CN210374925U - 一种集成电路板厚度检测装置 - Google Patents
一种集成电路板厚度检测装置 Download PDFInfo
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- CN210374925U CN210374925U CN201921782319.9U CN201921782319U CN210374925U CN 210374925 U CN210374925 U CN 210374925U CN 201921782319 U CN201921782319 U CN 201921782319U CN 210374925 U CN210374925 U CN 210374925U
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CN201921782319.9U CN210374925U (zh) | 2019-10-23 | 2019-10-23 | 一种集成电路板厚度检测装置 |
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CN112858880A (zh) * | 2021-01-12 | 2021-05-28 | 安徽华为硕半导体科技有限公司 | 一种集成电路的测试装置 |
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CN112858880A (zh) * | 2021-01-12 | 2021-05-28 | 安徽华为硕半导体科技有限公司 | 一种集成电路的测试装置 |
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TR01 | Transfer of patent right |
Effective date of registration: 20220519 Address after: 233099 workshop 7 and 8, zone a, China (Bengbu) sensor Valley, No. 888 Donghai Avenue, economic development zone, Bengbu City, Anhui Province Patentee after: Anhui Yuxin Semiconductor Technology Co.,Ltd. Address before: 234000 1st and 2nd floor, No.3 Factory building, Tonghui Photoelectric Industrial Park, Suzhou hi tech Industrial Development Zone, Anhui Province Patentee before: Anhui Huawei Shuo Semiconductor Technology Co.,Ltd. |
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TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200421 |
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CF01 | Termination of patent right due to non-payment of annual fee |