CN214263174U - Waste wire collecting device of bonding wire equipment in integrated circuit packaging industry - Google Patents
Waste wire collecting device of bonding wire equipment in integrated circuit packaging industry Download PDFInfo
- Publication number
- CN214263174U CN214263174U CN202023009627.3U CN202023009627U CN214263174U CN 214263174 U CN214263174 U CN 214263174U CN 202023009627 U CN202023009627 U CN 202023009627U CN 214263174 U CN214263174 U CN 214263174U
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- fixedly connected
- board
- waste
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002699 waste material Substances 0.000 title claims abstract description 29
- 238000004806 packaging method and process Methods 0.000 title claims description 17
- 230000007246 mechanism Effects 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Wire Bonding (AREA)
Abstract
The utility model provides a waste wire collection device of bonding wire equipment in integrated circuit encapsulation trade, includes the base, the one side that the fixed plate is relative is rotated and is provided with clamping device, the top activity of base is provided with collects the box, it is located the inner chamber of the relative one side of fixed plate to collect the box, the fixed surface who collects the box is connected with the handle, clamping device is including placing the board, the one end fixedly connected with bearing bar of placing the board, the other end fixedly connected with turning handle of placing the board, the top of placing the board is the fixed recess of seting up symmetrically all, the inner chamber of recess slides and has cup jointed the limiting plate, the one end fixedly connected with fastening device of limiting plate. The utility model discloses a board and collection box are placed in the rotation, when having solved current integrated circuit encapsulation bonding wire, have many tiny waste wires and drop on circuit board and workstation, need artifical the collection, but collection of artifical one can be slower, and can influence work efficiency.
Description
Technical Field
The utility model relates to an integrated circuit technical field especially relates to a waste wire collection device of bonding wire equipment in integrated circuit encapsulation trade.
Background
An integrated circuit is a microelectronic device or component. The transistor, the resistor, the capacitor, the inductor and other elements and wires required in a circuit are interconnected together by adopting a certain process, are manufactured on a small or a plurality of small semiconductor wafers or medium substrates, and are then packaged in a tube shell to form a micro structure with the required circuit function; all the elements are structurally integrated, so that the electronic elements are greatly miniaturized, low in power consumption, intelligent and high in reliability. Most applications in the semiconductor industry today are silicon-based integrated circuits.
When the existing integrated circuit packaging bonding wires are used, a plurality of tiny waste wires fall on the surface of a circuit board and need to be collected manually, but the collection of the waste wires one by one manually is slow, and the working efficiency is influenced.
SUMMERY OF THE UTILITY MODEL
Objects of the invention
For the technical problem who exists among the solution background art, the utility model provides a waste wire collection device of bonding wire equipment among the integrated circuit packaging trade, when having solved current integrated circuit packaging bonding wire, have the tiny waste wire of many and drop on the circuit board surface, need artifical the collection, but collection of artifical one can be more slow, and can influence work efficiency's problem.
(II) technical scheme
The utility model provides a waste wire collection device of bonding wire equipment in integrated circuit encapsulation trade, which comprises a base, the equal symmetrical fixedly connected with fixed plate in top of base.
The fixed plate is provided with a clamping device in a rotating mode, the top of the base is movably provided with a collecting box, the collecting box is located in an inner cavity of the fixed plate on the opposite side, and a handle is fixedly connected to the surface of the collecting box.
The clamping device comprises a placing plate, one end of the placing plate is fixedly connected with a bearing rod, the other end of the placing plate is fixedly connected with a rotating handle, the top of the placing plate is symmetrically and fixedly provided with a groove, a limiting plate is sleeved in the inner cavity of the groove in a sliding mode, and one end of the limiting plate is fixedly connected with a fastening mechanism.
Preferably, the fastening mechanism comprises a sleeve, a sliding rod is sleeved in an inner cavity of the sleeve in a sliding manner, and the bottom of the sliding rod is fixedly connected with the bottom of the inner cavity of the sleeve through a spring.
Preferably, the surface of the base is symmetrically sleeved with bolts in a rotating mode.
Preferably, one end of the fixing plate is fixedly connected with a connecting plate.
Preferably, the surface of the connecting plate is rotatably sleeved with a manual screw rod.
Preferably, the rotating handle and the bearing rod are rotatably sleeved on the surface of the fixing plate, and one end of the rotating handle extends to the outer side of the fixing plate.
Preferably, one ends of the springs are symmetrically and fixedly connected to the inner side of the fixing plate.
Preferably, one end of the manual screw rod is in contact with a surface of the rotating handle.
Compared with the prior art, the above technical scheme of the utility model following profitable technological effect has: one end of the integrated circuit board is placed on the surface of the placing board to abut against the placing board, the limiting board is pushed to slide in the inner cavity of the groove, the sliding rod drives the spring to extrude in the inner cavity of the sleeve, one end of the limiting board abuts against the other end of the integrated circuit board, the integrated circuit is welded, when the welding is completed, the surface of the integrated circuit board has residual waste wires, the manual lead screw is rotated to rotate on the surface of the connecting board, one end of the manual lead screw is separated from the rotating handle, the placing board is rotated through the bearing rod to enable the front surface of the placing board to face downwards, all the waste wires on the surface of the integrated circuit board fall into the inner cavity of the collecting box, the placing board is rotated to be right at the rotating handle, one end of the manual lead screw abuts against the surface of the rotating handle to be fixed, and the operation is repeated, the collecting box is taken out through the handle after the work is finished, waste wires in the inner cavity of the collecting box are cleaned, and the problems that when the existing integrated circuit packaging bonding wires are used, a plurality of fine waste wires drop on the surface of a circuit board, manual collection is needed, however, manual collection one by one is slow, and the work efficiency is influenced are solved.
Drawings
Fig. 1 is a schematic structural view of a waste wire collecting device of a bonding wire apparatus in the integrated circuit packaging industry.
Fig. 2 is the utility model provides a clamping device's in waste wire collection device of bonding wire equipment among integrated circuit packaging industry structural schematic diagram.
Fig. 3 is a structural cross-sectional view of a fastening mechanism in a waste wire collecting device of a bonding wire device in the integrated circuit packaging industry.
Reference numerals: 1. a base; 2. a bolt; 3. a fixing plate; 4. a handle; 5. a collection box; 6. a clamping device; 61. placing the plate; 62. a bearing rod; 63. rotating the handle; 64. a groove; 65. a limiting plate; 66. a fastening mechanism; 661. a sleeve; 662. a slide bar; 663. a spring; 7. a connecting plate; 8. and (4) manually operating a screw rod.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in FIGS. 1-3, the utility model provides a waste wire collecting device of a bonding wire device in the integrated circuit packaging industry, which comprises a base 1, wherein the top of the base 1 is symmetrically and fixedly connected with a fixed plate 3, one end of the fixed plate 3 is fixedly connected with a connecting plate 7, a manual lead screw 8 is sleeved on the surface of the connecting plate 7 in a rotating way, a clamping device 6 is rotatably arranged on the opposite side of the fixed plate 3, a collecting box 5 is movably arranged on the top of the base 1, the collecting box 5 is positioned in an inner cavity on the opposite side of the fixed plate 3, a handle 4 is fixedly connected on the surface of the collecting box 5, the clamping device 6 comprises a placing plate 61, one end of the placing plate 61 is fixedly connected with a bearing rod 62, the other end of the placing plate 61 is fixedly connected with a rotating handle 63, the top of the placing plate 61 is symmetrically and fixedly provided with a groove 64, a limiting plate 65 is slidably sleeved in the inner cavity of the groove 64, one end of the limiting plate 65 is fixedly connected with a fastening mechanism 66, one end of the spring 663 is symmetrically and fixedly connected with the inner side of the fixed plate 3.
In the utility model, one end of the integrated circuit board is placed on the surface of the placing plate 61 to abut against the surface, the limiting plate 65 is pushed to enable the limiting plate 65 to slide in the inner cavity of the groove 64, meanwhile, the sliding rod 662 drives the spring 663 to extrude in the inner cavity of the sleeve 661, one end of the limiting plate 65 abuts against the other end of the integrated circuit board, when the integrated circuit is welded, the surface of the integrated circuit board has residual waste wires, at the moment, the manual lead screw 8 is rotated to enable the manual lead screw 8 to rotate on the surface of the connecting plate 7, one end of the manual lead screw 8 is separated from the rotating handle 63, then the rotating handle 63 is rotated, the placing plate 61 can be rotated through the bearing rod 62, the placing plate 61 is made to face downwards, thereby the waste wires on the surface of the integrated circuit board can all fall in the inner cavity of the collecting box 5, the rotating handle 63 is rotated, the placing plate 61 is rotated correctly, make the one end of manual lead screw 8 support and fix on the surface of twist grip 63, so repeat the operation, take out collection box 5 through handle 4 again after the work is finished, come to collect the waste wire of box 5 inner chamber and clear up can.
In an alternative embodiment, the fastening mechanism 66 comprises a sleeve 661, a sliding rod 662 is slidably sleeved in an inner cavity of the sleeve 661, a bottom of the sliding rod 662 and a bottom of the inner cavity of the sleeve 661 are fixedly connected through a spring 663, the rotating handle 63 and the bearing rod 62 are rotatably sleeved on the surface of the fixed plate 3, and one end of the rotating handle 63 extends to the outer side of the fixed plate 3.
It should be noted that the fastening mechanism 66 can achieve the effect of automatically fastening and clamping.
In an alternative embodiment, the surface of the base 1 is symmetrically and rotatably sleeved with the bolt 2.
Note that the device is fixed to a position where work is required by a bolt 2.
In an alternative embodiment, one end of the manual screw 8 and a surface of the turning handle 63 are in contact with each other.
The clamping device 6 is fixed by the manual screw 8.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (8)
1. A waste wire collecting device of a bonding wire device in the integrated circuit packaging industry comprises a base (1), and is characterized in that the top of the base (1) is symmetrically and fixedly connected with a fixing plate (3);
a clamping device (6) is rotatably arranged on one surface, opposite to the fixed plate (3), of the base (1), a collecting box (5) is movably arranged at the top of the base, the collecting box (5) is located in an inner cavity of one surface, opposite to the fixed plate (3), of the fixed plate, and a handle (4) is fixedly connected to the surface of the collecting box (5);
clamping device (6) is including placing board (61), place one end fixedly connected with bearing rod (62) of board (61), place other end fixedly connected with turning handle (63) of board (61), the top of placing board (61) is all the symmetry fixed to be seted up fluted (64), limiting plate (65) have been cup jointed in the inner chamber slip of recess (64), the one end fixedly connected with fastening device (66) of limiting plate (65).
2. The waste wire collecting device of wire bonding equipment in integrated circuit package industry as claimed in claim 1, wherein said fastening mechanism (66) comprises a sleeve (661), a sliding rod (662) is slidably sleeved in an inner cavity of said sleeve (661), and a bottom of said sliding rod (662) and a bottom of said inner cavity of said sleeve (661) are fixedly connected through a spring (663).
3. The waste wire collecting device of the wire bonding equipment in the integrated circuit packaging industry as claimed in claim 1, wherein the surface of the base (1) is symmetrically sleeved with bolts (2) in a rotating manner.
4. The waste wire collecting device of the wire bonding equipment in the integrated circuit packaging industry as claimed in claim 1, wherein a connecting plate (7) is fixedly connected to one end of the fixing plate (3).
5. The waste wire collecting device of wire bonding equipment in the integrated circuit packaging industry as claimed in claim 4, wherein the surface of the connecting plate (7) is rotatably sleeved with a manual screw rod (8).
6. The waste wire collecting device of the wire bonding equipment in the integrated circuit packaging industry according to claim 1, wherein the rotating handle (63) and the bearing rod (62) are rotatably sleeved on the surface of the fixing plate (3), and one end of the rotating handle (63) extends to the outer side of the fixing plate (3).
7. The waste wire collecting device of the wire bonding equipment in the integrated circuit packaging industry as claimed in claim 2, wherein one end of each spring (663) is symmetrically and fixedly connected to the inner side of the fixing plate (3).
8. The wire waste collection device of wire bonding equipment in the IC packaging industry as claimed in claim 5, wherein one end of the manual feed screw (8) is in contact with the surface of the rotating handle (63).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023009627.3U CN214263174U (en) | 2020-12-14 | 2020-12-14 | Waste wire collecting device of bonding wire equipment in integrated circuit packaging industry |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023009627.3U CN214263174U (en) | 2020-12-14 | 2020-12-14 | Waste wire collecting device of bonding wire equipment in integrated circuit packaging industry |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214263174U true CN214263174U (en) | 2021-09-24 |
Family
ID=77781394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023009627.3U Expired - Fee Related CN214263174U (en) | 2020-12-14 | 2020-12-14 | Waste wire collecting device of bonding wire equipment in integrated circuit packaging industry |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214263174U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115258259A (en) * | 2022-07-11 | 2022-11-01 | 殷占元 | Integrated circuit packaging device |
-
2020
- 2020-12-14 CN CN202023009627.3U patent/CN214263174U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115258259A (en) * | 2022-07-11 | 2022-11-01 | 殷占元 | Integrated circuit packaging device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN214263174U (en) | Waste wire collecting device of bonding wire equipment in integrated circuit packaging industry | |
| CN210996959U (en) | Multi-purpose automatic soldering tin machine | |
| CN206194718U (en) | Feeding device of lead frame | |
| CN217933728U (en) | Semiconductor lead frame surface treatment equipment | |
| CN109127233A (en) | A kind of integrated circuit board excessive glue cleaning equipment | |
| CN208385366U (en) | A kind of LED packaging and die bonding structure | |
| CN213847467U (en) | A semiconductor electronic component SMT surface mount equipment | |
| CN210200531U (en) | Automatic wire pulling machine for transformer | |
| CN212636001U (en) | Integrated circuit board processing drilling equipment | |
| CN220821478U (en) | Pressing plate structure of integrated circuit packaging wire bonding machine | |
| CN214077554U (en) | Dispensing device for electronic processing | |
| CN208570576U (en) | A kind of Modular, semiconductor encapsulating structure | |
| CN212098908U (en) | Multifunctional double-tray device for IC burning | |
| CN209793398U (en) | Grinding device for glue hole on crystal block | |
| CN210880358U (en) | Integrated circuit silicon wafer cutting device | |
| CN217748451U (en) | Cleaning equipment for integrated circuit processing | |
| CN215735050U (en) | Positioning tool for integrated circuit board machining | |
| CN208758672U (en) | A kind of Electronic Components Manufacturing drilling equipment | |
| CN214827098U (en) | NG board collecting machine | |
| CN215010909U (en) | Safety device is used in integrated circuit mainboard processing | |
| CN210788263U (en) | Glue removing channel mechanism | |
| CN217883965U (en) | Flash memory packaging structure suitable for USB flash disk | |
| CN215345255U (en) | A encapsulation auxiliary device for communication electronic components | |
| CN219404880U (en) | Multifunctional silicon wafer test bench | |
| CN213764404U (en) | Plasma cutting machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210924 |