CN210361603U

CN210361603U - Lead frame die shaping unloading structure for semiconductor

Info

Publication number: CN210361603U
Application number: CN201921116789.1U
Authority: CN
Inventors: 刘明华; 邹学彬
Original assignee: CHENGDU SHANGMING INDUSTRIAL CO LTD
Current assignee: CHENGDU SHANGMING INDUSTRIAL CO LTD
Priority date: 2019-07-17
Filing date: 2019-07-17
Publication date: 2020-04-21
Anticipated expiration: 2029-07-17

Abstract

The utility model relates to a lead frame die plastic structure of unloading for semiconductor, include: a base and a transmission frame, wherein the top of the base is welded with a support frame, the inner ring of the first bearing is fixedly connected with a roll shaft, the other end of the roll shaft is fixedly connected with the inner ring of the second bearing, four fixing blocks are fixedly connected with two sides of the transmission frame, a fixing rod is fixedly connected with one side of each fixing block, the outer side wall of the fixed rod is fixedly connected with a scrubbing brush, one side of the transmission frame is fixedly connected with a baffle plate, the punched lead frame slides to one side from the roll shaft through the roll shaft, the waste materials attached to the lead frame are cleaned through the upper side and the lower side of the scrubbing brush during sliding, the dropped waste materials fall into the material receiving box, the lead frame through the roller enters into from the flitch and places the incasement, makes the waste material after the punching press and product in time separately, has avoided the staff to clear up the product, has saved the time, the subsequent work link of being convenient for.

Description

Lead frame die shaping unloading structure for semiconductor

Technical Field

The utility model relates to a mould technical field is glued to the plastic envelope, in particular to lead frame die plastic structure of unloading for semiconductor.

Background

The lead frame is used as a chip carrier of an integrated circuit, the lead frame is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of a gold bonding wire to form an electrical circuit, the lead frame plays a role of a bridge connected with an external lead, the lead frame is required to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry, the lead frame is mainly produced by a die stamping method and a chemical etching method, the lead frame can not only obtain a required product after being stamped by the die, but also generate redundant waste materials, the current production generally has no special link aiming at waste material removal, the waste materials and the product are often mixed together or part of the waste materials and the product are mixed together, so that workers can clean the product, waste time and labor and can influence the subsequent work.

The above information disclosed in the background section is only for enhancement of understanding of the background of the present invention, and therefore it may contain information that does not form the prior art that is known to those of ordinary skill in the art.

SUMMERY OF THE UTILITY MODEL

In view of the above, embodiments of the present invention provide a lead frame stamping and shaping unloading structure for semiconductor, so as to solve or alleviate the technical problems in the prior art, and at least provide a useful choice.

The embodiment of the utility model provides a technical scheme is so realized:

according to the utility model discloses an embodiment provides a lead frame die plastic structure of unloading for semiconductor, include: base and transmission frame, the top welding of base has the support frame, the lateral wall fixedly connected with mounting of support frame, the mounting is articulated through one side of pivot and support frame, the inside wall fixed connection of transmission frame is in the outer lane of first bearing, the inside wall fixed connection that transmission frame is located first bearing relative position is in the outer lane of second bearing, the inner circle fixedly connected with roller of first bearing, the other end of roller and the inner circle fixed connection of second bearing, four fixed blocks of the equal fixedly connected with in both sides of transmission frame, four the equal fixedly connected with dead lever in one side of fixed block, the lateral wall fixedly connected with scrubbing brush of dead lever, one side fixedly connected with baffle of transmission frame.

In some embodiments, a rubber sleeve is sleeved on the outer wall of the roll shaft.

In some embodiments, the two sides of the bottom of the transmission frame are fixedly connected with a material receiving box, and one side of the material receiving box is hinged with a box door.

In some embodiments, a placing box is arranged on one side of the transmission frame, a material plate is inserted into the placing box, and one end of the material plate is located on one side of the transmission frame.

In some embodiments, sliding grooves are formed in two sides of the bottom of the transmission frame, a guide rail is fixedly connected to one side of the material receiving box, and the guide rail is in sliding connection with the sliding grooves.

In some embodiments, a through hole is formed in one side of the bottom of the transmission frame, a screw is inserted into the through hole, and the outer wall of the screw is in threaded connection with the inner wall of the through hole.

The embodiment of the utility model provides a owing to adopt above technical scheme, it has following advantage: through setting up the roller, the lead frame after the punching press slides to one side from the roller, cleans the subsidiary waste material on the lead frame through both sides about the scrubbing brush during slip, and the waste material that drops falls into to the storage box, and the lead frame through the roller enters into from the flitch and places the incasement, makes the waste material after the punching press and product in time separately, has avoided the staff to clear up the product, has saved the time, the subsequent working link of being convenient for.

The foregoing summary is provided for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will be readily apparent by reference to the drawings and following detailed description.

Drawings

In the drawings, like reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily to scale. It is appreciated that these drawings depict only some embodiments in accordance with the disclosure and are not to be considered limiting of its scope.

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic side view of the transmission frame of the present invention.

Fig. 3 is a schematic view of the roller structure of the present invention.

Fig. 4 is a schematic view of the practical sliding chute structure of the present invention.

Reference numerals: 1. a base; 2. a support frame; 3. a transmission frame; 4. a material plate; 5. placing a box; 6. a rotating shaft; 7. a fixing member; 8. a baffle plate; 9. a first bearing; 10. scrubbing and brushing; 11. fixing the rod; 12. a fixed block; 13. a second bearing; 14. a rubber sleeve; 15. a roll shaft; 16. a material receiving box; 17. a chute; 18. a through hole; 19. a screw; 20. a box door; 21. a guide rail.

Detailed Description

In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The following disclosure provides many different embodiments or examples for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

The embodiment of the utility model provides a lead frame die plastic structure of unloading for semiconductor, as shown in fig. 1-4, include: base 1 and transmission frame 3, the top welding of base 1 has support frame 2, the lateral wall fixedly connected with mounting 7 of support frame 2, mounting 7 is articulated through pivot 6 and one side of support frame 2, the inside wall fixed connection of transmission frame 3 is in the outer lane of first bearing 9, the inside wall fixed connection that transmission frame 3 is located first bearing 9 relative position is in the outer lane of second bearing 13, the inner circle fixedly connected with roller 15 of first bearing 9, the other end of roller 15 and the inner circle fixed connection of second bearing 13, four fixed blocks 12 of the equal fixedly connected with in both sides of transmission frame 3, four the equal fixedly connected with dead lever 11 in one side of fixed block 12, the lateral wall fixedly connected with scrubbing brush 10 of dead lever 11, one side fixedly connected with baffle 8 of transmission frame 3.

In one embodiment, the outer wall of the roll shaft 15 is sleeved with the rubber sleeve 14, and the lead frame is prevented from being rubbed on the roll shaft 15 to cause damage by the arrangement of the rubber sleeve 14.

In one embodiment, the two sides of the bottom of the transmission frame 3 are fixedly connected with the material receiving box 16, one side of the material receiving box 16 is hinged with a box door 20, waste materials cleaned by the scrubbing brush 10 fall into the material receiving box 16, and the waste materials in the material receiving box 16 can be conveniently treated by opening the box door 20.

In one embodiment, a placing box 5 is arranged on one side of the transmission frame 3, a material plate 4 is inserted into the placing box 5, one end of the material plate 4 is located on one side of the transmission frame 3, and the lead frame passes through the material plate 4 from the roller 15 and conveniently enters the placing box 5.

In one embodiment, sliding grooves 17 are formed in two sides of the bottom of the transmission frame 3, a guide rail 21 is fixedly connected to one side of the material receiving box 16, the guide rail 21 is slidably connected with the sliding grooves 17, and the material receiving box 16 can move in the sliding grooves 17 through the guide rail 21, so that the material receiving box 16 can be separated from the transmission frame 3, and the material receiving box 16 can be replaced conveniently.

In one embodiment, a through hole 18 is formed in one side of the bottom of the transmission frame 3, a screw 19 is inserted into the through hole 18, the outer wall of the screw 19 is in threaded connection with the inner wall of the through hole 18, and the screw 19 is inserted into the through hole 18, so that the position of the material receiving box 16 is fixed conveniently, and the material receiving box 16 is prevented from sliding off.

The utility model discloses the device is at the during operation, place stamping die's one side with the one end of transmission frame 3, place the lead frame on roller 15, section of thick bamboo roller 15's rotation, make the lead frame slide in roller 15 top one side, it has avoided the damage of lead frame to set up rubber sleeve 14 on roller 15, upper and lower both sides through roller 15 all set up scrubbing brush 10, clean the waste material of the lead frame of process, scrubbing brush 10 of roller 15 below is longer than scrubbing brush 10 on roller 15 upper portion, the lead frame passes through flitch 4 and slides in placing the case 5, set up receipts workbin 16 bottom transmission frame 3, collect the waste material that drops, roll out screw 19 anticlockwise from through-hole 18, can be with receiving workbin 16 from the bottom roll-off of transmission frame 3, be convenient for handle receipts workbin 16.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various changes or substitutions within the technical scope of the present invention, which should be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The utility model provides a lead frame die plastic structure of unloading for semiconductor which characterized in that includes: base and transmission frame, the top welding of base has the support frame, the lateral wall fixedly connected with mounting of support frame, the mounting is articulated through one side of pivot and support frame, the inside wall fixed connection of transmission frame is in the outer lane of first bearing, the inside wall fixed connection that transmission frame is located first bearing relative position is in the outer lane of second bearing, the inner circle fixedly connected with roller of first bearing, the other end of roller and the inner circle fixed connection of second bearing, four fixed blocks of the equal fixedly connected with in both sides of transmission frame, four the equal fixedly connected with dead lever in one side of fixed block, the lateral wall fixedly connected with scrubbing brush of dead lever, one side fixedly connected with baffle of transmission frame.

2. The lead frame die shaping and discharging structure for semiconductors as claimed in claim 1, wherein a rubber sleeve is fitted over an outer wall of the roll shaft.

3. The lead frame die shaping and discharging structure for semiconductors as claimed in claim 1, wherein a material receiving box is fixedly connected to both sides of the bottom of the transmission frame, and a box door is hinged to one side of the material receiving box.

4. The lead frame die shaping and discharging structure for semiconductors as claimed in claim 1, wherein a placing box is provided at one side of the driving frame, a flitch is inserted into the placing box, and one end of the flitch is located at one side of the driving frame.

5. The lead frame die shaping and discharging structure for semiconductors as claimed in claim 3, wherein sliding grooves are formed on both sides of the bottom of the transmission frame, and a guide rail is fixedly connected to one side of the material receiving box and is slidably connected to the sliding grooves.

6. The lead frame die shaping and discharging structure for semiconductors as claimed in claim 1, wherein a through hole is formed at one side of the bottom of the transmission frame, a screw is inserted into the through hole, and the outer wall of the screw is in threaded connection with the inner wall of the through hole.