CN210298399U - Power amplifier - Google Patents
Power amplifier Download PDFInfo
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- CN210298399U CN210298399U CN201921304560.0U CN201921304560U CN210298399U CN 210298399 U CN210298399 U CN 210298399U CN 201921304560 U CN201921304560 U CN 201921304560U CN 210298399 U CN210298399 U CN 210298399U
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- flat plate
- plate part
- power amplifier
- heat dissipation
- iii
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Abstract
The utility model discloses a power amplifier, which comprises a shell, wherein a bottom plate of the shell comprises a first flat plate part, a second flat plate part and a third flat plate part; the first flat plate part and the third flat plate part are respectively parallel to a cover plate of the shell, the distance between the first flat plate part and the cover plate is smaller than that between the third flat plate part and the cover plate, and two ends of the second flat plate part are respectively connected with the first flat plate part and the third flat plate part; the inner surface of the III flat plate part is provided with a power amplification circuit board, and the outer surface of the III flat plate part is provided with a heat dissipation grid. The utility model provides a pair of power amplifier has better radiating effect.
Description
Technical Field
The utility model relates to a power amplification technical field mainly relates to a power amplifier.
Background
As is well known, two side vents are respectively formed at two ends of a housing of a conventional power amplifier, and a heat dissipation fan is installed inside the housing, so that air convection is generated in the housing by the heat dissipation fan, and the heat dissipation and temperature reduction effects are achieved. However, as the usage time increases, the side vents accumulate a lot of dust, causing the side vents to shrink, thereby causing an insufficient ventilation amount. When the power amplifier continues to work, the temperature inside the power amplifier gradually rises, and the power amplifier works in a high-temperature environment for a long time, so that the working efficiency of the power amplifier is influenced, and the service life of the power amplifier is seriously influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a power amplifier solves power amplifier's heat dissipation problem.
The utility model discloses a following technical scheme realizes:
a power amplifier comprises a housing, wherein a bottom plate of the housing comprises an I flat plate part, an II flat plate part and an III flat plate part; the first flat plate part and the third flat plate part are respectively parallel to a cover plate of the shell, the distance between the first flat plate part and the cover plate is smaller than that between the third flat plate part and the cover plate, and two ends of the second flat plate part are respectively connected with the first flat plate part and the third flat plate part; the inner surface of the III flat plate part is provided with a power amplification circuit board, and the outer surface of the III flat plate part is provided with a heat dissipation grid.
The inner surface of the first flat plate part corresponds to a power supply input wiring part of a power amplifier, the inner surface of the third flat plate part corresponds to a power amplification circuit board of the power amplifier, and a large amount of heat is easily generated when the power amplification circuit board works, so that the distance between the third flat plate part and the cover plate is larger than that between the first flat plate part and the cover plate, and the generated heat is conveniently diffused in time; the second flat plate part is used for connecting the first flat plate part and the third flat plate part to realize the smooth transition of the first flat plate part and the third flat plate part; and a heat dissipation grid is arranged on the outer surface of the III flat plate part, so that heat generated when the power amplification circuit board works is further dispersed.
Further, the heat dissipation grid is transversely mounted on an outer surface of the third plate portion. More heat dissipation grids can be transversely installed, and heat dissipation is better carried out.
Furthermore, the height of the heat dissipation grid corresponding to the middle part of the third flat plate part is larger than the height of the heat dissipation grid corresponding to the rest parts of the third flat plate part. The middle part of the third flat plate part corresponds to an area where the heat of the power amplification circuit board is concentrated, and a higher heat dissipation grid is arranged to dissipate more heat, so that the problem of heat generation of the power amplifier can be effectively solved.
Furthermore, the shape of the heat dissipation grid corresponding to one end of the third flat plate part close to the second flat plate part is a right trapezoid, and the oblique side of the heat dissipation grid is parallel to the second flat plate part. The hypotenuse of heat dissipation grid is parallel with II plateform portion, not only looks more pleasing to the eye, can also effectively avoid the damage that causes the heat dissipation grid because of the touching.
Furthermore, the housing is provided with an output interface on an end surface close to the third flat plate portion, and the housing is provided with an input interface and a power interface on an end surface close to the first flat plate portion, for inputting and outputting signals.
Furthermore, the power amplifier also comprises a plurality of isolation plates, and the isolation plates are fixedly arranged on the power amplification circuit board. The isolation board separates the working modules of the power amplification circuit board from each other, so that the working modules of the power amplification circuit board are prevented from generating interference with each other when working, and the working efficiency of the power amplifier is prevented from being influenced.
Compared with the prior art, the utility model, following advantage and beneficial effect have:
(1) the heat dissipation grid is adopted to replace the ventilation opening and the heat dissipation fan, so that the phenomenon that the service life of the power amplifier is influenced due to the fact that the heat dissipation effect is not obvious because dust is accumulated in the ventilation opening can be effectively avoided;
(2) the heat dissipation grids with different heights are arranged, so that the power amplifier can be effectively cooled;
(3) the amplifying circuit board is provided with the isolation plate, so that the mutual interference of all modules can be effectively prevented when the amplifying circuit board works;
(4) the distances between different parts of the bottom plate and the cover plate are different, so that the effective space is reasonably utilized, the size of the power amplifier is reduced, and the power amplifier is convenient to carry by a user.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a front view of one embodiment of a housing of the present invention;
FIG. 2 is a top view of one embodiment of the housing of the present invention;
FIG. 3 is a top view of an embodiment of the interior of the housing of the present invention;
and (3) appendage marking: 1. a base plate; 2. a cover plate; 3. a first flat plate portion; 4. a second plate portion; 5. a III plate portion; 6. a power amplification circuit board; 7. a heat dissipation grid; 8. an output interface; 9. an input interface; 10. a power interface; 11. and (4) a partition board.
Detailed Description
To make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the following examples and drawings, and the exemplary embodiments and descriptions thereof of the present invention are only used for explaining the present invention, and are not intended as limitations of the present invention.
Examples
As shown in the figures 1-3 of the drawings,
a power amplifier comprises a housing, a bottom plate 1 of the housing comprises an I flat plate part 3, a II flat plate part 4 and a III flat plate part 5, the length of the I flat plate part 3 is 40cm, the length of the II flat plate part 4 is 38cm, and the length of the III flat plate part 5 is 200 cm; the first flat plate part 3 and the third flat plate part 5 are respectively parallel to the cover plate 2 of the housing, the distance between the first flat plate part 3 and the cover plate 2 is 20cm, the distance between the third flat plate part 5 and the cover plate 2 is 47.5cm, and two ends of the second flat plate part 4 are respectively connected with the first flat plate part 3 and the third flat plate part 5; the inner surface of the III flat plate part 5 is provided with a power amplification circuit board 6, and the outer surface of the III flat plate part 5 is provided with a heat dissipation grid 7.
The inner surface of the I flat plate part 3 corresponds to a power supply input wiring part of a power amplifier, the inner surface of the III flat plate part 5 corresponds to a power amplification circuit board 6 of the power amplifier, and because a large amount of heat is easily generated when the power amplification circuit board 6 works, the distance between the III flat plate part 5 and the cover plate 2 is larger than that between the I flat plate part 3 and the cover plate 2, so that the generated heat can be diffused in time; the second flat plate part 4 is used for connecting the first flat plate part 3 and the third flat plate part 5 to realize the smooth transition of the first flat plate part 3 and the third flat plate part 5; the outer surface of the third flat plate part 5 is provided with a heat dissipation grid 7 for further dispersing heat generated by the power amplification circuit board 6 during operation.
In one embodiment, the heat dissipation grid 7 is transversely mounted on the outer surface of the iii-th flat plate portion 5. More heat dissipation grids 7 can be transversely arranged, and heat dissipation is better carried out.
In another embodiment, the height of the heat dissipation grid 7 corresponding to the middle portion of the iii-th flat plate portion 5 is greater than the height of the heat dissipation grid 7 corresponding to the rest of the iii-th flat plate portion 5. The middle part of the III flat plate part 5 corresponds to an area where heat generated by the power amplification circuit board 6 is concentrated, and a higher heat dissipation grid 7 is arranged to dissipate more heat, so that the problem of heat generation of the power amplifier can be effectively solved.
In another embodiment, the shape of the heat dissipation grid 7 corresponding to the third flat plate portion 5 near one end of the second flat plate portion 4 is a right trapezoid, and the oblique side of the heat dissipation grid 7 is parallel to the second flat plate portion 4. The bevel edge of the heat dissipation grid 7 is parallel to the second flat plate part 4, so that the appearance is more attractive, and the damage to the heat dissipation grid 7 caused by touch can be effectively avoided.
In another embodiment, the housing is provided with an output interface 8 at an end surface close to the iii-th flat plate portion 5, and the housing is provided with an input interface 9 and a power interface 10 at an end surface close to the i-th flat plate portion 3 for signal transmission.
In another embodiment, the power amplifier further comprises a plurality of isolation plates 11, and the isolation plates 11 are fixedly arranged on the power amplification circuit board 6. The isolation board 11 separates the working modules of the power amplification circuit board 6 from each other, so as to avoid that the working modules of the power amplification circuit board 6 interfere with each other during working and influence the working efficiency of the power amplifier.
The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above description is only the embodiments of the present invention, and is not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (6)
1. A power amplifier comprising a housing, characterized in that: the bottom plate (1) of the shell comprises an I-th flat plate part (3), a II-th flat plate part (4) and a III-th flat plate part (5); the first flat plate part (3) and the third flat plate part (5) are respectively parallel to a cover plate (2) of the shell, the distance between the first flat plate part (3) and the cover plate (2) is less than the distance between the third flat plate part (5) and the cover plate (2), and two ends of the second flat plate part (4) are respectively connected with the first flat plate part (3) and the third flat plate part (5); the inner surface of the III flat plate part (5) is provided with a power amplification circuit board (6), and the outer surface of the III flat plate part (5) is provided with a heat dissipation grid (7).
2. A power amplifier according to claim 1, characterized in that: the heat dissipation grid (7) is transversely installed on the outer surface of the III flat plate part (5).
3. A power amplifier according to claim 1, characterized in that: the height of the heat dissipation grid (7) corresponding to the middle part of the III flat plate part (5) is larger than that of the heat dissipation grid (7) corresponding to the rest part of the III flat plate part (5).
4. A power amplifier according to claim 1, characterized in that: the shape of the heat dissipation grid (7) corresponding to one end of the III flat plate part (5) close to the II flat plate part (4) is a right-angled trapezoid, and the oblique side of the heat dissipation grid (7) is parallel to the II flat plate part (4).
5. A power amplifier according to claim 1, characterized in that: the end face of the shell close to the III-th flat plate part (5) is provided with an output interface (8), and the end face of the shell close to the I-th flat plate part (3) is provided with an input interface (9) and a power interface (10).
6. A power amplifier according to claim 1, characterized in that: the power amplifier further comprises a plurality of isolation plates (11), wherein the isolation plates (11) are fixedly arranged on the power amplification circuit board (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921304560.0U CN210298399U (en) | 2019-08-13 | 2019-08-13 | Power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921304560.0U CN210298399U (en) | 2019-08-13 | 2019-08-13 | Power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210298399U true CN210298399U (en) | 2020-04-10 |
Family
ID=70062378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921304560.0U Active CN210298399U (en) | 2019-08-13 | 2019-08-13 | Power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210298399U (en) |
-
2019
- 2019-08-13 CN CN201921304560.0U patent/CN210298399U/en active Active
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