CN210334683U

CN210334683U - Wave soldering tin soldering machine spraying device

Info

Publication number: CN210334683U
Application number: CN201921108455.XU
Authority: CN
Inventors: 禹涛军
Original assignee: Shenzhen Zhishengwei Electronic Equipment Co ltd
Current assignee: Shenzhen Zhishengwei Electronic Equipment Co ltd
Priority date: 2019-07-15
Filing date: 2019-07-15
Publication date: 2020-04-17
Anticipated expiration: 2029-07-15

Abstract

The utility model discloses a wave soldering tin soldering machine spraying device, which comprises a spraying table and a moving mechanism, wherein a soldering flux groove is arranged inside the spraying table, a roller is arranged in the soldering flux groove, a sleeve is arranged inside the roller, one end of the sleeve extends out of the soldering flux groove and is connected with a rotating motor, a support is arranged at the center of the sleeve, and a plurality of spray heads are arranged on the support; the moving mechanism comprises two sliding chutes, a ball screw and a ball nut, the ball screw is positioned in the sliding chutes, the ball nut is sleeved outside the ball screw, the top of the ball nut is connected with a vertical supporting rod, the top of the supporting rod is connected with a cross rod, at least two sliding seats are sleeved outside the cross rod, and the top of each sliding seat is fixedly connected with a supporting plate; the utility model discloses the device, simple structure maintains conveniently, and the coating is even, can control spraying volume and spraying power way effectively for the scaling powder can not splash at the spraying platform surface, more need not plus the protection casing, has practiced thrift the cost, has improved production efficiency.

Description

Wave soldering tin soldering machine spraying device

Technical Field

The utility model relates to a spraying device specifically is a wave-soldering tin machine spraying device.

Background

The tin soldering machine is an automatic tin soldering device, and mainly completes tin soldering operation by using the motion function of a manipulator. In the existing electronic industry soldering process, in order to ensure soldering quality, soldering is usually performed after soldering flux is coated on a position of a PCB substrate where an electronic element is soldered, and particularly, when wave soldering of the electronic element is performed on a whole PCB substrate, a layer of flux needs to be sprayed on the PCB substrate in advance according to process requirements, so that better soldering quality is achieved.

However, in the process of spraying the soldering flux, a layer of soldering flux is usually sprayed on the whole PCB substrate, and actually, the soldering flux is only selectively sprayed on the local part of the electronic component to be soldered so as to meet the soldering requirement of the product; therefore, the existing spraying mode not only wastes a large amount of soldering flux, but also rosin residues formed after welding do not meet the quality requirements of customers on the appearance of products; and the spraying device is mostly arranged above the PCB substrate, the nozzle sprays the PCB substrate downwards, and rosin often drops on the PCB substrate.

In addition, the existing spraying device mostly adopts a structure that a nozzle directly sprays and coats, and the structure has the following defects: 1. the design process is complex and maintenance is troublesome;

2. the spraying force is strong, floating molecules cannot be effectively controlled, the using amount of the soldering flux is increased, and a protective cover is required to be added to avoid polluting equipment;

3. the uniformity is poor, and the adhesion rate is only below 70%;

4. the nozzle hole is small and easy to block;

5. only can carry out single face spraying to the PCB board, if have two-sided PCB board then need manual turn-over, waste time and energy.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wave-soldering tin machine spraying device to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a wave soldering tin soldering machine spraying device comprises a spraying table and a moving mechanism, wherein a soldering flux groove is formed in the spraying table, a roller is arranged in the soldering flux groove, a plurality of meshes are uniformly distributed on the outer surface of the roller, the upper surface of the roller is higher than the liquid level in the soldering flux groove, a sleeve is arranged in the roller and is coaxial with the roller, one end of the sleeve extends out of the soldering flux groove and is connected with a rotating motor, a support is arranged at the center of the sleeve and is fixed on the soldering flux groove, a plurality of spray heads are arranged on the support, and an air outlet groove is formed in the;

the moving mechanism comprises two chutes, a ball screw and a ball nut, the chutes are located at the top of the spraying platform and are respectively located at two sides of the scaling powder groove, the ball screw is located in the chutes, the ball nut is sleeved outside the ball screw, the top of the ball nut is connected with a vertical support rod, the top of the support rod is connected with a cross rod, the cross rod is sleeved with at least two sliding seats, and the top of each sliding seat is fixedly connected with a supporting plate.

As a further aspect of the present invention: the supporting plate is horizontally arranged, and a plurality of vacuum suckers are arranged on the supporting plate.

As a further aspect of the present invention: one end of the cross rod penetrates through the support rod to be connected with a stepping motor, and the stepping motor is fixed on the spraying platform through a motor base.

As a further aspect of the present invention: the spray heads are distributed at equal intervals along the support, the bottom of each spray head is provided with a throttle valve, and each spray head is connected with a compressed air tank through an air pump.

As a further aspect of the present invention: the top of the scaling powder groove is provided with a top cover, and an opening is formed in the position, corresponding to the roller, of the top cover.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a spraying device, simple structure maintains the convenience, and the coating is even, and the PCB yields that obtains is high, can control spraying volume and spraying power way effectively for the scaling powder can not splash at spraying platform surface, more need not plus the protection casing, has practiced thrift the cost, has improved production efficiency.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic connection diagram of the middle rotating motor of the present invention.

Fig. 3 is a schematic structural diagram of the middle moving structure of the present invention.

Fig. 4 is a schematic connection diagram of the stepping motor of the present invention.

Fig. 5 is a schematic view of the connection of the sprinkler head according to the present invention.

In the figure: 1-spraying platform, 2-soldering flux, 3-roller, 4-sleeve, 5-nozzle, 6-soldering flux groove, 7-support rod, 8-supporting plate, 9-sucker, 10-opening, 11-top cover, 12-bracket, 13-rotating motor, 14-mesh, 15-ball nut, 16-cross bar, 17-stepping motor, 18-chute, 19-ball screw, 20-slide seat, 21-compressed air tank, 22-throttle valve, 23-air pump and 24-air outlet groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1-2, in the embodiment of the utility model, a wave-soldering tin soldering machine spraying device, including spraying platform 1 and moving mechanism, 1 inside scaling powder groove 6 that is equipped with of spraying platform, the interior cylinder 3 that is equipped with of

scaling powder groove

6, 3 surface evenly distributed of cylinder have

several mesh

14, and 3 upper surfaces of cylinder are higher than the interior liquid level of

scaling powder groove

6, and 3 inside sleeves 4 that are equipped with of cylinder,

sleeve

4 and 3 coaxial settings of cylinder, sleeve 4 one end extend scaling powder groove 6 and be connected with rotation motor 13, and sleeve 4 center is equipped with support 12, and support 12 fixes on scaling powder groove 6, is equipped with several shower nozzle 5 on support 12, sleeve 4 corresponds the position with shower nozzle 5 and is equipped with out gas tank 24.

The utility model discloses a spraying device, simple structure maintains the convenience, and the coating is even, and the PCB yields that obtains is high, can control spraying volume and spraying power way effectively for scaling powder 2 can not splash on 1 surface of spraying platform, more need not plus the protection casing, has practiced thrift the cost, has improved production efficiency.

The utility model discloses the device is at work, at first drive the PCB board through moving mechanism to spraying platform 1, and aim at scaling powder groove 6 top, drive cylinder 3 high-speed rotation by rotating motor 13 after that, each mesh 14 on cylinder 3 has all been stained with scaling powder 2 and has been taken to the top, meet with the high-speed air current that goes out air groove 24 department by shower nozzle 5 spun, the scaling powder 2 that glues in mesh 14 on cylinder 3 surface just is thrown by the air current and spreads to the PCB board lower surface and the connection region of components and parts, thereby has accomplished the spraying of certain part of PCB board; the moving mechanism drives the PCB to move at a constant speed, so that all areas to be sprayed on the surface of the PCB are sprayed by the soldering flux 2.

The spraying coating is realized through the structures of the roller 3 and the spray head 5, the pressure of the spray head 5 is adjustable, so that the spraying force can be controlled, the spraying just covers the surface of the PCB plate and can not sputter in large quantity, the waste of the soldering flux 2 is greatly reduced, and the cost is saved.

A top cover 11 is arranged at the top of the scaling powder groove 6, and an opening 10 is formed at the position, corresponding to the roller 3, of the top cover 11; because the top of the soldering flux groove 6 is in an open state and is directly contacted with air, the soldering flux 2 is easily subjected to secondary pollution; therefore, the top cover 11 is arranged at the top of the soldering flux groove 6, so that the soldering flux 2 dropped on the PCB cannot drop into the soldering flux groove 6 again, and the soldering flux 2 is prevented from being secondarily polluted.

Referring to fig. 3, in the embodiment of the present invention, the moving mechanism is composed of two sliding grooves 18, a ball screw 19 and a ball nut 15, the sliding grooves 18 are located at the top of the spraying platform 1 and located at two sides of the soldering flux groove 6 respectively, the ball screw 19 is located in the sliding groove 18, the ball nut 15 is sleeved outside the ball screw 19, the top of the ball nut 15 is connected with a vertical supporting rod 7, the top of the supporting rod 7 is connected with a cross rod 16, at least two sliding seats 20 are sleeved outside the cross rod 16, and the top of the sliding seat 20 is fixedly connected with a supporting plate 8.

The moving mechanism drives the ball nut 15 to move in the sliding groove 18 mainly through a ball screw 19, so that the PCB connected with the upper supporting plate 8 can move left and right above the soldering flux groove 6; in addition, the moving mechanism can also realize the rotation and turnover of the PCB; when the PCB needs to be turned over, the stepping motor 17 is driven to rotate 180 degrees, so that the cross rod 16 drives the sliding seat 20 and the PCB to rotate 180 degrees, the turning over of the PCB is realized, and the spraying of the double-sided PCB is facilitated.

The supporting plate 8 is horizontally arranged, and a plurality of vacuum suckers 9 are arranged on the supporting plate 8; the supporting plate 8 mainly plays a role of supporting the PCB; the vacuum chuck 9 can suck the surface of the PCB to prevent the PCB from sliding off and cannot damage the PCB.

Referring to fig. 4, in the embodiment of the present invention, one end of the cross bar 16 passes through the support rod 7 and is connected to the stepping motor 17, and the stepping motor 17 is fixed on the spraying platform 1 through the motor base; the rotation of the stepping motor 17 can drive the cross rod 16, further drive the PCB to rotate for a certain angle, and the double-sided coating function of the PCB is realized.

Referring to fig. 5, in the embodiment of the present invention, the nozzles 5 are equidistantly distributed along the support 12, the bottom of the nozzle 5 is provided with a throttle valve 22, and the nozzle 5 is connected to a compressed air tank 21 through an air pump 23; the spray head 5 sprays high-pressure air in the compressed air tank 21, so that the soldering flux 2 in the meshes 14 can be uniformly coated on the PCB; the spray head 5 is provided with a plurality of nozzles which are beneficial to increasing the spraying speed; the throttle valve 22 is used for controlling the flow rate of the gas sprayed from the spray head 5, thereby controlling the spraying force of the soldering flux 2 and preventing the soldering flux 2 from splashing.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a wave-soldering tin-soldering machine spraying device, includes spraying platform (1) and moving mechanism, its characterized in that: a scaling powder groove (6) is formed in the spraying platform (1), a roller (3) is arranged in the scaling powder groove (6), a plurality of meshes (14) are uniformly distributed on the outer surface of the roller (3), the upper surface of the roller (3) is higher than the liquid level in the scaling powder groove (6), a sleeve (4) is arranged in the roller (3), the sleeve (4) and the roller (3) are coaxially arranged, one end of the sleeve (4) extends out of the scaling powder groove (6) and is connected with a rotating motor (13), a support (12) is arranged at the center of the sleeve (4), the support (12) is fixed on the scaling powder groove (6), a plurality of spray heads (5) are arranged on the support (12), and air outlet grooves (24) are formed in the positions, corresponding to the;

moving mechanism comprises two spout (18), ball (19) and ball nut (15), spout (18) are located spraying platform (1) top and are located the both sides of scaling powder groove (6) respectively, ball (19) are located spout (18), ball nut (15) cover is outside ball (19), and ball nut (15) top is connected with vertical bracing piece (7), and bracing piece (7) top is connected with horizontal pole (16), and horizontal pole (16) overcoat has two at least slides (20), and slide (20) top has linked firmly layer board (8).

2. A wave soldering machine spraying apparatus as claimed in claim 1, characterized in that: the supporting plate (8) is horizontally arranged, and a plurality of vacuum suckers (9) are arranged on the supporting plate (8).

3. A wave soldering machine spraying apparatus as claimed in claim 1, characterized in that: one end of the cross rod (16) penetrates through the support rod (7) to be connected with a stepping motor (17), and the stepping motor (17) is fixed on the spraying platform (1) through a motor base.

4. A wave soldering machine spraying apparatus as claimed in claim 1, characterized in that: the spray heads (5) are distributed at equal intervals along the support (12), the bottom of each spray head (5) is provided with a throttle valve (22), and each spray head (5) is connected with a compressed air tank (21) through an air pump (23).

5. A wave soldering machine spraying apparatus as claimed in claim 1, characterized in that: the top of the scaling powder groove (6) is provided with a top cover (11), and the corresponding part of the top cover (11) and the roller (3) is provided with an opening (10).