CN210294802U - Gas-liquid two-phase supply and recovery device and immersion type photoetching equipment - Google Patents
Gas-liquid two-phase supply and recovery device and immersion type photoetching equipment Download PDFInfo
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- CN210294802U CN210294802U CN201921424914.5U CN201921424914U CN210294802U CN 210294802 U CN210294802 U CN 210294802U CN 201921424914 U CN201921424914 U CN 201921424914U CN 210294802 U CN210294802 U CN 210294802U
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Abstract
The utility model provides a two-phase recovery unit and immersion lithography apparatus of supplying with of gas-liquid, the two-phase recovery unit that supplies with of gas-liquid set up in on immersion lithography apparatus's the main substrate with right immersion lithography apparatus carries out the supply of immersion liquid and retrieves, it including thermal-insulated shell and set up in branch flow block main part in the thermal-insulated shell, be provided with temperature control fluid passage in the lateral wall of thermal-insulated shell, temperature control fluid passage is the heliciform and encircles branch flow block main part, and, temperature control fluid passage can circulate with the fluid that main substrate temperature equals, through fluid in the temperature control fluid passage with the mode that branch flow block main part takes place the heat exchange guarantees that the temperature of main substrate does not change, has reduced the influence of the temperature of branch flow block main part to main substrate, has reduced the thermal deformation of main substrate.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor manufacturing technique and specifically relates to a gas-liquid double-phase supplies with recovery unit and submergence formula lithography apparatus.
Background
The lithographic apparatus is based on optical lithography and uses an optical system to accurately project and expose a pattern on a mask onto a substrate (e.g., a silicon wafer) coated with a photoresist. The immersion lithography equipment is characterized in that immersion liquid (water or immersion liquid with higher refraction) is filled between a projection objective and a substrate to replace corresponding air in the traditional dry lithography technology, when a workpiece platform drives the substrate to perform high-speed scanning and stepping actions, the immersion lithography equipment can provide a stable immersion liquid flow field in the field range of the projection objective according to the motion state of the workpiece platform, and simultaneously ensure that the immersion liquid flow field is sealed with the outside, so that the immersion liquid is not leaked, and the numerical aperture of a lens group of the projection objective is increased due to the fact that the refractive index of water is larger than that of air, and further smaller characteristic line width can be obtained.
The projection objective of the existing immersion lithography equipment is usually fixed on a main substrate in a penetrating manner, and as immersion liquid is recycled, a shunting block is required to be arranged on the main substrate and used for recovering the immersion liquid and separating liquid and bubbles in the immersion liquid and then supplying the liquid and the bubbles to a substrate again, but the temperature of the working environment of the immersion lithography equipment is usually about 295.15K, the temperature on the main substrate is also about 295.15K, the temperature on the surface of the shunting block is about 293.15K, and the shunting block and the main substrate are usually rigidly connected through a flange, so that the heat transfer influence is large, the influence of heat exchange is large, the main substrate is deformed due to the temperature difference between the main substrate and the shunting block, and further the focusing, leveling, alignment, measurement and exposure of the immersion lithography equipment are unstable, and the precision of lithography is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a gas-liquid is double-phase supplies with recovery unit and submergence formula lithography apparatus to solve the problem that the difference in temperature between current main substrate and the reposition of redundant personnel piece leads to main substrate to warp.
In order to achieve the above object, the utility model provides a gas-liquid double-phase supply recovery unit sets up on an immersion lithography apparatus's main substrate with right immersion lithography apparatus carries out the supply of immersion liquid and retrieves, including thermal-insulated shell and set up in branch flow block main part in the thermal-insulated shell, be provided with in the lateral wall of thermal-insulated shell and encircle the temperature control fluid passage of branch flow block main part.
Optionally, the temperature-controlled fluid channel spirally surrounds the diverter block body.
Optionally, a section of the side wall of the heat insulating case protrudes outward to form a support portion, one end of the heat insulating case penetrates through the main substrate, and the support portion is disposed on the main substrate to be connected with the main substrate.
Optionally, an annular cavity is disposed in a side wall of the heat insulation housing, the temperature control fluid channel is located in the annular cavity, a gas pressure homogenizing unit and a gas pressure air outlet are respectively disposed at two ends of the annular cavity, the gas pressure homogenizing unit is configured to introduce a uniform pressure gas having the same temperature as the main substrate into the annular cavity, and the uniform pressure gas flows through the annular cavity and is released from the gas pressure air outlet.
Optionally, a buffer structure is further disposed between the support portion and the main substrate, so that the support portion is flexibly connected to the main substrate.
Optionally, the damping rate of the buffer structure is greater than 0.1.
Optionally, the buffer structure comprises a spring, a hydraulic damper, a rubber pad or an air damper.
Optionally, the flow splitting block main body comprises a flow splitting cavity, a first gas-liquid interface and a second gas-liquid interface are arranged at two ends of the flow splitting cavity, and the first gas-liquid interface and the second gas-liquid interface extend out of the heat insulation shell to supply and recover immersion liquid.
The utility model also provides an immersion lithography apparatus, include:
an illumination assembly for providing an exposure beam;
the mask assembly is used for bearing a mask plate;
the projection objective lens penetrates and is fixed on a main substrate, and the gas-liquid two-phase supply and recovery device is also arranged on the main substrate;
the immersion liquid flow field maintaining assembly is used for providing immersion liquid;
and the workpiece stage assembly is used for bearing a substrate, and the immersion liquid flow field maintaining assembly is used for filling immersion liquid between the projection objective and the workpiece stage assembly to form an immersion liquid flow field.
Optionally, the main substrate is provided with a plurality of the gas-liquid two-phase supply and recovery devices, and the plurality of the gas-liquid two-phase supply and recovery devices are arranged along the circumferential direction of the projection objective.
Optionally, a water-cooling circulation pipeline is arranged at the bottom of the main substrate, and a temperature control fluid channel of the gas-liquid two-phase supply recovery device is communicated with the water-cooling circulation pipeline.
The utility model provides a two-phase recovery unit that supplies with of gas-liquid sets up on an submergence formula lithography apparatus's main substrate in order right submergence formula lithography apparatus carries out the supply with the recovery of immersion liquid, it including thermal-insulated shell and set up in branch flow block main part in the thermal-insulated shell, be provided with temperature control fluid channel in the lateral wall of thermal-insulated shell, temperature control fluid channel is the heliciform and encircles branch flow block main part, can circulate among the temperature control fluid channel with the fluid that main substrate temperature equals, through fluid among the temperature control fluid channel with the mode that branch flow block main part takes place the heat exchange guarantees that the temperature of main substrate does not produce the change, has reduced the influence of the temperature of branch flow block main part to main substrate, has reduced the thermal deformation of main substrate.
Drawings
Fig. 1 is a schematic view of a first structure of a gas-liquid two-phase supply and recovery device according to an embodiment of the present invention;
fig. 2 is a schematic view of a second structure of the gas-liquid two-phase supply and recovery device according to the embodiment of the present invention;
fig. 3 is a schematic structural diagram of a third structure of a gas-liquid two-phase supply and recovery device according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of an immersion lithography apparatus according to an embodiment of the present invention;
fig. 5 is a distribution diagram of a gas-liquid two-phase supply and recovery device provided by an embodiment of the present invention on a main substrate;
among them, 10-lighting assembly; 20-a mask assembly; 30-a projection objective; 40-a main substrate; 50-a gas-liquid two-phase supply recovery device; 51-diverter block body; 511-a shunting cavity; 512-first gas-liquid interface; 513-a second gas-liquid interface; 52-a thermally insulated enclosure; 521-an upper end plate; 522-lower end plate; 523-thermally insulated housing sidewalls; 524-temperature controlled fluid channel; 525-a support portion; 53-air pressure homogenization unit; 531-air pressure controller; 532-an air inlet duct; 533-air pressure air outlet; 54-ring cavity; 55-a buffer structure; 60-an immersion liquid flow field maintenance assembly; 70-a workpiece stage assembly; 80-photoelectric measurement component.
Detailed Description
The following description of the embodiments of the present invention will be described in more detail with reference to the drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in simplified form and are not to precise scale, and are provided for convenience and clarity in order to facilitate the description of the embodiments of the present invention.
As shown in fig. 1, the present embodiment provides a gas-liquid two-phase supply and recovery device, which is disposed on a main substrate 40 of an immersion lithography apparatus to supply and recover an immersion liquid to and from the immersion lithography apparatus, and includes a heat insulation housing 52 and a splitter block main body 51 disposed in the heat insulation housing 52, that is, a cavity is disposed in the heat insulation housing 52, and the splitter block main body 51 is disposed in the cavity. Further, a temperature-controlled fluid channel 524 is disposed in a side wall 523 of the heat insulation housing 52, the temperature-controlled fluid channel 524 spirally surrounds the diversion block main body 51, and a fluid having a temperature equal to that of the main substrate 40, such as water, can flow through the temperature-controlled fluid channel 524. It is understood that the temperature of the main substrate 40 is typically about 295.15K (22 ℃), the temperature of the surface of the diverter block body 51 is typically about 293.15K (20 ℃), and the temperature difference between the main substrate 40 and the diverter block body 51 is about 2 ℃, in this embodiment, by sheathing the thermal insulation casing 52 on the diverter block body 51 and providing the temperature control fluid passage 524 in the side wall 523 of the thermal insulation casing 52, and flowing the fluid having the same temperature as the main substrate 40 in the temperature control fluid passage 524, the influence of the diverter block body 51 on the main substrate 40 can be reduced, and the heat exchange influence of the temperature of the diverter block body 51 and the main substrate 107 can be reduced, so as to ensure that the amount of thermal deformation of the main substrate 40 is within the specification (the amount of deformation of the main substrate 40 with the width dimension of 500mm is less than 1 nm).
Referring to fig. 1, in the present embodiment, the heat insulation housing 52 includes an upper end plate 521, a lower end plate 522, and a side wall 523, the side wall 523 is annular and is integrally formed with the upper end plate 521 and the lower end plate 522, the flow dividing block main body 51 includes a flow dividing cavity 511, a first gas-liquid interface 512 and a second gas-liquid interface 513 are disposed at upper and lower ends of the flow dividing cavity 511, and the first gas-liquid interface 512 and the second gas-liquid interface 513 extend out of the heat insulation housing 52 to supply and recover the immersion liquid.
Further, as shown in fig. 2, a section of the side wall 523 of the heat insulation housing 52 protrudes outward to form a support portion 525, after one end of the heat insulation housing 52 passes through the main substrate 40, the support portion 525 is clamped on the surface of the main substrate 40 to achieve connection with the main substrate 40, and since the heat insulation housing 52 is provided with the support portion 525, compared with the prior art, it is not necessary to use a flange to connect the splitter block main body 51 with the main substrate 40, the area of the support portion 525 may be designed to be smaller than that of the flange, so as to reduce the contact area with the main substrate 40, and further reduce heat exchange between the splitter block main body 51 and the main substrate 40.
As shown in fig. 2, an annular cavity 54 is disposed in the side wall 523 of the heat insulating housing 51 (or it can be understood that the side wall 523 of the heat insulating housing 51 is a double-layer structure having an inner wall, an outer wall and an annular cavity 54 formed by the inner wall and the outer wall), the temperature-controlled fluid channel 524 is located in the annular cavity 54, a gas pressure homogenizing unit 53 and a gas pressure outlet 533 are disposed at the upper end and the lower end of the annular cavity 54, respectively, the gas pressure homogenizing unit 53 includes a gas pressure controller 531 and a plurality of gas inlet pipes 532, the gas pressure controller 531 reduces the pressure of the input gas into a uniform pressure gas through the plurality of gas inlet pipes 532, and outputs the uniform pressure gas out of the annular cavity 54, and the uniform pressure gas flows through the annular cavity 54 and is released. It can be understood that the temperature of the uniform pressure gas is the same as the temperature of the main substrate 40, a film gas bath is formed in the annular cavity 54, heat exchange with the diverter block body 51 is realized, and the temperature index of the outer surface of the whole diverter block body 51 is further ensured.
Optionally, as shown in fig. 3, a buffer structure 55 (with a damping rate greater than 0.1) is further disposed between the supporting portion 525 and the main substrate 40, so as to achieve a flexible connection between the supporting portion 525 and the main substrate 40. The buffer structure 55 may be a spring, a hydraulic damper, a rubber pad, or an air damper, etc. to reduce the influence of the vibration of the splitter block body 51 itself, the vibration of the fluid in the temperature-controlled fluid channel 524, and the disturbance caused by the vibration of the air flow in the air pressure homogenizing unit 53 on the dynamic performance of the main substrate 40.
Based on this, as shown in fig. 4, the present embodiment further provides an immersion lithographic apparatus, comprising, in order from top to bottom:
an illumination assembly 10 for providing an exposure beam;
the mask assembly 20 is used for bearing a mask plate;
a projection objective lens 30 fixed to a main substrate 40 in a penetrating manner, wherein the gas-liquid two-phase supply/recovery device 50 is further provided on the main substrate 40;
an immersion liquid flow field maintenance assembly 60 for providing an immersion liquid 61;
a stage assembly 70 for carrying a substrate 71, the immersion liquid flow field maintenance assembly 60 filling an immersion liquid 61 between the projection objective 30 and the stage assembly 70 to form an immersion liquid flow field.
Specifically, the main substrate 40 provides a support for the objective lens 30, the substrate 71 coated with photosensitive photoresist is placed on the workpiece stage assembly 70, the immersion liquid flow field maintaining assembly 60 fills immersion liquid (for example, water) 61 in a gap between the projection objective lens 4 and the substrate 71, during work, a photoelectric measuring assembly 80 obtains the position of the workpiece stage assembly 70, the workpiece stage assembly 70 drives the substrate 71 to perform high-speed scanning and stepping actions, and the immersion liquid flow field maintaining assembly 60 provides a stable immersion liquid flow field in the field range of the projection objective lens according to the motion state of the workpiece stage assembly 70, and simultaneously, the immersion liquid flow field is sealed with the outside. The pattern of the integrated circuit on the mask plate carried on the mask assembly 20 is transferred to the substrate 71 coated with photosensitive photoresist in an imaging exposure mode through the illumination assembly 10 and the projection objective 30, thereby completing the exposure.
When the workpiece table assembly 70 moves rapidly, the immersion liquid on the substrate 71 needs to be recovered and re-supplied continuously, in this embodiment, the gas-liquid two-phase supply and recovery device 50 is communicated with the immersion liquid on the substrate 71 through a first gas-liquid interface 512 and a second gas-liquid interface 513 as shown in fig. 1, so as to recover and supply the immersion liquid. In this embodiment, as shown in fig. 5, two gas-liquid two-phase supply and recovery devices 50 are disposed on the main substrate 40, and the two gas-liquid two-phase supply and recovery devices 50 are disposed along the circumferential direction of the projection objective 30 to achieve rapid supply and recovery of the immersion liquid.
Further, a water-cooling circulation pipeline is arranged at the bottom of the main substrate 40, fluid at about 22 ℃ circulates in the water-cooling circulation pipeline to ensure that the temperature of the main substrate 40 is consistent with the temperature of the environment, and a temperature control fluid channel of the gas-liquid two-phase supply and recovery device 50 can be communicated with the water-cooling circulation pipeline to simplify the structure of the system.
In summary, in the gas-liquid two-phase supply and recovery device and the immersion lithography apparatus provided in the embodiments of the present invention, the gas-liquid two-phase supply and recovery device is arranged on a main substrate of the immersion type photoetching equipment to supply and recover the immersion liquid to the immersion type photoetching equipment, which comprises a heat insulation shell and a shunting block main body arranged in the heat insulation shell, wherein a temperature control fluid channel is arranged in the side wall of the heat insulation shell, the temperature control fluid channel spirally surrounds the shunting block main body, and fluid with the same temperature as the main substrate can flow in the temperature control fluid channel, the temperature of the main substrate is not changed by the way that the fluid in the temperature control fluid channel exchanges heat with the splitter block main body, the influence of the temperature of the splitter block main body on the main substrate is reduced, and the thermal deformation of the main substrate is reduced.
The above description is only for the preferred embodiment of the present invention, and does not limit the present invention. Any technical personnel who belongs to the technical field, in the scope that does not deviate from the technical scheme of the utility model, to the technical scheme and the technical content that the utility model discloses expose do the change such as the equivalent replacement of any form or modification, all belong to the content that does not break away from the technical scheme of the utility model, still belong to within the scope of protection of the utility model.
Claims (11)
1. A gas-liquid two-phase supply and recovery device is arranged on a main substrate of an immersion type photoetching device to supply and recover immersion liquid to the immersion type photoetching device and is characterized by comprising a heat insulation shell and a shunting block main body arranged in the heat insulation shell, wherein a temperature control fluid channel surrounding the shunting block main body is arranged in the side wall of the heat insulation shell.
2. The gas-liquid two-phase supply and recovery device according to claim 1, wherein the temperature-controlled fluid passage spirally surrounds the diverter block body.
3. The gas-liquid two-phase supply and recovery device according to claim 1, wherein a side wall of the heat insulating case protrudes outward to form a support portion, one end of the heat insulating case penetrates the main substrate, and the support portion is placed on the main substrate to be connected to the main substrate.
4. The two-phase gas-liquid supply and recovery device according to claim 3, wherein an annular chamber is disposed in a side wall of the thermal insulation housing, the temperature-controlled fluid channel is located in the annular chamber, a gas pressure homogenizing unit and a gas pressure outlet are disposed at two ends of the annular chamber, respectively, the gas pressure homogenizing unit is configured to introduce a uniform pressure gas having the same temperature as the main substrate into the annular chamber, and the uniform pressure gas is released from the gas pressure outlet after flowing through the annular chamber.
5. The gas-liquid two-phase supply and recovery device according to claim 3 or 4, wherein a buffer structure is further provided between the support portion and the main substrate to flexibly connect the support portion and the main substrate.
6. The gas-liquid two-phase supply and recovery device according to claim 5, wherein the damping rate of the buffer structure is greater than 0.1.
7. The gas-liquid two-phase supply and recovery device according to claim 5, wherein the buffer structure includes a spring, a hydraulic damper, a rubber pad, or an air damper.
8. The gas-liquid two-phase supply and recovery device according to claim 1 or 2, wherein the flow dividing block body comprises a flow dividing cavity, a first gas-liquid interface and a second gas-liquid interface are arranged at two ends of the flow dividing cavity, and the first gas-liquid interface and the second gas-liquid interface extend out of the heat insulation shell to supply and recover the immersion liquid.
9. An immersion lithographic apparatus, comprising:
an illumination assembly for providing an exposure beam;
the mask assembly is used for bearing a mask plate;
a projection objective lens which is fixed on a main substrate, wherein the main substrate is provided with a gas-liquid two-phase supply and recovery device according to any one of claims 1-8;
the immersion liquid flow field maintaining assembly is used for providing immersion liquid;
and the workpiece stage assembly is used for bearing a substrate, and the immersion liquid flow field maintaining assembly is used for filling immersion liquid between the projection objective and the workpiece stage assembly to form an immersion liquid flow field.
10. The immersion lithographic apparatus according to claim 9, wherein a plurality of the gas-liquid two-phase supply and recovery devices are provided on the main substrate, the plurality of the gas-liquid two-phase supply and recovery devices being provided along a circumferential direction of the projection objective.
11. The immersion lithography apparatus according to claim 9, wherein a water-cooled circulation conduit is provided at a bottom of the main substrate, and the temperature-controlled fluid channel of the gas-liquid two-phase supply recovery device is in communication with the water-cooled circulation conduit.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921424914.5U CN210294802U (en) | 2019-08-28 | 2019-08-28 | Gas-liquid two-phase supply and recovery device and immersion type photoetching equipment |
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| CN201921424914.5U CN210294802U (en) | 2019-08-28 | 2019-08-28 | Gas-liquid two-phase supply and recovery device and immersion type photoetching equipment |
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| CN210294802U true CN210294802U (en) | 2020-04-10 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115248532A (en) * | 2021-04-28 | 2022-10-28 | 上海微电子装备（集团）股份有限公司 | Immersion type photoetching equipment |
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2019
- 2019-08-28 CN CN201921424914.5U patent/CN210294802U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115248532A (en) * | 2021-04-28 | 2022-10-28 | 上海微电子装备（集团）股份有限公司 | Immersion type photoetching equipment |
| CN115248532B (en) * | 2021-04-28 | 2024-08-06 | 上海微电子装备（集团）股份有限公司 | Immersion lithography apparatus |
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