrete, respectively, after the three photoelectric conversion chips 13 (i.e., the first photoelectric conversion chip 131, the second photoelectric conversion chip 132, and the third photoelectric conversion chip 133) scan the three crack depth positions a, b, and c, the obtained corresponding crack widths are a2 (corresponding to the depth position a), b2 (corresponding to the depth position b), and c2 (corresponding to the depth position c), respectively. At this time, the numbers of clocks 704 corresponding to the slit widths a2, B2, C2 of the three depth positions a, B, C are a2, B2 and C2 in this order.
Assuming that the operating frequency and the operating resolution corresponding to the three photoelectric conversion chips are fixed, the crack width signal corresponding to 1 clock of the three photoelectric conversion chips is d. The widths of the cracks at the three depth positions a, B and C after the concrete crack changes shown in fig. 7 are a2 xd, B2 xd and C2 xd, respectively.
According to the embodiment, different crack widths of each depth position of the crack can be clearly read through the crack change monitoring device.
In particular, in embodiments of the present invention, the light source 12 is an LED light source that emits visible and/or invisible light. In a typical monitoring process, LED light sources with wavelengths in the visible light band, such as red, green, blue, etc., can be selected. And in some special occasions, the information of the depth direction and the surface state of the crack of the concrete and the like can be read in more detail by using the LED light source of infrared light and ultraviolet light.
As shown in fig. 1, in an embodiment of the present invention, the crack change monitoring device includes a box 50, a contact image sensor device 10, a crack change monitoring unit 20, and an output device 30. The box body 50 is provided with a detection surface, and the detection surface is attached to a position to be detected; the contact image sensor device 10 is located in the case 50; the crack change monitoring part 20 is connected with the contact image sensor device 10 and obtains width data of different depth positions of the crack at the position to be detected according to the signal detected by the contact image sensor device 10; the output device 30 is connected with the crack change monitoring part 20 and outputs the crack change monitoring part in at least one of display, storage record and alarm; the contact image sensor device 10 is the aforementioned contact image sensor device 10.
When using the crack change monitoring devices of above-mentioned structure, treat through contact image sensor device 10 and detect the position and carry out image acquisition, can send the luminance grade line of the different degree of depth positions that wait to detect the position to crack change monitoring portion 20, crack change monitoring portion 20 receives above-mentioned luminance grade line after, can save and handle different luminance grade lines, calculate the width change of the different degree of depth positions of the same crack that corresponds simultaneously, therefore can the width change of the different degree of depth positions of real-time supervision crack, compare prior art, the operation burden of detecting the crack has been improved by a wide margin, and the efficiency is improved. In addition, after the crack change monitoring unit 20 calculates and processes the related data, the calculated data may be sent to the output device 30, and after the output device 30 receives the data, a reminder may be sent to the operator according to the actual situation (for example, the data exceeds the set value).
As shown in fig. 1, in the embodiment of the present invention, the output device 30 includes a wireless control unit 31, and the wireless control unit 31 receives and transmits the width variation data of different depth positions of the crack. With this arrangement, after the crack change monitoring unit 20 processes the data acquired by the contact image sensor device 10, the data can be transmitted to the wireless control unit 31 and transmitted to the outside through the wireless control unit 31.
Specifically, the wireless control unit 31 includes: a wireless network; the wireless control body receives width data of different degrees of positions of the crack; the antenna is connected with the wireless control body and sends width data of different depth positions of the crack outwards through the wireless network. The selected wireless network can be a low-power wide area wireless network.
In particular, the output means 30 also comprise a database. The database stores the width change data of the crack transmitted by the wireless control unit 31; and the computer terminal analyzes the width change data of the cracks and sends a prompt when the width change data of the cracks in the database exceeds an early warning value. With this arrangement, the data can be stored after the database receives the data of the width change of the crack transmitted from the wireless control unit. And the computer terminal is arranged, so that the information in the database can be analyzed and monitored through the computer terminal.
Optionally, the computer terminal comprises at least one of a display, a buzzer alarm and an alarm indicator.
As shown in fig. 1, in the embodiment of the present invention, the contact image sensor device 10 further includes a plurality of control switches, and the plurality of control switches 18 and the plurality of photoelectric conversion chips 13 are arranged in a one-to-one correspondence.
With the above arrangement, each photoelectric conversion chip 13 is controlled by an independent control switch 18, so that different photoelectric conversion chips 13 can be turned on or off according to actual needs. Specifically, the number of the control switches is three, and the three control switches include a first control switch 181, a second control switch 182, and a third control switch 183. The three control switches 18 (i.e., the first control switch 181, the second control switch 182, and the third control switch 183) control the on/off of the three photoelectric conversion chips 13 (i.e., the first photoelectric conversion chip 131, the second photoelectric conversion chip 132, and the third photoelectric conversion chip 133) in a one-to-one correspondence. In other words, the first control switch 181 controls the on/off of the first photoelectric conversion chip 131; the second control switch 182 controls the on/off of the second photoelectric conversion chip 132; the third control switch 183 controls the on/off of the third photoelectric conversion chip 133. After the corresponding control switch is arranged for each photoelectric conversion chip, the start and stop of different photoelectric conversion chips can be independently controlled according to actual needs.
Of course, in an alternative embodiment not shown in the drawings of the present application, it may also be configured as required, and the contact image sensor apparatus 10 further includes a control switch, and the control switch is connected to the plurality of photoelectric conversion chips 13 to control the on/off of all the photoelectric conversion chips 13.
As shown in fig. 1 to 5, in an embodiment of the present invention, the contact image sensor device 10 includes three optical lenses 17 (i.e., a first optical lens 171, a second optical lens 172, and a third optical lens 173), and distances between focal points of the three optical lenses 17 (i.e., the first optical lens 171, the second optical lens 172, and the third optical lens 173) and the first surface of the frame 11 are different.
Thus, when there are three optical lenses 17, the positions of three different depths of the crack in the same wall surface can be monitored.
As shown in fig. 1, in the embodiment of the present invention, the crack change monitoring device further includes a power supply portion 40 located in the box 50, and both the contact image sensor device 10 and the crack change monitoring portion 20 are connected to the power supply portion 40.
Specifically, the power supply unit 40 is a battery pack, and the power supply unit 40 can supply power to the contact image sensor device 10, the crack change monitoring unit 20, and the wireless control unit 31 of the output device 30.
From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects: by illuminating the position to be detected with a light source and image-acquiring the position to be detected by means of three optical lenses, the width variation of the different depth positions of the slit can be obtained accordingly, due to the different distances (L1, L2 and L3) between the focal points of the three optical lenses and the first surface of the transparent plate (i.e. the three optical lenses have different optical focal properties); further, carry out image acquisition to waiting to detect the position through contact image sensor device, can change the monitoring portion to the crack and send the luminance grade line of waiting to detect the different depth position of position, crack change monitoring portion receives above-mentioned luminance grade line after, can save and handle different luminance grade lines, calculate the width change of the different depth position of the same crack that corresponds simultaneously, therefore can the width change of the different depth position of real-time supervision crack, compare prior art, the operation burden of detecting the crack has been improved by a wide margin, and efficiency is improved.
It is obvious that the above described embodiments are only some of the embodiments of the present invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular is intended to include the plural unless the context clearly dictates otherwise, and it should be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of features, steps, operations, devices, components, and/or combinations thereof.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A contact image sensor device, characterized in that the contact image sensor device (10) comprises:
a frame (11);
the light sources (12) are positioned in the frame body (11), and the light sources (12) are used for irradiating the wall surface and cracks at the position to be detected;
a plurality of optical lenses (17) positioned in the frame body (11), wherein at least one light source (12) is arranged on each of the left side and the right side of each optical lens (17);
a plurality of photoelectric conversion chips (13) provided in one-to-one correspondence with the plurality of optical lenses (17), each of the photoelectric conversion chips being configured to convert an optical signal emitted from the corresponding optical lens (17) into an electrical signal;
wherein the height positions of at least two optical lenses (17) in the frame (11) in the plurality of optical lenses (17) are different, so that the distances between the focal points of the at least two optical lenses (17) and the first surface of the frame (11) are different.
2. The contact image sensor device according to claim 1, wherein the contact image sensor device (10) further comprises a transparent plate (15), the transparent plate (15) being connected to the frame body (11) and forming a receiving cavity, wherein distances between focal points of at least two of the optical lenses (17) of the plurality of optical lenses (17) and an upper surface of the transparent plate (15) are different.
3. The contact image sensor device according to claim 1,
the contact image sensor device (10) further comprises a circuit board (14) positioned in the frame body (11), and the plurality of photoelectric conversion chips (13) are arranged on the circuit board (14);
or, the contact image sensor device (10) further comprises a plurality of circuit boards (14) positioned in the frame body (11), and the plurality of circuit boards (14) and the plurality of photoelectric conversion chips (13) are arranged in a one-to-one correspondence manner.
4. A contact image sensor device according to any of claims 1 to 3, characterized in that the light source (12) is an LED light source emitting visible and/or invisible light.
5. A fracture-variation monitoring device, comprising:
the box body (50) is provided with a detection surface, and the detection surface is attached to the position to be detected;
a contact image sensor device located within the housing (50);
the crack change monitoring part (20) is connected with the contact type image sensor device and obtains width data of different depth positions of the crack at the position to be detected according to signals detected by the contact type image sensor device;
an output device (30), wherein the output device (30) is connected with the crack change monitoring part (20) and outputs the crack change monitoring part in at least one mode of displaying, storing and recording and alarming;
wherein the contact image sensor device is a contact image sensor device (10) according to any one of claims 1 to 4.
6. Crack change monitoring device according to claim 5, characterized in that the output device (30) comprises a wireless control (31), which wireless control (31) receives and transmits width data of different depth positions of the crack.
7. Crack change monitoring device according to claim 6, characterized in that the wireless control part (31) comprises:
a wireless network;
a wireless control body that receives width data for different depth positions of the fracture;
the antenna is connected with the wireless control body and sends width data of different depth positions of the crack outwards through the wireless network.
8. Crack change monitoring device according to claim 5,
the contact type image sensor device (10) further comprises a control switch, and the control switch is connected with the plurality of photoelectric conversion chips (13) to control the on-off of the photoelectric conversion chips (13);
or, the contact image sensor device (10) further comprises a plurality of control switches, and the plurality of control switches and the plurality of photoelectric conversion chips (13) are arranged in a one-to-one correspondence manner.
9. Crack change monitoring device according to claim 5 characterized in that the contact image sensor device (10) comprises three optical lenses (17), the focal points of the three optical lenses (17) being at different distances from the first surface of a transparent plate (15) arranged on the frame (11).
10. Crack change monitoring device according to any of the claims 5-9, characterized in that the crack change monitoring device further comprises a power supply (40) inside the box (50), the contact image sensor device (10) and the crack change monitoring portion (20) being connected to the power supply (40).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921162110.2U CN210375002U (en) | 2019-07-23 | 2019-07-23 | Contact image sensor device and crack change monitoring device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921162110.2U CN210375002U (en) | 2019-07-23 | 2019-07-23 | Contact image sensor device and crack change monitoring device with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210375002U true CN210375002U (en) | 2020-04-21 |
Family
ID=70273126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921162110.2U Active CN210375002U (en) | 2019-07-23 | 2019-07-23 | Contact image sensor device and crack change monitoring device with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210375002U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111650207A (en) * | 2020-05-29 | 2020-09-11 | 威海华菱光电股份有限公司 | Welding crack detection device, method and system |
-
2019
- 2019-07-23 CN CN201921162110.2U patent/CN210375002U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111650207A (en) * | 2020-05-29 | 2020-09-11 | 威海华菱光电股份有限公司 | Welding crack detection device, method and system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210037627U (en) | Crack change monitoring device | |
| WO2020177165A1 (en) | Crack change monitoring device and crack change monitoring method | |
| KR20160124504A (en) | A multi-functional street light system | |
| CN207163931U (en) | Glass defect detection device | |
| CN210375002U (en) | Contact image sensor device and crack change monitoring device with same | |
| CN105486243A (en) | Bridge flexibility monitoring system based on visible light imaging technology | |
| JP6642400B2 (en) | Light detection device and equipment management system | |
| CN101270978A (en) | Ranging system, ranging method, electronic device system and remote controller | |
| KR100953942B1 (en) | Concrete slump flow tester and Concrete consistency test method using the same | |
| CN105004282A (en) | Depth data detecting device | |
| KR100789477B1 (en) | A measuring system for vibration and noise in a construction site | |
| US20190187065A1 (en) | Lighting apparatus, method for providing lighting system, and road management system | |
| CN107271466B (en) | Nondestructive testing system | |
| CN109341542A (en) | Method and its monitoring device based on digital signal sequences length identification fracture width | |
| JP2017011429A (en) | Inspection apparatus | |
| CN211318239U (en) | Toughened glass curtain wall impurity and defect on-site detecting system | |
| KR20160000468A (en) | A warning system for process states using a LED module and determining method of alarm mode | |
| CN110986875A (en) | Automatic monitoring device, system and method for tunnel vault settlement | |
| CN111817440B (en) | Transformer monitoring method and device | |
| CN112415927B (en) | Monitoring system for photoelectric gap of point switch | |
| CN201690660U (en) | Area lighting detector | |
| JP2009250879A (en) | Apparatus and method for inspecting light-emitting device | |
| CN210922515U (en) | Contact image sensor and crack change monitoring device | |
| CN112066859A (en) | Light spot position detection method and light spot position detection system | |
| ATE292806T1 (en) | OPTOELECTRONIC MONITORING SYSTEM |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |