CN210349779U - Semiconductor packaging detection device - Google Patents

Abstract

The utility model relates to the technical field of auxiliary devices of detection equipment, in particular to a semiconductor packaging detection device, which can automatically move an X-ray perspective detection structure back and forth, saves time and labor and improves the practicability; comprises a bottom plate, a clamping plate, a fixing plate, a connecting plate and an X-ray perspective detection structure; still include four fixed blocks of group and fixed pipes, still include AC motor, the axis of rotation, first threaded rod, the connecting axle, ball bearing, spacing piece and removal pipe, the AC motor front end links to each other with fixed tub of rear end, the anterior output of AC motor links to each other with the axis of rotation rear end, it all communicates with the rear end and is provided with the opening to remove tub front end and rear end, it is portable the suit on fixed tub middle part lateral wall to remove the pipe, fixed tub top and bottom are all to the intercommunication front and back being provided with spacing hole, it links to each other with connecting plate bottom left side to remove tub top, the AC motor bottom is provided with the firm board, firm board front end links to each other with fixed.

Description

Semiconductor packaging detection device

Technical Field

The utility model relates to a technical field of check out test set auxiliary device especially relates to a semiconductor package detection device.

Background

As is known, a semiconductor package inspection apparatus is an auxiliary apparatus used for inspecting whether a semiconductor is failed, and impurities such as inclusions and attachments may be introduced into a semiconductor device during a packaging process, so that a cavity or other problems occur in a packaging structure, and it is important to inspect whether the semiconductor is failed, and the semiconductor package inspection apparatus is widely used in the field of inspection equipment; the conventional semiconductor packaging detection device comprises a bottom plate, a clamping plate, a fixed plate, a connecting plate and an X-ray perspective detection structure, wherein the right side of the bottom end of the connecting plate is connected with the top end of the X-ray perspective detection structure; when the existing semiconductor packaging detection device is used, the device is firstly fixed at a proper position, a semiconductor device to be detected is placed on a bottom plate, the semiconductor device is clamped between a clamping plate and a fixing plate to be fixed, an X-ray perspective detection structure is electrically connected, a worker controls a connecting plate to enable the X-ray perspective detection structure to move forwards and backwards at the position above the semiconductor device to detect the semiconductor device, the X-ray perspective detection structure is connected with an external computer, when the X-ray perspective detection structure is used for detecting the semiconductor device, certain data can appear on a computer, a worker counts and analyzes the data, the X-ray perspective detection structure is purchased, and the X-ray perspective detection structure is electrically connected through a purchased use instruction in use; the prior semiconductor packaging detection device finds that certain labor force is needed by workers when the X-ray perspective detection structure moves forwards and backwards in use, so that the prior semiconductor packaging detection device wastes time and labor and has lower practicability.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a can make the automatic removal around going on of X ray perspective detection structure, labour saving and time saving relatively has improved a semiconductor package detection device of practicality.

The utility model discloses a semiconductor packaging detection device, which comprises a bottom plate, a clamping plate, a fixed plate, a connecting plate and an X-ray perspective detection structure, wherein the right side of the bottom end of the connecting plate is connected with the top end of the X-ray perspective detection structure, the bottom end of the clamping plate is connected with the left side of the top end of the bottom plate, and the bottom end of the fixed plate is connected with the right side of the top end of the; the device also comprises four groups of fixed blocks and fixed tubes, the top ends of the four groups of fixed blocks are respectively connected with the left front side, the left rear side, the right front side and the right rear side of the bottom end of the fixed tube, the bottom ends of the four groups of fixed blocks are all connected with the left side of the top end of the bottom plate, the device also comprises an alternating current motor, a rotating shaft, a first threaded rod, a connecting shaft, a ball bearing, a limiting piece and a moving tube, the front end of the alternating current motor is connected with the rear end of the fixed tube, the front output end of the alternating current motor is connected with the rear end of the rotating shaft, the front end of the rotating shaft passes through the rear end of the fixed tube and extends into the fixed tube to be connected with the rear end of the first threaded rod, the front end of the first threaded rod is connected with the rear end of the connecting shaft, a placing cavity is arranged in the middle part of the front end of the fixed tube, remove the portable suit of pipe on fixed pipe middle part lateral wall, fixed pipe top and bottom are all provided with spacing hole to the intercommunication around, it all is provided with the stopper to remove intraductal top lateral wall and the inner bottom lateral wall of pipe, and all be provided with the adjusting thread in two sets of stoppers, two sets of stoppers the inner passes two sets of spacing hole outer ends respectively and all stretch into fixed intraducts respectively with first threaded rod top and bottom spiral shell dress be connected, it links to each other with connecting plate bottom left side to remove the pipe top, the alternating current motor bottom is provided with the stabilizing plate, the stabilizing plate front end links to each other with fixed pipe rear end.

The utility model discloses a semiconductor package detection device, still include the movable plate, two sets of removal axles, two sets of elastic spring, control panel and carrying handle, movable plate bottom and bottom plate top right side contact, two sets of removal axle right-hand members link to each other with control panel left end front side and left end rear side respectively, two sets of removal axle left ends are portable respectively to pass fixed plate right-hand member front side and right-hand member rear side and link to each other with movable plate right-hand member front side and right-hand member rear side respectively, the carrying handle left end links to each other with control panel right-hand member middle part, two sets of elastic spring encircle respectively to set up on two sets of removal axle right-hand members lateral walls, two sets of elastic spring left ends link to each other with fixed plate right-hand member front side and right-hand member rear side respectively, two sets of elastic spring right.

The utility model discloses a semiconductor package detection device still includes four group's second threaded rods and four group's screwed pipes, and four group's second threaded rod tops link to each other with bottom plate bottom left front side, left rear side, right front side and right rear side respectively, and four group's screwed pipe tops all communicate and are provided with the flexible mouthful, and four group's second threaded rod bottoms pass four group's screwed pipe tops respectively and inside spiral shell dress to four group's screwed pipe tops respectively.

The utility model discloses a semiconductor package detection device, cardboard right-hand member and removal board left end are provided with left cushion and right cushion respectively, and left cushion bottom links to each other with bottom plate top left side, and right cushion bottom contacts with bottom plate top right side.

The utility model discloses a semiconductor package detection device still includes two sets of supports, and two sets of support tops all link to each other with connecting plate bottom right side, and two sets of support bottoms link to each other with X ray perspective detection structure left side top and right side top respectively.

The utility model discloses a semiconductor package detection device is provided with the rotation sand grip on the carrying handle lateral wall.

The utility model discloses a semiconductor package detection device, four screwed pipe left ends of group and right-hand member all are provided with the dwang.

The utility model discloses a semiconductor package detection device still includes four group's firm pads, and four group's firm pad tops link to each other with four group's screwed pipe bottom respectively.

Compared with the prior art, the beneficial effects of the utility model are that: can make the automatic removal of going on around of X ray perspective detection structure, it is more labour saving and time saving, carry out the electricity with AC motor and connect, AC motor drives the axis of rotation and rotates, the axis of rotation drives first threaded rod and rotates, first threaded rod links to each other with the connecting axle, the connecting axle can be at the inside rotation of ball bearing, and then supplementary first threaded rod rotates, the stopper is connected with first threaded rod spiral shell dress, and spacing hole plays certain limiting displacement to the stopper, and then make and remove the pipe and carry out the removal from beginning to end, make and remove pipe drive connecting plate and X ray perspective detection structure and carry out the removal from beginning to end, the practicality has been improved, AC motor purchases and purchases, and AC motor carries out the electricity through the instruction manual of purchasing together when using and connects.

Drawings

Fig. 1 is a schematic structural diagram of the present invention;

FIG. 2 is an enlarged view of a portion A of FIG. 1;

fig. 3 is a schematic top view of the moving plate portion of the present invention;

FIG. 4 is a schematic top view of the stationary tube portion of the present invention;

in the drawings, the reference numbers: 1. a base plate; 2. clamping a plate; 3. a fixing plate; 4. a connecting plate; 5. an X-ray fluoroscopy detection configuration; 6. a fixed block; 7. a fixed tube; 8. an alternating current motor; 9. a rotating shaft; 10. a first threaded rod; 11. a connecting shaft; 12. a ball bearing; 13. moving the tube; 14. a limiting hole; 15. a stabilizing plate; 18. moving the plate; 19. a movable shaft; 20. an elastic spring; 21. a control panel; 22. a carrying handle; 23. a second threaded rod; 24. a threaded pipe; 25. a left rubber pad; 26. a right rubber pad; 27. a support; 28. rotating the convex strips; 29. rotating the rod; 30. and (6) stabilizing the cushion.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

As shown in fig. 1 to 4, the semiconductor package inspection device of the present invention comprises a bottom plate 1, a clamping plate 2, a fixing plate 3, a connecting plate 4 and an X-ray perspective inspection structure 5, wherein the right side of the bottom end of the connecting plate 4 is connected to the top end of the X-ray perspective inspection structure 5, the bottom end of the clamping plate 2 is connected to the left side of the top end of the bottom plate 1, and the bottom end of the fixing plate 3 is connected to the right side of the top end of the bottom plate; the device also comprises four groups of fixed blocks 6 and fixed tubes 7, the top ends of the four groups of fixed blocks 6 are respectively connected with the left front side, the left rear side, the right front side and the right rear side of the bottom end of the fixed tube 7, the bottom ends of the four groups of fixed blocks 6 are all connected with the left side of the top end of the bottom plate 1, the device also comprises an alternating current motor 8, a rotating shaft 9, a first threaded rod 10, a connecting shaft 11, a ball bearing 12, a limiting piece and a moving tube 13, the front end of the alternating current motor 8 is connected with the rear end of the fixed tube 7, the front output end of the alternating current motor 8 is connected with the rear end of the rotating shaft 9, the front end of the rotating shaft 9 passes through the rear end of the fixed tube 7 and extends into the fixed tube 7 to be connected with the rear end of the first threaded rod 10, the front end of the first threaded rod 10 is connected with the rear end of the connecting shaft 11, a placing cavity is arranged in the middle, the front end and the rear end of the moving pipe 13 are communicated and provided with through holes, the moving pipe 13 can be movably sleeved on the outer side wall of the middle part of the fixed pipe 7, the top end and the bottom end of the fixed pipe 7 are communicated in the front-back direction and provided with limit holes 14, the inner top side wall and the inner bottom side wall of the moving pipe 13 are provided with limit blocks, the inner ends of the two sets of limit blocks are provided with adjusting threads, the inner ends of the two sets of limit blocks penetrate through the outer ends of the two sets of limit holes 14 respectively and extend into the fixed pipe 7 to be connected with the top end and the bottom end of the first threaded rod 10 respectively in a threaded mode, the top end of the moving pipe 13 is connected with the left side of the bottom end; can make the automatic removal of going on around of X ray perspective detection structure, it is more labour saving and time saving, carry out the electricity with AC motor and connect, AC motor drives the axis of rotation and rotates, the axis of rotation drives first threaded rod and rotates, first threaded rod links to each other with the connecting axle, the connecting axle can be at the inside rotation of ball bearing, and then supplementary first threaded rod rotates, the stopper is connected with first threaded rod spiral shell dress, and spacing hole plays certain limiting displacement to the stopper, and then make and remove the pipe and carry out the removal from beginning to end, make and remove pipe drive connecting plate and X ray perspective detection structure and carry out the removal from beginning to end, the practicality has been improved, AC motor purchases and purchases, and AC motor carries out the electricity through the instruction manual of purchasing together when using and connects.

The utility model discloses a semiconductor package detection device, still include movable plate 18, two sets of removal axle 19, two sets of elastic spring 20, control panel 21 and carrying handle 22, contact of movable plate 18 bottom and 1 top right side of bottom plate, two sets of removal axle 19 right-hand members link to each other with control panel 21 left end front side and left end rear side respectively, two sets of removal axle 19 left ends respectively can move and pass fixed plate 3 right-hand member front side and right-hand member rear side and link to each other with movable plate 18 right-hand member front side and right-hand member rear side respectively, carrying handle 22 left end links to each other with control panel 21 right-hand member middle part, two sets of elastic spring 20 encircle respectively and set up on two sets of removal axle 19 right-hand member lateral walls, two sets of elastic spring 20 left ends link to each other with fixed plate 3 right-hand member front side and right-hand member rear side respectively, two sets of elastic spring; can be better to the fixed effect of X ray perspective detection structure, detect the structure with X ray perspective and clamp between cardboard and movable plate, under elastic spring's elastic action, the removal axle can have the trend of removing left, and then makes the movable plate have the trend of removing left, and then has certain extrusion force to X ray perspective detection structure, fixes X ray perspective detection structure, and the carrying handle can make that the staff is more convenient control removing the axle.

The utility model discloses a semiconductor package detection device, still include four groups of second threaded rods 23 and four groups of screwed pipes 24, four groups of second threaded rods 23 top are continuous with bottom plate 1 bottom left front side, left rear side, right front side and right rear side respectively, and four groups of screwed pipes 24 top all communicate and are provided with the flexible mouthful, and four groups of second threaded rods 23 bottom pass four groups of screwed pipes 24 top respectively and screw-mount to four groups of screwed pipes 24 top inside respectively; can adjust the stationarity of device, the staff rotates the screwed pipe, makes the second threaded rod carry out the removal from top to bottom in the screwed pipe is inside, and then adjusts the corner height of device, has improved the stability of device.

The utility model discloses a semiconductor packaging detection device, the right end of the clamping plate 2 and the left end of the movable plate 18 are respectively provided with a left rubber mat 25 and a right rubber mat 26, the bottom end of the left rubber mat 25 is connected with the left side of the top end of the bottom plate 1, and the bottom end of the right rubber mat 26 is contacted with the right side of the top end of the bottom plate 1; the right end of the left rubber mat and the left end of the right rubber mat are both in contact with the X-ray perspective detection structure, and the X-ray perspective detection structure can be protected to a certain extent.

The utility model discloses a semiconductor packaging detection device, still include two sets of supports 27, two sets of supports 27 tops all link to each other with the right side of connecting plate 4 bottom, two sets of supports 27 bottoms are linked to each other with X-ray perspective detection structure 5 left side top and right side top respectively; the support can make X ray perspective detection structure more firm.

The utility model discloses a semiconductor packaging detection device, a rotary raised line 28 is arranged on the outer side wall of a handle 22; the rotary convex strip can make the working personnel more convenient when controlling the carrying handle.

In the semiconductor package inspection device of the present invention, the left and right ends of the four groups of threaded pipes 24 are provided with the rotating rods 29; the dwang can make the staff more convenient when rotating the screwed pipe.

The semiconductor packaging detection device of the utility model also comprises four groups of stabilizing pads 30, the top ends of the four groups of stabilizing pads 30 are respectively connected with the bottom ends of the four groups of threaded pipes 24; the stabilizing pad may allow the device to be more securely held in place.

The utility model discloses a semiconductor packaging detection device, it at work fixes the device in a suitable position at first, place the semiconductor device that will detect on the bottom plate, fix semiconductor device, carry out the electricity with X ray perspective detection structure, the control connecting plate, make X ray perspective detection structure carry out the removal around semiconductor device top position, detect semiconductor device, according to the difference of different positions of semiconductor device to X ray absorptivity and transmissivity, utilize the intensity of ray after X ray passes through each position decay of semiconductor device, detect the defect inside of semiconductor device, and then detect whether semiconductor device is invalid, X ray perspective detection structure is connected with external computer, X ray perspective detection structure when detecting semiconductor device, certain data can appear on the computer, the staff makes statistics on data and analyzes, the X-ray perspective detection structure can automatically move forwards and backwards, time and labor are saved, the alternating current motor is electrically connected, the alternating current motor drives the rotating shaft to rotate, the rotating shaft drives the first threaded rod to rotate, the first threaded rod is connected with the connecting shaft, the connecting shaft can rotate inside the ball bearing to further assist the first threaded rod to rotate, the limiting block is in threaded connection with the first threaded rod, the limiting hole has a certain limiting effect on the limiting block, the moving pipe can move forwards and backwards, the moving pipe drives the connecting plate and the X-ray perspective detection structure to move forwards and backwards, the practicability is improved, the fixing effect of the X-ray perspective detection structure is better, the X-ray perspective detection structure is clamped between the clamping plate and the moving plate, and the moving shaft can have the trend of moving leftwards under the elastic action of the elastic spring, so that the movable plate has the tendency of moving leftwards, and further has a certain extrusion force on the X-ray perspective detection structure, the X-ray perspective detection structure is fixed, the lifting handle can enable workers to more conveniently control the movable shaft, the stability of the device can be adjusted, the workers rotate the threaded pipe to enable the second threaded rod to move up and down in the threaded pipe, and further adjust the corner height of the device, the stability of the device is improved, the right end of the left rubber mat and the left end of the right rubber mat are both contacted with the X-ray perspective detection structure, the X-ray perspective detection structure can be protected to a certain degree, the support can enable the X-ray perspective detection structure to be more stable, the raised strips can be rotated to enable the workers to more conveniently control the lifting handle, the rotating rod can enable the workers to more conveniently rotate the threaded pipe, and the stable mat can enable the device to be more stably fixed at a proper position, the X-ray perspective detection structure and the alternating current motor are purchased, and the X-ray perspective detection structure and the alternating current motor are electrically connected through a purchased instruction book when in use.

The utility model discloses a semiconductor package detection device, it is above the mounting means, the connected mode or the mode that sets up of all parts are welding, riveting or other common mechanical system, wherein can slide/rotate fixedly for slide/not dropping under the rotation state, seal when sealed intercommunication is two connecting pieces intercommunications promptly, and concrete structure, model and the coefficient index of its all parts are its from taking the technique, as long as can reach all can implementing of its beneficial effect, the event is not adding the perusal more.

In the semiconductor package inspection device of the present invention, unless otherwise stated, the terms "up, down, left, right, front, back, inner, front, rear, inner, and vertical, horizontal" and the like are included in the terms and are intended to represent only the orientation of the terms in the normal use state, or be a trivial term understood by those skilled in the art, and should not be considered as limiting the term, at the same time, the numerical terms "first," "second," and "third," etc. do not denote any particular quantity or order, but rather are used to distinguish one from another, furthermore, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements, but also includes other elements not expressly listed or inherent to such process, method, article, or apparatus.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.

Claims (8)

1. A semiconductor packaging detection device comprises a bottom plate (1), a clamping plate (2), a fixing plate (3), a connecting plate (4) and an X-ray perspective detection structure (5), wherein the right side of the bottom end of the connecting plate (4) is connected with the top end of the X-ray perspective detection structure (5), the bottom end of the clamping plate (2) is connected with the left side of the top end of the bottom plate (1), and the bottom end of the fixing plate (3) is connected with the right side of the top end of the bottom plate (1); it is characterized by also comprising four groups of fixed blocks (6) and fixed tubes (7), wherein the top ends of the four groups of fixed blocks (6) are respectively connected with the left front side, the left rear side, the right front side and the right rear side of the bottom end of the fixed tube (7), the bottom ends of the four groups of fixed blocks (6) are respectively connected with the left side of the top end of the bottom plate (1), the electric iron further comprises an alternating current motor (8), a rotating shaft (9), a first threaded rod (10), a connecting shaft (11), a ball bearing (12), a limiting sheet and a moving tube (13), the front end of the alternating current motor (8) is connected with the rear end of the fixed tube (7), the front output end of the alternating current motor (8) is connected with the rear end of the rotating shaft (9), the front end of the rotating shaft (9) passes through the rear end of the fixed tube (7) and extends into the fixed tube (7) to be connected with the rear end of the first threaded rod (10), the front end of the first, the ball bearing (12) and the limiting piece are both placed inside the placing cavity, the front end of the connecting shaft (11) can rotatably penetrate through the rear end of the placing cavity and is inserted into the ball bearing (12) to be connected with the limiting piece, the front end and the rear end of the moving pipe (13) are both communicated with each other to be provided with through holes, the moving pipe (13) can be movably sleeved on the outer side wall of the middle part of the fixed pipe (7), the top end and the bottom end of the fixed pipe (7) are both communicated with each other forwards and backwards to be provided with limiting holes (14), the inner top side wall and the inner bottom side wall of the moving pipe (13) are both provided with limiting blocks, the inner ends of the two limiting blocks are both provided with adjusting threads, the inner ends of the two limiting blocks respectively penetrate through the outer ends of the two limiting holes (14) and respectively extend into the fixed pipe (7) to be respectively connected with the top end and the bottom end of the first threaded rod (, the front end of the stabilizing plate (15) is connected with the rear end of the fixing pipe (7).

2. The semiconductor package inspection apparatus according to claim 1, further comprising a moving plate (18), two sets of moving shafts (19), two sets of elastic springs (20), a control board (21), and a handle (22), wherein the bottom end of the moving plate (18) contacts the right side of the top end of the bottom plate (1), the right ends of the two sets of moving shafts (19) are respectively connected to the front side and the rear side of the left end of the control board (21), the left ends of the two sets of moving shafts (19) respectively movably penetrate the front side and the rear side of the right end of the fixed plate (3) and are respectively connected to the front side and the rear side of the right end of the moving plate (18), the left end of the handle (22) is connected to the middle portion of the right end of the control board (21), the two sets of elastic springs (20) are respectively disposed around the outer side walls of the right ends of the two sets of moving shafts (19), the left ends of the two sets of elastic springs (20, the right ends of the two groups of elastic springs (20) are respectively connected with the front side and the rear side of the left end of the control plate (21).

3. The semiconductor package inspection device according to claim 2, further comprising four sets of second threaded rods (23) and four sets of threaded tubes (24), wherein the top ends of the four sets of second threaded rods (23) are respectively connected to the left front side, the left rear side, the right front side and the right rear side of the bottom end of the bottom plate (1), the top ends of the four sets of threaded tubes (24) are respectively communicated with a telescopic opening, and the bottom ends of the four sets of second threaded rods (23) respectively penetrate through the top ends of the four sets of threaded tubes (24) and are respectively screwed into the top ends of the four sets of threaded tubes (24).

4. The semiconductor package inspection device according to claim 3, wherein the right end of the clamping plate (2) and the left end of the moving plate (18) are respectively provided with a left rubber pad (25) and a right rubber pad (26), the bottom end of the left rubber pad (25) is connected with the left side of the top end of the bottom plate (1), and the bottom end of the right rubber pad (26) is in contact with the right side of the top end of the bottom plate (1).

5. The semiconductor package inspection device according to claim 4, further comprising two sets of supports (27), wherein the top ends of the two sets of supports (27) are connected to the right side of the bottom end of the connection board (4), and the bottom ends of the two sets of supports (27) are connected to the top ends of the left side and the right side of the X-ray perspective inspection structure (5), respectively.

6. The semiconductor package inspection device according to claim 5, wherein the handle (22) is provided with a rotation rib (28) on an outer side wall thereof.

7. The semiconductor package inspection device according to claim 6, wherein the four sets of screw pipes (24) are provided with rotation rods (29) at left and right ends thereof.

8. The semiconductor package inspection device according to claim 7, further comprising four sets of the stabilizing pads (30), wherein the top ends of the four sets of the stabilizing pads (30) are connected to the bottom ends of the four sets of the screw pipes (24), respectively.

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