CN210274675U - Composite circuit board - Google Patents
Composite circuit board Download PDFInfo
- Publication number
- CN210274675U CN210274675U CN201920862501.9U CN201920862501U CN210274675U CN 210274675 U CN210274675 U CN 210274675U CN 201920862501 U CN201920862501 U CN 201920862501U CN 210274675 U CN210274675 U CN 210274675U
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- CN
- China
- Prior art keywords
- circuit board
- thermal
- insulated
- silica gel
- gel piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The utility model discloses a composite circuit board, which comprises a circuit board, the upper end of circuit board is equipped with a thermal-insulated silica gel piece, four limits of thermal-insulated silica gel piece all downwarping, and all the adhesion is fixed in on the surface of circuit board, form a sealed air cavity between thermal-insulated silica gel piece and the circuit board, thermal-insulated silica gel piece increases all to be equipped with a through-hole to pad department on the circuit board, the inside thermal-insulated silicone tube that all is equipped with of through-hole, all adhesion fixed mounting solid fixed ring on the opening terminal surface of thermal-insulated silicone tube bottom surface, gu fixed ring's bottom surface all offsets with the bottom surface of pad, gu fixed ring's interior all weld fixed mounting connecting pipe of ring, inside the pad was all inserted to the connecting pipe. The utility model discloses simple structure can be toward the inside inflation of thermal-insulated rubber piece, makes the thermal-insulated rubber piece inflation, effectually with keep apart between the electronic component, has avoided thermal mutual transmission, has guaranteed electronic component's security, has increased the shock attenuation effect simultaneously.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to composite circuit board.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board may be referred to as a printed wiring board or a printed circuit board.
At present, electronic component on the circuit board can produce a large amount of heats after working for a long time, because do not have thermal-insulated function between the electronic component for heat on the electronic component can transmit each other, to some electronic component that can not be heated for a long time, the overheated heat of transmission causes electronic component's damage easily, influences the operation of whole equipment, and present circuit board all is through bolt snap-on, does not have shock-absorbing function.
Disclosure of Invention
The utility model aims to solve the technical problem that a composite circuit board is provided to solve the problem of proposing in the above-mentioned background art.
The utility model discloses a realize through following technical scheme: the utility model provides a composite circuit board, which comprises a circuit board, the upper end of circuit board is equipped with a thermal-insulated silica gel piece, four limits of thermal-insulated silica gel piece all downwarping, and all the adhesion is fixed in on the surface of circuit board, form a sealed air cavity between thermal-insulated silica gel piece and the circuit board, thermal-insulated silica gel piece increases all to be equipped with a through-hole to pad department on the circuit board, the inside thermal-insulated silicone tube that all is equipped with of through-hole, all adhesion fixed mounting solid fixed ring on the opening end face of thermal-insulated silicone tube bottom surface, gu fixed ring's bottom surface all offsets with the bottom surface of pad, gu fixed ring's interior intra-annular all weld fixation installs a connecting pipe, inside the connecting.
As the preferred technical scheme, an air pipe is installed on the right side of the heat-insulating silica gel sheet in a hot melting mode, and an air nozzle is installed at the upper end of the air pipe.
As preferred technical scheme, all be equipped with a mounting hole on four angles of circuit board, a mounting hole inside all adhesion fixed mounting bearing, a cylinder all welds in the inner ring of bearing, a cylinder upper end all welds a fixed mounting rotary disk, all is equipped with the screw thread on the outer wall of cylinder lower extreme, and the cylinder all overlaps on being located one section of lower extreme on the circuit board and has a spring, and the equal adhesion of the opposite face of spring is fixed in on the circuit board.
As the preferred technical scheme, the heat-insulating silicone sheet and the heat-insulating silicone tube are arranged in an integrated injection molding mode.
As the preferred technical scheme, the through holes, the inner holes of the fixing rings and the welding pads of the circuit board are all arranged in a straight line.
The utility model has the advantages that: the utility model discloses simple structure, under the condition that does not influence the electronic component installation, can toward inside aerifing of thermal-insulated sheet rubber, make thermal-insulated sheet rubber inflation, because the thermal-insulated sheet rubber of electronic component bottom can be blocked by electronic component, thereby can not outwards bulge, but, the thermal-insulated silica gel piece in the space between the electronic component does not receive and blocks, thereby can outwards expand, thereby effectually keep apart between the electronic component, thermal mutual transmission has been avoided, electronic component's security has been guaranteed, the shock attenuation effect has been increased simultaneously.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected" and "disposed" are to be construed broadly, and may for example be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1, the utility model discloses a composite circuit board, including circuit board 3, the upper end of circuit board 3 is equipped with a thermal-insulated silica gel piece 1, four limits of thermal-insulated silica gel piece 1 are all downwarping, and all the adhesion is fixed in circuit board 3 on the surface, form a sealed air cavity 14 between thermal-insulated silica gel piece 1 and the circuit board 3, thermal-insulated silica gel piece 1 increases all to be equipped with a through-hole 2 to the pad department on the circuit board 3, through-hole 2 inside all is equipped with a thermal-insulated silicone tube 11, all adhesion fixed mounting solid fixed ring 10 on the opening terminal surface of thermal-insulated silicone tube 11 bottom surface, gu fixed ring 10's bottom surface all offsets with the bottom surface of pad, gu fixed ring 10's the equal welded fastening in the inner ring all welded fastening installs a connecting pipe 9, inside connecting pipe 9 lower.
In this embodiment, an air tube 13 is hot-melted and installed on the right side of the heat insulation silicon sheet 1, and an air nozzle 12 is installed at the upper end of the air tube 13.
In this embodiment, all be equipped with a mounting hole 8 on four angles of circuit board 3, a bearing 6 of the inside equal adhesion fixed mounting of mounting hole 8, a cylinder 15 of all welding in the inner ring of bearing 6, a cylinder 15 upper end equal welding fixed mounting rotary disk 4 all is equipped with the screw thread on the outer wall of cylinder 15 lower extreme, and cylinder 15 all overlaps in one section of the lower extreme on being located circuit board 3 has a spring 7, and the equal adhesion of the opposite face of spring 7 is fixed in on circuit board 3.
In this embodiment, the heat insulation silicone sheet 1 and the heat insulation silicone tube 11 are integrally formed by injection molding.
In this embodiment, the through hole 2, the inner hole of the fixing ring 10 and the pad of the circuit board 3 are all arranged in a straight line.
The pin on the electronic component can pass through the through-hole and during solid fixed ring inserts the pad, from not influencing electronic component's installation, after electronic component installation is accomplished, aerify in toward the air cock through inflation equipment such as air pumps, the gas of entering can be along gas tube injection air cavity, thereby make thermal-insulated silica gel piece inflation, because the thermal-insulated rubber piece of electronic component bottom can be blocked by electronic component, thereby can outwards not bulge, but, thermal-insulated silica gel piece in the space between the electronic component does not receive and blocks, thereby can outwards expand, plug up the space between the electronic component, thereby effectually keep apart between the electronic component, thermal mutual transmission has been avoided, electronic component's security has been guaranteed.
Wherein, during the installation, rotate the rotary disk, make cylinder lower extreme have a threaded section screw in the screw hole, wherein, because the circuit board sets up between two springs, through the effectual reduction of the elastic energy of spring vibration on the circuit board, increased the security of circuit board.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.
Claims (5)
1. A composite circuit board, characterized by: the circuit board comprises a circuit board, the upper end of circuit board is equipped with a thermal-insulated silica gel piece, four limits of thermal-insulated silica gel piece all downwarping, and all the adhesion is fixed in on the surface of circuit board, form a sealed air cavity between thermal-insulated silica gel piece and the circuit board, thermal-insulated silica gel piece increases all to be equipped with a through-hole to the pad department on the circuit board, the inside thermal-insulated silicone tube that all is equipped with of through-hole, all adhesion fixed mounting solid fixed ring on the opening terminal surface of thermal-insulated silicone tube bottom surface, gu fixed ring's bottom surface all offsets with the bottom surface of pad, gu fixed ring's interior all welded fastening installs a connecting pipe, inside the connecting pipe lower extreme all.
2. The composite circuit board of claim 1, wherein: an air pipe is arranged on the right side of the heat insulation silica gel sheet in a hot melting mode, and an air nozzle is arranged at the upper end of the air pipe.
3. The composite circuit board of claim 1, wherein: all be equipped with a mounting hole on four angles of circuit board, a mounting hole inside equal adhesion fixed mounting bearing, a cylinder all welds in the inner ring of bearing, a cylinder upper end equal welding fixed mounting rotary disk all is equipped with the screw thread on the outer wall of cylinder lower extreme, and the cylinder is located one section of lower extreme on the circuit board and all overlaps and have a spring, and the equal adhesion of opposite face of spring is fixed in on the circuit board.
4. The composite circuit board of claim 1, wherein: the heat insulation silicone sheet and the heat insulation silicone tube are arranged in an integrated injection molding mode.
5. The composite circuit board of claim 1, wherein: the through hole, the inner hole of the fixing ring and the welding disc of the circuit board are all arranged in a straight line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920862501.9U CN210274675U (en) | 2019-06-10 | 2019-06-10 | Composite circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920862501.9U CN210274675U (en) | 2019-06-10 | 2019-06-10 | Composite circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210274675U true CN210274675U (en) | 2020-04-07 |
Family
ID=70041472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920862501.9U Expired - Fee Related CN210274675U (en) | 2019-06-10 | 2019-06-10 | Composite circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210274675U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747659A (en) * | 2021-10-09 | 2021-12-03 | 深圳市安博利电路有限公司 | Anti-warping structure of circuit board |
-
2019
- 2019-06-10 CN CN201920862501.9U patent/CN210274675U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747659A (en) * | 2021-10-09 | 2021-12-03 | 深圳市安博利电路有限公司 | Anti-warping structure of circuit board |
| CN113747659B (en) * | 2021-10-09 | 2023-02-03 | 深圳市安博利电路有限公司 | Anti-warping structure of circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200407 Termination date: 20210610 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |