CN210274701U

CN210274701U - Circuit board structure with inner layer blind buried with electric gold lead

Info

Publication number: CN210274701U
Application number: CN201920894036.7U
Authority: CN
Inventors: 计向东
Original assignee: Kunshan Dayang Printed Circuit Board Co ltd
Current assignee: Kunshan Dayang Printed Circuit Board Co ltd
Priority date: 2019-06-14
Filing date: 2019-06-14
Publication date: 2020-04-07
Anticipated expiration: 2029-06-14

Abstract

The utility model provides a blind circuit board structure of burying electric gold lead wire of inlayer, it includes: bottom copper layer; the base material layer is fixedly arranged on the bottom copper layer; the built-in lead layer is fixedly arranged on the base material layer; the laminated copper foil is fixedly arranged on the built-in lead layer; and a conductive mechanism is arranged between the laminated copper foil and the built-in lead layer. The utility model discloses compare in prior art and can solve lead wire layer burr and the copper perk phenomenon after the processing effectively, solve the fish tail problem to the face gold layer.

Description

Circuit board structure with inner layer blind buried with electric gold lead

Technical Field

The utility model relates to a printed circuit board field particularly, relates to a blind circuit board structure who buries electric gold lead wire of inlayer.

Background

With the development of the electronic industry, the gold price is soaring, the production cost of the traditional gold plating process is too high, and the market gradually turns to plating thin gold (namely selective gold plating) in order to further compress the production cost and save gold. In the manufacturing process of selective electrogilding, an electrogilding lead is required to be drawn out from a plate to the edge of the plate so as to achieve local conduction and plate an electrogilding layer, and the surface electrogilding lead is cut off in a machining mode after electrogilding, so that the phenomena of wire end burrs and copper warping of the lead layer can exist in the processing process, and the problem of scratching the surface electrogilding layer is easily caused.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a blind circuit board structure who buries electrogilding lead wire of inlayer, it adopts the blind electrogilding lead wire mode of burying of inlayer, cancels the electrogilding lead wire of top layer, can solve lead wire layer burr and the copper upwarp phenomenon after the processing effectively, solves the fish tail problem to the face gold layer.

Therefore, the utility model provides a blind circuit board structure of burying electric gold lead wire of inlayer, it includes:

bottom copper layer;

the base material layer is fixedly arranged on the bottom copper layer;

the built-in lead layer is fixedly arranged on the base material layer;

the laminated copper foil is fixedly arranged on the built-in lead layer;

and a conductive mechanism is arranged between the laminated copper foil and the built-in lead layer.

Furthermore, the conductive mechanism is located at the edge of the laminated copper foil.

Furthermore, the conductive mechanism is a through hole which sequentially penetrates through the laminated copper foil, the built-in lead layer, the substrate layer and the bottom layer copper.

Furthermore, an adhesive layer is arranged between the laminated copper foil and the built-in lead layer.

Further, the adhesive layer is a PP film.

The utility model provides an among the blind circuit board structure who buries electrogilding lead wire of inlayer, it compares traditional electrogilding lead wire, owing to adopt the blind electrogilding lead wire mode of burying of inlayer to embed the lead wire layer, cancel top layer electrogilding lead wire, therefore the end of a thread burr and the copper wire upwarp phenomenon that bring when consequently can not appear cutting off the lead wire because of machining to avoid board and board contact process in burr, the golden face fish tail problem that the copper wire caused, reduce the disability rate and promote the quality of circuit board.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:

fig. 1 is a structural exploded view of a circuit board structure of an inner-layer blind buried gold lead according to an embodiment of the present invention;

fig. 2 is a structural assembly diagram of a circuit board structure of an inner-layer blind buried gold lead according to an embodiment of the present invention.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below. While the drawings show exemplary embodiments of the disclosure, it should be understood that the disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

As shown in fig. 1 to fig. 2, the present embodiment provides a circuit board structure with an inner layer of a blind buried gold wire, which mainly includes: bottom copper 1; a substrate layer 2 (which is a substrate layer commonly used in the field of circuit boards) fixedly arranged on the bottom layer copper 1; a built-in lead layer 3 fixedly provided on the base material layer 2; a laminated copper foil 4 fixedly arranged on the built-in lead layer 3; a conductive mechanism 41 is arranged between the laminated copper foil 4 and the built-in lead layer 3, the conductive mechanism 41 is located at the edge of the laminated copper foil 4, and the conductive mechanism 41 can be a through hole which sequentially penetrates through the laminated copper foil 4, the built-in lead layer 3, the substrate layer 2 and the bottom layer copper 1.

As shown in fig. 1 to 2, an adhesive layer 42 is provided between the laminated copper foil 4 and the built-in lead layer 3, and the adhesive layer 42 is a PP film.

With reference to fig. 1 to fig. 2, the present embodiment further provides a method for embedding a gold wire in an inner layer of a circuit board, which includes the following steps:

s1: arranging bottom copper 1 and a base material layer 2, wherein the base material layer 2 is fixedly arranged on the bottom copper 1;

s2: arranging a built-in lead layer 3 on the substrate layer 2, and forming an electric gold lead 31 extending to the edge of the circuit board on the built-in lead layer 3;

s3: a layer of pressed copper foil 4 is pressed on the built-in lead layer 3 in a laminating way;

s4: the conduction of the inner layer and the outer layer is achieved on the edge of the circuit board in a through hole drilling mode;

s5: the gold wire 31 is cut.

Referring to fig. 1 to fig. 2, in step S2, the gold wire 31 may be formed on the built-in wire layer 3 by a single-sided etching method.

Referring to fig. 1 to 2, in step S3, an adhesive layer 42 may be disposed between the laminated copper foil 4 and the internal lead layer 3, and the adhesive layer 42 may be a PP film.

Referring to fig. 1 to 2, in step S5, the gold wire 31 may be cut from the side of the board edge of the circuit board by a routing method.

The specific process comprises the following steps: cutting, inner layer pressing, drilling, electroplating, outer layer welding prevention, character electroplating, gold electroplating and gong shape.

Therefore, in the circuit board structure of the blind electrogilding lead wire of burying of inlayer that this embodiment provided, it compares traditional electrogilding lead wire, owing to adopt the blind electrogilding lead wire mode of burying of inlayer to embed the lead wire layer, cancel the electrogilding lead wire of top layer, therefore the end of a thread burr and the copper wire upwarp phenomenon that bring when consequently can not appear cutting off the lead wire because of machining to avoid board and board contact in-process burr, the golden face fish tail problem that the copper wire caused, reduce the disability rate and promote the quality of circuit board.

It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. The utility model provides a circuit board structure of blind buried electric gold lead wire of inlayer which characterized in that includes:

a bottom layer copper (1);

a base material layer (2) fixedly arranged on the base copper layer (1);

a built-in lead layer (3) fixedly provided on the base material layer (2);

the laminated copper foil (4) is fixedly arranged on the built-in lead layer (3);

and a conductive mechanism (41) is arranged between the pressed copper foil (4) and the built-in lead layer (3).

2. The circuit board structure of inner-layer blind buried gold leads according to claim 1, characterized in that the conductive means (41) is located at the edge of the laminated copper foil (4).

3. The circuit board structure of inner-layer blind buried electric gold lead according to claim 1 or 2, characterized in that the conductive mechanism (41) is a through hole passing through the laminated copper foil (4), the inner lead layer (3), the substrate layer (2) and the bottom copper (1) in sequence.

4. The circuit board structure of inner-layer blind buried gold leads according to claim 1, characterized in that an adhesive layer (42) is provided between the laminated copper foil (4) and the inner lead layer (3).

5. The circuit board structure of inner-layer blind buried gold leads according to claim 4, characterized in that the adhesive layer (42) is PP film.