CN207909041U - A kind of computer motherboard of good heat dispersion performance - Google Patents

Abstract

The utility model discloses a computer motherboard with better heat dissipation performance in the technical field of computers, which comprises a casing, motors are installed on the outer walls of the left and right sides of the casing through fixing frames, a heat conduction sheet is installed on the top of the computer motherboard, and the heat conduction The top of the sheet is uniformly provided with grooves, the front outer wall of the housing is installed with the motor, the side of the fixed shaft away from the motor extends into the inner cavity of the housing and is mounted on the rear inner wall of the housing through bearings, the fixed shaft Four sets of connecting rods with the same structure are evenly arranged on the outer wall of the outer wall, and heat dissipation tiles are installed on the side of the connecting rods away from the fixed rotating shaft. When the heat is high, when the heat dissipation tiles rotate with the fixed shaft, the arched surface of each heat dissipation tile sweeps from the arc surface of the groove to take away the heat on the heat conduction sheet, further Improve the effect of heat dissipation.

Description

A computer motherboard with better heat dissipation performance

technical field

The utility model relates to the technical field of computers, in particular to a computer motherboard with better heat dissipation performance.

Background technique

The motherboard, also known as the motherboard, is installed in the case and is one of the most basic and important components of the computer. The motherboard is generally a rectangular circuit board, on which are installed the main circuit systems that make up the computer. Generally, there are BIOS chips, I/O control chips, keys and panel control switch interfaces, indicator light connectors, expansion slots, motherboards and cards. DC power supply connectors and other components.

The computer motherboard will generate a lot of heat when the computer is running. Due to the effective space inside the computer case, it is difficult to quickly remove the heat emitted by the computer motherboard when it is working. Most of the current computers use built-in fans for heat dissipation, but due to the The internal space is small, and the fan heat effect is not ideal. Therefore, we propose a computer motherboard with better heat dissipation performance.

Utility model content

The purpose of this utility model is to provide a computer motherboard with better heat dissipation performance, so as to solve the problem of unsatisfactory fan heat effect proposed in the above-mentioned background technology.

In order to achieve the above object, the utility model provides the following technical solutions: a computer motherboard with better heat dissipation performance, including a casing, the outer walls of the left and right sides of the casing are equipped with motors through fixing frames, and the output shaft of the motor extends to the casing The inner cavity of the inner cavity is connected with a rotating shaft through a coupling, and a connecting block is installed on the side of the rotating shaft far away from the motor. A fan is arranged on the connecting block, and a shock absorbing pad is installed at the bottom of the inner cavity of the casing. A computer motherboard is installed on the top of the pad, and a heat conduction sheet is installed on the top of the computer motherboard, and grooves are evenly opened on the top of the heat conduction sheet, a motor is installed on the front side outer wall of the housing, and a fixed rotating shaft is installed at the output end of the motor, and the The side of the fixed shaft away from the motor extends into the inner cavity of the casing and is mounted on the rear inner wall of the casing through bearings. The outer wall of the fixed shaft is evenly provided with four sets of connecting rods with the same structure, and the connecting rods are far away from the fixed shaft. Heat dissipation tiles are installed on one side, and the outer wall of the heat dissipation tile is attached to the inner wall of the groove, and a through hole is opened on the top of the shell.

Preferably, the shock-absorbing pad is a sponge shock-absorbing pad, and honeycomb holes are evenly opened on the shock-absorbing pad, and adjacent honeycomb holes are connected.

Preferably, the radian of the heat dissipation tile is the same as that of the groove, and heat dissipation holes are evenly opened on the heat dissipation tile, and a connecting seat is installed on the bottom of the heat dissipation tile, and the connecting seat is connected to the connecting rod through a bolt.

Preferably, the motor is a servo motor, and the outer walls of the motor and the motor are provided with sound-absorbing films.

Preferably, the computer motherboard is a rectangular motherboard, and the size of the computer motherboard is 6cm in length and 4cm in width.

Preferably, the casing is an aluminum alloy casing, and the outer wall of the casing is provided with a waterproof membrane.

Compared with the prior art, the utility model has the beneficial effects that: the device has a simple structure and is easy to use, and through the mutual cooperation between the set motor, the rotating shaft and the fan, it is beneficial to dissipate the heat generated by the computer motherboard, and when the heat Most of the time, when the heat dissipation tiles rotate with the fixed shaft, the arched surface of each heat dissipation tile sweeps from the arc surface of the groove, takes away the heat from the heat conduction sheet, and rotates to the outside of the shell through the through hole to dissipate the heat. The heat is dissipated, further improving the effect of heat dissipation.

Description of drawings

Fig. 1 is a structural representation of the utility model;

Fig. 2 is a schematic diagram of the structure of the heat dissipation tile of the present invention.

In the figure: 1 casing, 2 motor, 3 fixing frame, 4 rotating shaft, 5 connecting block, 6 fan, 7 computer motherboard, 8 shock absorbing pad, 9 heat conducting sheet, 10 groove, 11 through hole, 12 fixed rotating shaft, 13 connection Rod, 14 cooling tiles, 141 cooling holes, 142 connecting seats.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

Please refer to Figure 1-2, the utility model provides a technical solution: a computer motherboard with better heat dissipation performance, including a casing 1, and the outer walls of the left and right sides of the casing 1 are installed with a motor 2 through a fixing frame 3, which is convenient for installation and disassembly , the output shaft of the motor 2 extends to the inner cavity of the housing 1 and is connected to the rotating shaft 4 through a coupling. The side of the rotating shaft 4 far away from the motor 2 is installed with a connecting block 5. The connecting block 5 is provided with a fan 6. Shock-absorbing pad 8 is installed at the bottom of the cavity, and computer motherboard 7 is installed on the top of the shock-absorbing pad 8 to prevent computer motherboard 7 from being damaged by vibration. Heat conduction sheet 9 is installed on the top of computer motherboard 7, and the top of heat conduction sheet 9 is evenly provided with groove 10, and the shell A motor is installed on the front outer wall of 1, and a fixed shaft 12 is installed on the output end of the motor. The side of the fixed shaft 12 away from the motor extends into the inner cavity of the housing 1 and is mounted on the rear inner wall of the housing 1 through a bearing. The fixed shaft 12 Four groups of connecting rods 13 with the same structure are evenly arranged on the outer wall. Heat dissipation tiles 14 are installed on the side of the connecting rods 13 away from the fixed rotating shaft 12, and the outer walls of the heat dissipation tiles 14 are attached to the inner walls of the groove 10. The top of the housing 1 is opened There is a through hole 11, and the motor 2 and the motor are connected to an external power supply through wires.

Wherein, the shock-absorbing pad 8 is a sponge shock-absorbing pad, and the shock-absorbing pad 8 is evenly provided with honeycomb holes, and the adjacent honeycomb holes are communicated, which is beneficial to protect the computer motherboard 7 while shock-absorbing and protect the computer motherboard 7, and make the inside of the shell 1 The wind flows between the honeycomb holes to take away the heat and dissipate heat;

The radian of the heat dissipation tile 14 is the same as that of the groove 10, and the heat dissipation tile 14 is evenly provided with heat dissipation holes 141, which is beneficial to the arched shape of each heat dissipation tile 14 during the rotation of the heat dissipation tile 14 with the fixed rotating shaft 12. Sweeping from the arc surface of the groove 10, the heat on the heat conducting sheet 9 is taken away, and the heat is dissipated by rotating to the outside of the shell 1 through the through hole 11, and the connecting seat 142 is installed on the bottom of the heat dissipation tile 14, and the connecting seat 142 is connected with connecting rod 13 by bolts, which is convenient for installation;

The motor 2 is a servo motor, which is beneficial to control the speed of the motor 2, thereby controlling the speed of the fan 6, and the outer wall of the motor 2 and the motor is provided with a sound-absorbing film, which is beneficial to reduce the noise generated when the motor 2 and the motor work, and is convenient for people to use ;

The computer main board 7 is a rectangular main board, and the length of the computer main board 7 is 6cm, and the width is 4cm, which takes up little space and is convenient for installation;

The shell 1 is an aluminum alloy shell, which better improves the effect of heat dissipation, and the outer wall of the shell 1 is provided with a waterproof film to prevent water from entering and damaging the computer motherboard 7 .

Working principle: When the computer motherboard 7 works to generate heat, the controller in the computer controls the motor 2 to work, and the motor 2 drives the fan 6 to rotate, so that the heat generated by the computer motherboard 7 is dissipated through the through hole 11. When the heat generated by the computer motherboard 7 Most of the time, the controller in the computer makes the motor work at the same time, driving the fixed rotating shaft 12 to rotate. During the process of the cooling tiles 14 rotating with the fixed rotating shaft 12, the arched surface of each cooling tile 14 moves from the arc surface of the groove 10. Sweeping takes away the heat on the heat conducting sheet 9, and rotates to the outside of the casing 1 through the through hole 11 to dissipate the heat, further improving the effect of heat dissipation.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes and modifications can be made to these embodiments without departing from the principle and spirit of the present invention , replacements and modifications, the scope of the present utility model is defined by the appended claims and their equivalents.

Claims (6)

1. A computer motherboard with better heat dissipation performance, comprising a casing (1), characterized in that: the outer walls of the left and right sides of the casing (1) are equipped with motors (2) through the fixing frame (3), and the motor ( The output shaft of 2) extends to the inner cavity of the casing (1) and is connected to the rotating shaft (4) through a coupling. The connecting block (5) is installed on the side of the rotating shaft (4) away from the motor (2). A fan (6) is arranged on the connection block (5), a shock absorbing pad (8) is installed at the bottom of the inner cavity of the casing (1), and a computer motherboard (7) is installed on the top of the shock absorbing pad (8). A heat conduction sheet (9) is installed on the top of the computer motherboard (7), and grooves (10) are evenly opened on the top of the heat conduction sheet (9), and a motor is installed on the front outer wall of the housing (1), and the output end of the motor Install the fixed rotating shaft (12), the side of the fixed rotating shaft (12) away from the motor extends into the inner cavity of the casing (1) and is installed on the rear inner wall of the casing (1) through bearings, the fixed rotating shaft (12) Four sets of connecting rods (13) with the same structure are evenly arranged on the outer wall of the outer wall, and the heat dissipation tiles (14) are installed on the side of the connecting rods (13) away from the fixed rotating shaft (12), and the outer walls of the heat dissipation tiles (14) are in line with the The inner wall of the groove (10) is attached, and the top of the shell (1) is provided with a through hole (11). 2. A computer motherboard with better heat dissipation performance according to claim 1, characterized in that: the shock absorbing pad (8) is a sponge shock absorbing pad, and honeycomb holes are evenly opened on the shock absorbing pad (8) , and the communication between adjacent honeycomb holes. 3. A computer motherboard with better heat dissipation performance according to claim 1, characterized in that: the radian of the heat dissipation tile (14) is the same as that of the groove (10), and the heat dissipation tile (14) Cooling holes (141) are evenly opened on the top, and a connection seat (142) is installed on the bottom of the heat dissipation tile (14), and the connection seat (142) is connected to the connecting rod (13) by bolts. 4 . The computer motherboard with better heat dissipation according to claim 1 , characterized in that: the motor ( 2 ) is a servo motor, and the motor ( 2 ) and the outer wall of the motor are both provided with sound-absorbing films. 5. A computer motherboard with better heat dissipation performance according to claim 1, characterized in that: the computer motherboard (7) is a rectangular motherboard, and the size of the computer motherboard (7) is 6cm in length and 4cm in width. 6. A computer motherboard with better heat dissipation performance according to claim 1, characterized in that: the casing (1) is an aluminum alloy casing, and the outer wall of the casing (1) is provided with a waterproof membrane.