CN210325696U - Whole board packaging mold of flexible board - Google Patents

Abstract

The utility model provides a whole board packaging mold of flexbile plate, mould on including encapsulation lower mould and encapsulation, the central point of encapsulation lower mould puts and sets up the tablet groove of placing the flexbile plate, the protruding polishing boss that is equipped with in side towards the encapsulation lower mould of mould on the encapsulation, the encapsulation upper cover fits on the encapsulation lower mould and the polishing boss inlays the tablet inslot, the polishing boss constitutes a whole board encapsulation cavity with the tablet groove combination, the encapsulation lower mould is provided with exhaust part and advances the glue part respectively and exhaust part and advance the different homonymy settings of glue part in the both sides that lie in the tablet groove, the mould corresponds the encapsulation lower mould and is provided with the injecting glue sleeve that injects glue usefulness to whole board encapsulation cavity in the one side that the encapsulation lower mould was provided with into the. The utility model discloses can solve the technological problem of flexible board LED encapsulation in the industry effectively, reach the purpose of whole board encapsulation, simplify the process sequence effectively, shorten the preparation cycle, reach reduce cost, reduce the effect of supply chain.

Description

Whole board packaging mold of flexible board

Technical Field

The utility model relates to a whole board moulding-die encapsulation technical field of FPC flexbile plate, concretely relates to whole board packaging mold of flexbile plate.

Background

With the continuous maturity of the development of the LED technology, the LED application is more and more extensive, except replacing the traditional illumination, the LED is also continuously applied to the fields of indoor large screen display, smart phone/flat panel, VR display device, etc., and the application of curved surface display gradually becomes a trend in these fields, so that the development and production of curved surface LED screens made of flexible boards also inevitably becomes a trend. But the flexible board packaging technology is a big problem, and the whole board compression molding packaging technology is not available at present. The key point is that the flexible plate is easy to deform, the whole plate die pressing easily causes the glue to be unevenly distributed on the surface of the plate, and if the plate is a material which is normally installed, the phenomena of line collapse, swinging and the like are easily caused.

At present, most of the existing mass production schemes for flexible plate LEDs in the industry are that LED particles and a flexible substrate are designed and produced separately, and finally, assembly and assembly are carried out, so that the production and manufacturing have the disadvantages of increasing cost invisibly, being complex in process, long in manufacturing period and the like.

In view of the above, if the LED particles and the flexible substrate are integrated and then packaged in a whole board, the above problems can be avoided, and therefore, in order to effectively solve the technical problem of flexible board LED packaging in the industry, it is necessary to design a mold capable of packaging in a whole board for the flexible board, so as to simplify the process and reduce the manufacturing period.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model aims at providing a whole board packaging mold of flexonics board can solve the difficult technical problem of flexonics board LED encapsulation in the industry effectively, reaches the purpose of whole board encapsulation, simplifies the process procedure effectively, shortens the preparation cycle, reaches reduce cost, reduces the effect of supply chain.

In order to achieve the above purpose, the utility model adopts the technical scheme that:

the utility model provides an entire board packaging mold of flexbile plate, includes encapsulation lower mould and encapsulation and goes up the mould, the central point of encapsulation lower mould puts and has seted up and place the tablet groove of flexbile plate, the mould orientation is gone up in the encapsulation the protruding polishing boss that is equipped with in side of encapsulation lower mould, the encapsulation upper cover fits on the encapsulation lower mould just the embedding of polishing boss the tablet inslot, the polishing boss with tablet groove combination constitutes an entire board encapsulation cavity, the encapsulation lower mould is lieing in the both sides in tablet groove are provided with exhaust part respectively and advance the gluey part, just exhaust part with advance the different side settings of gluey part, the mould corresponds on the encapsulation lower mould is provided with advance gluey part one side be equipped with to the injecting glue sleeve that the injecting glue was used is injected into to entire board encapsulation cavity.

Preferably, the whole-plate packaging mold further comprises a lower mold fixing block, a lower mold fixing groove is formed in any position of the surface of the lower mold fixing block, and the packaging lower mold is embedded in the lower mold fixing groove.

Preferably, the lower packaging mold is a rectangular lower mold plate, the tablet groove is formed in the center of the lower mold plate along the length direction of the lower mold plate, the exhaust component and the glue inlet component are both arranged on the lower mold plate along the width direction of the lower mold plate, and two ends of the exhaust component and two ends of the glue inlet component are respectively located on the side edge of the tablet groove and the side edge of the lower mold plate.

Preferably, the exhaust part is a plurality of strip-shaped exhaust grooves arranged in parallel, the depth of each strip-shaped exhaust groove is smaller than that of the material sheet groove, the glue feeding part is a plurality of strip-shaped glue feeding grooves arranged in parallel, and an angle α is formed between each strip-shaped glue feeding groove and the bottom surface of each material sheet groove.

Preferably, the number of the strip-shaped air exhaust grooves is equal to that of the strip-shaped glue inlet grooves, and the angle α is 10-15 degrees.

Preferably, the lower mold plate is provided with a lifting plate which is of an integral structure and is convenient to take and place and extends from two ends of the lower mold plate in the length direction, the width of the lifting plate is smaller than that of the lower mold plate, the length of the lower mold fixing groove is larger than the sum of the lengths of the lower mold plate and the lifting plate, and the width of the lower mold fixing groove is equal to that of the lower mold plate.

Preferably, the upper packaging mold is a rectangular upper mold plate, the upper mold plate and the lower mold plate are in the same shape, the polishing boss is convexly arranged on the side surface of the upper mold plate facing the lower mold plate, the position of the polishing boss corresponds to the position of the material slice groove, the shape of the polishing boss is the same as that of the material slice groove, and the height of the polishing boss is smaller than the depth of the material slice groove.

Preferably, the injecting glue sleeve sets up the cope match-plate pattern corresponds the lower bolster setting advance on one side of gluey part position, just still be connected with a colloid extrusion pipe on the injecting glue sleeve, the encapsulation upper die cover fits behind the encapsulation lower mould, the colloid extrusion pipe will glue in the injecting glue sleeve extrudes the warp advance gluey part gets into in the whole board encapsulation cavity.

Compared with the prior art, the utility model provides a pair of whole board packaging mold of flexbile plate can use flexbile plate and LED granule after reflow soldering the utility model provides a packaging mold encapsulates, can solve the technological problem of flexbile plate LED encapsulation in the industry effectively, reaches the purpose of whole board encapsulation, simplifies the process sequence effectively, shortens the preparation cycle, reaches reduce cost, reduces the effect of supply chain.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is an assembly schematic view of a whole board packaging mold for a flexible board according to the present invention;

fig. 2 is a schematic structural view of a lower packaging mold in a whole-plate packaging mold for a flexible plate according to the present invention;

FIG. 3 is an enlarged view of the glue inlet part in FIG. 2;

fig. 4 is a schematic structural view of a side surface of a polishing boss on an upper die of a flexible board in a whole board packaging die provided by the present invention;

fig. 5 is a schematic structural view of the whole flexible board packaging mold provided by the present invention after the lower mold fixing block is removed and glue is injected;

fig. 6 is an enlarged view of the structure of part a in fig. 5 after the lower mold is hidden.

Reference numerals and component parts description referred to in the drawings:

1. a lower die fixing block; 2. packaging the lower die; 3. packaging the upper die; 4. a lower die fixing groove; 5. a tablet groove; 6. polishing the boss; 7. injecting a glue sleeve; 8. a strip-shaped exhaust groove; 9. a strip-shaped glue inlet groove; 10. glue; 11. a flexible board;

21. a lower template; 22. a lifting plate; 31. and (5) loading the template.

Detailed Description

At present, most of the existing mass production schemes for flexible plate LEDs in the industry are that LED particles and a flexible substrate are designed and produced separately, and finally, assembly and assembly are carried out, so that the production and manufacturing have the disadvantages of increasing cost invisibly, being complex in process, long in manufacturing period and the like. To this, the utility model discloses an effective technological problem who solves flexible board LED encapsulation in the trade designs one kind and can carry out the mould of whole board encapsulation to the flexible board to simplify the process, reduce the preparation cycle.

The technical solution of the present invention will be described clearly and completely through the following detailed description. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 to 6, an entire board packaging mold for a flexible board includes a lower mold fixing block 1, a lower packaging mold 2, and an upper packaging mold 3. The lower die fixing block 1 is used for fixing the whole plate packaging die, a lower die fixing groove 4 is formed in any position of the surface of the lower die fixing block, and the packaging lower die 2 is embedded in the lower die fixing groove 4.

The central point of encapsulation lower mould 2 puts and offers the tablet groove 5 of placing the flexbleboard, and encapsulation is gone up mould 3 and is equipped with polishing boss 6 towards the protruding side of encapsulation lower mould 2, and encapsulation is gone up mould 3 lid and is fitted on encapsulation lower mould 2 and polishing boss 6 inlays into tablet groove 5 in, and polishing boss 6 constitutes a whole board encapsulation cavity with tablet groove 5 combination. And placing the flexible board 11 welded with the LED particles in the whole board packaging cavity, injecting glue and curing the flexible board, and finishing packaging operation. In order to facilitate glue injection and air exhaust, the lower packaging mold 2 is provided with an air exhaust component and a glue inlet component on two sides of the material sheet groove 5 respectively, and the air exhaust component and the glue inlet component are arranged on different sides. Furthermore, a glue injection sleeve 7 for injecting glue 10 into the whole board packaging cavity is arranged on one side of the upper packaging mold 3, which corresponds to the side of the lower packaging mold 2, provided with the glue inlet component.

In this embodiment, the lower package mold 2 is a rectangular lower mold plate 21, the material sheet groove 5 is formed in the center of the lower mold plate 21 along the length direction of the lower mold plate 21, the exhaust component and the glue inlet component are both arranged on the lower mold plate 21 along the width direction of the lower mold plate 21, and two ends of the exhaust component and the glue inlet component are respectively located on the side edge of the material sheet groove 5 and the side edge of the lower mold plate 21, the exhaust component is a plurality of strip-shaped exhaust grooves 8 arranged in parallel, the depth of each strip-shaped exhaust groove 8 is smaller than the groove depth of the material sheet groove 5, the arrangement of each strip-shaped exhaust groove 8 is used for effectively exhausting air in a glue injection process of glue 10 and a whole plate package chamber, so that the package effect is improved, the glue inlet component is a plurality of strip-shaped glue inlet grooves 9 arranged in parallel, each strip-shaped glue inlet groove 9 and the groove bottom surface of the material sheet groove 5 form an angle α, the angle α is 10-15 degrees after multiple tests, preferably 15 degrees, the strip-shaped exhaust grooves 8 and the glue inlet grooves 9 are equal in number, and the glue inlet grooves are more than the strip-shaped glue injection mold plate 11, and the glue injection is more uniform.

Because encapsulation lower mould 2 inlays to be established in lower mould fixed slot 4 on 1 surface of lower mould fixed block, encapsulation lower mould 2 is taken in order to make things convenient for, in time change suitable encapsulation mould according to the flexonics requirement, lower bolster 21 is located the both ends punishment of its length direction and extends respectively and is equipped with an organic whole structure and conveniently gets the board 22 of holding of putting, the width of holding board 22 is less than the width of lower bolster 21, the length of lower mould fixed slot 4 is greater than the length sum of lower bolster 21 and holding board 22, the width of lower mould fixed slot 4 equals the width of lower bolster 21, thereby the cell wall of lower mould fixed slot 4 still leaves certain space with the side of holding board 22, make things convenient for the staff to take lower bolster 21.

The upper package mold 3 also has a rectangular upper mold plate 31 corresponding to the lower package mold 2, and the upper mold plate 31 and the lower mold plate 21 have the same shape. The polishing boss 6 is convexly arranged on the side surface of the upper template 31 facing the lower template 21, the position of the polishing boss 6 corresponds to the position of the material sheet groove 5, the shape of the polishing boss 6 is the same as that of the material sheet groove 5, and the height of the polishing boss 6 is smaller than the depth of the material sheet groove 5. Namely, after the flexible board 11 welded with the LED particles is placed in the material sheet groove 5 and the upper package mold 3 is covered, a certain gap is formed between the polishing boss 6 and the surface of the flexible board 11, and the gap is the thickness of the package glue 10. Therefore, the height of the whole board packaging cavity depends on the thickness of the flexible board 11 welded with the LED particles and the thickness of the glue 10 layer meeting the packaging requirements, and the height of the polishing boss 6 and the groove depth of the material sheet groove 5 can be adjusted according to the actual packaging requirements.

Meanwhile, the glue injection sleeve 7 is arranged on one side, corresponding to the lower template 21, of the upper template 31, of the glue inlet component, a glue extrusion pipe (not shown in the figure) is further connected to the glue injection sleeve 7, after the upper encapsulation mold 3 covers the lower encapsulation mold 2, the glue extrusion pipe extrudes glue 10 in the glue injection sleeve 7 and evenly flows into the whole board encapsulation cavity after entering the glue inlet component, glue injection encapsulation is carried out on the flexible board 11 welded with the LED particles, and then heating, curing and demolding are carried out, so that the whole encapsulation operation is completed.

After the structure of the above-mentioned whole board packaging mold is fully set forth, a method for performing whole board packaging of a flexible board using the whole board packaging mold will be described in detail. The method is based on a PCB substrate die-pressing technology, the flip chip die-bonding process is consistent with that of a PCB, and the flip chip die-bonding process can be packaged after reflow soldering without a wire bonding process. The detailed steps are as follows:

and S1, soldering the LED particles on the flexible board through reflow soldering to obtain a flexible LED whole board, and defining the surface of the flexible board, on which the LED particles are soldered, as a functional area surface.

S2, selecting a proper lower packaging mold with a material sheet groove with a proper groove depth according to the height of the whole flexible LED board and the thickness of a packaging glue layer, and then fixedly embedding the lower packaging mold in a lower mold fixing groove on the surface of a lower mold fixing block.

And S3, placing the whole flexible LED board in a material sheet groove of the packaging lower die in a mode that the functional area faces upwards. The back of panel is up, the functional area is down for the usual die-pressing mode, and then adopts the functional area up in this embodiment, because glue has certain gravity, has certain pressure to the panel after covering the surface of the whole board of flexible LED, and is better to the roughness effect of guaranteeing the whole board of flexible LED, otherwise then does not have this effect. And then, adding a proper amount of glue into the glue injection sleeve on the upper die of the package.

And S4, covering the upper packaging mold on the lower packaging mold, embedding the polishing boss into the sheet groove, fixedly placing the whole flexible LED board in the whole board packaging chamber, and waiting for glue injection packaging.

S5, uniformly extruding glue in the glue injection sleeve to the notches of the plurality of strip-shaped glue feeding grooves by the glue extrusion pipe, wherein the glue enters the whole board packaging cavity formed by the polishing boss and the material sheet groove at an angle of 15 degrees from the notches of the strip-shaped glue feeding grooves and slowly covers the whole board of the glue flexible LED. In the process, the air in the whole plate packaging chamber is exhausted from the plurality of long strip-shaped exhaust grooves on the other side.

And S6, heating the whole board packaging mold after the glue completely covers and wraps the whole flexible LED board in the whole board packaging chamber, so that the glue is cured, and demolding the whole flexible LED board, thereby completing the whole board packaging operation of the whole flexible LED board. After the colloid is completely cured, the flexible LED panel is demoulded, colloid traces entering and exiting the strip-shaped glue inlet groove cannot be left on the whole flexible LED panel, and the trouble of subsequent cleaning is avoided.

The utility model provides a pair of whole board packaging mold of flexonics can solve the technological problem of flexonics LED encapsulation in the trade effectively, reaches the purpose of whole board encapsulation, simplifies the process procedure effectively, shortens the preparation cycle, reaches reduce cost, reduces the effect of supply chain.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (8)

1. The utility model provides a whole board packaging mold of flexographic plate which characterized in that: including encapsulation lower mould and encapsulation mould, the central point of encapsulation lower mould puts and has seted up the place the tablet groove of flexonics board, the encapsulation goes up the mould orientation the protruding polishing boss that is equipped with in side of encapsulation lower mould, the encapsulation upper mould lid fits on the encapsulation lower mould just the embedding of polishing boss the tablet inslot, the polishing boss with the tablet groove combination constitutes a whole board encapsulation cavity, the encapsulation lower mould is lieing in the both sides in tablet groove are provided with exhaust part respectively and advance gluey part, just exhaust part with advance the different homonymy settings of gluey part, the encapsulation is gone up the mould and is corresponded the encapsulation lower mould is provided with one side of advancing gluey part be equipped with to the injecting glue sleeve that whole board encapsulation cavity injected glue usefulness.

2. The mold for encapsulating a flexible board as claimed in claim 1, wherein: the whole plate packaging mold further comprises a lower mold fixing block, a lower mold fixing groove is formed in any position of the surface of the lower mold fixing block, and the packaging lower mold is embedded in the lower mold fixing groove.

3. The mold for encapsulating a flexible board as claimed in claim 2, wherein: the packaging lower die is a rectangular lower die plate, the material sheet groove is formed in the center of the lower die plate along the length direction of the lower die plate, the exhaust component and the glue inlet component are arranged on the lower die plate along the width direction of the lower die plate, and two ends of the exhaust component and the glue inlet component are respectively located on the side edge of the material sheet groove and the side edge of the lower die plate.

4. The whole board packaging mold for the flexible board as claimed in claim 3, wherein the exhaust member is a plurality of parallel elongated exhaust grooves, the depth of the elongated exhaust grooves is less than the depth of the sheet groove, the glue feeding member is a plurality of parallel elongated glue feeding grooves, and an angle α is formed between the elongated glue feeding grooves and the bottom surface of the sheet groove.

5. The whole flexible board packaging mold according to claim 4, wherein the number of the strip-shaped air discharge grooves is equal to that of the strip-shaped glue inlet grooves, and the angle α is 10-15 °.

6. The whole plate packaging mold of the flexible plate as claimed in claim 3, wherein: the lower die comprises a lower die plate and a lower die fixing groove, wherein the lower die plate is provided with a lifting plate which is of an integral structure and is convenient to take and place, the lifting plate is arranged at two ends of the lower die plate in the length direction in an extending mode, the width of the lifting plate is smaller than that of the lower die plate, the length of the lower die fixing groove is larger than the sum of the lengths of the lower die plate and the lifting plate, and the width of the lower die fixing groove is equal to that of.

7. The whole plate packaging mold of the flexible plate as claimed in claim 3, wherein: the packaging upper die is a rectangular upper die plate, the upper die plate is the same as the lower die plate in shape, the polishing boss is convexly arranged on the side face, facing the lower die plate, of the upper die plate, the position of the polishing boss corresponds to the position of the material slice groove, the polishing boss is the same as the material slice groove in shape, and the height of the polishing boss is smaller than the depth of the material slice groove.

8. The mold for encapsulating a flexible board as claimed in claim 7, wherein: the injecting glue sleeve sets up the cope match-plate pattern corresponds the lower bolster setting advance on one side of gluey part position, just still be connected with a colloid extrusion pipe on the injecting glue sleeve, the encapsulation upper die cover fits behind the encapsulation lower mould, the colloid extrusion pipe will glue extrusion in the injecting glue sleeve passes through advance gluey part gets into in the whole board encapsulation cavity.

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