JP2008227452A - Exposure apparatus and method for manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure apparatus which is excellent in transfer precision and throughput. <P>SOLUTION: The exposure apparatus, which exposes a substrate 40 through liquid LW, is provided with a projection optical system 30 which projects a pattern of an original 20 onto the substrate 40; and a substrate stage 45 which holds and moves the substrate 40. The substrate stage 45 has a chuck 42 which holds the substrate 40; a top plate 44 which is disposed around the substrate 40 held by the chuck 42; and a draining mechanism (203, 204, 301, 402) which drains the liquid LW on the top plate 44. The top plate 44 has a first area 201 and a second area 202 on its surface. At least a part of the first area 201 is formed between the substrate 40 held by the chuck 42 and the second area 201. The contact angle of the liquid LW to the first area 201 is smaller than the contact angle of the liquid LW to the second area 202. The draining mechanism (203, 204, 301, 402) drains the liquid LW on the first area 201. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an exposure apparatus that exposes a substrate through a liquid.

  Conventionally, a projection exposure apparatus that exposes a circuit pattern drawn on a reticle and a substrate held by a chuck via a projection optical system has been used. In recent years, there is an increasing demand for an exposure apparatus that has high resolution and excellent transfer accuracy and throughput. Immersion exposure is attracting attention as a means for meeting the demand for high resolution. In immersion exposure, the numerical aperture (NA) of the projection optical system is increased by using a liquid as a medium between the projection optical system and the substrate held by the chuck. The NA of the projection optical system is expressed by NA = n × sin θ, where n is the refractive index of the medium. Therefore, by making the medium a medium having a refractive index (n> 1) higher than the refractive index of air, the NA can be increased up to n times compared to the case where the medium is air. Therefore, the resolution R (R = k1 × (λ / NA)) of the exposure apparatus expressed by the process constant k1 and the wavelength λ and NA of the light source can be improved.

  In immersion exposure, a local fill method has been proposed in which a liquid is locally filled between the final surface of the projection optical system and the substrate (see Patent Documents 1 to 3). In the local fill method, it is important to maintain the amount of liquid in the gap by flowing and collecting the liquid uniformly in a narrow gap between the final surface of the projection optical system and the substrate. For example, if liquid partially remains on the top plate provided around the chuck of the substrate stage and the substrate held by the chuck, the top plate is distorted by heat of vaporization or the pattern drawn on the reticle is transferred. It may happen that the accuracy is deteriorated. Further, when the substrate stage is moved at a high speed, the amount of liquid splashed around or the amount of liquid remaining partially around the periphery can be increased.

  Furthermore, for example, the liquid partially remaining on the top plate or the substrate may be mixed with the liquid filled in the gap between the final surface of the projection optical system and the substrate. In this case, bubbles may be mixed into the filled liquid. Since the mixed bubbles diffusely reflect the exposure light, the exposure amount can be reduced to reduce the throughput, or the exposure light can be prevented from reaching the substrate and transfer accuracy can be deteriorated.

  In order to solve such a problem, a method has been proposed to cope with bubble formation and liquid leakage by increasing the contact angle of the substrate or the substrate table for holding the substrate with respect to the liquid (immersion liquid) greater than 90 degrees. (See Patent Document 2).

  In addition, there is a problem in that the transfer accuracy is deteriorated because the liquid partially remaining on the top plate moves onto the substrate together with impurities on the top plate.

In order to solve this problem, the surface of the substrate support is set to a surface state in which the contact angle between the substrate support and the liquid decreases continuously or intermittently from the outer edge side of the substrate toward the outside. Therefore, a method for suppressing the movement of the liquid onto the substrate has been proposed (see Patent Document 3). In this method, a liquid recovery mechanism is provided outside the surface area.
International Publication No. 99/49504 Pamphlet JP 2005-150734 A JP 2006-186112 A

  In the exposure apparatus of Patent Document 2, the contact angle of the substrate and the substrate table for holding the substrate with respect to the immersion liquid is set larger than 90 degrees so that no liquid remains. However, as shown in FIG. 8, when the substrate table is moved at a high speed for a long distance, the liquid film is broken and a liquid residue is generated. The liquid remaining on the surface with high liquid repellency is easy to move and scatters when the substrate table is moved at high speed.

  FIG. 8A shows a schematic view of the projection optical system viewed from the −Z direction, and FIG. 8B shows a schematic cross-sectional view thereof. The liquid (immersion liquid) is supplied through the supply nozzle 101, recovered through the recovery nozzle 103, and exposed while being filled under the lens barrel 32. However, as the substrate stage moves at a high speed, the liquid is broken and the liquid remains on the top plate 44 as shown in FIG. If the liquid remaining on the top plate is mixed with the liquid filled under the lens barrel again as the substrate stage moves at high speed, bubbles are generated during this mixing, and the bubbles enter under the lens barrel. Can be.

  In Patent Document 3, the surface of the substrate support is set to a surface state in which the contact angle between the substrate support and the liquid decreases continuously or intermittently from the outer edge side of the substrate toward the outside. This prevents the liquid from moving onto the substrate. However, the liquid recovery mechanism is provided outside the surface area, and the liquid partially remaining on the area is difficult to be discharged. In particular, it is difficult to efficiently discharge the liquid that partially remains in the area close to the exposure area, which has a large influence on the transfer accuracy.

  The present invention has been made in consideration of the above problems, and an object of the present invention is to provide an exposure apparatus having excellent transfer accuracy and throughput.

  An exposure apparatus according to one aspect of the present invention is an exposure apparatus that exposes a substrate through a liquid, and includes a projection optical system that projects a pattern image of an original onto the substrate, and a substrate stage that holds and moves the substrate. The substrate stage includes: a chuck for holding the substrate; a top plate disposed around the substrate held by the chuck; and a drainage mechanism for discharging the liquid on the top plate. The surface of the plate includes a first region and a second region, and at least a part of the first region is formed between the substrate held by the chuck and the second region, The contact angle of the liquid with respect to the second region is smaller than the contact angle of the liquid with respect to the second region, and the drainage mechanism discharges the liquid on the first region.

  According to the present invention, for example, an exposure apparatus excellent in transfer accuracy and throughput can be provided.

  Further objects and other aspects of the present invention will be made clear by the preferred embodiments described below with reference to the accompanying drawings.

  Hereinafter, an exposure apparatus according to one aspect of the present invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted. Here, FIG. 1 is a schematic sectional view showing the configuration of the exposure apparatus 1 of the present embodiment.

  The exposure apparatus 1 performs step / step through the circuit pattern formed on the reticle 20, the projection optical system 30, and the liquid LW supplied between the projection optical system 30 and the substrate 40 held by the chuck 42. It is an immersion type projection exposure apparatus that exposes the substrate 40 by an AND scan method. The exposure apparatus 1 can also be applied to a step-and-repeat method.

  As shown in FIG. 1, the exposure apparatus 1 includes an illumination device 10, a reticle stage 25 that holds and moves the reticle 20, a projection optical system 30, and a substrate (wafer) stage 45 that holds and moves the substrate 40. And have. Furthermore, it has the surface plate 47 which supports the board | substrate stage 45, the ranging apparatus 50, the stage control part 60, and another member. Other members include, for example, the liquid supply unit 70, the immersion control unit 80, the liquid recovery unit 90, and the member 100.

  The illumination apparatus 10 is an apparatus that illuminates a reticle 20 on which a circuit pattern to be transferred to a substrate is formed, and includes a light source unit 12 and an illumination optical system 14.

In this embodiment, the light source unit 12 uses an ArF excimer laser having a wavelength of about 193 nm as a light source. However, the light source is not limited to the ArF excimer laser. For example, a KrF excimer laser having a wavelength of about 248 nm or an F ₂ laser having a wavelength of about 157 nm may be used, or a lamp such as a mercury lamp or a xenon lamp may be used. Also good.

  The illumination optical system 14 is an optical system for illuminating the reticle 20 with light from the light source unit 12.

  The reticle 20 is transported from outside the exposure apparatus 1 by a reticle transport system (not shown), and is held and driven by a reticle stage 25. The reticle 20 is made of, for example, quartz, and a pattern is formed thereon. The pattern image of the reticle 20 is projected onto the substrate 40 held by the chuck 42 by the projection optical system 30. The reticle 20 and the substrate 40 are arranged so as to have an optically conjugate relationship. Since the exposure apparatus 1 is a step-and-scan exposure apparatus, the reticle 20 and the substrate 40 are scanned at the same speed ratio as the reduction magnification ratio of the projection optical system 30, so that the pattern of the reticle 20 is transferred to the substrate 40. Transfer on top. In the case of a step-and-repeat type exposure apparatus, exposure is performed with the reticle 20 and the substrate 40 stationary.

  The reticle stage 25 is supported by a surface plate 27. The reticle stage 25 holds the reticle 20 via a reticle chuck (not shown), and its position is controlled by a moving mechanism and stage control unit 60 (not shown). The moving mechanism includes a linear motor and can drive the reticle stage 25 in the scanning direction (X-axis direction in the present embodiment).

  The projection optical system 30 has a function of forming a pattern image formed on the reticle 20 on the substrate 40. As the projection optical system 30, a refractive system or a catadioptric system can be used. The projection optical system 30 includes a lens (final lens) that comes into contact with the liquid LW. As the final lens, it is preferable to use a plano-convex lens having a plane in contact with the liquid LW.

  The substrate 40 is transported from outside the exposure apparatus 1 by a substrate transport system (not shown), and is held and driven by a substrate stage 45. The substrate 40 is an object to be exposed and widely includes a semiconductor substrate, a glass substrate, and other substrates. A photoresist is applied to the substrate 40.

  The top plate 44 disposed around the substrate 40 held by the chuck 42 is configured such that the surface thereof and the surface of the substrate 40 held by the chuck 42 are in substantially the same plane. The top plate 44 is a plate for holding the liquid LW. The top plate 44 has a surface that is substantially the same height as the surface of the substrate 40, so that when exposing a shot near the outer periphery of the substrate 40, the top plate 44 holds the liquid LW in a region outside the substrate 40, thereby projecting. It is possible to form a stable liquid film under the optical system 30.

  The substrate stage 45 includes a chuck 42, a top plate 44 and a moving body 46. The substrate stage 45 is supported by a surface plate 47 and holds the substrate 40 via the chuck 42. The substrate stage 45 has a function of translating the substrate 40 in the X, Y, and Z axial directions and rotating around each axis, and is controlled by the stage controller 60. The substrate stage 45 is controlled by the stage control unit 60 so that the surface of the substrate 40 always matches the focal plane (image plane) of the projection optical system 30 with high accuracy during exposure.

  The distance measuring device 50 measures the position of the reticle stage 25 and the two-dimensional position of the substrate stage 45 in real time via reference mirrors 52 and 54 and laser interferometers 56 and 58. A distance measurement result obtained by the distance measuring device 50 is transmitted to the stage controller 60. The stage controller 60 controls the movement of the reticle stage 25 and the substrate stage 45 for positioning and synchronization control based on the distance measurement result.

  Liquid supply and recovery will be described with reference to FIGS. The liquid supply unit 70 in FIG. 1 has a function of supplying the liquid LW to the space or gap between the final optical member 32 of the projection optical system and the top plate 44 or the substrate 40 shown in FIG. In the present embodiment, the liquid supply unit 70 of FIG. 1 includes a liquid purification device (not shown), a deaeration device, a liquid temperature control device, and a liquid supply pipe 72. The liquid supply unit 70 supplies the liquid LW, which is disposed around the final surface of the projection optical system 30, through the liquid supply port 101 illustrated in FIG. 2, and enters the space between the projection optical system 30 and the substrate 40. A liquid film of the liquid LW is formed. The gap between the projection optical system 30 and the substrate 40 is preferably such that the liquid film of the liquid LW can be stably formed and removed, for example, 1.0 mm.

  The liquid supply unit 70 includes, for example, a tank that stores the liquid LW, a pressure feeding device that sends out the liquid LW, a flow rate adjustment device that adjusts the supply flow rate of the liquid LW, and the like.

  The liquid LW is selected from those that absorb less exposure light, and preferably has a refractive index comparable to that of a refractive optical element such as quartz or fluorite constituting the projection optical system 30. The liquid purifier reduces impurities such as metal ions, fine particles, and organic substances contained in a raw material liquid supplied from a liquid supply source (not shown), and generates a liquid LW. The liquid LW purified by the liquid purifier is supplied to the deaerator.

  The deaeration device performs a deaeration process on the liquid LW to reduce dissolved oxygen and dissolved nitrogen in the liquid LW. The deaeration device is constituted by, for example, a membrane module and a vacuum pump. As the degassing device, for example, a device is preferred in which a gas permeable membrane is separated, the liquid LW is flowed on one side, the other is evacuated, and the dissolved gas in the liquid LW is expelled into the vacuum through the membrane. is there.

  The temperature control device has a function of controlling the liquid LW to a target temperature.

  The liquid supply pipe 72 projects the liquid LW, which has been subjected to deaeration processing and temperature control by the deaeration device and the temperature control device, via the liquid supply port 101 formed in the member (nozzle member) 100. And a space between the chuck 40 and the substrate 40 held by the chuck 42. That is, the liquid supply pipe 72 is connected to the liquid supply port 101. The member 100 is supported so as not to come into direct contact with the final optical member 32 of the projection optical system 30.

  The liquid immersion control unit 80 acquires information such as the current position, speed, acceleration, target position, and moving direction of the substrate stage 45 from the stage control unit 60, and liquid immersion (liquid supply / recovery) based on the information. The control which concerns on is performed. The liquid immersion control unit 80 gives control commands such as the start and stop of the supply and recovery of the liquid LW and the flow rate of the liquid LW to be supplied and recovered to the liquid supply unit 70 and the liquid recovery unit 90.

  The liquid recovery unit 90 has a function of recovering the liquid LW supplied by the liquid supply unit 70, and has a liquid recovery pipe 92 in this embodiment. The liquid recovery unit 90 includes, for example, a tank that temporarily stores the recovered liquid LW, a suction unit that sucks the liquid LW, a flow rate adjusting device for adjusting the recovery flow rate of the liquid LW, and the like.

  The liquid recovery pipe 92 is connected to the liquid recovery port 103 formed in the member 100.

  Specific examples of each member are shown below.

  As the liquid LW, pure water, functional water, a fluorinated liquid (for example, fluorocarbon) or the like is used. In addition, the liquid LW is preferably one in which the dissolved gas is sufficiently removed in advance using a degassing device (not shown). Thereby, generation | occurrence | production of the bubble in the liquid LW is suppressed, and even if a bubble generate | occur | produces in the liquid LW, this bubble can be immediately absorbed in the liquid LW. For example, if nitrogen and oxygen contained in a large amount in the air are targeted and 80% of the amount of gas that can be dissolved in the liquid LW is removed, the generation of bubbles can be sufficiently suppressed. Of course, a degassing device (not shown) may be provided in the exposure apparatus, and the liquid LW may be supplied to the liquid supply unit 70 while always removing the dissolved gas in the liquid.

  The liquid supply pipe 72 and the liquid recovery pipe 92 are preferably made of a resin such as a polytetrafluoroethylene (polytetrafluoroethylene) resin, a polyethylene resin, or a polypropylene resin with a small amount of elution substances so as not to contaminate the liquid LW. . When a liquid other than pure water is used as the liquid LW, the liquid supply pipe 72 and the liquid recovery pipe 92 may be configured with a material that is resistant to the liquid LW and has a small amount of eluted substances.

It is preferable that a porous member is fitted in the liquid supply port 101. As the porous member, a porous body obtained by sintering a fibrous or granular (powdered) metal material or an inorganic material is particularly suitable. In addition, as a material (material which comprises at least the surface) used for such a porous body, stainless steel, nickel, alumina, SiO ₂ , SiC, SiC having SiO ₂ only on the surface by heat treatment, and the like are suitable.

  Here, the features of the top plate 44 of the present embodiment will be described with reference to FIG.

  As shown in FIG. 8B, even when the top plate 44 is formed of a material having high liquid repellency (water repellency), when the substrate stage 45 is moved at a high speed for a long distance, When the liquid LW is extended and the liquid is extended to some extent, the liquid LW is torn off. In the case of FIG. 8B, it is difficult to specify the location where the liquid LW is torn off when performing the exposure operation. Therefore, in the present embodiment, a location where the liquid LW is torn off is specified with the following configuration, and the torn liquid is prevented from being scattered to other locations.

  As shown in FIG. 2A, the surface of the top plate 44 has a first region 201 and a second region 202 adjacent to each other, and the contact angles with respect to the immersion liquid in each region are different. . Here, the first region 201 is lyophilic (the contact angle with respect to the liquid LW is smaller than 90 degrees), and the second region 202 has a contact angle with respect to the liquid LW that is greater than that of the first region 201. It is supposed to be.

  The effect brought about by the first region 201 and the second region 202, which are two regions having mutually different contact angles, will be described in detail with reference to FIG. FIG. 3A shows a schematic cross-sectional view of a liquid that has been broken by the high-speed movement of the substrate stage 45 or the like. The torn liquid moves on the second region 202 as the substrate stage 45 moves, and reaches the first region 201 having higher lyophilicity as shown in FIG. As shown in c), it shows affinity with the first region 201. Therefore, the liquid that has moved on the second region 202 remains in the first region 201 as shown in FIG. 3D even if the substrate stage 45 further moves. In this way, when two regions having different contact angles adjacent to each other are provided on the top plate 44, there is an effect of collecting droplets (liquid) in a region having higher lyophilicity.

  In the present embodiment, by using this effect, the liquid on the top plate 44 is collected in the first region 201 and the collected liquid is discharged through the first region 201.

  In addition, two regions having different contact angles adjacent to each other have a characteristic that the liquid is easily broken and remains in a region having a lower contact angle.

  FIG. 2A is a diagram illustrating the behavior of the liquid LW when the substrate stage 45 is moved at a high speed and a long distance in the −X direction. As the first region 201 having a smaller contact angle than the contact angle of the second region 202 passes under the liquid LW, a liquid residue is generated on the first region 201. By generating this liquid residue, the amount of the liquid LW formed under the final optical member 32 is reduced, making it difficult for the liquid residue to be generated in places other than the first region 201. In addition, even if the liquid is torn off and scattered at a place other than the first region 201, the effect of the liquid gathering in the lyophilic region causes the first liquid when the scattered liquid moves onto the first region 201. The liquid can remain on one region 201.

  Here, as shown in FIG. 2B, the first region 201 is formed of a porous member or a porous material, and the first space 203 as the drainage mechanism and the drainage pipe 301 are formed in the first region. It is preferable to connect to 201. The first space 203 is provided in the top plate 44 below the first region 201, and the drainage pipe 301 is connected to the first space 203. The liquid remaining on the first region 201 soaks into the lyophilic porous member and falls into the first space 203. The liquid accumulated in the first space 203 is drained through the drain pipe 301. With such a configuration, the liquid remaining on the first region 201 does not remain, so that the scattering of the liquid can be further reduced.

  FIG. 4 is a diagram for explaining an example in which the liquid remains in the first region on the surface of the top plate 44 adjacent to the surface of the substrate 40. 4A is a schematic cross-sectional view in the vicinity of the top plate 44 adjacent to the substrate 40, and FIG. 4B is a top plate in the (1)-(1) ′ cross section orthogonal to the paper surface in FIG. 4A. 44 is a schematic sectional view of 44. FIG.

  The liquid collected on the first region 201 is discharged by the drainage mechanism through the second gap 206 and the third gap (also referred to as opening) 207. The drainage mechanism includes a first space 203, a porous body 402, a second space 204, and a drainage pipe 301. By the drainage mechanism, the liquid stored in the first space 203 moves to the second space 204 via the porous body 402 and is discharged via the drainage pipe 301.

Next, the embodiment shown in FIGS. 4A and 4B will be described in detail below.
On the surface in contact with the liquid LW, the substrate 40, the first region 201, and the second region 202 are arranged in that order from the center of the substrate 40 toward the outside. Here, the contact angle of the first region with respect to the liquid LW is made smaller than the contact angle of the surface of the substrate 40 with respect to the liquid LW. Further, the contact angle of the second region 201 with respect to the liquid LW is made larger than the contact angle of the first region 201 with respect to the liquid LW. By adopting such a configuration, it is possible to reduce the remaining of the liquid in a region close to the substrate (exposure region), which has a large influence on the accuracy of pattern transfer to the substrate, in the region on the top plate 44. . Moreover, since it can reduce that the liquid remains in the 2nd area | region 201 among the area | regions on the top plate 44, it can suppress that a liquid splashes on the outer side of the top plate 44. FIG.

  Next, a plurality of gaps provided between the substrate 40 and the top plate 44 and on the top plate 44 will be described below.

  The first gap 205 is a gap between the substrate 40 and the top plate 44. The interval between the first gaps varies depending on the outer diameter error of the substrate and the transport error of the substrate. When this gap increases, the amount of liquid falling from the gap increases and the amount of liquid LW below the final optical member becomes insufficient. In addition, when the liquid falls, air easily enters the liquid LW, which may cause exposure failure. In view of this, the first gap 205 is formed by subjecting the slope of the top plate 44 and the slope of the chuck 42 (400 in FIG. 4A) forming the first gap 205 to liquid repellency. It is possible to reduce the amount of liquid that enters the liquid and to reduce the liquid falling into the first space 203. Note that the angle θ in the figure is preferably less than 60 ° in order to reduce the amount of liquid falling. By reducing the angle θ to less than 60 °, the gap formed by the inclined surface of the top plate 44 and the inclined surface of the chuck 42 can be narrowed, and further, the liquid falling into the first space 203 can be reduced. The amount can be reduced. Further, it is possible to suppress the liquid accumulated in the first space 203 from jumping to the surface of the substrate 40 from a gap formed by the slope of the top plate 44 and the slope of the chuck 42 as the substrate stage 45 moves. Can do.

  Further, when the liquid accumulates on the first region 201, the liquid moves from the first region 201, and there is a possibility that residual liquid is generated in a place other than the first region 201. Therefore, the top plate 44 is provided with the second gap 206 and the third gap 207 in advance, and the liquid is efficiently moved into the first space 203. The second gap 206 is provided at the boundary between the first region 201 and the second region 202. The third gap 207 is provided in the vicinity of the first gap 205 and in the first region 201. It goes without saying that the number and / or shape of these gaps are not limited to these, and can be changed as appropriate in order to discharge the liquid through the first region 201.

  In addition, a gas supply pipe 401 and a gas supply port 403 for supplying gas to the first space 203 are arranged in the chuck 42, and gas supply from the gas supply port 403 leads to the liquid second space 204. The movement may be assisted. By taking such a configuration, a secondary effect that liquid can be prevented from entering the back surface of the substrate 40 is also obtained.

  Note that the second space 204 is not necessarily provided over the entire circumference of the substrate 40. As shown in FIG. 4B, the liquid stored in the first space 203 may be moved to the second space 204 and drained. By providing the second space 204 only in the vicinity of the drainage pipe 301 instead of the entire circumference, the deformation of the top plate 44 due to the heat of vaporization can be reduced as compared with the case where the second space 204 is arranged on the entire circumference. Can reduce a decrease in control performance of the substrate stage 45 on which the top plate 44 is placed. Further, if the second space 204 is provided only in the vicinity of the drainage pipe 301 instead of the entire circumference, even when the temperature of the top plate 44 is adjusted by a temperature adjustment mechanism (not shown), there is a place to be cooled by the heat of vaporization. Since it is limited to the vicinity of the porous body 402, the temperature can be easily adjusted.

  Note that if the porous body 402 is not used and the liquid accumulated in the first space 203 is drained through an opening such as a pinhole or slit, the temperature drop due to the heat of vaporization is further reduced. It is possible.

  Moreover, it is preferable that the −Z-direction wall surface (bottom surface) forming the first space 203 is made of a lyophilic material, or the surface thereof is subjected to lyophilic treatment. By doing so, the liquid falling into the first space 203 is likely to spread on the wall surface in the −Z direction that forms the space 203 and easily reaches the porous body 402, so that the drainage efficiency can be improved. .

  Further, as shown in FIG. 4B, the first space 203 may be partitioned at a plurality of locations (four locations in FIG. 4B) by a partition 209. By doing so, the liquid accumulated in the first space 203 is less likely to be disturbed with the operation of the substrate stage 45, and the drainage can be smooth. Further, by partitioning the first space 203, the vibration of the substrate stage 45 due to the liquid turbulence can be reduced.

  The portion of the top plate 44 adjacent to the substrate 40 can have other configurations as long as the variation in the first gap can be reduced. The same applies to the case where the first and second regions are arranged at portions other than the portion adjacent to the substrate 40 of the top plate 44. Below, the other example of the 1st and 2nd area | region arrange | positioned on the top plate 44 is demonstrated using FIG.

  In the immersion exposure apparatus, since the contact angles of the substrate 40 and the top plate 44 with respect to the immersion liquid are different from each other, the liquid LW easily breaks at the boundary between the substrate 40 and the top plate 44, and the liquid remains at a lower contact angle. There is a problem that it is easy.

  In particular, this liquid residue is likely to occur when the substrate 40 moves over a long distance, for example, 100 mm or more, and the liquid immersion region straddles the substrate 40 and the top plate 44. Furthermore, the upper limit of the moving speed at which the liquid residue hardly occurs is different between when the liquid LW moves from the top plate 44 to the substrate 40 and when the liquid LW moves from the substrate 40 to the top plate 44. Since the contact angle of the material forming the surface of the top plate 44 is higher than the contact angle of the material applied to the substrate 40, when the liquid LW moves from the substrate 40 onto the top plate 44, the liquid residue is removed. The upper limit of the movement speed that is difficult to occur is reduced. Even if the speed is set so that the liquid does not easily remain in each case, there is a problem that the liquid remains easily when the first gap is narrow.

  If the moving speed of the substrate stage is further lowered so as not to generate liquid residue, there arises a problem that the throughput is lowered. In order to solve this, as shown in FIG. 5A, the first area 201 is limited to a part of the area on the top plate 44 adjacent to the substrate 40, and the other areas are defined as the first area 201. The second area 202 may be set. In this case, if the immersion region 500 moves between the substrate 40 and the second region 202 on the top plate 44 via the first region 201 during the long distance movement, The occurrence of liquid residue on the second region 202 can be reduced.

  Further, as shown in FIG. 5B, an annular first region 201 is arranged adjacent to the substrate 40 so as to surround the entire circumference (entire outer periphery) of the substrate 40, and the other regions are the second. The region 202 may be the same. If the first region 201 is provided so as to surround the entire circumference in this way, the liquid immersion region 500 is always between the second region 202 on the substrate 40 and the top plate 44 via the first region 201. Can be moved. Therefore, generation of liquid residue on the substrate 40 and the second region 202 can be reduced while minimizing the movement distance.

As shown in FIGS. 5A and 5B, when the first region is arranged so as to surround at least a part of the substrate 40, the first region 201 has a very low contact angle with the immersion liquid. Material can be used. For example, if the first region 201 is made of SiO ₂ or SiC having SiO ₂ only on the surface by heat treatment, the contact angle changes greatly even when exposure light is irradiated when the peripheral region of the substrate is exposed. There is nothing. Therefore, it is possible to stably collect and drain the immersion liquid that has been torn to the first region.

  Furthermore, a plurality of first regions may exist on the top plate 44 as shown in FIG. A plurality of first regions 201 are arranged, for example, at equal intervals, and a residual liquid is intentionally generated on the first region. By generating the remaining liquid at an appropriate interval, it is possible to reduce the extension of the liquid LW when the substrate stage is moved at a high speed and a long distance, and to reduce the generation of the remaining liquid outside the first region 201. . In addition, by providing a plurality of first regions 201 on the top plate 44, when residual liquid is generated on the second region 202, it is possible to reduce the residual liquid from moving and scattering from the top plate 44. be able to.

  Further, as shown in FIG. 5D, a hole 210 is provided in the top plate 44, a region in contact with the hole 210 on the top plate 44 is a first region 201, and exposure light is irradiated into the hole 210. A configuration may be adopted in which the measurement member 215 is disposed. With such a configuration, the measurement member 215 and the residual liquid generated in the vicinity of the measurement member 215 can be collected in the first region 201 and discharged through the first region 201. The liquid collected in the first region may be moved to the first space 203 through the opening. Further, the liquid that has moved to the first space 203 may be directly discharged from the first space 203.

  As described above, as shown in FIGS. 5A to 5D, in the immersion exposure apparatus of the present embodiment, between the substrate 40 and the second region 202 or between the hole 210 and the second region 202. In addition, at least a part of the first region 201 is provided. By configuring in this way, it is possible to reduce the occurrence of residual liquid in a region other than the first region 201.

  Each of the configurations of FIGS. 5A to 5D may be combined with each other. You may combine at least 2 of the structure of Fig.5 (a) or FIG.5 (b), the structure of FIG.5 (c), and the structure of FIG.5 (d).

  An example of the opening and the drainage mechanism will be described below with reference to FIG.

  FIG. 6A shows a schematic cross-sectional view of the vicinity of the first space 203 provided on the top plate 44. For example, a plurality of openings 208 are provided in the first region 201. The liquid in contact with the first region 201 moves to the first space 203 through the opening 208 and is discharged. The opening 208 may be a plurality of pinhole-shaped openings 211 arranged near the boundary between the first region 201 and the second region 202, as shown in FIG. 6B. Further, the opening 208 may be a plurality of slit-shaped openings 212 arranged in the vicinity of the boundary between the first region 201 and the second region 202 as shown in FIG.

  Further, a gap is provided between the first region 201 and the second region 202 or the measurement member 215 instead of the pinhole-like opening or the slit-like opening, and the drainage mechanism is drained through this gap. You may comprise so that it may perform. Further, although not shown, a groove may be provided at the boundary between the first region 201 and the second region 202, and a pinhole-like opening or a slit-like opening may be provided in the groove. Further, as shown in FIG. 6D, the first region 201 may be divided into regions 201-a and 201-b and may have a plurality of gaps (205, 206) as openings. At this time, each part of the top plate corresponding to the divided first regions (regions 201-a and 201-b) is supported by a support member (not shown). These support members may be made of different materials. Moreover, this support member should just be the structure which can move a liquid to the 1st space or 2nd space provided in the drainage mechanism. Although not illustrated, for example, the configuration is a configuration in which the support member includes a porous body, and for example, the configuration in which the support member includes an opening. Further, for example, the support member may be divided into a plurality of parts, and the liquid can move between them.

  Further, a connecting mechanism that connects the first portion of the top plate 44 including the first region 201 and the second portion of the top plate 44 including the second region 202 may be provided. The coupling mechanism may be, for example, an elastic member having elasticity in a direction parallel to the first region and the second region (the top plate surface), for example, a leaf spring 404 as shown in FIG. FIG. 7A is a cross-sectional view in the vicinity of the boundary between the substrate 40 and the top plate 44, and FIG. 7B is a view of the substrate 40 and the top plate 44 viewed from the + Z direction. The configuration example of FIG. 7 is different from the configuration example of FIG. 4 described above so that the top plate portion having the first region 201 is supported by the leaf spring 404 from the top plate portion having the second region 202. It is configured. The top plate portion having the first region 201 can be deformed due to a temperature decrease accompanying the evaporation of the immersion liquid from the first region 201 made of a lyophilic material. However, by supporting the top plate portion having the first region 201 with the leaf spring 404, the influence of the deformation of the top plate portion having the first region 201 can be reduced by the top plate portion having the second region 202, etc. It can be made difficult to exert on other members. In addition, it is possible to reduce the influence of the temperature change of the first region 201 on other parts of the substrate stage 45 such as the second region 202.

  Next, specific examples of materials that can be used for the first region 201 and the second region 202 are described.

The first region 201 is preferably lyophilic, that is, made of a member or material having a contact angle with the liquid smaller than 90 degrees. For example, when the liquid is water, SiO ₂ , SiC, SiC having SiO ₂ only on the surface by heat treatment, high stability glass ceramic (eg, Zerodur, Zerodur is a registered trademark of Schott), etc. are suitable. . In addition, when a liquid other than water is used as the liquid, a material having resistance to the liquid and little elution and exhibiting the lyophilic property described above can be widely used.

  In the second region 202, a member or material having a contact angle with the liquid to be used is larger than the contact angle of the first region 201 with respect to the liquid and having resistance to the liquid and little elution. Can be used.

  For example, when the liquid is water, it is possible to use a fluorine-based resin or a vapor-deposition polymerization resin that is generally known to have high water repellency. Specifically, a polymer containing tetrafluoroethylene (TFE) as a fluorine-based resin can be widely used. More specifically, examples include polytetrafluoroethylene (PTFE), perfluoroalkyl vinyl ether resin (PFA), and perfluoroethylene-propylene copolymer resin (FEP). PTFE is a polymer obtained by polymerizing TFE, PFA is a polymer obtained by copolymerizing TFE and perfluoroalkoxyethylene, and FEP is a polymer obtained by copolymerizing TFE and hexafluoropropylene.

  Moreover, as a vapor deposition polymerization resin, the polymer containing paraxylylene or its derivative (s) can be used. Specifically, parylene (polyparaxylylene resin developed by Union Carbide Chemical and Plastics Corporation (UCC) in the United States) can be mentioned. More specifically, Parylene N (a product name of polyparaxylylene manufactured by UCC), Parylene C (a product name of polymonochloroparaxylylene manufactured by UCC), Parylene D (a product of polydichloroparaxylylene manufactured by UCC) Name).

  These resins can adjust the contact angle with respect to the liquid by adjusting the degree of polymerization or the polymerization ratio, or adjusting by introducing a functional group or a derivative.

  Furthermore, the contact angle can be increased by adjusting the surface roughness by providing irregularities or needle-like microstructures on the surface of the top plate 44 coated with a fluorine resin or the like. With such a configuration, it is possible to efficiently discharge the liquid from the top plate 44 through the first region 201, and to provide an exposure apparatus that is excellent in transfer accuracy and throughput and stable for a long time. it can.

[Another embodiment 1]
With reference to the schematic cross-sectional view of FIG. 9, another embodiment of the substrate stage of the present invention will be described. The difference from the previous embodiment is that there is no third gap 207. The third gap 207 can be eliminated when the width of the first region 201 can be reduced to several millimeters or less, or when the moving speed of the substrate stage 45 does not need to be increased so much.

  It is also possible to eliminate the liquid repellent portion (the portion treated so as to have liquid repellency) 400 on the slope of the top plate 44 and the slope of the chuck 42 forming the first gap 205. If the variation in the first gap 205 can be reduced and the first gap 205 can be made sufficiently small by using a substrate carrying device having a small substrate outer shape error and high carrying accuracy, the liquid repellent part 400 can be eliminated.

  In the present embodiment, the first region 201 is made of SiC, and the second region 202 is made of a fluororesin. Further, the surface of the member in the vicinity of the gas supply port 403 arranged at a position facing the back surface of the substrate 40 is subjected to a liquid repellency. In addition, in order to move the liquid collected into the first space 203 to the second space 204 to which the drainage pipe 301 is connected, gas supply from the gas supply port 403 is used as an auxiliary. . With such a configuration, it is possible to efficiently discharge the liquid collected in the first region 201 from the top plate 44, and to provide an exposure apparatus that is excellent in transfer accuracy and throughput and stable for a long period of time. Can do.

[Another embodiment 2]
With reference to the cross-sectional schematic of FIG. 10, another embodiment of the substrate stage of the present invention will be described. The difference from the previous embodiment is that the first region 201 arranged around the substrate 40 is composed of the porous body 402. The liquid collected in the first region 201 moves to the first space 203 through the first gap 205 and the porous body 402, and is further discharged through the porous body 402 and the second space 204. ing. With such a configuration, the liquid remaining on the top plate 44 can be efficiently discharged, and an exposure apparatus having excellent transfer accuracy and throughput can be provided.

  In the present embodiment, the liquid is also drained from the first gap 205. However, as described above, the first gap 205 varies due to the substrate outline error and the substrate transport error. The amount changes. For this purpose, the top plate 44 is configured regardless of the control of the first gap 205 by disposing the liquid repellent portion 400 on the slope of the porous 402 forming the first gap 205 and the slope of the chuck 42. Thus, the amount of liquid drained from the porous body 402 can be stabilized. Therefore, it is possible to provide an exposure apparatus that is excellent in transfer accuracy and throughput and stable for a long period of time.

  As in the previous embodiment, it is possible to eliminate the liquid repellent part 400 by using a substrate having a small outer shape error and using a substrate transfer device having high transfer accuracy.

[Another embodiment 3]
Still another embodiment of the substrate stage of the present invention will be described with reference to the schematic cross-sectional view of FIG. The feature of this embodiment is that the gap for draining from the first region 201 arranged around the substrate 40 is limited to the first gap 205. As described above, by using a substrate having a small outer shape error and using a substrate transfer device having high transfer accuracy, the first gap 205 is made to have a size suitable for both the maintenance of the liquid LW and the discharge of the liquid. It can be stabilized. By adopting such a configuration, the liquid collected in the first region 201 can be efficiently discharged from the top plate 44 through the first gap 205, and the transfer accuracy and throughput are excellent. An exposure apparatus stable for a period can be provided.

[Another embodiment 4]
Still another embodiment of the substrate stage of the present invention will be described with reference to the schematic cross-sectional views of FIGS. FIG. 14 is a view showing a state in which the top plate 44 and the substrate 40 are moved in the −X direction under the member 100, and FIG. 15 is added FIG. 14 with a reference symbol S for explaining each surface. FIG.

  The feature of this embodiment is that the height of the top plate 44 is reduced around the substrate 40 (that is, a recess is provided in a portion of the top plate 44 adjacent to the substrate 40). The first region 201 is formed by lowering the height of the surface of the top plate 44 adjacent to the substrate 40 by hd2 relative to the surface of the substrate 40, and the height hd1 is increased outside the first region 201 by a height hd1. Two regions 202 are formed.

  By reducing the height of the first region 201 with respect to the substrate 40 and the second region 202, it is possible to make it easier to collect liquid in the first region 201 and torn along with the high-speed movement of the stage. The liquid LW can be prevented from scattering from the first region 201. In addition, hd1 and hd2 are not more than the thickness of the substrate 40, preferably not more than 0.5 mm. When hd1 and hd2 are increased, when the stage is moved at a high speed, it becomes easy for air to be trapped at a level difference, and bubbles enter the liquid LW, causing defective exposure.

  Further, the liquid LW collected in the first region 201 can be easily dropped into the space 203 by inclining so that the surface on which the first region 201 is formed becomes lower toward the substrate 40. The liquid accumulated in the space 203 can be discharged from the drainage pipe 301 through the porous body 402 and the second space 204.

  If a steep step is provided when the height of the first region 201 and the second region 202 is changed, the liquid easily breaks at the stepped portion, and there is a possibility that residual liquid is generated on the second region 202. is there. Therefore, it is preferable that the first region 201 and the second region 202 are connected via the slope S2, as shown in FIG. The contact angle with respect to the liquid having the slope S2 may be the same as or equal to the contact angle with respect to the liquid in the first region 201 and the second region 202.

  Further, when the outer peripheral portion of the substrate 40 passes under the member 100 in a state where the liquid LW is filled between the member 100 and the substrate 40, the liquid LW is placed in the gap between the side surface of the substrate 40 and the side surface S4 of the top plate 44. A part of the liquid may remain accumulated, and the liquid may flow around the back surface of the substrate 40. Therefore, by setting the thickness hd3 of the side surface S4 of the top plate 44 to about one half or less of the thickness of the substrate 40, the liquid LW does not easily accumulate in the gap between the side surface of the substrate 40 and the side surface S4 of the top plate 44. Is possible.

  Further, the inclined surface S5 that forms a part of the space 203 is subjected to a liquid repellent treatment, and the contact angle of the inclined surface S5 with respect to the liquid LW is made higher than the contact angle of the side surface S7 of the chuck 42 with respect to the liquid LW. The liquid LW can be made easy to fall. As a result, it is possible to make it difficult for the liquid LW to accumulate in the gap between the side surface of the substrate 40 and the side surface S4 of the top plate 44.

  Furthermore, the contact angle with respect to the liquid LW of the surface S8 that forms the first space 203 is made smaller than the contact angle with respect to the liquid LW of the chuck side surface S7, so that the porous body 402 efficiently accumulates in the first space. It is possible to recover the liquid.

  In addition, when the amount of liquid falling into the first space 203 through the gap between the side surface of the substrate 40 and the side surface S4 of the top plate 44 is too large, the angle θ1 of the chuck 42 is 90 degrees or more, preferably 120 degrees or more. By doing so, it is possible to reduce the amount of the falling liquid.

  By increasing the angle θ1, the gap between the slope S5 of the top plate 44 and the slope S7 of the chuck 42 can be reduced. For this reason, it is possible to suppress the liquid accumulated in the first space 203 from jumping to the surface of the substrate 40 from the gap formed by the slope of the top plate 44 and the slope of the chuck 42 as the substrate stage 45 moves. Can do.

  In the previous embodiment, the contact angle of the first region 201 with the liquid LW is set lower than the contact angle of the liquid LW in the second region 202. However, in this embodiment, the generated residual liquid can be collected in the first region 201 by making the height of the first region 201 lower than the height of the substrate 40 and the second region 202. Therefore, the contact angle with respect to the liquid LW in the first region and the contact angle with respect to the liquid LW in the second region may be set to be the same. Similarly to the previous embodiment, the contact angle with respect to the liquid LW in the first region is set lower than the contact angle with respect to the liquid LW in the second region. Can be collected.

[Another embodiment 5]
Still another embodiment of the present invention will be described with reference to the schematic cross-sectional views of FIGS. 16 and 17. FIG. 16 is a view showing a state where the top plate 44 and the substrate 40 are moved in the −X direction under the member 100, and FIG. 17 is added with reference numerals S for explaining each surface to FIG. FIG.

  The feature of this embodiment is that a drainage flow path is provided between the first region 201 and the second region 202 in addition to the previous example.

  By reducing the height of the first region 201 with respect to the substrate 40 and the second region 202, the liquid can be easily collected by the first region 201. It is possible to suppress the liquid LW from being scattered from the first region 201.

  In this embodiment, since the drainage flow path is provided between the first region 201 and the second region 202, the liquid can be drained from both sides of the second region. Therefore, even if the width of the second region is set to about several tens of millimeters, it is possible to prevent the broken liquid LW from scattering from the first region 201 to the surface of the substrate 40 or the second region.

  The liquid accumulated in the first space 203A can be discharged from the drainage pipe 301A through the porous body 402A and the second space 204A.

  Further, the liquid accumulated in the first space 203B can be discharged from the drainage pipe 301B through the porous body 402B and the second space 204B.

  Furthermore, the slope S26 that forms a part of the space 203A and the slope S22 that forms a part of the space 203B are subjected to a liquid repellent treatment, thereby connecting the wall surface S31 of the chuck 42 and the slope S12 of the second region 202. The liquid LW can be easily dropped. Therefore, it becomes difficult for the liquid LW to accumulate on the surface S21 of the first region 201, and it is possible to prevent the broken liquid LW from scattering to the surface of the substrate 40 or the second region.

  Furthermore, the liquid is moved from the surface S12 to the surface S13 by reducing the contact angle with respect to the liquid LW of the surface S13 forming the first space 203B as compared with the contact angle with respect to the liquid LW of the side surface S12 of the second region. It can be made easier. With this configuration, it is possible to efficiently recover the liquid accumulated in the first space 203B from the porous body 402B.

  Further, the liquid can be easily moved from the surface S31 to the surface S32 by reducing the contact angles of the surfaces S32 and S33 with respect to the liquid LW as compared with the contact angle with respect to the liquid LW of the surface S31. With this configuration, it is possible to efficiently recover the liquid accumulated in the first space 203A from the porous body 402A.

  Further, when the amount of liquid falling into the first space 203A from the gap between the surface S26 and the surface S31 is too large, the amount of water fall can be reduced by setting the chuck angle Θ3 to 0 ° or more, preferably 30 ° or more. It is possible to reduce. Further, when the amount of liquid falling into the first space 203B from the gap between the surfaces S12 and S22 is too large, the amount of water falling can be reduced by setting the chuck angle Θ2 to 0 ° or more, preferably 30 ° or more. It is possible to reduce.

[Embodiment of Device Manufacturing Method]
Next, an embodiment of a device manufacturing method using the above-described exposure apparatus 1 will be described with reference to FIGS. FIG. 12 is a flowchart for explaining how to fabricate devices (ie, semiconductor chips such as IC and LSI, LCDs, CCDs, and the like). Here, the manufacture of a semiconductor chip will be described as an example. In step 1 (circuit design), a device circuit is designed. In step 2 (reticle fabrication), a reticle (also referred to as an original plate or a mask) on which the designed circuit pattern is formed is fabricated. In step 3 (wafer manufacture), a wafer (also referred to as a substrate) is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the reticle and wafer. Step 5 (assembly) is called a post-process, and is a process for forming a semiconductor chip using the wafer created in step 4, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). Including. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device created in step 5 are performed. Through these steps, the semiconductor device is completed and shipped (step 7).

  FIG. 13 is a detailed flowchart of the wafer process in Step 4. In step 11 (oxidation), the surface of the wafer is oxidized. In step 12 (CVD), an insulating film is formed on the surface of the wafer. In step 13 (electrode formation), an electrode is formed on the wafer by vapor deposition or the like. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist process), a photosensitive agent (also referred to as a resist) is applied to the wafer. Step 16 (exposure) uses the exposure apparatus 1 described above to expose the wafer through the reticle circuit pattern. In step 17 (development), the exposed wafer is developed. Step 18 (etching) etches the wafer using the resist pattern obtained by development as a mask. In step 19 (resist stripping), the resist that has become unnecessary after the etching is removed. By repeatedly performing these steps, multiple circuit patterns are formed on the wafer. According to this device manufacturing method, it is possible to manufacture a higher quality device than before.

  As mentioned above, although preferable embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

It is sectional drawing which shows the structure of the exposure apparatus which concerns on embodiment. It is sectional drawing which shows an example of the principal part structure of (a) (b) exposure apparatus. (A)-(d) It is sectional drawing explaining the effect | action which concerns on embodiment. (A) It is sectional drawing which shows an example of the principal part structure of exposure apparatus. (B) It is sectional drawing of a top plate. (A)-(d) It is a top view which shows the example of arrangement | positioning of the 1st and 2nd area | region on a top plate. (A) It is sectional drawing of the top plate containing an opening part. (B)-(d) It is a top view which shows the example of the shape of the opening part formed in a top plate. (A) It is sectional drawing of the top plate containing the supporting member of a 1st area | region. (B) It is a top view of the top plate containing the supporting member of a 1st area | region. (A) (b) It is a figure for demonstrating the subject of this invention. It is sectional drawing which shows the other example of the principal part structure of exposure apparatus. It is sectional drawing which shows the other example of the principal part structure of exposure apparatus. It is sectional drawing which shows the other example of the principal part structure of exposure apparatus. It is a flowchart for demonstrating the manufacturing method of a device. It is a detailed flowchart of a wafer process. It is sectional drawing which shows the other example of the principal part structure of exposure apparatus. It is sectional drawing which shows the other example of the principal part structure of exposure apparatus. It is sectional drawing which shows the other example of the principal part structure of exposure apparatus. It is sectional drawing which shows the other example of the principal part structure of exposure apparatus.

Explanation of symbols

1 Exposure device 20 Master (reticle)
30 Projection optical system 40 Substrate (wafer)
42 Chuck 44 Top plate 45 Substrate stage 201 First area 202 Second area 207 Opening 301 Pipe for drainage (drainage mechanism)

Claims (15)

In an exposure apparatus that exposes a substrate through a liquid,
A projection optical system for projecting a pattern image of an original onto the substrate;
A substrate stage for holding and moving the substrate,
The substrate stage is
A chuck for holding the substrate;
A top plate disposed around the substrate held by the chuck;
A drainage mechanism for discharging the liquid on the top plate,
The surface of the top plate includes a first region and a second region,
At least a portion of the first region is formed between the substrate held by the chuck and the second region;
The contact angle of the liquid with respect to the first region is smaller than the contact angle of the liquid with respect to the second region,
The exposure apparatus characterized in that the drainage mechanism discharges the liquid on the first region. In an exposure apparatus that exposes a substrate through a liquid,
A projection optical system for projecting a pattern image of an original onto the substrate;
A substrate stage for holding and moving the substrate,
The substrate stage is
A chuck for holding the substrate;
A top plate disposed around the substrate held by the chuck;
A drainage mechanism for discharging the liquid on the top plate,
The surface of the top plate includes a first region and a second region,
At least a part of the first region is formed between the substrate held by the chuck and the second region;
The drainage mechanism drains the liquid on the first region;
The distance from the surface of the lens in contact with the liquid of the projection optical system to the first region is the distance from the surface of the lens to the surface of the substrate and the distance from the surface of the lens to the second region. An exposure apparatus characterized in that it is longer. In an exposure apparatus that exposes a substrate through a liquid,
A projection optical system for projecting a pattern image of an original onto the substrate;
A substrate stage for holding and moving the substrate,
The substrate stage is
A chuck for holding the substrate;
A top plate disposed around the substrate held by the chuck;
A drainage mechanism for discharging the liquid on the top plate,
The surface of the top plate includes a first region and a second region,
The contact angle of the liquid with respect to the first region is smaller than the contact angle of the liquid with respect to the second region,
The exposure apparatus according to claim 1, wherein the drainage mechanism discharges the liquid through an opening formed in the first region. In an exposure apparatus that exposes a substrate through a liquid,
A projection optical system for projecting a pattern image of an original onto the substrate;
A substrate stage for holding and moving the substrate,
The substrate stage is
A chuck for holding the substrate;
A top plate disposed around the substrate held by the chuck;
A drainage mechanism for discharging the liquid on the top plate, a measurement member disposed in a hole formed in the top plate,
Have
The surface of the top plate includes a first region and a second region,
At least a portion of the first region is formed between the hole and the second region;
The contact angle of the liquid with respect to the first region is smaller than the contact angle of the liquid with respect to the second region,
The exposure apparatus characterized in that the drainage mechanism discharges the liquid on the first region. The substrate held by the chuck and the first region are adjacent via a gap,
The exposure apparatus according to claim 1, wherein the liquid discharge mechanism discharges the liquid through a gap between the substrate held by the chuck and the first region. The first region and the second region are adjacent via a gap,
The exposure apparatus according to claim 1, wherein the drainage mechanism discharges the liquid through a gap between the first region and the second region.   The exposure apparatus according to claim 2, wherein a contact angle of the liquid with respect to the first region is smaller than a contact angle of the liquid with respect to the second region. The measurement member and the first region are adjacent to each other through a gap,
The exposure apparatus according to claim 4, wherein the drainage mechanism discharges the liquid through a gap between the measurement member and the first region. The portion including the first region of the top plate is made of a porous material,
The exposure apparatus according to claim 1, wherein the drainage mechanism discharges the liquid through the porous material. The first region and the second region are adjacent via a gap,
The said top plate is isolate | separated into the 1st part containing the said 1st area | region, and the 2nd part containing the said 2nd area | region, The any one of Claim 1 thru | or 9 characterized by the above-mentioned. The exposure apparatus described. The substrate stage has a connection mechanism that connects the first part and the second part,
The exposure apparatus according to claim 10, wherein the coupling mechanism includes an elastic member having elasticity in a direction parallel to a surface of the top plate.   The distance from the surface of the lens in contact with the liquid of the projection optical system to the first region is the distance from the surface of the lens to the surface of the substrate and the distance from the surface of the lens to the second region. The exposure apparatus according to claim 1, wherein the exposure apparatus is longer than the exposure time. The difference between the distance from the surface of the lens to the surface of the substrate and the distance from the surface of the lens to the first region; and
The difference between the distance from the lens surface to the first region and the distance from the lens surface to the second region is:
The exposure apparatus according to claim 12, wherein the exposure apparatus has a thickness equal to or less than the thickness of the substrate.   The exposure apparatus according to claim 1, wherein a contact angle of the liquid with respect to the first region is smaller than 90 degrees. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 14;
Developing the exposed substrate. A device manufacturing method comprising:

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