CN210324064U

CN210324064U - Computer motherboard heat dissipation system mechanism

Info

Publication number: CN210324064U
Application number: CN201920576593.4U
Authority: CN
Inventors: 张军; 何月顺; 徐洪珍
Original assignee: East China Institute of Technology
Current assignee: East China Institute of Technology
Priority date: 2019-04-25
Filing date: 2019-04-25
Publication date: 2020-04-14
Anticipated expiration: 2029-04-25

Abstract

The utility model belongs to the technical field of the computer motherboard heat dissipation technique and specifically relates to a computer motherboard heat dissipation system mechanism. The utility model discloses a computer motherboard heat dissipation system mechanism that sets up, including the diaphragm, the equal rigid coupling in bottom four corners of diaphragm has the stabilizer blade, the bottom of mainboard scribbles heat conduction silica gel layer, the inside of diaphragm is equipped with reduction gears, reduction gears's bottom is equipped with swing mechanism. This computer mainboard heat dissipation system mechanism, through swing mechanism, mainboard and reduction gears's cooperation, the area that blows is bigger, and can dispel the heat to electronic component on the mainboard simultaneously, and then reduce the probability that the mainboard burns out because of overheated, and make swing mechanism's swing speed reduce greatly through reduction gears, and then make when the flabellum swings, and then guarantee the radiating effect of optional position, the rethread mainboard, the cooperation of heat conduction silica gel layer and graphite plate, make the waste heat of mainboard bottom can be conducted fast and diluted, and then play the additional contribution to the heat dissipation.

Description

Computer motherboard heat dissipation system mechanism

Technical Field

The utility model relates to a computer motherboard heat dissipation technical field especially relates to a computer motherboard heat dissipation system mechanism.

Background

The mainboard is also called a mainboard, a system board or a motherboard, which is divided into a commercial mainboard and an industrial mainboard, is arranged in a case, is one of the most basic and the most important components of a microcomputer, is generally a rectangular circuit board, is provided with a main circuit system forming a computer, and generally comprises elements such as a BIOS chip, an I/O control chip, a key and panel control switch interface, an indicator lamp plug-in connector, an expansion slot, a mainboard and a plug-in card direct current power supply plug-in connector, and the like, but when the mainboard is used, the mainboard is easy to be burned out due to overheating, the problem of heat dissipation is more and more emphasized, the heat dissipation system mechanism of the mainboard of the computer in the prior art has a plurality of defects, the direction of wind blowing is fixed, the heat dissipation area is easy to be small, the condition of heat dissipation is easy to occur, the heat dissipation effect is not good, the possibility that the mainboard is burned out due to overheating, is inconvenient for people to use.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving computer motherboard heat dissipation system mechanism among the prior art and having a great deal of not enough, the direction of blowing is fixed unchangeable, leads to heat radiating area little easily, appears the uneven condition of heat dissipation easily, and then leads to the radiating effect not good, increases the mainboard because of overheated possibility of being burnt out, and then can't guarantee the normal operating of mainboard, the shortcoming that inconvenient people used, and a computer motherboard heat dissipation system mechanism that provides.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a computer motherboard heat dissipation system mechanism, includes the diaphragm, the equal rigid coupling in bottom four corners of diaphragm has the stabilizer blade, the bottom processing of stabilizer blade has the through-hole, the inner wall clearance fit of through-hole has the screw, the outer wall threaded connection of screw has the mainboard, the bottom of mainboard scribbles the heat conduction silica gel layer, the bottom rigid coupling on heat conduction silica gel layer has the graphite cake, the inside of diaphragm is equipped with reduction gears, reduction gears's bottom is equipped with swing mechanism.

Preferably, reduction gears includes montant, first bearing, sheave, belt, first gear, second gear, round bar, second bearing and iron stand, the outer wall of montant passes through first bearing and is connected with the diaphragm rotation, the top rigid coupling of montant has the sheave, the belt has been cup jointed to the outer wall of sheave, the bottom rigid coupling of montant has first gear, the left end meshing of first gear is connected with the second gear, the bottom rigid coupling of second gear has the round bar, the outer wall of round bar rotates through the second bearing and is connected with the iron stand, the top of iron stand is in the same place with the bottom rigid coupling of diaphragm.

Preferably, the number of teeth of the second gear is 10 times that of the first gear.

Preferably, swing mechanism includes swash plate, down tube, motor, branch, square frame, horizontal pole, frame, lug and flabellum, the left end of swash plate is in the same place with the left end rigid coupling of round bar, the bottom of swash plate is rotated and is connected with the down tube, the bottom rigid coupling of down tube has the motor, the front of motor and the equal rigid coupling of rear end face have branch, two the outer wall of branch all rotates and is connected with the square frame, the equal rigid coupling in both ends has the horizontal pole about the square frame, the outer wall of horizontal pole rotates and is connected with the frame, the top right side of frame is in the same place with the outer wall below rigid coupling of iron frame, the output bottom rigid coupling of motor has the lug, the outer wall rigid coupling of lug has three flabellum.

Preferably, the inclined plate and the inclined rod are perpendicular to each other.

Preferably, the three fan blades are distributed at 120 degrees between every two fan blades.

The utility model provides a pair of computer motherboard heat dissipation system mechanism, beneficial effect lies in: this computer mainboard heat dissipation system mechanism, through swing mechanism, mainboard and reduction gears's cooperation, when making the flabellum rotate, the area that wind blown is bigger, and then make heat dissipation range wider, and can dispel the heat to electronic component on the mainboard simultaneously, guarantee mainboard normal motion, and then reduce the probability that the mainboard burns out because of overheated, and make swing mechanism's swing speed reduce greatly through reduction gears, and then make when the flabellum swings, wind blows the time of mainboard optional position for a longer time, and then guarantee the radiating effect of optional position, the rethread mainboard, the cooperation of heat conduction silica gel layer and graphite plate, make the waste heat of mainboard bottom can be conducted fast and diluted, and then play the additional contribution to the heat dissipation, and then make the radiating effect better, make things convenient for people to use.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the connection between the vertical rod, the first bearing and the first gear in FIG. 1;

FIG. 3 is a schematic view of the connection between the motor, the square frame and the support bar of FIG. 1;

fig. 4 is a schematic view of the connection relationship between the legs, the support plate and the screws in fig. 1.

In the figure: 1. the device comprises a transverse plate, 2, supporting legs, 3, a through hole, 4, a screw, 5, a main plate, 6, a heat-conducting silica gel layer, 7, a graphite plate, 8, a speed reducing mechanism, 801, a vertical rod, 802, a first bearing, 803, a grooved pulley, 804, a belt, 805, a first gear, 806, a second gear, 807, a round rod, 808, a second bearing, 809, an iron frame, 9, a swing mechanism, 901, an inclined plate, 902, an inclined rod, 903, a motor, 904, a supporting rod, 905, a square frame, 906, a transverse rod, 907, a frame, 908, a bump, 909 and fan blades.

Detailed Description

Referring to fig. 1-4, a computer motherboard heat dissipation system mechanism comprises a horizontal plate 1, four corners of the bottom of the horizontal plate 1 are fixedly connected with support legs 2, the four support legs 2 make the horizontal plate 1 more stable, through holes 3 are processed at the bottoms of the support legs 2, screws 4 are in clearance fit with the inner walls of the through holes 3, the outer walls of the screws 4 are in threaded connection with a motherboard 5, the support plates 5 and the support legs 2 are fixed together by the screws 4, the bottom of the motherboard 5 is coated with a heat conduction silica gel layer 6, the heat conduction silica gel layer 6 is used for rapidly conducting heat, the bottom of the heat conduction silica gel layer 6 is fixedly connected with a graphite plate 7, the graphite plate 7 is used for rapidly dissipating heat, a speed reduction mechanism 8 is arranged inside the horizontal plate 1, the speed reduction mechanism 8 comprises a vertical rod 801, a first bearing 802, a grooved pulley 803, a belt 804, a first gear 805, a second gear 806, a round rod 807, a second, the first bearing 802 enables the vertical rod 1 to rotate when stressed, a grooved pulley 803 is fixedly connected to the top of the vertical rod 801, a belt 804 is sleeved on the outer wall of the grooved pulley 803, the tail end of the belt 804 is connected with an external power device, a first gear 805 is fixedly connected to the bottom of the vertical rod 801, a second gear 806 is connected to the left end of the first gear 805 in a meshed mode, the number of teeth of the second gear 806 is 10 times that of the first gear 805, the second gear 806 plays a role in reducing the speed of the first gear 805, a round rod 807 is fixedly connected to the bottom of the second gear 806, an iron frame 809 is rotatably connected to the outer wall of the round rod 807 through a second bearing 808, the second bearing 808 enables the round rod 807 to rotate when stressed, the top of the iron frame 809 is fixedly connected with the bottom of the transverse plate 1, the iron frame 809 plays a limiting role in limiting the second gear 806, a swing mechanism 9 is arranged at the bottom of the speed reducing mechanism 8, and the, The left end of an inclined plate 901 is fixedly connected with the left end of a round rod 807, the bottom of the inclined plate 901 is rotatably connected with an inclined rod 902, the inclined plate 901 and the inclined rod 902 are perpendicular to each other, so that the movement tracks of the inclined rod 902 and the inclined plate 901 are not affected by each other, the bottom of the inclined rod 902 is fixedly connected with a motor 903, the model of the motor 903 is 140, the front surface and the rear end surface of the motor 903 are fixedly connected with supporting rods 904, the outer walls of the two supporting rods 904 are rotatably connected with a square frame 905, the supporting rods 904 enable the motor 903 to rotate relative to the square frame 905 when stressed, the left end and the right end of the square frame 905 are fixedly connected with cross rods 906, the outer wall of each cross rod 906 is rotatably connected with the frame 907, the square frame 905 can move when stressed, the right side of the top of the frame 907 is fixedly connected with the lower portion of the outer wall of the iron frame 809, and the bottom of the output end of the, three fan blades 909 are fixedly connected to the outer wall of the bump 908, and the three fan blades 909 are distributed at 120 degrees between each two fan blades, so that the fan blades 909 are uniformly stressed and shake is reduced when rotating.

When the computer motherboard heat dissipation system mechanism is used, firstly, the motor 903 is connected with an external power supply, so that the motor 903 rotates, and then the fan blade 909 is driven to rotate rapidly, and further wind is blown to the top of the motherboard 5, so as to play a role in heat dissipation, and is rotationally connected with the grooved pulley 803 through the belt 804 by an external power device, so that the grooved pulley 803 rotates, and is rotationally connected with the transverse plate 1 through the vertical rod 802, so that the first gear 805 rotates, through the meshing connection of the first gear 805 and the second gear 806, the second gear 806 drives the vertical rod 807 to rotate in a speed reduction manner, and further drives the inclined plate 901 and the round rod 807 to do circular motion, through the rotational connection of the support rod 904 and the square frame 905 and the rotational connection of the cross rod 906 and the frame 907, so that when the inclined plate 901 rotates, the motor 903 is driven by the inclined rod 902 to horizontally take the cross rod 906 as a center, and vertically take, and then the movement track that drives lug 908 is conical, and then make the rotation wind direction of flabellum 909 change along with the motion of lug 908, and then when making flabellum 909 rotate, the area that is blown to is bigger, and then make heat radiating area bigger, and can dispel the heat to the electronic component on mainboard 5 simultaneously, and then reduce the overheated probability that leads to burning out of mainboard 5, the normal operating of mainboard 5 has been guaranteed, and through the effect of heat conduction silica gel layer 6 and graphite cake 7, can carry out the conduction dilution to mainboard 5 bottom waste heat conduction, and then supplementary heat dissipation, further through the radiating effect.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a computer motherboard heat dissipation system mechanism, includes diaphragm (1), its characterized in that, the equal rigid coupling in bottom four corners of diaphragm (1) has stabilizer blade (2), the bottom processing of stabilizer blade (2) has through-hole (3), the inner wall clearance fit of through-hole (3) has screw (4), the outer wall threaded connection of screw (4) has mainboard (5), the bottom of mainboard (5) scribbles heat conduction silica gel layer (6), the bottom rigid coupling of heat conduction silica gel layer (6) has graphite cake (7), the inside of diaphragm (1) is equipped with reduction gears (8), the bottom of reduction gears (8) is equipped with swing mechanism (9).

2. The heat dissipation system mechanism of the computer motherboard according to claim 1, wherein the speed reduction mechanism (8) comprises a vertical rod (801), a first bearing (802), a grooved wheel (803), a belt (804), a first gear (805), a second gear (806), a round rod (807), a second bearing (808) and an iron frame (809), the outer wall of the vertical rod (801) is rotatably connected with the horizontal plate (1) through the first bearing (802), the top of the vertical rod (801) is fixedly connected with the grooved wheel (803), the outer wall of the grooved wheel (803) is sleeved with the belt (804), the bottom of the vertical rod (801) is fixedly connected with the first gear (805), the left end of the first gear (805) is engaged with the second gear (806), the bottom of the second gear (806) is fixedly connected with the round rod (807), the outer wall of the round rod (807) is rotatably connected with the iron frame (809) through the second bearing (808), the top of the iron frame (809) is fixedly connected with the bottom of the transverse plate (1).

3. The computer motherboard heat dissipation system of claim 2, wherein the number of teeth of the second gear (806) is 10 times the number of teeth of the first gear (805).

4. The computer motherboard heat dissipation system mechanism according to claim 1, wherein the swing mechanism (9) comprises a sloping plate (901), a sloping rod (902), a motor (903), a strut (904), a square frame (905), a cross bar (906), a frame (907), a bump (908) and a fan blade (909), the left end of the sloping plate (901) is fixedly connected with the left end of a round bar (807), the bottom of the sloping plate (901) is rotatably connected with the sloping rod (902), the bottom of the sloping rod (902) is fixedly connected with the motor (903), the front and rear end faces of the motor (903) are fixedly connected with the strut (904), the outer walls of the two struts (904) are rotatably connected with the square frame (905), the left and right ends of the square frame (905) are fixedly connected with a cross bar (906), the outer wall of the cross bar (906) is rotatably connected with the frame (907), the top right side of the frame (907) is fixedly connected with the lower part of the outer wall of the iron frame (809), the bottom of the output end of the motor (903) is fixedly connected with a bump (908), and the outer wall of the bump (908) is fixedly connected with three fan blades (909).

5. The computer motherboard heat dissipation system mechanism of claim 4, wherein said tilted plate (901) and tilted rod (902) are perpendicular to each other.

6. The heat dissipation system as claimed in claim 4, wherein the three fan blades (909) are disposed at 120 degrees.